KR101263537B1 - 사용 지점 공정 제어 블렌더 시스템 및 상응 방법 - Google Patents

사용 지점 공정 제어 블렌더 시스템 및 상응 방법 Download PDF

Info

Publication number
KR101263537B1
KR101263537B1 KR1020087010026A KR20087010026A KR101263537B1 KR 101263537 B1 KR101263537 B1 KR 101263537B1 KR 1020087010026 A KR1020087010026 A KR 1020087010026A KR 20087010026 A KR20087010026 A KR 20087010026A KR 101263537 B1 KR101263537 B1 KR 101263537B1
Authority
KR
South Korea
Prior art keywords
tank
concentration
solution
bath
chemical solution
Prior art date
Application number
KR1020087010026A
Other languages
English (en)
Korean (ko)
Other versions
KR20080053941A (ko
Inventor
칼 제이. 우르크하트
Original Assignee
레르 리키드 쏘시에떼 아노님 뿌르 레？드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 레르 리키드 쏘시에떼 아노님 뿌르 레？드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 filed Critical 레르 리키드 쏘시에떼 아노님 뿌르 레？드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드
Publication of KR20080053941A publication Critical patent/KR20080053941A/ko
Application granted granted Critical
Publication of KR101263537B1 publication Critical patent/KR101263537B1/ko

Links

Images

Classifications

    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D11/00—Control of flow ratio
    • G05D11/02—Controlling ratio of two or more flows of fluid or fluent material
    • G05D11/13—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means
    • G05D11/135—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture
    • G05D11/138—Controlling ratio of two or more flows of fluid or fluent material characterised by the use of electric means by sensing at least one property of the mixture by sensing the concentration of the mixture, e.g. measuring pH value
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
    • G05D21/00—Control of chemical or physico-chemical variables, e.g. pH value
    • G05D21/02—Control of chemical or physico-chemical variables, e.g. pH value characterised by the use of electric means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Accessories For Mixers (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Control Of Non-Electrical Variables (AREA)
KR1020087010026A 2005-09-26 2008-04-25 사용 지점 공정 제어 블렌더 시스템 및 상응 방법 KR101263537B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US72059705P 2005-09-26 2005-09-26
US60/720,597 2005-09-26
PCT/IB2006/002618 WO2007034304A1 (en) 2005-09-26 2006-09-21 Point-of-use process control blender systems and corresponding methods

Publications (2)

Publication Number Publication Date
KR20080053941A KR20080053941A (ko) 2008-06-16
KR101263537B1 true KR101263537B1 (ko) 2013-05-14

Family

ID=37617280

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087010026A KR101263537B1 (ko) 2005-09-26 2008-04-25 사용 지점 공정 제어 블렌더 시스템 및 상응 방법

Country Status (6)

Country Link
EP (1) EP1934663A1 (ru)
JP (1) JP2009510556A (ru)
KR (1) KR101263537B1 (ru)
CN (1) CN101273317A (ru)
RU (1) RU2008116685A (ru)
WO (1) WO2007034304A1 (ru)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110079247A1 (en) * 2008-03-17 2011-04-07 Yue Ma Solution preparation apparatus and method for treating individual semiconductor workpiece
JP5558854B2 (ja) * 2010-02-02 2014-07-23 倉敷紡績株式会社 液体混合方法及び液体混合装置
CN102147625B (zh) * 2010-02-08 2013-03-13 鞍钢股份有限公司 一种再生酸密度检测控制装置及方法
EP3409347B1 (en) 2012-11-16 2020-06-17 Entegris, Inc. Controlling mixing concentration
WO2016134279A1 (en) * 2015-02-19 2016-08-25 Asahi Kasei Bioprocess, Inc. System and method for compensating binary inlet buffers during inline buffer diluation
JP7296726B2 (ja) * 2015-08-17 2023-06-23 アイコール・システムズ・インク 流体制御システム
JP2019501095A (ja) * 2015-11-03 2019-01-17 カーギル・インコーポレイテッド 温度に対して安定である化学溶液を製造するためのシステム及び方法
US10877491B2 (en) 2017-09-14 2020-12-29 Delaware Capital Formation, Inc. Pressure compensated Venturi dispensing system
CN112327953B (zh) * 2020-11-05 2023-04-07 山西黄腾化工有限公司 一种聚羧酸外加剂的加工工艺

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3074366B2 (ja) * 1993-02-22 2000-08-07 東京エレクトロン株式会社 処理装置
KR100290703B1 (ko) * 1997-08-26 2001-06-01 윤종용 정량공급조건을갖는반도체웨이퍼세정방법
JP3075350B2 (ja) * 1997-12-03 2000-08-14 日本電気株式会社 薬液処理方法および薬液処理装置
US6464799B1 (en) * 1999-06-01 2002-10-15 Applied Materials, Inc. Method for managing a fluid level associated with a substrate processing tank
US6584989B2 (en) * 2001-04-17 2003-07-01 International Business Machines Corporation Apparatus and method for wet cleaning

Also Published As

Publication number Publication date
JP2009510556A (ja) 2009-03-12
KR20080053941A (ko) 2008-06-16
WO2007034304A1 (en) 2007-03-29
CN101273317A (zh) 2008-09-24
EP1934663A1 (en) 2008-06-25
RU2008116685A (ru) 2009-11-10

Similar Documents

Publication Publication Date Title
KR101263537B1 (ko) 사용 지점 공정 제어 블렌더 시스템 및 상응 방법
US20120300573A1 (en) Point-of-use process control blender systems and corresponding methods
CN1332741C (zh) 混合过程原料的方法和设备
TWI418398B (zh) 在處理環境中之液體環式泵送及回收系統
KR101751626B1 (ko) 유량 조정 기구, 희석 약액 공급 기구, 액처리 장치 및 그 운용 방법
CN110197803B (zh) 基板液处理装置和基板液处理方法
JP4319803B2 (ja) 湿式洗浄装置および方法
US7980753B2 (en) Systems and methods for managing fluids in a processing environment using a liquid ring pump and reclamation system
CN110168713B (zh) 用于产生包括其中溶解有氨气的去离子水的导电液体的系统和方法
TWI454682B (zh) 用於管理使用液體環式泵之流體的系統及方法
US20070043473A1 (en) Point-of-use mixing method with standard deviation homogeneity monitoring
TWI735506B (zh) 供給液體製造裝置及供給液體製造方法
JP2006255696A (ja) 薬液混合供給方法
JP2005510054A (ja) 浸漬処理用の改良されたプロセス制御
US6286526B1 (en) Method for treatment of semiconductor substrate with chemical solution and apparatus used for said treatment
JP3120520B2 (ja) 洗浄装置
JP7326003B2 (ja) 液体供給装置、洗浄ユニット、基板処理装置
JPH0737851A (ja) 洗浄装置
KR101348437B1 (ko) 액처리 장치 및 처리액 공급 방법
JP2009098128A (ja) 液処理装置および処理液供給方法
JP2001118821A (ja) 洗浄方法
KR100394194B1 (ko) 화학용액 자동 공급장치 및 그 제어방법
JP2020087985A (ja) 基板処理装置および基板処理方法
WO2009064878A1 (en) System and method for blending, monitoring and dispensing chemical mixtures
US20230335417A1 (en) Wafer cleaning water supply system and wafer cleaning water supply method

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee