KR20040084872A - A composition of wooden floor board for electromagnetic-shielding and electromagnetic-absorption and preparation method thereof - Google Patents
A composition of wooden floor board for electromagnetic-shielding and electromagnetic-absorption and preparation method thereof Download PDFInfo
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- KR20040084872A KR20040084872A KR1020040058963A KR20040058963A KR20040084872A KR 20040084872 A KR20040084872 A KR 20040084872A KR 1020040058963 A KR1020040058963 A KR 1020040058963A KR 20040058963 A KR20040058963 A KR 20040058963A KR 20040084872 A KR20040084872 A KR 20040084872A
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- 239000000203 mixture Substances 0.000 title claims abstract description 10
- 238000010521 absorption reaction Methods 0.000 title claims description 12
- 238000002360 preparation method Methods 0.000 title 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 25
- 229920000049 Carbon (fiber) Polymers 0.000 claims abstract description 15
- 239000004917 carbon fiber Substances 0.000 claims abstract description 15
- 239000008199 coating composition Substances 0.000 claims abstract description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 14
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 13
- 239000010439 graphite Substances 0.000 claims abstract description 13
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 12
- 239000002699 waste material Substances 0.000 claims abstract description 9
- 239000002929 natural lacquer Substances 0.000 claims abstract description 6
- 238000004519 manufacturing process Methods 0.000 claims abstract 3
- 239000002023 wood Substances 0.000 claims description 29
- 239000011120 plywood Substances 0.000 claims description 10
- 239000004922 lacquer Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- 239000002245 particle Substances 0.000 claims description 7
- 239000007787 solid Substances 0.000 claims description 7
- 238000009628 steelmaking Methods 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 5
- 238000002156 mixing Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 239000011550 stock solution Substances 0.000 claims description 2
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 2
- 239000002994 raw material Substances 0.000 claims 2
- 230000032683 aging Effects 0.000 claims 1
- 239000000395 magnesium oxide Substances 0.000 claims 1
- 239000007770 graphite material Substances 0.000 abstract description 5
- 229910000831 Steel Inorganic materials 0.000 abstract description 3
- 239000010959 steel Substances 0.000 abstract description 3
- 244000044283 Toxicodendron succedaneum Species 0.000 abstract 1
- 239000000835 fiber Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/24—Electrically-conducting paints
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/12—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain a coating with specific electrical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/66—Additives characterised by particle size
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
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- C08K2201/005—Additives being defined by their particle size in general
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Environmental & Geological Engineering (AREA)
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
Description
본 발명은 제철소의 제철소 제강공정의 전로에서 폐기되는 마그네시아-카본 (magnesia- carbon)이 함유되어 있는 흑연재 또는 카본 함량이 99 중량부 이상인 흑연재와 전기전도성이 우수한 길이 3mm 내지 10 mm의 PAN계 탄소섬유를 이용하여 전자파 차폐 성능 및 전자파 흡수 성능이 우수한 목재 마루판에 관한 것이다.The present invention is a graphite material containing magnesia-carbon, which is discarded in a converter in a steelmaking process of a steel mill, or a graphite material having a carbon content of 99 parts by weight or more and a PAN system having a length of 3 mm to 10 mm having excellent electrical conductivity. The present invention relates to a wooden floorboard having excellent electromagnetic shielding performance and electromagnetic wave absorption performance using carbon fiber.
종래에는 건축물의 벽체에 전자파를 차폐할 목적으로 적당히 전도성 재료를 첨가한 고분자 수지인 전도성 에폭시 수지, 도전성 카펫, 도전성 매트 등을 사용하여 왔다. 상기 기술들은 유기질계 바인더로서의 고분자 수지에 전도성 물질인 금속재료를 분산시켜 전도특성을 부여한 재료로서 유기 바인더에 분산된 금속재료의 전도성 저하로 만족할만한 전도특성을 발휘하지 못하였으며 그 사용범위가 벽체로 한정되어 있다.Conventionally, conductive epoxy resins, conductive carpets, conductive mats, and the like, which are polymer resins with an appropriately added conductive material, have been used for the purpose of shielding electromagnetic waves on walls of buildings. The above techniques do not exhibit satisfactory conduction characteristics due to the deterioration of the conductivity of the metal material dispersed in the organic binder as the material imparting the conduction properties by dispersing the metal material as the conductive material in the polymer resin as the organic binder, the use range of the wall It is limited.
