KR101244882B1 - Anti-reflecting double layer board and manufacturing method thereof - Google Patents

Anti-reflecting double layer board and manufacturing method thereof Download PDF

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Publication number
KR101244882B1
KR101244882B1 KR1020120027728A KR20120027728A KR101244882B1 KR 101244882 B1 KR101244882 B1 KR 101244882B1 KR 1020120027728 A KR1020120027728 A KR 1020120027728A KR 20120027728 A KR20120027728 A KR 20120027728A KR 101244882 B1 KR101244882 B1 KR 101244882B1
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KR
South Korea
Prior art keywords
substrate
double
sided
forming
antireflective
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KR1020120027728A
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Korean (ko)
Inventor
윤정흠
나종주
이건환
권정대
이성훈
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한국기계연구원
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Priority to KR1020120027728A priority Critical patent/KR101244882B1/en
Priority to PCT/KR2012/003495 priority patent/WO2013141442A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/111—Anti-reflection coatings using layers comprising organic materials
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/11—Anti-reflection coatings
    • G02B1/113—Anti-reflection coatings using inorganic layer materials only
    • G02B1/115—Multilayers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
    • G02B1/12—Optical coatings produced by application to, or surface treatment of, optical elements by surface treatment, e.g. by irradiation

Abstract

Disclosed are a double-sided antireflection substrate and a method of manufacturing the same. It is made of a material that can transmit light, and includes a base substrate including a first surface and a second surface, a first anti-reflection layer formed on the first surface and a second anti-reflection layer formed on the second surface, At least one of the anti-reflection layer and the second anti-reflection layer may include a plurality of protrusion structures formed on the surface of the base substrate and a plurality of protrusion structures, and include an anti reflection structure formed by deposition of inorganic particles. A double-sided antireflection substrate and a manufacturing method thereof are provided.

Description

Anti-reflecting double layer board and manufacturing method

The present invention relates to a double-sided antireflection substrate and a method of manufacturing the same.

Due to the emergence of portable electronic devices such as mobile phones, smart phones, tablet PCs, etc., which have recently increased in use, optical properties of screen protection substrates for protecting screens of portable electronic devices made of tempered glass, polymer, etc. need to be improved. There is. In addition, the need for a substrate that can directly replace the screen of the portable electronic device, rather than the screen protection substrate is also increasing.

At present, the technical requirements for the implementation of flexible devices for use in screens of portable electronic devices are widely used in displays, thin films, and organic solar cells represented by LCDs and LEDs. As a technical prerequisite for the implementation of the flexible device, the existing glass substrate must be replaced with the flexible polymer substrate. Polymer substrates are mechanically flexible and lightweight, which increases the degree of freedom of product design while requiring optical properties and chemical stability comparable to those of glass.

The improvement of light transmittance through the adjustment of the anti-reflective properties, the enhancement of the contrast, the removal of the ghost image, etc. are known as the core element technology for commercialization of the transparent polymer substrate. These elemental techniques, which cannot be fully realized with polymer-specific material properties, have been attempted through chemical and structural modifications on the surface of polymer substrates and the addition of heterogeneous coating materials.

In the related art, there is a publication 2010-0099092.

Embodiments of the present invention provide a double-sided anti-reflection substrate having a double-sided structure in which the optical properties are improved by improving the transmittance by preventing the reflection of light through pretreatment of the surface of the base substrate.

According to an aspect of the present invention, a light transmitting material is made of a base substrate including a first surface and a second surface, a first anti-reflection layer formed on the first surface, and a second surface formed on the second surface. An antireflection layer, wherein at least one of the first antireflection layer and the second antireflection layer is formed on a plurality of projection structures and a plurality of projection structures formed on the surface of the base substrate, and is formed by deposition of inorganic particles. A double sided antireflective substrate is provided comprising an antireflective structure.

The plurality of protrusion structures may be formed on the surface of the base substrate by using a plasma dry etching method.

The antireflection structure may be formed by depositing inorganic particles with a plasma thin film.

The antireflective structures may be arranged at intervals of 200 nm or less.

The antireflective structure may be composed of the antireflective structures disposed adjacent to each other.

The antireflection structure may be formed in a spherical shape.

