TWI760100B - Manufacturing method of substrate surface structure - Google Patents

Manufacturing method of substrate surface structure Download PDF

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TWI760100B
TWI760100B TW110104723A TW110104723A TWI760100B TW I760100 B TWI760100 B TW I760100B TW 110104723 A TW110104723 A TW 110104723A TW 110104723 A TW110104723 A TW 110104723A TW I760100 B TWI760100 B TW I760100B
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substrate
metal mask
microstructures
manufacturing
surface structure
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TW202232593A (en
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姜哲文
祝慶松
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大陸商業成科技(成都)有限公司
大陸商業成光電(深圳)有限公司
大陸商業成光電(無錫)有限公司
英特盛科技股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C71/00After-treatment of articles without altering their shape; Apparatus therefor
    • B29C71/0009After-treatment of articles without altering their shape; Apparatus therefor using liquids, e.g. solvents, swelling agents

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Surface Treatment Of Glass (AREA)

Abstract

The present invention is a method for manufacturing the surface structure of a substrate, which includes combining one side of the substrate with a magnetic plate, and a metal mask is arranged on the other side of the substrate. The metal mask is provided with a plurality of openings. The magnetism of the magnetic plate can attract the metal mask. The substrate is pressed tightly between the magnetic plate and the metal mask to form a intermediate product, and then the intermediate product to be immersed in the etching solution. The etching solution erodes the position of the substrate relative to the opening, and then the product to be taken out of the etching solution. The magnetic plate and the metal mask are removed. The side of the substrate opposite to the metal mask forms multiple microstructures at positions opposite to the openings. The multiple microstructures of the substrate are used as composite functional layers with anti-reflection and anti-fouling.

Description

基板表面結構之製造方法Manufacturing method of substrate surface structure

本發明有關於光學元件,尤指一種在基板設置具有抗反射及抗污的微結構體者。The present invention relates to an optical element, especially a microstructure with anti-reflection and anti-fouling provided on a substrate.

玻璃具有優異的光學性質,且對於物理性與化學性的侵蝕有較佳的抵抗能力,能用於製作出高品質之光學元件。當玻璃應用於行動電話、筆記型電腦…等具有顯示面板的裝置時,從玻璃到面板之間會經過多種界面,將經過各個界面反射的光會因相干作用,而使光強度較只遇到單一界面時增強或減弱。而玻璃本身並不具有抗反射(增穿透)的能力,因此,為了讓玻璃的外表面(此處及以下所稱之外表面,係指玻璃背對顯示面板的一面)具有抗反射的能力,許多廠商係於玻璃的外表面上製作微結構體,不僅能保有玻璃優異的特性,同時能讓表面反射的效果。Glass has excellent optical properties, and has better resistance to physical and chemical erosion, and can be used to make high-quality optical components. When glass is applied to devices with display panels, such as mobile phones, notebook computers, etc., various interfaces will pass between the glass and the panel, and the light reflected from each interface will be coherent, and the light intensity will be higher than that of the display panel. Increase or decrease when a single interface is used. The glass itself does not have the ability of anti-reflection (enhancing penetration), therefore, in order to make the outer surface of the glass (here and hereinafter referred to as the outer surface, refers to the side of the glass facing away from the display panel) has the ability of anti-reflection , Many manufacturers make microstructures on the outer surface of the glass, which can not only maintain the excellent characteristics of the glass, but also make the surface reflect the effect.

上述的微結構體通常稱為抗反射層(Anti-Reflection Layer,或增透層),它的主要功能是減少玻璃表面的反射光,從而增加這些元件的透光量,以及減少或消除各種雜散光。換言之,在玻璃的外表面所設置的抗反射層提高玻璃透光率,降低玻璃反射率,達到可以清晰看到顯示面板的目的。而抗反射層的設置方式,一般是利用真空鍍膜製程或者磁控濺射鍍製程,將高低折射率材料交叉堆疊在玻璃的外表面。The above-mentioned microstructure is usually called an anti-reflection layer (Anti-Reflection Layer, or anti-reflection layer), and its main function is to reduce the reflected light on the glass surface, thereby increasing the light transmission of these components, and reducing or eliminating various impurities. astigmatism. In other words, the anti-reflection layer disposed on the outer surface of the glass increases the light transmittance of the glass and reduces the reflectivity of the glass, so as to achieve the purpose of clearly seeing the display panel. The anti-reflection layer is generally arranged by using a vacuum coating process or a magnetron sputtering process to cross-stack high and low refractive index materials on the outer surface of the glass.

又,一般抗反射層有單層及多層兩種,單層膜通常鍍氟化鎂(MgF2),可將單面反射率降低,並且提高穿透率提高至,多層膜可將單面反射率再降低,且可將穿透率提高至98%以上,如果在搭配上較高品質的玻璃,幾乎可以達到近100%的穿透的效果。In addition, there are generally two types of anti-reflection layers: single-layer and multi-layer. It can be lowered further, and the penetration rate can be increased to more than 98%. If it is matched with higher-quality glass, it can almost achieve the effect of nearly 100% penetration.