또한 대한민국 공개특허 특 2003-0083853 및 대한민국 공개특허 특 2003-0059588 에서는 이러한 단점을 보완하여 무기질계 벽체용 바름재에 전도성 재료인스테인레스 섬유나 탄소섬유를 사용하는 것으로 공개되어 있다. 그러나 스테인레스섬유는 전자파 차폐 및 전자파 흡수용으로는 전도성이 약하다는 문제점이 있다.In addition, Korean Patent Laid-Open Publication No. 2003-0083853 and Korean Patent Laid-Open Publication No. 2003-0059588 disclose that the conductive material stainless fiber or carbon fiber is used as a coating material for inorganic wall to compensate for these disadvantages. However, stainless fiber has a problem that the conductivity is weak for electromagnetic shielding and electromagnetic wave absorption.
또한 기존의 전자파 차폐용 재료들은 그 사용 범위가 벽체로 한정되어 있으며, 시공 시 분진 발생 등의 환경저해 요소가 많으며, 재료의 손실 등의 경제적인 원가상승의 요인이 많아 고가인 단점이 있다.In addition, the existing electromagnetic shielding materials are limited to the use of walls, there are many environmental detrimental factors such as dust generation during construction, and there are many economical factors such as material loss, which is expensive.
따라서, 본 발명에서는 전도성 섬유로는 가장 전도 특성이 우수한 섬유로 PAN계 탄소섬유를 사용하고, 목재 마루판 구성체의 전도특성을 향상시키기 위하여 흑연재 분말을 혼합 사용하고 이들 구성재료의 목재와의 접합을 위하여 기존의 유기물계 바인더를 사용하지 않고, 천연 옻나무에서 추출한 옻 원액을 사용하여 공지의 여타 재료보다 경제적이며, 내구성이 우수하고 전자파 차폐 및 전자파 흡수 성능이 우수한 목재 마루판을 완성하게 되었다.Therefore, in the present invention, as the conductive fiber, PAN-based carbon fiber is used as the fiber having the most conductive property, and graphite powder is mixed in order to improve the conductive property of the wood floorboard component, and the bonding of these component materials with wood is performed. In order not to use conventional organic binders, using the lacquer extract extracted from natural lacquer to finish the wood floorboards more economical than other known materials, durable and excellent electromagnetic shielding and electromagnetic wave absorption performance.
본 발명은 상기의 문제점을 해결하기 위해 안출된 것으로서, 전기전도성 및 열전도성이 우수한 탄소섬유를 사용하고 전기 전도성이 우수한 재료인 흑연재 분말을 목재 마루판에 사용하고, 이들 재료의 목재와의 부착성 및 미려한 외관을 위하여 천연 옻나무 추출액인 옻칠 원액을 희석하여 사용함으로서 전자파 차폐 및 전자파 흡수 성능이 우수할 뿐 아니라, 열전도성이 우수한 목재 마루판을 제공한다.The present invention has been made to solve the above problems, using a carbon fiber having excellent electrical conductivity and thermal conductivity, and using a graphite powder, which is a material having excellent electrical conductivity, in a wooden floorboard, and adhesion of these materials to wood. And by diluting the lacquer undiluted solution, which is a natural lacquer extract for a beautiful appearance, it provides a wooden floorboard having excellent electromagnetic shielding and electromagnetic wave absorption performance, as well as excellent thermal conductivity.
