KR101244883B1 - Anti-reflecting board having anti-fingerprint function and manufacturing method thereof - Google Patents

Anti-reflecting board having anti-fingerprint function and manufacturing method thereof Download PDF

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Publication number
KR101244883B1
KR101244883B1 KR1020120027739A KR20120027739A KR101244883B1 KR 101244883 B1 KR101244883 B1 KR 101244883B1 KR 1020120027739 A KR1020120027739 A KR 1020120027739A KR 20120027739 A KR20120027739 A KR 20120027739A KR 101244883 B1 KR101244883 B1 KR 101244883B1
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KR
South Korea
Prior art keywords
fingerprint
reflection
layer
substrate
forming
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KR1020120027739A
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Korean (ko)
Inventor
윤정흠
나종주
이건환
권정대
이성훈
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한국기계연구원
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Priority to KR1020120027739A priority Critical patent/KR101244883B1/en
Priority to PCT/KR2012/003495 priority patent/WO2013141442A1/en
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Publication of KR101244883B1 publication Critical patent/KR101244883B1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/111Anti-reflection coatings using layers comprising organic materials
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11Anti-reflection coatings
    • G02B1/113Anti-reflection coatings using inorganic layer materials only
    • G02B1/115Multilayers
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/12Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation

Abstract

Disclosed are an antireflective substrate provided with anti-fingerprint characteristics and a method of manufacturing the same. Preparing a base substrate capable of transmitting light; Forming a plurality of protrusion structures on the surface of the base substrate using a dry etching method, and forming an anti-reflection structure that can prevent reflection of light on each of the plurality of protrusion structures by deposition of inorganic particles, An antireflective substrate provided with an anti-fingerprint property including forming an antireflective layer on a substrate surface and a method of manufacturing the same are provided.

Description

Anti-reflective substrate with anti-fingerprint property and manufacturing method thereof {Anti-reflecting board having anti-fingerprint function and manufacturing method

The present invention relates to an antireflection substrate provided with an anti-fingerprint property and a method of manufacturing the same.

Due to the emergence of portable electronic devices such as mobile phones, smart phones, tablet PCs, etc., which have recently increased in use, optical properties of screen protection substrates for protecting screens of portable electronic devices made of tempered glass, polymer, etc. need to be improved. There is. In addition, the need for a substrate that can directly replace the screen of the portable electronic device, rather than the screen protection substrate is also increasing.

At present, the technical requirements for the implementation of flexible devices for use in screens of portable electronic devices are widely used in displays, thin films, and organic solar cells represented by LCDs and LEDs. As a technical prerequisite for the implementation of the flexible device, the existing glass substrate must be replaced with the flexible polymer substrate. Polymer substrates are mechanically flexible and lightweight, which increases the degree of freedom of product design while requiring optical properties and chemical stability comparable to those of glass.

The improvement of light transmittance through the adjustment of the anti-reflective properties, the enhancement of the contrast, the removal of the ghost image, etc. are known as the core element technology for commercialization of the transparent polymer substrate. These elemental techniques, which cannot be fully realized with polymer-specific material properties, have been attempted through chemical and structural modifications on the surface of polymer substrates and the addition of heterogeneous coating materials.

In the related art, there is a publication 2010-0099092.

Embodiments of the present invention provide an anti-reflection substrate having an anti-fingerprint characteristic, in which optical properties are improved by preventing reflection of light through pretreatment of the surface of the base substrate to improve transmittance.

According to an aspect of the present invention, preparing a base substrate capable of transmitting light, forming a plurality of projection structures on the surface of the base substrate using a dry etching method, a plurality of projections by the deposition of inorganic particles Reflective with anti-fingerprint characteristics, comprising: forming an antireflective structure capable of preventing reflection of light on each of the type structures, forming an antireflective layer on the surface of the base substrate, and forming an anti-fingerprint layer on the antireflective layer surface An anti-substrate manufacturing method is provided.

Forming the anti-fingerprint layer is cyclomethicone (Cyclomethicone, C8H24Si4O4), hexamethyldioxane (HMDSO), octamethylcyclotetrasiloxane (OMCTS), 2-fluoro-6-methoxybenzaldehyde, 3-fluoro- 4 methoxybenzaldehyde, 4-fluoro-3 methoxybenzaldehyde, 5-fluoro-2 methoxybenzaldehyde, 2-fluoro-6 methoxyphenol, 4-fluoro-2 methoxyphenol and 5-fluoro- At least one of 3 methoxysalicylaldehyde may be deposited to form an anti-fingerprint layer.

The anti-fingerprint layer may be formed including at least one of methyl group (CH 3) and carbon fluoride group (CF).

In the forming of the plurality of protrusion structures, the plurality of protrusion structures may be formed on the surface of the base substrate by using a plasma dry etching method.

