KR101252097B1 - Shield board and method of manufacturing the same - Google Patents

Shield board and method of manufacturing the same Download PDF

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Publication number
KR101252097B1
KR101252097B1 KR1020110120059A KR20110120059A KR101252097B1 KR 101252097 B1 KR101252097 B1 KR 101252097B1 KR 1020110120059 A KR1020110120059 A KR 1020110120059A KR 20110120059 A KR20110120059 A KR 20110120059A KR 101252097 B1 KR101252097 B1 KR 101252097B1
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South Korea
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charcoal powder
shielding board
base sheet
coating layer
mixture
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KR1020110120059A
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Korean (ko)
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윤태순
박정석
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호남대학교 산학협력단
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/06—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard

Abstract

PURPOSE: An electromagnetic wave shielding board and a manufacturing method thereof are provided to manufacture the electromagnetic wave shielding board at a wanted thickness using Korean hanji, charcoal powder, and the sap of a lacquer tree which are environmental friendly. CONSTITUTION: An electromagnetic wave shielding board(10) comprises a base sheet(11) and a coating layer(13). The base sheet applies Korean hanji cut in a wanted shape. The thickness of the Korean hanji is in the range of 0.19mm to 0.21mm. The coating layer is formed by applying mixture including the sap of a lacquer tree and charcoal powder on the surface of the base sheet. The coating layer applies the mixture mixed with the sap of the lacquer tree of 20 weight% and the charcoal powder of 80 weight%. The particle size of the charcoal powder is in the range of 0.01mm to 0.1mm.

Description

전자파 차폐 보드 및 그 제조방법{shield board and method of manufacturing the same}Electromagnetic shielding board and its manufacturing method {shield board and method of manufacturing the same}

본 발명은 전자파 차폐 보드 및 그 제조방법에 관한 것으로서, 상세하게는 한지를 이용한 전자파 차폐보드 및 그 제조방법에 관한 것이다.The present invention relates to an electromagnetic wave shielding board and a method of manufacturing the same, and more particularly, to an electromagnetic wave shielding board and a method of manufacturing the same using hanji.

최근 전기·전자 산업과 정보통신기술의 급속한 발전은 인류 생활에 많은 편리함과 윤택함을 제공하고 있다. 그러나, 이러한 전기·전자 산업과 정보통신기술의 발전에 따른 장점 외에도 여러 가지 부작용을 낳고 있는데, 그 중의 하나가 이로부터 발생하는 전자파의 유해성이다. 생활 가전기기, 정보통신기기 및 산업기기 등으로부터 발생하는 전자파는 기기간의 전자파 장해(EMI, electromagnetic interference)와 더불어 인체에 대한 유해성으로 인하여 새로운 환경 문제로 대두되고 있는 실정이다. 또한, 전자, 정보통신기기의 고속화, 광대역화가 가속화됨에 따라 휴대폰, 노트북컴퓨터, 개인휴대용정보단말기(PDA, personal digital assistant) 등 정보통신기기뿐만 아니라 일상 생활용품 등의 소형화, 박형화 및 경량화가 이루어지고 있으며, 이에 따라 EMI 문제가 더욱 심하게 대두되고 있어 이를 해결하기 위한 전자파 차폐재 개발이 시급하다.The recent rapid development of the electric and electronic industry and information and communication technology has provided many conveniences and benefits to human life. However, in addition to the advantages of the electric and electronic industry and the development of information and communication technology, there are also various side effects, one of which is the harmfulness of electromagnetic waves generated therefrom. Electromagnetic waves generated from household appliances, information and communication devices, and industrial devices are emerging as new environmental problems due to electromagnetic interference (EMI) and harmful effects on human bodies. In addition, as the speed and speed of electronic and information communication devices are accelerated, miniaturization, thinning, and weight reduction of not only information communication devices such as mobile phones, notebook computers, personal digital assistants (PDAs), but also daily living products are achieved. As the EMI problem is more serious, there is an urgent need to develop electromagnetic shielding materials to solve this problem.