본 발명에 의한 전자파 차폐 및 전자파 흡수용 목재 마루판은 표면을 가공하지 않은 원목 마루판 또는 합판에, 길이가 3mm 내지 10 mm 범위의 탄소섬유를 목재마루판 표면 코팅용 조성물 100 중량부에 대하여 약 0.3 내지 0.8 중량부와 입자의 크기가 0.5 mm 이하인 제철소 제강공정의 전로에서 폐기되는 마그네시아-카본계 폐흑연재 또는 카본 함량 99 중량부 이상인 흑연을 목재 마루판 표면 코팅용조성물에 1 내지 3 중량부가 포함되는 구성을 특징으로 하며, 표면-표면 저항 및 표면-접지 저항이 2.5x104Ω∼ 1.0x106Ω을 가지는 전자파 차폐 및 전자파 흡수용 목재 마루판이다.The wood floorboard for electromagnetic wave shielding and electromagnetic wave absorption according to the present invention is about 0.3 to 0.8 based on 100 parts by weight of carbon fiber having a length ranging from 3 mm to 10 mm to a wood floorboard surface coating composition on a wooden floorboard or plywood not processed on the surface. 1 to 3 parts by weight of magnesia-carbon-based waste graphite or carbon content of 99 parts by weight or more is contained in the wood floorboard surface coating composition, which is discarded in a converter of a steelmaking process with a weight part and a particle size of 0.5 mm or less. A wooden floorboard for electromagnetic wave shielding and electromagnetic wave absorption having a surface-surface resistance and a surface-ground resistance of 2.5x10 4 kPa to 1.0x10 6 kPa.
이하, 본 발명을 상세히 설명하면 아래와 같다.Hereinafter, the present invention will be described in detail.
본 발명에 따른 탄소섬유는 PAN 계 탄소섬유로서 길이가 3mm 내지 10mm 범위의 것을 사용하며, 3mm 이하의 것을 사용하는 경우에는 목재 마루판 코팅용 조성물 혼합 시 분산이 어려우며, 10 mm 이상의 것을 사용하는 경우에는 목재 마루판의 표면 마감성이 떨어진다.The carbon fiber according to the present invention uses a PAN-based carbon fiber having a length in the range of 3mm to 10mm, when using less than 3mm, it is difficult to disperse when mixing the wood floorboard coating composition, when using more than 10mm The surface finish of wood floorboards is poor.
본 발명에 따른 목재 마루판 조성물에 전도성을 부여하기 위하여 첨가되는 흑연 분말은 입자형으로, 제철소 제강공정의 전로에서 폐기되는 폐흑연을 사용하며, 폐 흑연을 온도 섭씨 60도, 습도 70％ 이상의 조건에서 2시간 이상 숙성한 것을 다시 건조한 후 입자의 크기를 0.5 mm 이하의 범위로 분쇄한 것을 사용한다.The graphite powder added to impart conductivity to the wood floorboard composition according to the present invention is in the form of particles, using waste graphite discarded in the converter of the steelmaking steelmaking process, and the waste graphite is used at a temperature of 60 degrees Celsius and a humidity of 70% or more. After drying for 2 hours or more again, it is used to grind the size of the particles in the range of 0.5 mm or less.