It may further include a continuous thin film layer formed on the surface of the anti-reflection layer.

The continuous thin film layer may be formed using the same material as the inorganic particles.

The continuous thin film layer may be formed with a thickness of 5 nm or more and 100 nm or less.

The base substrate may be provided with a reinforcement coating layer on the surface of the base substrate.

Inorganic particles, metals (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te At least one selected from oxides and nitrides of Ti, W, Zn, Zr, and Yb, and compounds of oxide-nitrides (AlON, SiON) and magnesium fluoride Can be done.

The base substrate is at least one selected from fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39, and polyurethane. It can be made, including.

According to another aspect of the invention, the step of preparing a base substrate comprising a material capable of transmitting light, the first surface and the second surface, forming a first anti-reflection layer on the first surface and the second And forming a second anti-reflection layer on the surface, wherein at least one of the first anti-reflection layer formation step and the second anti-reflection layer formation step includes applying a plurality of protrusion structures to the surface of the base substrate using a dry etching method. A method of manufacturing a double-sided antireflection substrate is provided that includes forming an antireflection structure capable of preventing reflection of light on each of the plurality of protrusion structures by forming and depositing inorganic particles.

In the forming of the plurality of protrusion structures, the plurality of protrusion structures may be formed on the surface of the base substrate by using a plasma dry etching method.

In the forming of the anti-reflective structure, the inorganic particles may be deposited by plasma thin film to form an anti-reflective structure.

The antireflective structures are arranged at intervals of 200 nm or less, and the forming of the plurality of projecting structures may include adjusting the diameters and the arrangement intervals of the plurality of projecting structures so that the antireflective structures can be arranged at intervals of 200 nm or less. Controlling the etch exposure time.

Controlling the etching exposure time may make the etching exposure time less than 7 minutes.

Forming the antireflective structure may form an antireflective structure comprising the antireflective structures disposed adjacent to each other.

Forming the antireflective structure may form a spherical antireflective structure.

After the forming of the first anti-reflection layer and the forming of the second anti-reflection layer, the method may further include forming a continuous thin film layer on at least one surface of the first anti-reflection layer and the second anti-reflection layer.

In the forming of the continuous thin film layer, the continuous thin film layer may be formed using the same material as the inorganic particles.

The continuous thin film layer may be formed with a thickness of 5 nm or more and 100 nm or less.

The surface of the base substrate may be provided with a reinforcement coating layer.

Forming the plurality of protrusion structures by using a dry etching method may include at least one gas selected from Ar, O 2, H 2, He, and N 2.

Inorganic particles, metals (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te At least one selected from oxides and nitrides of Ti, W, Zn, Zr, and Yb, and compounds of oxide-nitrides (AlON, SiON) and magnesium fluoride Can be done.

The base substrate is at least one selected from fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39, and polyurethane. It can be made, including.

According to embodiments of the present invention, before the step of forming the anti-reflection layer by pre-treating the surface of the base substrate by using a dry etching method such as plasma, the array spacing and size of the anti-reflection structure forming the anti-reflection layer to be formed later It is possible to provide a double-sided antireflection substrate having a double-sided structure that can be easily controlled to control the optical and physical properties.

1 to 3 are schematic views illustrating a double-sided antireflective substrate according to various embodiments of the present invention.
4 illustrates an anti-reflection layer according to an embodiment of the present invention.
5 illustrates an antireflective structure arranged adjacent to each other in accordance with one embodiment of the present invention.
6 is a flowchart illustrating a method of manufacturing a double-sided antireflection substrate according to another embodiment of the present invention in order.
7 to 10 are process diagrams sequentially showing a method of manufacturing a double-sided anti-reflection substrate according to another embodiment of the present invention.
FIG. 11 is a view showing light transmittance with respect to a dry etching process time of a double-sided antireflection substrate according to another embodiment of the present invention. FIG.
12 is a view showing the durability measurement results of the double-sided anti-reflection substrate according to an embodiment of the present invention.
FIG. 13 is a view showing durability measurement results according to a known double-sided antireflection substrate. FIG.