현재 일반적으로 이용되고 있는 전자파 차폐 방법은 대부분 금속을 이용한 것으로서 은이나 구리와 같은 금속 입자를 차폐 대상물에 도포하여 사용하는 방법, 플라스틱 또는 고분자 매트릭스에 금속 섬유를 분산시켜 사용하는 방법 및 금속 박막 또는 금속 후막에 의한 방법 등이 있다. 그러나, 이러한 방법들은 전자파를 단순히 반사 또는 산란 차폐함으로써 인체 보호 측면에서는 유효하나 반사된 전자파로 인하여 기기의 오작동과 노이즈(noise)를 증가시키는 문제점이 존재한다. 또한, 도전성 금속 입자의 함량이 70중량% 이상인 경우가 많아서 단순히 기계적으로 혼합되기 때문에 복합체의 탄성율, 연신율 등과 같은 기계적 특성 및 내열성이 매우 떨어지는 단점이 있으며, 고가의 금속 입자를 사용함에 따른 가격적인 문제가 잔존하고 있다.Most commonly used electromagnetic shielding methods are metals, which are metal particles such as silver or copper coated on a shielding object, metal fibers dispersed in a plastic or polymer matrix, and metal thin films or metals. Thick-film method; However, these methods are effective in terms of human protection by simply reflecting or scattering shielding electromagnetic waves, but there is a problem of increasing the malfunction and noise of the device due to the reflected electromagnetic waves. In addition, since the content of the conductive metal particles is often 70% by weight or more, simply mechanically mixed, mechanical properties such as elastic modulus and elongation of the composite, and heat resistance are very poor, and there is a price problem due to the use of expensive metal particles. Is remaining.

이에 따라 친환경 비금속성 천연소재를 이용한 전자파 차폐보드의 필요성이 요구되고 있다.Accordingly, there is a need for an electromagnetic shielding board using eco-friendly nonmetallic natural materials.

본 발명은 상기와 같은 요구사항을 해결하기 위하여 창안된 것으로서, 천연물질을 이용하여 원하는 두께로 용이하게 제작할 수 있는 전자파 차폐 보드 및 그 제조방법을 제공하는데 그 목적이 있다.The present invention was devised to solve the above requirements, and an object thereof is to provide an electromagnetic shielding board and a method of manufacturing the same, which can be easily manufactured to a desired thickness using natural materials.

상기의 목적을 달성하기 위하여 본 발명에 따른 전자파 차폐 보드는 한지로 형성된 베이스 시트와; 상기 베이스 시트의 표면에 옻수액에 숯분말을 혼합한 혼합물을 도포하여 형성된 코팅층;을 구비한다.In order to achieve the above object, an electromagnetic wave shielding board according to the present invention comprises: a base sheet formed of Hanji; And a coating layer formed on the surface of the base sheet by applying a mixture of charcoal powder mixed with lacquer sap.

바람직하게는 상기 코팅층은 옻수액 20중량%에 숯분말80중량%로 혼합된 것을 적용한다.Preferably the coating layer is applied to 20% by weight of lacquer sap mixed with 80% by weight of charcoal powder.

또한, 상기의 목적을 달성하기 위하여 본 발명에 따른 전자파 차폐보드의 제조방법은 가. 숯분말을 옻수액에 혼합한 혼합물을 제조하는 단계와; 나. 상기 혼합물을 한지로 형성된 베이스 시트의 표면에 도포하여 경화시키는 단계;를 포함한다.In addition, the manufacturing method of the electromagnetic wave shielding board according to the present invention to achieve the above object is a. Preparing a mixture of charcoal powder mixed with lacquer sap; I. It includes; the step of applying the mixture on the surface of the base sheet formed by Hanji to cure.

상기 혼합물이 도포된 베이스 시트 복수매를 옻수액으로 상호 접합하는 단계;를 더 포함할 수 있다.A step of bonding the plurality of base sheets coated with the mixture to each other in a lacquer sap; may further include.

본 발명에 따른 전자파 차폐 보드 및 그 제조방법에 의하면, 친환경 천연소재인 한지, 숯분말 및 옻수액을 이용하여 원하는 두께로 용이하게 제조할 수 있는 장점을 제공한다. According to the electromagnetic wave shielding board and a method for manufacturing the same according to the present invention, it provides an advantage that it can be easily manufactured to a desired thickness using Hanji, charcoal powder and lacquer sap, which is an environmentally friendly natural material.