본 발명은, 표면 처리하지 않은 원목 및 합판의 표면을 표면 가공함에 있어서, 첫 번째는 400목으로 구성된 사포로 원목 및 합판의 표면을 1 차 연마한 후, 다시 1000목 정도의 사포로 재 연마하여 원목 또는 합판의 표면을 곱게 표면 처리한다. 표면 코팅용 조성물은 목재 가구에 사용되는 옻칠용 원액과 에탄올을 1:4의비율로 희석한다. 3mm 내지 10mm 범위의 PAN계 탄소섬유를 상기 코팅용 조성물 100중량부에 대하여 약 0.3 내지 0.8 중량부와 입자의 크기가 0.5 mm 이하인 제철소 제강공정의 전로에서 폐기되는 마그네시아-카본계 폐흑연재 또는 카본 함량 99 중량부 이상인 흑연재를 고르게 충분히 혼합한다. 이때 탄소섬유가 고르게 분산되도록 하기 위하여 섬유 분산제 등을 사용할 수 있다. 고르게 혼합된 코팅용 조성물을 사포로 표면 연마한 원목 또는 합판에 칠한다. 원목 또는 합판에 칠하는 공정은 다음과 같다.The present invention, in the surface processing of the surface and the surface of the solid wood and plywood, the first is a sandpaper composed of 400 wood and first polished the surface of the wood and plywood, and then regrind with sandpaper of about 1000 wood The surface of solid wood or plywood is finely surfaced. The surface coating composition dilutes the lacquer stock solution and ethanol in a ratio of 1: 4 for wood furniture. Magnesia-carbon waste graphite material or carbon content of PAN-based carbon fiber in the range of 3 mm to 10 mm with respect to 100 parts by weight of the coating composition and discarded in a converter of a steelmaking process in which the particle size is 0.5 mm or less. The graphite material which is 99 weight part or more is mixed sufficiently evenly. At this time, to disperse the carbon fibers evenly, a fiber dispersant may be used. The evenly mixed coating composition is applied to surface polished solid wood or plywood. The process of painting on solid wood or plywood is as follows.
① 표면 연마한 원목 또는 합판을 충분히 건조한다.① Dry the surface polished solid wood or plywood sufficiently.
② 충분히 건조된 합판에 배합된 코팅용 조성물을 두께 약 5㎛ 정도로 일차 코팅한다.② First coat the coating composition blended to the sufficiently dried plywood with a thickness of about 5㎛.
③ 일차 코팅된 원목 또는 합판을 섭씨온도 20도 내지 23도,상대습도 55 내지 65의 범위에서 6시간 건조한다.③ The primary coated wood or plywood is dried for 6 hours in the range of 20 degrees to 23 degrees Celsius, 55 to 65 relative humidity.
④ 일차 코팅 및 건조 공정을 2 내지 3회 반복하여 최종 제품으로 한다.④ Repeat the primary coating and drying process 2-3 times to make the final product.
이하, 본 발명의 실시예를 상세히 설명하면 아래와 같고, 본 발명이 하기 실시예의 의해 제한되는 것은 아니며, 특허청구의 범위를 벗어나지 않는 범위 내에서 본 발명의 기술이 속하는 분야의 당업자에 의해 변형될 수 있음은 자명하다.Hereinafter, the embodiments of the present invention will be described in detail as follows, and the present invention is not limited by the following examples, and may be modified by those skilled in the art to which the technology of the present invention belongs without departing from the scope of the claims. It is self-evident.
실시예Example
표 1의 조성비에 따라 탄소섬유와 탄소 함량 99 중량부 이상인 흑연을 옻나무에서 추출한 옻 원액과 에탄올의 비율이 1:4인 마루판 코팅용 조성물에 첨가하여 혼합속도 60 rpm으로 60분간 고르게 혼합하였다. 원목 시편은 이태리에서 수입되는조르지아 원목으로 하였다. 원목의 표면을 사포로 연마한 후, 상기에서 제조한 탄소섬유와 흑연이 옻과 에탄올 혼합액에 고르게 분산되어 있는 코팅용 조성물로 3회도포 하였다. 건조조건은 섭씨온도 21도, 상대습도 60의 조건으로 6시간 건조하였다. 최종 3차 가공 후 건조된 시편을 바닥면에 30 cm 격자모양으로 동테이프로 연결한 후 ESD S 57.1에 의거하여 저항을 측정하였다.According to the composition ratio of Table 1, carbon fiber and graphite having a carbon content of 99 parts by weight or more were added to the floorboard coating composition having a ratio of 1: 4 of lacquer extract extracted from lacquer and ethanol, and mixed evenly at 60 rpm at a mixing speed of 60 rpm. The wood specimens were made of Georgian timber imported from Italy. After polishing the surface of the solid wood with sandpaper, the carbon fiber and graphite prepared above were applied three times with a coating composition in which the lacquer and ethanol mixture were evenly dispersed. Drying conditions were dried for 6 hours under conditions of 21 degrees Celsius and 60 relative humidity. After the final tertiary processing, the dried specimen was connected to the bottom surface with copper tape in the form of a 30 cm grid, and the resistance was measured according to ESD S 57.1.