In the forming of the anti-reflection layer, inorganic particles may be deposited by plasma thin film to form an anti-reflection structure.

The antireflective structures are arranged at intervals of 20 nm or more and 200 nm or less, and the forming of the plurality of protruding structures may include diameters and arrangement intervals of the plurality of protruding structures so that the antireflective structures may be arranged at intervals of 20 nm or more and 200 nm or less. Controlling the etching exposure time to adjust the pressure.

Controlling the etching exposure time may make the etching exposure time less than 7 minutes.

Forming the antireflective layer may be made of an antireflective structure disposed adjacent to each other.

In the forming of the antireflection layer, a spherical antireflection structure may be formed.

After forming the anti-reflection layer, the method may further include forming a continuous thin film layer on the surface of the anti-reflection layer.

In the forming of the continuous thin film layer, the continuous thin film layer may be formed using the same material as the inorganic particles.

The continuous thin film layer may be formed with a thickness of 5 nm or more and 100 nm or less.

The surface of the base substrate may be provided with a reinforcing coating layer.

Forming the plurality of protrusion structures using a dry etching method may use at least one gas selected from Ar, O 2, H 2, He, and N 2.

The inorganic particles may include at least one selected from Si, Al, Ti, Zn, Fe-based oxides, nitrides, and magnesium fluoride.

The base substrate is at least one selected from fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39, and polyurethane. It can be made, including.

According to another aspect of the present invention, a base substrate capable of transmitting light, a plurality of projection structure formed on one surface of the base substrate, a plurality of projection structure formed on the anti-reflective structure formed by the deposition of inorganic particles There is provided an antireflection substrate having anti-fingerprint characteristics, including an anti-reflection layer formed on the surface of the base substrate and an anti-fingerprint layer formed on the surface of the antireflection layer.

The anti-fingerprint layer is cyclomethicone (C8H24Si4O4), hexamethyldioxane (HMDSO), octamethylcyclotetrasiloxane (OMCTS), 2-fluoro-6-methoxybenzaldehyde, 3-fluoro-4 methoxybenzaldehyde , 4-fluoro-3 methoxybenzaldehyde, 5-fluoro-2 methoxybenzaldehyde, 2-fluoro-6 methoxyphenol, 4-fluoro-2 methoxyphenol and 5-fluoro-3 methoxysal At least one of the silaldehydes may be deposited to form an anti-fingerprint layer.

The anti-fingerprint layer may be formed including at least one of methyl group (CH 3) and carbon fluoride group (CF).

The plurality of protrusion structures may be formed on the surface of the base substrate by using a plasma dry etching method.

The antireflection layer may be formed of an antireflection structure formed by depositing inorganic particles with a plasma thin film.

The antireflective structure may be arranged at intervals of 20 nm or more and 200 nm or less.

The antireflection layer may be made of an antireflection structure disposed adjacent to each other.

The antireflection structure may be formed in a spherical shape.

In this case, the continuous thin film layer interposed between the anti-reflection layer and the fingerprint protection layer may be further included.

The continuous thin film layer may be formed using the same material as the inorganic particles.

The continuous thin film layer may be formed with a thickness of 5 nm or more and 100 nm or less.

The base substrate may be provided with a reinforcing coating layer on the surface of the base substrate.

The inorganic particles may include at least one selected from Si, Al, Ti, Zn, Fe-based oxides, nitrides, and magnesium fluoride.

The base substrate is at least one selected from fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39, and polyurethane. It can be made, including.

According to embodiments of the present invention, before the step of forming the anti-reflection layer by pre-treating the surface of the base substrate by using a dry etching method such as plasma, the array spacing and size of the anti-reflection structure forming the anti-reflection layer to be formed later It can be controlled easily. Therefore, the optical and physical properties of the antireflective substrate with anti-fingerprint properties can also be easily controlled.

1 is a schematic view showing an anti-reflection substrate provided with anti-fingerprint characteristics according to an embodiment of the present invention.
2 is a flowchart illustrating a method of manufacturing an antireflective substrate having an anti-fingerprint property according to another embodiment of the present invention in order.
3 to 5 and 7 to 8 are process diagrams sequentially showing a method of manufacturing an anti-reflective substrate having an anti-fingerprint property according to another embodiment of the present invention.
Figure 6 is a view showing the actual structure of the anti-reflective substrate provided with a fingerprint preventing property according to an embodiment of the present invention.
9 is a view showing the transmittance of light with the dry etching treatment time of the antireflective substrate with a fingerprint protection characteristics according to another embodiment of the present invention.
10 illustrates an antireflective structure arranged adjacent to each other in accordance with an embodiment of the present invention.
11 is a view showing the durability measurement results of the anti-reflective substrate provided with a fingerprint protection characteristic according to an embodiment of the present invention.
12 is a view showing the durability measurement results according to the anti-reflection substrate with a known anti-fingerprint property.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, components, or a combination thereof.