도 1은 본 발명의 일 실시예에 따른 전자파 차폐보드의 단면도이고,
도 2는 본 발명의 또 다른 실시 예에 따른 전자파 차폐보드의 단면도이고,
도 3은 복수매의 베이스 시트를 상호 접합하는 과정을 나타내 보인 사시도이고,
도 4는 본 발명에 따른 전자파 차폐보드에 대한 전자파 차폐효율을 측정한 결과를 나타내 보인 그래프이다.1 is a cross-sectional view of an electromagnetic shielding board according to an embodiment of the present invention,
2 is a cross-sectional view of the electromagnetic shielding board according to another embodiment of the present invention,
3 is a perspective view illustrating a process of bonding a plurality of base sheets to each other;
4 is a graph showing the results of measuring the electromagnetic shielding efficiency of the electromagnetic shielding board according to the present invention.

이하, 첨부된 도면을 참조하면서 본 발명의 바람직한 실시 예에 따른 전자파 차폐 보드 및 그 제조방법을 더욱 상세하게 설명한다.Hereinafter, an electromagnetic shielding board and a method of manufacturing the same according to an exemplary embodiment of the present invention will be described in detail with reference to the accompanying drawings.

도 1은 본 발명의 일 실시예에 따른 전자파 차폐보드의 단면도이다.1 is a cross-sectional view of an electromagnetic shielding board according to an embodiment of the present invention.

도 1을 참조하면, 본 발명에 따른 전자파 차폐보드(10)는 한지로 형성된 베이스 시트(11)와, 베이스 시트(11)의 표면에 옻수액에 숯분말을 혼합한 혼합물을 도포하여 형성한 코팅층(13)을 구비한다.Referring to Figure 1, the electromagnetic wave shielding board 10 according to the present invention is a coating layer formed by applying a mixture of a base sheet 11 formed of a sheet of paper and a mixture of charcoal powder in lacquer sap on the surface of the base sheet 11 (13) is provided.

베이스 시트(11)는 한지를 원하는 형태로 제단한 것을 적용한다.The base sheet 11 applies what was cut by Hanji in desired form.

여기서, 베이스 시트(11)로 적용되는 한지는 두께가 0.19mm 내지 0.21mm 인 것을 적용하는 것이 바람직하다.Here, it is preferable that the paper used as the base sheet 11 has a thickness of 0.19 mm to 0.21 mm.

코팅층(13)은 옻수액에 숯분말을 혼합한 혼합물을 베이스 시트(11)의 표면에 도포하여 경화과정을 거쳐 형성된다.The coating layer 13 is formed through a curing process by applying a mixture of charcoal powder to the lacquer sap on the surface of the base sheet (11).

여기서 코팅층(13)은 옻수액 20중량%에 숯분말80중량%로 혼합된 것을 적용하는 것이 바람직하다.Here, the coating layer 13 is preferably applied to a mixture of 80% by weight of charcoal powder to 20% by weight of lacquer sap.

이러한 전자파 차폐보드(10)는 먼저 숯분말을 옻수액에 혼합한 혼합물을 제조하고, 다음으로 혼합물을 한지로 형성된 베이스 시트(11)의 표면에 도포하여 상온에서 건조과정을 거쳐 경화시켜 코팅층(13)을 형성하면 된다. 코팅층(13)의 건조과정은 경화과정에서 크랙발생을 억제할 수 있도록 적절한 습도 분위기에서 수행하는 것이 바람직하다.The electromagnetic shielding board 10 is prepared by first mixing a mixture of charcoal powder in the lacquer sap, and then coating the mixture on the surface of the base sheet 11 formed of Hanji and curing through a drying process at room temperature to coat the coating layer 13 ) May be formed. The drying process of the coating layer 13 is preferably carried out in an appropriate humidity atmosphere to suppress the occurrence of cracks during the curing process.

한편, 전자파 차폐보드(10)는 다수매의 베이스 시트(11)가 상호 대향되게 적층되되 베이스 시트(11) 사이와 최외측 표면에 혼합물로 도포된 코팅층(13)을 갖는 구조로 형성될 수 있고 도 2는 일 예로서 2매의 베이스 시트(13) 사이에 코팅층(13)이 형성된 구조가 예시되어 있다.Meanwhile, the electromagnetic shielding board 10 may have a structure in which a plurality of base sheets 11 are stacked to face each other, but have a coating layer 13 coated in a mixture between the base sheets 11 and on the outermost surface thereof. 2 illustrates a structure in which a coating layer 13 is formed between two base sheets 13 as an example.