BRIEF DESCRIPTION OF THE DRAWINGS The present invention is capable of various modifications and various embodiments, and specific embodiments are illustrated in the drawings and described in detail in the detailed description. It is to be understood, however, that the invention is not to be limited to the specific embodiments, but includes all modifications, equivalents, and alternatives falling within the spirit and scope of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used in this application is used only to describe a specific embodiment and is not intended to limit the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

Hereinafter, an embodiment of a double-sided antireflection substrate and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. And duplicate description thereof will be omitted.

1 to 3 illustrate a double-sided anti-reflective substrate according to various embodiments of the present disclosure.

1 to 3, according to an embodiment of the present invention, a double-sided anti-reflective substrate including a base substrate 110, a first anti-reflection layer 120, and a second anti-reflection layer 130 is provided. do.

The base substrate 110 is a substrate made of a material capable of transmitting light, and has two surfaces, a first surface and a second surface.

At this time, the base substrate 110 is a fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and so as to transmit light It may comprise at least one selected from polyurethane (polyiourethane).

Since the base substrate 110 according to the present embodiment may be made of a transparent polymer material, the base substrate 110 may be easily used in a place such as a display screen of a portable electronic device in which light must be transmitted smoothly.

On the other hand, the base substrate 110 according to the present embodiment may be formed including a reinforcement coating layer formed on the surface.

The reinforcement coating layer may improve physical properties such as strength and hardness of the base substrate 110, and may also improve adhesion of the anti-reflection layer laminated on the base substrate 110. In addition, due to the formation of the reinforcing coating layer, the optical properties of the base substrate 110 may also be improved, and chemical resistance properties may also be improved.

The polymer paint used to form the reinforcement coating layer may be a polymer paint composed of at least one of acrylic, polyurethane, epoxy, and primer paints, and in addition to the above-described effects on the base substrate 110. Any polymer paint that can be included in the scope of the present invention.

In addition, the reinforcing coating layer provided according to the present embodiment may be formed by mixing the metal oxide, sulfide, alumina, silica, zirconium oxide, iron oxide, and the like, which are inorganic fine particles, with the above-described polymer paint.

The first anti-reflection layer 120 is a surface formed on the first surface of the base substrate 110, and serves to increase the light transmittance and reduce the amount of reflected light.

The second anti-reflection layer is a surface formed on the second surface of the base substrate 110 and, like the first anti-reflection layer 120, increases the transmittance of light and reduces the amount of reflected light.

At least one of the first antireflection layer 120 and the second antireflection layer 130 may include a plurality of protrusion structures 122 and 132 and antireflection structures 124 and 134.

1 and 2, according to an embodiment of the present invention, the first surface of the base substrate 110 may be formed of a plurality of protrusion structures 122 and 132 and antireflective structures 124 and 134. 1 may include an anti-reflection layer 120, and a second surface of the base substrate 110 may be provided with a double-sided anti-reflection substrate including an anti-reflection layer that is continuously formed without a separate pretreatment.

Meanwhile, as shown in FIG. 3, in accordance with another embodiment of the present invention, both the first and second surfaces of the base substrate 110 may include the plurality of protrusion structures 122 and 132 and the anti-reflection structure 124. , An anti-reflective substrate comprising a first anti-reflection layer 120 and a second anti-reflection layer 130 may be provided.

On the other hand, Figure 4 is a view showing a microscope image of the actual structure of the anti-reflection layer (120, 130) provided in accordance with this embodiment.

As shown in FIGS. 1 to 3, the double-sided antireflection substrate provided according to the present embodiment may be dry-etched on the surface of the base substrate 110 to control the optical and physical properties of the double-sided antireflection substrate. Including the anti-reflective structure (124, 134) formed in each of the protrusion structure by depositing inorganic particles on the plurality of protrusion structure (122, 132) and the plurality of protrusion structure (122, 132) formed by the At least one of the first anti-reflection layer 120 and the second anti-reflection layer 130 may be formed.

Inorganic particles provided to form the antireflective structures 124 and 134 according to the present embodiment may be formed of a metal material (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Oxides, nitrides, and oxide-nitrides of Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te, Ti, W, Zn, Zr, Yb) AlON, SiON) and magnesium fluoride (Magnesium fluoride) may be made to include at least one.

Therefore, the antireflection structures 124 and 134 formed through the above-described inorganic particles may be prevented from reflecting light, thereby contributing to the improvement of light transmittance.