Hereinafter, an embodiment of an anti-reflective substrate equipped with an anti-fingerprint property according to the present invention and a method of manufacturing the same will be described in detail with reference to the accompanying drawings. The same reference numerals will be given and redundant description thereof will be omitted.

1 is a view showing an anti-reflective substrate having an anti-fingerprint property according to an embodiment of the present invention, Figure 2 is an anti-reflective substrate having an anti-fingerprint property according to another embodiment of the present invention A flowchart showing the methods in order.

As shown in FIG. 2, according to an embodiment of the present invention, the preparing of the base substrate 110 (s100), the forming of the plurality of protrusion structures 120 (s200), and the forming of the anti-reflection layer 130 ( Provided is a method for manufacturing an anti-reflection substrate having an anti-fingerprint property including an s300 and an anti-fingerprint layer 150 (s500).

The base substrate 110 preparing step (s100) is a step of preparing the base substrate 110 made of a material capable of transmitting light.

Base substrate 110 is a fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and polyurethane so as to transmit light It may comprise at least one selected from (polyiourethane).

Since the base substrate 110 according to the present embodiment may be made of a transparent polymer material, the base substrate 110 may be easily used in a place such as a display screen of a portable electronic device in which light must be transmitted smoothly.

At this time, the base substrate 110 according to the present embodiment may be formed including a reinforcement coating layer formed on the surface.

The reinforcement coating layer may improve physical properties such as strength and hardness of the base substrate 110, and may also improve adhesion of the anti-reflection layer 130 stacked on the base substrate 110. In addition, due to the formation of the reinforcing coating layer, the optical properties of the base substrate 110 may also be improved, and chemical resistance properties may also be improved.

The polymer paint used to form the reinforcement coating layer may be a polymer paint composed of at least one of acrylic, polyurethane, epoxy, and primer paints, and in addition to the above-described effects on the base substrate 110. Any polymer paint that can be included in the scope of the present invention.

In addition, the reinforcing coating layer provided according to the present embodiment may be formed by mixing the metal oxide, sulfide, alumina, silica, zirconium oxide, iron oxide, and the like, which are inorganic fine particles, with the above-described polymer paint.

Forming the plurality of protrusion structures 120 (s200), unlike the conventional wet etching method, as shown in Figure 4, using a dry etching method on the surface of the base substrate 110 a plurality of protrusion structures ( 120).

When the dry etching method is used, the formation of the plurality of protrusion structures 120 may be controlled more precisely and accurately than when etching using the wet etching method.

The dry etching method according to the present embodiment may be a plasma dry etching method.

In this case, the material used in the plasma dry etching method according to the present embodiment may be at least one gas selected from Ar, O 2 , H 2 , He, and N 2 .

According to the present exemplary embodiment, when the base substrate 110 is exposed to a plasma including at least one of the above-described gaseous materials, the surface of the base substrate 110 is etched to form the plurality of protrusion structures 120. Can be formed.

At this time, the optical properties of the antireflective substrate provided with the anti-fingerprint property provided according to the present embodiment is controlled by the anti-reflection layer 130 made of the anti-reflective structure described in detail below, and controlling the distance between the anti-reflective structures In order to control the spacing between the plurality of protrusion-like structures 120 are formed.

Therefore, the etching exposure time of the plurality of protrusion structures 120 according to the present exemplary embodiment may be controlled for the optical characteristics of the anti-reflection layer 130.

In particular, in order to form the plurality of protrusion structures 120 provided according to the present embodiment, the time for exposing the base substrate 110 to the plasma may be controlled to less than 7 minutes.

FIG. 9 is a graph illustrating a change in the anti-reflection characteristics of the anti-reflection substrate provided with the anti-fingerprint characteristics according to the time when the base substrate 110 is exposed to the plasma.

As shown in FIG. 9, the optical properties of the antireflective substrate provided with the anti-fingerprint property provided in accordance with the present embodiment indicate a maximum value when the plasma exposure time is about 3 minutes, and the plasma exposure time is 7 minutes or more. In this case, optical characteristics similar to those when not exposed to plasma are exhibited.

Therefore, the plasma exposure time in the forming of the plurality of protrusion structures 120, which is provided as a pretreatment of the base substrate 110 to form the anti-reflection layer 130 according to the present embodiment, may be less than 7 minutes.

Forming the anti-reflection layer 130 (s300), as shown in Figure 5, by depositing the inorganic particles on the plurality of projection structure 120 formed by a dry etching method on the surface of the base substrate 110, respectively, The anti-reflective structure is formed on the protruding structure of the anti-reflective layer 130.

FIG. 6 is a view showing a micrograph of the actual state of the anti-reflection layer 130 formed according to the embodiment of the present invention.