여기서, 숯분말은 입도가 0.01mm 내지 0.1mm 로 된 것을 적용하는 것이 바람직하다.Here, the charcoal powder is preferably applied to those having a particle size of 0.01mm to 0.1mm.

이 경우 도 3에 도시된 바와 같이 베이스 시트(11)의 양 표면에 코팅층(13)이 형성된 것을 상호 대향되는 면 중 적어도 한면에 옻수액을 다시 도포하여 상호 접합시킨 후 건조과정을 거치면 된다.In this case, the coating layer 13 is formed on both surfaces of the base sheet 11 as shown in FIG.

이러한 전자파 차폐보드(10)에 대해 베이스 시트(11)의 적용 매수를 달리하여 제작한 것에 대해 전자파 차폐효율을 측정한 실험결과가 도 4에 도시되어 있다.Experimental results of measuring the electromagnetic shielding efficiency for the fabricated by varying the number of sheets of the base sheet 11 for the electromagnetic shielding board 10 is shown in FIG.

도 4를 통해 알 수 있는 바와 같이, 4매의 베이스 시트(11)에 각각 코팅층(13)을 형성하여 상호 접합하여 두께가 2.0mm인 경우 거의 100%에 육박하는 전자파 차폐효율을 보여주고 있다.As can be seen from FIG. 4, the coating layers 13 are formed on the four base sheets 11 to be bonded to each other to show electromagnetic shielding efficiency of nearly 100% when the thickness is 2.0 mm.

10: 전자파 차폐보드 11: 베이스 시트
13: 코팅층10: electromagnetic shielding board 11: base sheet
13: coating layer

Claims (5)

삭제delete 삭제delete 삭제delete 삭제delete 전자파 차폐보드의 제조방법에 있어서,
가. 숯분말을 옻수액에 혼합한 혼합물을 제조하는 단계와;
나. 상기 혼합물을 한지로 형성된 베이스 시트의 표면에 도포하여 경화시키는 단계와;를 포함하고,
다. 상기 혼합물이 도포된 베이스 시트 복수매를 옻수액으로 상호 접합하는 단계;를 포함하고,
상기 혼합물은 옻수액 20중량%에 숯분말80중량%로 혼합된 것을 적용하는 것을 특징으로 하는 전자파 차폐보드의 제조방법.





In the method of manufacturing an electromagnetic shielding board,
end. Preparing a mixture of charcoal powder mixed with lacquer sap;
I. And applying the mixture to the surface of the base sheet formed by Hanji to cure it.
All. And bonding each of the plurality of base sheets to which the mixture is applied with a lacquer sap.
The mixture is a method of manufacturing an electromagnetic shielding board, characterized in that the mixture of 20% by weight of lacquer sap and 80% by weight of charcoal powder.





KR1020110120059A 2011-11-17 2011-11-17 Shield board and method of manufacturing the same KR101252097B1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210070497A (en) 2019-12-05 2021-06-15 엔트리움 주식회사 Semiconductor package
WO2021137317A1 (en) * 2019-12-31 2021-07-08 김은주 Method for manufacturing plate material using korean paper, and plate material manufactured thereby

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JP2002026573A (en) * 2000-07-05 2002-01-25 Saidai Kk Electromagnetic shielding material and method of manufacturing the same
KR20040084872A (en) * 2004-07-27 2004-10-06 송명신 A composition of wooden floor board for electromagnetic-shielding and electromagnetic-absorption and preparation method thereof
KR100860780B1 (en) * 2008-05-19 2008-09-29 주식회사 나노맥 Manufacturing method of sheet for shielding and absorbing electromagnetic wave

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002026573A (en) * 2000-07-05 2002-01-25 Saidai Kk Electromagnetic shielding material and method of manufacturing the same
KR20040084872A (en) * 2004-07-27 2004-10-06 송명신 A composition of wooden floor board for electromagnetic-shielding and electromagnetic-absorption and preparation method thereof
KR100860780B1 (en) * 2008-05-19 2008-09-29 주식회사 나노맥 Manufacturing method of sheet for shielding and absorbing electromagnetic wave

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210070497A (en) 2019-12-05 2021-06-15 엔트리움 주식회사 Semiconductor package
WO2021137317A1 (en) * 2019-12-31 2021-07-08 김은주 Method for manufacturing plate material using korean paper, and plate material manufactured thereby

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