The plurality of protrusion structures 122 and 132 are portions formed by etching the surface of the base substrate 110 by a dry etching method.

As described above, the optical properties of the double-sided antireflective substrate provided according to this embodiment are controlled by the antireflective layer made of the antireflective structures 124 and 134 formed on the plurality of protruding structures 122 and 132. . In addition, the spacing between the antireflective structures 124 and 134 is controlled by the spacing between the plurality of protrusion structures 122 and 132 on which the antireflective structures 124 and 134 are formed.

Therefore, as will be described later, the antireflective structures 124, 134 are formed between the plurality of protrusion structures 122, 132 on which the antireflective structures 124, 134 can be arranged at intervals of 200 nm or less. The spacing can also be controlled to be arranged at spacings of 200 nm or less.

Control of the spacing between the plurality of protrusion structures 122 and 132 is achieved by controlling the time exposed to dry etching such as plasma.

According to the present exemplary embodiment, the method of depositing inorganic particles may be a deposition method using plasma, similarly to forming the plurality of protrusion structures 122 and 132.

As described above, the anti-reflective structures 124 and 134 provided according to the present embodiment may be arranged at intervals of 200 nm or less in order to increase light transmission efficiency and prevent light reflection.

In addition, the base substrate 110 provided in accordance with the present embodiment, by controlling the plasma exposure time to adjust the arrangement interval between the plurality of protrusion structures (122, 132) to adjust the arrangement interval of the anti-reflective structures (124, 134) Adjustable can also be the same as described above.

5 shows antireflective structures 124 and 134 disposed adjacent to each other.

The antireflective structures 124 and 134 may be disposed adjacent to each other as shown in FIG. 5, and the strength of the double-sided antireflective substrate is due to the antireflective layers formed by the antireflective structures 124 and 134 disposed adjacent to each other. And physical properties such as durability are increased.

The experimental results related to this are shown in FIG. 11, and as shown in FIG. 11, the antireflective layer including the antireflective structures 124 and 134 disposed adjacent to each other has a H 2 even after the eraser wear test rather than the continuous coating layer. The variation in the contact angle of O is small, which shows better results in physical properties such as strength and durability. This will be described later in more detail with respect to the manufacturing method of the double-sided antireflection substrate.

The double-sided antireflection substrate provided according to the present embodiment may further include continuous thin film layers 140, 142, and 144.

The continuous thin film layers 140, 142, and 144 are formed on the surface of the anti-reflection layer, and in order to further improve physical properties such as strength, hardness, and durability of the double-sided anti-reflection substrate, the anti-reflection structure 124 having a unit particle structure 134) A layer of material with continuous faces formed on its surface.

The continuous thin film layers 140, 142, and 144 provided according to the present embodiment may be made of the same material as the inorganic particles used to form the antireflection layer.

In the case of using the same material as the anti-reflection layer, it is easy to control optical properties such as refraction of light, and troublesomeness in the manufacturing process can be reduced.

Meanwhile, the continuous thin film layers 140, 142, and 144 provided according to the present embodiment may be formed to have a thickness of 5 nm or more and 100 nm or less for controlling optical characteristics.

As described above, the double-sided antireflective substrate provided in accordance with the present embodiment pretreats the surface of the base substrate 110 using a dry etching method such as plasma before the step of forming the antireflective layer. Therefore, the optical characteristics and physical properties can be easily controlled by easily controlling the arrangement intervals and sizes of the plurality of protrusion structures 122 and 132 and the antireflective structures 124 and 134 formed in the plurality of protrusion structures 122 and 132. A double-sided antireflection substrate can also be provided which can be easily controlled in characteristics.

Hereinafter, a method of manufacturing a double-sided antireflective substrate for manufacturing the above-described double-sided antireflective substrate will be described.

6 is a flowchart illustrating a method of manufacturing a double-sided anti-reflective substrate according to another embodiment of the present invention, Figures 7 to 10 is a method of manufacturing a double-sided anti-reflection substrate according to another embodiment of the present invention It is a process chart which shows the double-sided antireflection board | substrate manufactured in order.

As shown in FIG. 6, the preparing of the base substrate 110 (s100), the forming of the first antireflection layer 120, and the forming of the second antireflection layer 130 (s200) are performed. Provided is a method of manufacturing a double-sided antireflective substrate comprising.