The inorganic particles provided according to the present embodiment may be a metal material (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Oxides and nitrides of Si, Sn, Ta, Te, Ti, W, Zn, Zr, Yb etc), and oxide-nitride compounds (Alnitrides: AlON, SiON) and magnesium fluoride In at least one can be made, including.

Accordingly, the anti-reflection layer 130 formed through the inorganic particles described above may also prevent reflection of light, thereby contributing to the improvement of light transmittance.

According to the present exemplary embodiment, the method of depositing inorganic particles may be a deposition method using plasma, similarly to forming the plurality of protrusion structures 120.

When the inorganic particles are deposited by the plasma method, the inorganic particles are uniformly deposited in a valley between the plurality of protrusion structures 120 and the plurality of protrusion structures 120 at an initial stage of deposition.

However, over time, due to the shadow effect of the plasma particles, the inorganic particles reaching the surface of the base substrate 110 on the plasma made of gas, the plurality of projection structure 120 and the plurality of projections Since the antireflective structure grows on the upper portion of the mold structure 120, a phenomenon in which the valley between the plurality of protrusion structures 120 may not be reached may occur.

Therefore, since the inorganic particles deposited on the plurality of protrusion structures 120 are increased, the inorganic particles are eventually deposited only on the plurality of protrusion structures 120.

In addition, in the plasma sheath proximate to the base substrate 110 by a distance of several mm, an unbalanced accumulation of negative charges occurs in a portion protruding from the surface of the base substrate 110, which is positively charged ions. The phenomenon that induces concentration of the reaction gas is generated.

As a result, the reaction gas is concentrated on the plurality of protrusion structures protruding in a direction perpendicular to the surface of the base substrate 110 so that the antireflection structure is concentrated only on the upper portions of the plurality of protrusion structures 120.

Based on the two causes described above, as shown in FIGS. 5 and 6, an antireflection structure having a unit particle structure is formed on each of the plurality of protrusion structures 120.

In this case, the anti-reflection structure formed on each of the plurality of protrusion structures 120 may be formed in a spherical shape, as shown in FIGS. 5 and 6.

The antireflective structure provided according to the present embodiment may be arranged at intervals of 200 nm or less to increase the transmission efficiency of light and to prevent the reflection of light.

At this time, the base substrate 110 provided in accordance with the present embodiment, by controlling the plasma exposure time to adjust the arrangement interval between the plurality of the projection-like structure 120 can be adjusted to the arrangement interval of the anti-reflective structure same.

On the other hand, the anti-reflection layer 130 may be disposed adjacent to each other, not only to increase the optical characteristics, but also to improve the physical characteristics.

10 shows an antireflective structure disposed adjacent to each other.

As shown in FIG. 10, when the antireflective structures are disposed adjacent to each other, physical properties such as strength and durability are increased as compared to otherwise.

FIG. 11 sets an antireflective substrate having an anti-fingerprint property in which antireflective structures are disposed adjacent to each other as an experimental group, and FIG. 12 sets a substrate including a coating layer that is simply continuously formed without forming an antireflective structure as a control. The results of performing the wear resistance tester reliability tester using an eraser wear tester (Rubbing tester).

The tester conditions were to set the type of rubber eraser (1/4 in diameter) as the friction, the load was set to 500 grams, the test speed 40 times / min and the number of tests 1500 times, the analysis of the results of the anti-reflection layer 130 and The water repellent properties were evaluated by measuring the contact angle of H 2 O before and after the eraser wear test of the coating layer.

As shown in FIG. 11, the antireflective layer 130 including the antireflective structures disposed adjacent to each other has a smaller variation in the contact angle of H 2 O than the continuous coating layer shown in FIG. 12 even after the eraser wear test. In physical properties such as durability, better results are shown.

The anti-fingerprint layer 150 forming step (s500), as shown in Figure 8, has a water repellent function to flow down without being absorbed when water is buried, and has a fingerprint protection layer having a fingerprint function to prevent the user's fingerprints ( 150 is formed on the surface of the anti-reflection layer 130.

At this time, the anti-fingerprint layer 150 is cyclomethicone (Cyclomethicone, C8H24Si4O4), hexamethyldioxane (HMDSO), octamethylcyclotetrasiloxane (OMCTS), 2-fluoro-6-methoxybenzaldehyde, 3-fluoro -4 methoxybenzaldehyde, 4-fluoro-3 methoxybenzaldehyde, 5-fluoro-2 methoxybenzaldehyde, 2-fluoro-6 methoxyphenol, 4-fluoro-2 methoxyphenol and 5-fluoro It can be formed by depositing at least one of -3 methoxysalicylaldehyde.

In addition, it may be formed including at least one of the methyl group (CH3) or fluorocarbon group (CF).