실시예에서 보는 바와 같이 표면-표면 저항값 및 표면-접지 저항값이 2.5×104Ω ∼ 1.0×106Ω 으로 바람직한 전자파 차폐성능을 나타냄을 확인하였다.As shown in the examples, it was confirmed that the surface-surface resistance value and the surface-earth resistance value exhibit the desirable electromagnetic shielding performance of 2.5 × 10 4 kV to 1.0 × 10 6 kW.
이상에서 살펴본 바와 같이, 본 원 발명에서의 탄소섬유와 제철소 전로에서 폐기되는 폐흑연재 또는 탄소함량 99 중량부 이상인 흑연을 천연 옻나무 추출액과 에탄올로 혼합된 코팅용 조성물에 고르게 분산 혼합하여 사용한 목재 마루판은 전자파 차페 및 전자파 흡수 성능이 우수하여 전자파 차폐 및 전자파 흡수성능이 요구되는 공동주택 등의 거실에 매우 유용하게 활용될 수 있다.As described above, the wood floorboard used by uniformly dispersing and mixing the carbon fiber and waste graphite discarded in the steel mill converter or graphite having a carbon content of 99 parts by weight or more in a coating composition mixed with natural lacquer extract and ethanol It is excellent in electromagnetic shielding and electromagnetic wave absorbing performance can be very useful in the living room, such as apartment houses where electromagnetic shielding and electromagnetic wave absorbing performance is required.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR20040084873A (en) * | 2004-07-27 | 2004-10-06 | 이정빈 | A composite of bio-functional wooden floor board and preparation method thereof |
| KR101252097B1 (en) * | 2011-11-17 | 2013-04-12 | 호남대학교 산학협력단 | Shield board and method of manufacturing the same |
| KR20180127807A (en) * | 2017-05-22 | 2018-11-30 | 한밭대학교 산학협력단 | Lacquer Paint Composition for Shielding Electromagnetic Waves and the Fabrication Method Thereof |
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| JP2624274B2 (en) * | 1987-12-04 | 1997-06-25 | 電気化学工業株式会社 | Conductive hydraulic composition |
| JPH05286748A (en) * | 1992-04-10 | 1993-11-02 | Sekisui Chem Co Ltd | Production of hydraulic composition and conductive hardened body |
| KR100281697B1 (en) * | 1998-06-05 | 2001-03-02 | 노영민 | Conductive composite |
| KR100348865B1 (en) * | 1999-12-23 | 2002-08-17 | 태산도장 주식회사 | Oriental lacquer formulations with improved electrical properties and method for curing the same |
| KR100434199B1 (en) * | 2001-06-29 | 2004-06-04 | 김차봉 | Anti-corrosive epoxy coating composition containing lacquer |
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| KR20040084873A (en) * | 2004-07-27 | 2004-10-06 | 이정빈 | A composite of bio-functional wooden floor board and preparation method thereof |
| KR101252097B1 (en) * | 2011-11-17 | 2013-04-12 | 호남대학교 산학협력단 | Shield board and method of manufacturing the same |
| KR20180127807A (en) * | 2017-05-22 | 2018-11-30 | 한밭대학교 산학협력단 | Lacquer Paint Composition for Shielding Electromagnetic Waves and the Fabrication Method Thereof |
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