In the preparing of the base substrate 110 (s100), the base substrate 110 may be made of a material capable of transmitting light and include a first surface and a second surface.

7 shows a step (s100) of preparing the base substrate 110 according to the present embodiment.

Base substrate 110 is a fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and polyurethane so as to transmit light It may comprise at least one selected from (polyiourethane).

Since the base substrate 110 according to the present embodiment may be made of a transparent polymer material, the base substrate 110 may be easily used in a place such as a display screen of a portable electronic device in which light must be transmitted smoothly.

At this time, the base substrate 110 according to the present embodiment may be formed including a reinforcement coating layer formed on the surface.

The reinforcement coating layer may improve physical properties such as strength and hardness of the base substrate 110, and may also improve adhesion of the anti-reflection layer laminated on the base substrate 110. In addition, due to the formation of the reinforcing coating layer, the optical properties of the base substrate 110 may also be improved, and chemical resistance properties may also be improved.

The polymer paint used to form the reinforcement coating layer may be a polymer paint composed of at least one of acrylic, polyurethane, epoxy, and primer paints, and in addition to the above-described effects on the base substrate 110. Any polymer paint that can be included in the scope of the present invention.

In addition, the reinforcing coating layer provided according to the present embodiment may be formed by mixing the metal oxide, sulfide, alumina, silica, zirconium oxide, iron oxide, and the like, which are inorganic fine particles, with the above-described polymer paint.

In the forming of the first anti-reflection layer 120 (s200), in order to increase the transmittance of light and reduce the amount of reflected light, forming the first anti-reflection layer 120 on the first surface of the base substrate 110 to be.

Similarly, the second anti-reflective layer forming step (s200), on the second surface of the base substrate 110, like the first anti-reflective layer 120, the second reflection to increase the transmittance of light and reduce the amount of reflected light Forming the prevention layer 130.

In this case, at least one of forming the first anti-reflection layer 120 and forming the second anti-reflection layer 130 may include forming the plurality of protrusion structures 122 and 132 (s210) and anti-reflecting structures 124 and 134. ) May comprise a step (s220).

Therefore, as shown in Figs. 1 to 3, it is possible to manufacture double-sided antireflective substrates of various embodiments.

Forming the plurality of protrusion structures 122 and 132 (s210), as shown in FIG. 8, unlike the conventional wet etching method, a plurality of protrusion structures 122 and 132 may be formed on the surface of the base substrate 110 using a dry etching method. Forming the protruding structures 122 and 132.

When the dry etching method is used, the formation of the plurality of protrusion structures 122 and 132 can be controlled more precisely and accurately than in the case of using the wet etching method.

The dry etching method according to the present embodiment may be a plasma dry etching method.

In this case, the material used in the plasma dry etching method according to the present embodiment may include at least one of at least one gas selected from Ar, O 2 , H 2 , He, and N 2 .

According to the present exemplary embodiment, when the base substrate 110 is exposed to a plasma including at least one of the above-described gaseous materials, the surface of the base substrate 110 is etched to form the plurality of protrusion structures 122. 132 may be formed.

At this time, the optical characteristics of the double-sided anti-reflection substrate provided in accordance with the present embodiment is controlled by an anti-reflection layer consisting of the anti-reflective structure (124, 134) described in detail later, the gap between the anti-reflection structure (124, 134) In order to control, the distance between the plurality of protrusion structures 122 and 132 on which the antireflective structures 124 and 134 are formed must be controlled.

Therefore, the etching exposure time of the plurality of protrusion structures 122 and 132 according to the present exemplary embodiment may be controlled for the optical characteristics of the antireflection layer.

In particular, in order to form the plurality of protrusion structures 122 and 132 provided according to the present embodiment, the time for exposing the base substrate 110 to plasma may be controlled to less than 7 minutes.

FIG. 11 is a graph illustrating a change in the anti-reflective property of the double-sided antireflective substrate according to the time when the base substrate 110 is exposed to the plasma.

As shown in FIG. 11, the optical properties of the double-sided antireflective substrate provided according to the present embodiment exhibit maximum values when the plasma exposure time is about 3 minutes, and when the plasma exposure time is 7 minutes or more, the exposure to the plasma is performed. Optical characteristics similar to those without.