In this case, the anti-reflection substrate provided with the anti-fingerprint property provided according to the present embodiment may further include forming the continuous thin film layer 140 (S400).

The continuous thin film layer 140 is formed on the surface of the anti-reflection layer 130, and in order to further improve physical properties such as strength, hardness, and durability of the anti-reflection substrate provided with anti-fingerprint properties, the anti-reflection having a unit particle structure It is a layer of material with a continuous face formed on the surface of the structure.

The continuous thin film layer 140 provided according to the present embodiment may be formed using the same material as the inorganic particles used to form the anti-reflection layer 130.

In the case of using the same material as the anti-reflection layer 130, it is easy to control optical characteristics such as refraction of light, and troublesomeness may be reduced in the manufacturing process.

Meanwhile, the continuous thin film layer 140 provided according to the present embodiment may be formed to have a thickness of 5 nm or more and 100 nm or less for controlling the optical characteristics.

The continuous thin film layer 140 provided according to the present embodiment may be formed by deposition of inorganic particles.

In addition to the above-described plasma deposition method, it may be formed using various methods generally used for deposition of materials, such as deposition methods such as physical vapor deposition (PVD) and chemical vapor deposition (CVD). Of course.

In addition to the vapor deposition method, the space between the spherical antireflective structure forming the antireflective layer 130 and the surface of the antireflective layer 130 include liquid polymer particles such as sol-gel or dipping. The method of forming the continuous thin film layer 140 by applying to may be used.

As described above, the method for manufacturing an antireflective substrate provided with the anti-fingerprint characteristic provided in accordance with the present embodiment may be performed by using a dry etching method such as a plasma before forming the antireflection layer 130. By pre-treating the surface of the 110, it is possible to easily control the interval and size of the anti-reflective structure forming the anti-reflection layer 130 to be formed later.

Therefore, a method of manufacturing an anti-reflective substrate having an anti-fingerprint characteristic, which can be easily controlled, may also provide an optical and physical property of the anti-reflective substrate having the anti-fingerprint characteristic.

Hereinafter, a description will be given of an anti-reflection substrate having an anti-fingerprint characteristic manufactured by the method for manufacturing an anti-reflection substrate having the anti-fingerprint characteristic described above.

According to another embodiment of the present invention, an anti-reflection substrate having an anti-fingerprint property including a base substrate 110, a plurality of protrusion structures 120, and an anti-reflection layer 130 is provided.

The base substrate 110 is a substrate made of a material capable of transmitting light. The base substrate 110 is a fluorine-based transparent polymer film, an acrylic transparent polymer film, a polyethylene terephthalate series transparent polymer film, polycarbonate, polyethylene naphthalate, It may comprise at least any one selected from polyethersulfone, polycycloolefin, CR39 and polyurethane (polyiourethane).

Since the base substrate 110 according to the present embodiment may be made of a transparent polymer material, the base substrate 110 may be easily used in a place such as a display screen of a portable electronic device in which light must be transmitted smoothly.

At this time, the base substrate 110 according to the present embodiment may be formed including a reinforcement coating layer formed on the surface.

The reinforcement coating layer may improve physical properties such as strength and hardness of the base substrate 110, and may also improve adhesion of the anti-reflection layer 130 stacked on the base substrate 110. In addition, due to the formation of the reinforcing coating layer, the optical properties of the base substrate 110 may also be improved, and chemical resistance properties may also be improved.

The polymer paint used to form the reinforcement coating layer may be a polymer paint composed of at least one of acrylic, polyurethane, epoxy, and primer paints, and in addition to the above-described effects on the base substrate 110. Any polymer paint that can be included in the scope of the present invention.

In addition, the reinforcing coating layer provided according to the present embodiment may be formed by mixing a metal oxide, sulfide, alumina, silica, zirconium oxide, iron oxide, and the like, which are inorganic fine particles, with the above-described polymer paint.

The plurality of protrusion structures 120 are portions formed by etching the surface of the base substrate 110 by a dry etching method.

As described above, the optical properties of the antireflective substrate with anti-fingerprint properties provided according to the present embodiment are controlled by the anti-reflection layer 130 made of the anti-reflective structure. In addition, the spacing between the antireflective structures is controlled by the spacing between the plurality of protrusion structures 120 in which the antireflective structures are formed.

Therefore, as will be described later, the intervals between the plurality of protrusion structures 120 on which the antireflective structures are formed may also be controlled to be arranged at intervals of 200 nm or less so that the antireflective structures can be arranged at intervals of 200 nm or less. Can be.

Control of the spacing between the plurality of protrusion structures 120 is achieved by controlling the time exposed to the dry etching such as plasma.

The anti-reflection layer 130 may be formed on the plurality of protrusion structures 120 formed by a dry etching method on the surface of the base substrate 110 in order to control the optical and physical properties of the anti-reflection substrate having the anti-fingerprint property. It is a layer which consists of an anti-reflective structure formed in each protrusion structure by depositing inorganic particle.