Therefore, the plasma exposure time in the step of forming the plurality of protrusion structures 122 and 132, which is provided as a pretreatment of the base substrate 110 to form the antireflective structures 124 and 134 according to the present embodiment, is 7 minutes. May be less than.

The anti-reflective structures 124 and 134 may be formed by depositing inorganic particles on the plurality of protrusion structures 122 and 132 formed by a dry etching method on the surface of the base substrate 110. It is a step of forming an antireflection layer by forming the antireflection structures 124 and 134 in the structure.

The inorganic particles provided according to the present embodiment may be a metal material (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, From oxides and nitrides of Si, Sn, Ta, Te, Ti, W, Zn, Zr, Yb), and oxide-nitride compounds (AlON, SiON) and magnesium fluoride It may include at least one.

Therefore, the anti-reflection layer formed through the inorganic particles described above may also prevent reflection of light, thereby contributing to the improvement of light transmittance.

According to the present exemplary embodiment, the method of depositing inorganic particles may be a deposition method using plasma, similarly to forming the plurality of protrusion structures 122 and 132.

When the inorganic particles are deposited in a plasma manner, the inorganic particles are uniformly deposited in a valley between the plurality of protrusion structures 122 and 132 and the plurality of protrusion structures 122 and 132 at an initial stage of deposition.

However, over time, due to the shadow effect of the plasma particles, the inorganic particles reaching the surface of the base substrate 110 on the plasma made of gas, the plurality of protrusion structures 122, 132 and a plurality of Covered by the anti-reflective structures 124 and 134 growing on the protrusion structures 122 and 132, the phenomenon of reaching the valley between the plurality of protrusion structures 122 and 132 may occur.

Therefore, since the inorganic particles deposited on the plurality of protrusion structures 122 and 132 are increased, the inorganic particles are eventually deposited only on the plurality of protrusion structures 122 and 132.

In addition, in the plasma sheath proximate to the base substrate 110 by a distance of several mm, an unbalanced accumulation of negative charges occurs in a portion protruding from the surface of the base substrate 110, which is positively charged ions. The phenomenon that induces concentration of the reaction gas is generated.

As a result, the reaction gas is concentrated on the plurality of protrusion structures protruding in a direction perpendicular to the surface of the base substrate 110 so that the antireflection structures 124 and 134 are formed only on the upper portions of the plurality of protrusion structures 122 and 132. Make it form intensively.

Based on the above two causes, as shown in FIGS. 4 and 9, antireflection structures 124 and 134 having unit particle structures are formed on each of the plurality of protrusion structures 122 and 132. do.

In this case, the anti-reflective structures 124 and 134 formed on each of the plurality of protrusion structures 122 and 132 may be formed in a spherical shape, as shown in FIGS. 4 and 9.

The antireflective structures 124 and 134 provided according to the present embodiment may be arranged at intervals of 200 nm or less to increase light transmission efficiency and prevent light reflection.

At this time, the base substrate 110 provided in accordance with the present embodiment, by controlling the plasma exposure time to adjust the arrangement interval between the plurality of protrusions (122, 132) to adjust the arrangement interval of the anti-reflective structure (124, 134) Adjustable can be as described above.

On the other hand, the antireflection layer may be disposed adjacent to each other, in order not only to increase the optical characteristics, but also to improve the physical characteristics.

5 shows antireflective structures 124 and 134 disposed adjacent to each other in accordance with this embodiment.

As shown in FIG. 5, when the antireflective structures 124 and 134 are disposed adjacent to each other, physical properties such as strength and durability are increased in comparison with the other cases.

In FIG. 12, a double-sided antireflective substrate having antireflective structures 124 and 134 disposed adjacent to each other is set as an experimental group. The result of performing the wear resistance tester reliability tester using the eraser wear tester (Rubbing tester) by setting the substrate containing.

Tester conditions were set with a type rubber eraser (1/4 in diameter) as a friction, load was set to 500 grams, test speed 40 times / min and test times 1500 times, and analysis of the results was performed on the respective anti-reflective and coated erasers. The water repellent properties were evaluated by measuring the contact angle of H 2 O before and after the abrasion test.

As shown in FIG. 12, the antireflection layer including the antireflection structures 124 and 134 disposed adjacent to each other has a smaller variation in the contact angle of H 2 O even after the eraser wear test than the continuous coating layer shown in FIG. 13. In physical properties such as strength and durability, better results are shown.

In this case, the method for manufacturing a double-sided anti-reflection substrate provided according to the present embodiment may further include forming the continuous thin film layers 140, 142, and 144 (s300).

The continuous thin film layers 140, 142, and 144 are formed on the surface of the anti-reflection layer, and in order to further improve physical properties such as strength, hardness, and durability of the double-sided anti-reflection substrate, the anti-reflection structure 124 having a unit particle structure 134) A layer of material with continuous faces formed on its surface.

The continuous thin film layers 140, 142, and 144 provided according to the present embodiment may be made of the same material as the inorganic particles used to form the antireflection layer.

In the case of using the same material as the anti-reflection layer, control of optical properties such as refraction of light is easy, and troublesomeness in the manufacturing process can be reduced.

Meanwhile, the continuous thin film layers 140, 142, and 144 provided according to the present embodiment may be formed to have a thickness of 5 nm or more and 100 nm or less for controlling optical characteristics.

The continuous thin film layers 140, 142 and 144 provided according to the present embodiment may be formed by deposition of inorganic particles.

In addition to the above-described plasma deposition method, it may be formed using various methods generally used for deposition of materials, such as deposition methods such as physical vapor deposition (PVD) and chemical vapor deposition (CVD). Of course.

In addition to the vapor deposition method, liquid polymer particles such as sol-gel or dipping may be applied to the space between the spherical antireflection structures 124 and 134 forming the antireflection layer and to the surface of the antireflection layer. A method of coating to form the continuous thin film layers 140, 142, and 144 may be used.

As described above, the method for manufacturing a double-sided antireflection substrate provided according to the present embodiment is formed by pretreating the surface of the base substrate 110 using a dry etching method such as plasma before the step of forming the antireflection layer, It is possible to easily control the intervals and sizes of the antireflection structures 124 and 134 constituting the antireflection layer.

Therefore, the manufacturing method of the double-sided anti-reflection substrate can also be provided that can easily control the optical and physical properties of the double-sided anti-reflection substrate.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit of the invention as set forth in the appended claims. The present invention can be variously modified and changed by those skilled in the art, and it is also within the scope of the present invention.

110: Base substrate
120: first antireflection layer
122: a plurality of protrusion structures
124: antireflective structure
130: second antireflection layer
132: a plurality of protrusion structures
134: antireflective structure
140: continuous thin film layer
142: first continuous thin film layer
144: second continuous thin film layer

Claims (26)