The inorganic particles provided according to the present embodiment may be a metal material (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Oxides and nitrides of Si, Sn, Ta, Te, Ti, W, Zn, Zr, Yb etc), and oxide-nitride compounds (Alnitrides: AlON, SiON) and magnesium fluoride In at least one can be made, including.

Accordingly, the anti-reflection layer 130 formed through the inorganic particles described above may also prevent reflection of light, thereby contributing to the improvement of light transmittance.

According to the present exemplary embodiment, the method of depositing inorganic particles may be a deposition method using plasma, similarly to forming the plurality of protrusion structures 120.

As described above, the antireflective structure provided according to the present embodiment may be arranged at intervals of 200 nm or less in order to increase light transmission efficiency and prevent light reflection.

In addition, the base substrate 110 provided in accordance with the present embodiment, by controlling the plasma exposure time to adjust the arrangement interval between the plurality of the projection-like structure 120 can also adjust the arrangement interval of the anti-reflective structure as described above same.

In this case, the antireflective structures may be disposed adjacent to each other, and due to the antireflective layer 130 formed by the antireflective structures disposed adjacent to each other, physical properties such as strength and durability of an antireflective substrate having anti-fingerprint characteristics are provided. The characteristic is increased.

Experimental results related to this are shown in FIGS. 11 and 12, and as shown in FIG. 11, an anti-reflection layer 130 including an anti-reflective structure disposed adjacent to each other is formed by the continuous coating layer shown in FIG. 12. Even after the eraser abrasion test, the variation in the contact angle of H 2 O is small, and the results are superior in physical properties such as strength and durability.

The anti-fingerprint layer 150 is a functional thin film having a water repellent function so as to flow down without being absorbed when water gets into it, and having a fingerprint-proof function to prevent the fingerprint of the user from being buried, and formed on the surface of the anti-reflection layer 130.

At this time, the anti-fingerprint layer 150 is cyclomethicone (Cyclomethicone, C8H24Si4O4), hexamethyldioxane (HMDSO), octamethylcyclotetrasiloxane (OMCTS), 2-fluoro-6-methoxybenzaldehyde, 3-fluoro -4 methoxybenzaldehyde, 4-fluoro-3 methoxybenzaldehyde, 5-fluoro-2 methoxybenzaldehyde, 2-fluoro-6 methoxyphenol, 4-fluoro-2 methoxyphenol and 5-fluoro It can be formed by depositing at least one of -3 methoxysalicylaldehyde.

In addition, it may be formed including at least one of the methyl group (CH3) or fluorocarbon group (CF).

In this case, the anti-reflection substrate provided with the anti-fingerprint property provided according to the present embodiment may further include forming the continuous thin film layer 140.

The anti-reflective substrate provided with the anti-fingerprint property provided according to the present embodiment may further include a continuous thin film layer 140.

The continuous thin film layer 140 is formed on the surface of the anti-reflection layer 130, and in order to further improve physical properties such as strength, hardness, and durability of the anti-reflection substrate provided with anti-fingerprint properties, the anti-reflection having a unit particle structure It is a layer of material with a continuous face formed on the surface of the structure.

The continuous thin film layer 140 provided according to the present embodiment may be formed using the same material as the inorganic particles used to form the anti-reflection layer 130.

In the case of using the same material as the anti-reflection layer 130, it is easy to control optical characteristics such as refraction of light, and troublesomeness may be reduced in the manufacturing process.

Meanwhile, the continuous thin film layer 140 provided according to the present embodiment may be formed to have a thickness of 5 nm or more and 100 nm or less for controlling the optical characteristics.

As described above, the anti-reflective substrate provided with the anti-fingerprint property provided in accordance with the present embodiment may be formed by using a dry etching method such as plasma before the anti-reflection layer 130 is formed. By preprocessing, it is possible to easily control the arrangement interval and size of the anti-reflective structure forming the anti-reflection layer 130 to be formed later.

Therefore, an anti-reflection substrate having an anti-fingerprint characteristic, which can be easily controlled, may also be provided with the optical and physical characteristics of the anti-reflection substrate having the anti-fingerprint characteristic.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

110: Base substrate
120: a plurality of protrusion structures
130: antireflection layer
140: continuous thin film layer
150: anti-fingerprint layer

Claims (30)

Preparing a base substrate capable of transmitting light;
Forming a plurality of protruding structures on the surface of the base substrate using a dry etching method;
Forming an antireflection structure on the surface of the base substrate by forming an antireflection structure capable of preventing reflection of light on each of the plurality of protrusion structures by deposition of inorganic particles; And
The method of manufacturing an anti-reflection substrate provided with an anti-fingerprint property comprising the step of forming an anti-fingerprint layer on the surface of the anti-reflection layer.
The method of claim 1,
Forming the anti-fingerprint layer,
Cyclomethicone (C8H24Si4O4), hexamethyldioxane (HMDSO), octamethylcyclotetrasiloxane (OMCTS), 2-fluoro-6-methoxybenzaldehyde, 3-fluoro-4 methoxybenzaldehyde, 4-fluoro At least one of rho-3 methoxybenzaldehyde, 5-fluoro-2 methoxybenzaldehyde, 2-fluoro-6 methoxyphenol, 4-fluoro-2 methoxyphenol and 5-fluoro-3 methoxysalicylaldehyde Method of manufacturing an anti-reflection substrate with a fingerprint protection, characterized in that for depositing any one to form the fingerprint protection layer.
The method of claim 1,
The anti-fingerprint layer,
Method for manufacturing an anti-reflection substrate provided with an anti-fingerprint characteristic, characterized in that it comprises at least one of methyl group (CH3) or carbon fluoride group (CF).
The method of claim 1,
Forming the plurality of protrusion structures,
A method of manufacturing an anti-reflection substrate with a fingerprint protection, characterized in that to form a plurality of the projection structure on the surface of the base substrate using a plasma dry etching method.
The method of claim 1,
Forming the anti-reflection layer,
Plasma thin film deposition of the inorganic particles to form the anti-reflective structure characterized in that the anti-reflection substrate provided with a fingerprint.
The method of claim 1,
The antireflective structures are arranged at intervals of 20 nm or more and 200 nm or less,
Forming the plurality of protrusion structures,
And controlling an etching exposure time to adjust diameters and arrangement intervals of the plurality of protruding structures so that the antireflective structures are arranged at intervals of 20 nm or more and 200 nm or less. Antireflective substrate manufacturing method.
The method according to claim 6,
Controlling the etching exposure time,
The anti-reflective substrate manufacturing method provided with the anti-fingerprint characteristic characterized by the said etching exposure time being less than 7 minutes.
The method of claim 1,
Forming the anti-reflection layer,
The anti-reflection substrate manufacturing method provided with the anti-fingerprint characteristic characterized by forming the anti-reflection layer made of the anti-reflection structure disposed adjacent to each other.
The method of claim 1,
Forming the anti-reflection layer,
The anti-reflective substrate manufacturing method provided with the anti-fingerprint characteristic characterized by forming the said anti-reflective structure of spherical shape.
The method of claim 1,
After forming the anti-reflection layer,
The method of manufacturing an anti-reflective substrate provided with an anti-fingerprint characteristic further comprising the step of forming a continuous thin film layer on the surface of the anti-reflection layer.
The method of claim 10,
Forming the continuous thin film layer,
The anti-reflective substrate manufacturing method with a fingerprint prevention characteristic characterized by forming the said continuous thin film layer using the same material as said inorganic particle.
The method of claim 10,
The continuous thin film layer,
The anti-reflection substrate manufacturing method provided with the anti-fingerprint characteristic characterized in that it is formed in thickness of 5 nm or more and 100 nm or less.
The method of claim 1,
The anti-reflective substrate manufacturing method provided with the anti-fingerprint characteristic characterized in that the surface of the base substrate may be provided with a reinforced coating layer.
The method of claim 1,
Forming the plurality of protrusion structures by using a dry etching method,
A method for manufacturing an anti-reflection substrate with anti-fingerprint characteristics, characterized in that it is dry etched including at least one gas selected from Ar, O 2 , H 2 , He and N 2 .
The method of claim 1,
The inorganic particles,
Metallic materials (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te, Ti, W , Zn, Zr, Yb etc) oxide and nitride, and oxide-nitride compound (oxynitride: AlON, SiON) and magnesium fluoride (Magnesium fluoride) at least one selected from the The anti-reflection board | substrate manufacturing method provided with the fingerprint prevention characteristic made into.
The method of claim 1,
The base substrate includes:
Fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and at least one selected from polyurethane (polyiourethane) A method of manufacturing an antireflection substrate provided with an anti-fingerprint characteristic.
A base substrate capable of transmitting light;
A plurality of protrusion structures formed on one surface of the base substrate;
An anti-reflection layer formed on the plurality of protruding structures, the anti-reflection structure formed by deposition of inorganic particles, and formed on a surface of the base substrate; And
An anti-reflection substrate provided with a fingerprint protection property comprising a fingerprint protection layer formed on the surface of the anti-reflection layer.
18. The method of claim 17,
The anti-fingerprint layer,
Cyclomethicone (C8H24Si4O4), hexamethyldioxane (HMDSO), octamethylcyclotetrasiloxane (OMCTS), 2-fluoro-6-methoxybenzaldehyde, 3-fluoro-4 methoxybenzaldehyde, 4-fluoro At least one of rho-3 methoxybenzaldehyde, 5-fluoro-2 methoxybenzaldehyde, 2-fluoro-6 methoxyphenol, 4-fluoro-2 methoxyphenol and 5-fluoro-3 methoxysalicylaldehyde The anti-reflection substrate provided with a fingerprint prevention characteristic, characterized in that for depositing any one to form the fingerprint protection layer.
18. The method of claim 17,
The anti-fingerprint layer,
An anti-reflection substrate provided with an anti-fingerprint characteristic, characterized in that it comprises at least one of a methyl group (CH3) or a fluorocarbon group (CF).
18. The method of claim 17,
The plurality of protrusion structures,
An anti-reflection substrate provided with a fingerprint prevention characteristic, characterized in that formed on the surface of the base substrate using a plasma dry etching method.
18. The method of claim 17,
The anti-reflection layer,
The anti-reflective substrate provided with the fingerprint prevention characteristic characterized by consisting of the said anti-reflective structure formed by depositing the said inorganic particle plasma thin film.
18. The method of claim 17,
The antireflection structure,
An anti-reflection substrate with anti-fingerprint characteristics, characterized in that arranged at intervals of 20nm or more and 200nm or less.
18. The method of claim 17,
The anti-reflection layer,
An anti-reflection substrate provided with anti-fingerprint characteristics, characterized in that the anti-reflective structure disposed adjacent to each other.
18. The method of claim 17,
The antireflection structure,
An anti-reflection substrate provided with anti-fingerprint characteristics, characterized in that formed in a spherical shape.
18. The method of claim 17,
The anti-reflection substrate provided with an anti-fingerprint characteristic further comprises a continuous thin film layer interposed between the anti-reflection layer and the anti-fingerprint layer.
26. The method of claim 25,
The continuous thin film layer,
The anti-reflection substrate with an anti-fingerprint characteristic, characterized in that formed using the same material as the inorganic particles.
26. The method of claim 25,
The continuous thin film layer,
An anti-reflection substrate provided with anti-fingerprint characteristics, characterized in that formed to a thickness of 5nm or more and 100nm or less.
18. The method of claim 17,
The base substrate includes:
An anti-reflection substrate provided with a fingerprint protection feature, characterized in that the surface of the base substrate may be provided with a reinforcement coating layer.
18. The method of claim 17,
The inorganic particles,
Metallic materials (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te, Ti, W , Zn, Zr, Yb etc) oxide and nitride, and oxide-nitride compound (oxynitride: AlON, SiON) and magnesium fluoride (Magnesium fluoride) at least one selected from the The antireflection board | substrate with a fingerprint prevention characteristic made into it.
18. The method of claim 17,
The base substrate includes:
Fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and at least one selected from polyurethane (polyiourethane) An antireflection substrate provided with an anti-fingerprint characteristic.
KR1020120027739A 2012-03-19 2012-03-19 Anti-reflecting board having anti-fingerprint function and manufacturing method thereof KR101244883B1 (en)