A base substrate made of a material capable of transmitting light and including a first surface and a second surface;
A first anti-reflection layer formed on the first surface; And
A second anti-reflection layer formed on the second surface;
At least one of the first antireflection layer and the second antireflection layer is
A plurality of protrusion structures formed on a surface of the base substrate; And
The anti-reflective substrate formed on the plurality of protruding structures, the anti-reflective structure comprising an anti-reflective structure formed by the deposition of inorganic particles.
The method of claim 1,
The plurality of protrusion structures,
Double-sided anti-reflection substrate, characterized in that formed on the surface of the base substrate using a plasma dry etching method.
The method of claim 1,
The antireflection structure,
Double-sided anti-reflection substrate, characterized in that formed by the plasma thin film deposition of the inorganic particles.
The method of claim 1,
The antireflection structure,
A double-sided antireflective substrate, arranged at an interval of 20 nm or more and 200 nm or less.
The method of claim 1,
The antireflection structure,
Double-sided anti-reflection substrate, characterized in that disposed adjacent to each other.
The method of claim 1,
The antireflection structure,
A double-sided antireflection substrate, characterized in that formed in a spherical shape.
The method of claim 1,
And a continuous thin film layer formed on the surface of the antireflective structure.
The method of claim 7, wherein
The continuous thin film layer,
Double-sided anti-reflection substrate, characterized in that formed using the same material as the inorganic particles.
The method of claim 7, wherein
The continuous thin film layer,
A double-sided antireflective substrate, characterized in that formed at a thickness of 5 nm or more and 100 nm or less.
The method of claim 1,
The base substrate includes:
Double-sided anti-reflection substrate, characterized in that the surface of the base substrate may be provided with a reinforced coating layer.
The method of claim 1,
The inorganic particles,
Metallic materials (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te, Ti, W , Zn, Zr, Yb) oxide and nitride, and oxide-nitride compound (oxynitride: AlON, SiON) and at least one selected from magnesium fluoride (Magnesium fluoride) To the double-sided antireflective substrate.
The method of claim 1,
The base substrate includes:
Fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and at least one selected from polyurethane (polyiourethane) A double-sided antireflection substrate.
Preparing a base substrate made of a material capable of transmitting light, the base substrate including a first surface and a second surface;
Forming a first anti-reflection layer on the first surface; And
Forming a second anti-reflection layer on the second surface;
At least one of the first anti-reflective layer forming step and the second anti-reflective layer forming step,
Forming a plurality of protruding structures on the surface of the base substrate using a dry etching method; And
A method of manufacturing a double-sided anti-reflective substrate comprising the step of forming an anti-reflective structure capable of preventing reflection of light on each of the plurality of protruding structures by deposition of inorganic particles.
The method of claim 13,
Forming the plurality of protrusion structures,
A method of manufacturing a double-sided antireflective substrate, characterized in that to form the plurality of projection structure on the surface of the base substrate using a plasma dry etching method.
The method of claim 13,
Forming the antireflective structure,
And plasma-depositing the inorganic particles to form the anti-reflective structure.
The method of claim 13,
The antireflective structures are arranged at intervals of 20 nm or more and 200 nm or less,
Forming the plurality of protrusion structures,
And controlling an etching exposure time to adjust diameters and arrangement intervals of the plurality of protruding structures so that the antireflective structures can be arranged at intervals of 20 nm or more and 200 nm or less. Way.
17. The method of claim 16,
Controlling the etching exposure time,
The etching exposure time is less than 7 minutes.
17. The method of claim 16,
Forming the antireflective structure,
And arranging the antireflective structures adjacent to each other.
The method of claim 13,
Forming the antireflective structure,
A method for manufacturing a double-sided anti-reflective substrate, characterized by forming the spherical antireflection structure.
The method of claim 13,
After forming the first anti-reflection layer and forming the second anti-reflection layer,
And forming a continuous thin film layer on a surface of at least one of the first anti-reflection layer and the second anti-reflection layer.
21. The method of claim 20,
Forming the continuous thin film layer,
And forming the continuous thin film layer using the same material as that of the inorganic particles.
21. The method of claim 20,
The continuous thin film layer,
A method for manufacturing a double-sided antireflective substrate, which is formed with a thickness of 5 nm or more and 100 nm or less.
The method of claim 13,
A method of manufacturing a double-sided antireflection substrate, characterized in that the reinforcement coating layer is provided on the surface of the base substrate.
The method of claim 13,
Forming the plurality of protrusion structures by using a dry etching method,
A method of manufacturing a double-sided antireflective substrate, comprising dry etching by using at least one gas selected from Ar, O 2 , H 2 , He, and N 2 .
The method of claim 13,
The inorganic particles,
Metallic materials (Al, Ba, Be, Ca, Cr, Cu, Cd, Dy, Ga, Ge, Hf, In, Lu, Mg, Mo, Ni, Rb, Sc, Si, Sn, Ta, Te, Ti, W , Zn, Zr, Yb) oxide and nitride, and oxide-nitride compound (oxynitride: AlON, SiON) and at least one selected from magnesium fluoride (Magnesium fluoride) The double-sided anti-reflective substrate manufacturing method. The method of claim 13,
The base substrate includes:
Fluorine-based transparent polymer film, acrylic transparent polymer film, polyethylene terephthalate-based transparent polymer film, polycarbonate, polyethylene naphthalate, polyethersulfone, polycycloolefin, CR39 and at least one selected from polyurethane (polyiourethane) A double-sided antireflective substrate manufacturing method characterized by the above-mentioned.
KR1020120027728A 2012-03-19 2012-03-19 Anti-reflecting double layer board and manufacturing method thereof KR101244882B1 (en)

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