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PCT/KR2012/003495 WO2013141442A1 (en) 2012-03-19 2012-05-03 Anti-reflective substrate and manufacturing method therefor

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107683266A (en) * 2015-07-24 2018-02-09 株式会社度恩 Has figuratum clear glass
KR20180054139A (en) * 2016-11-15 2018-05-24 (주)도 은 Transparent substrate with pattern

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JP2001264511A (en) 2000-03-23 2001-09-26 Toppan Printing Co Ltd Antireflection member
KR20030042952A (en) * 2001-11-26 2003-06-02 소프트픽셀(주) Ferroelectric liquid crystal display and manufacturing method for cover layer and replector of it
KR20050043160A (en) * 2003-11-05 2005-05-11 한국화학연구원 Manufacturing method of fluorinated core-shell particles and composites containing fluorinated core-shell particles for front display panel
JP2006124417A (en) 2004-10-26 2006-05-18 Asahi Glass Co Ltd Stainproof layer-forming composition and reflection-preventing laminate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001264511A (en) 2000-03-23 2001-09-26 Toppan Printing Co Ltd Antireflection member
KR20030042952A (en) * 2001-11-26 2003-06-02 소프트픽셀(주) Ferroelectric liquid crystal display and manufacturing method for cover layer and replector of it
KR20050043160A (en) * 2003-11-05 2005-05-11 한국화학연구원 Manufacturing method of fluorinated core-shell particles and composites containing fluorinated core-shell particles for front display panel
JP2006124417A (en) 2004-10-26 2006-05-18 Asahi Glass Co Ltd Stainproof layer-forming composition and reflection-preventing laminate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107683266A (en) * 2015-07-24 2018-02-09 株式会社度恩 Has figuratum clear glass
KR20180054139A (en) * 2016-11-15 2018-05-24 (주)도 은 Transparent substrate with pattern

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