但是,玻璃表面鍍有單層或多層的抗反射層後,玻璃表面特別容易產生污漬,而污漬會破壞抗反射層的抗反射效果。其原因在於,反射膜層為複數個微結構體所組成,而在水、油污或其他污物特別容易進入到各微結構體之間的孔穴之中,進而導致抗反射層的效果降低。However, after the glass surface is coated with a single or multi-layer anti-reflection layer, the glass surface is particularly prone to stains, and the stain will destroy the anti-reflection effect of the anti-reflection layer. The reason is that the reflective film layer is composed of a plurality of microstructures, and water, oil or other contaminants are particularly easy to enter into the pores between the microstructures, thereby reducing the effect of the anti-reflection layer.

這種問題的解決方案是在抗反射層上再鍍一層具有疏油、疏水的抗污層(Anti-Smudge Layer),而且抗污層必須非常薄,以令抗污層不會改變抗反射層的光學特性。抗污層的材料以氟化物為主,有二種加工方法,一種是浸泡法,一種是真空鍍膜,而最常用的方法是真空鍍膜。當抗反射層完成後,可使用真空鍍膜製程將氟化物鍍於抗反射層上。抗污層可將多孔穴的抗反射層覆蓋起來,並且能夠將水和油與鏡片的接觸面積減少,使油和水滴不易粘附於抗污層表面。The solution to this problem is to coat the anti-reflection layer with an oleophobic, hydrophobic anti-smudge layer (Anti-Smudge Layer), and the anti-smudge layer must be very thin so that the anti-smudge layer does not change the anti-reflection layer. optical properties. The material of the antifouling layer is mainly fluoride, and there are two processing methods, one is immersion method, the other is vacuum coating, and the most commonly used method is vacuum coating. When the anti-reflection layer is completed, a vacuum coating process can be used to coat the fluoride on the anti-reflection layer. The antifouling layer can cover the porous antireflection layer, and can reduce the contact area of water and oil with the lens, so that oil and water droplets are not easy to adhere to the surface of the antifouling layer.

進一步而言,抗污層也是屬於複數個微結構體所組成,只是抗污層的微結構體的尺寸比抗反射層的尺寸小,甚至抗污層的微結構體尺寸達到如蓮葉表面的超疏水(super hydrophobicity)性質,使得落於抗污層上之水珠與其之接觸角(contact angle)大於110度以上,使得水不沾附於抗污層而形成小水珠。此外,細小之纖毛使灰塵等雜質與雨水不易沾附,稱為自潔(self-cleaning)特性,前述的超疏水(super hydrophobicity)性質及自潔(self-cleaning)特性通常被稱為蓮花效應(Lotus effect)。Further, the antifouling layer is also composed of a plurality of microstructures, but the size of the microstructures of the antifouling layer is smaller than that of the antireflection layer, and even the size of the microstructures of the antifouling layer is as large as that of the surface of a lotus leaf. The super hydrophobicity property makes the contact angle between the water droplets falling on the antifouling layer and the contact angle thereof greater than 110 degrees, so that the water does not adhere to the antifouling layer and form small water droplets. In addition, the fine cilia make it difficult for dust and other impurities to adhere to rainwater, which is called self-cleaning. The aforementioned super hydrophobicity and self-cleaning properties are often called lotus effect. (Lotus effect).

如上所述各家廠商大部分專注於真空鍍膜製程,真空鍍膜製程需要經過黃光、微影、蝕刻…等流程,才能達到在玻璃表面設置複數微結構體的目的,但因黃光、顯影需使用大量化學藥劑(光阻/顯影劑),且每片玻璃都需重複使用黃光、顯影製程,使得以前述方法所製作成具有抗反射層及抗污層的玻璃產品之價格不具競爭力及造成環境污染,因此需要針對此問題進行改善。As mentioned above, most of the manufacturers focus on the vacuum coating process. The vacuum coating process needs to go through processes such as yellow light, lithography, etching, etc. in order to achieve the purpose of setting multiple microstructures on the glass surface. A lot of chemicals (photoresist/developer) are used, and each piece of glass needs to use yellow light and development process repeatedly, so that the price of glass products with anti-reflection layer and anti-fouling layer made by the above method is not competitive and It causes environmental pollution, so it is necessary to improve this problem.

有鑑於先前技術的問題,本發明之目的係在基板上設置具有抗反射及抗污特性的微結構體,但是在基板設置微結構體的製造過程,不需要黃光/顯影流程,不用使用大量化學藥劑(光阻/顯影劑),可以降低生產成本,減少環境汙染,甚至可以縮短生產製造時間。In view of the problems of the prior art, the purpose of the present invention is to provide microstructures with anti-reflection and anti-fouling properties on the substrate, but the manufacturing process of arranging the microstructures on the substrate does not require yellow light/development process, and does not need to use a large number of Chemical agents (photoresist/developer) can reduce production costs, reduce environmental pollution, and even shorten production time.

根據本發明之目的,係提供一種基板表面結構之製造方法,包括下列步驟,將基板的一面結合磁性板,基板的另一面設置金屬遮罩,且金屬遮罩上設有複數個開孔,並藉由磁性板的磁性吸住金屬遮罩,令基板被緊密地壓合在磁性板與金屬遮罩之間形成一待製品,再將待製品浸泡在蝕刻溶液中,使得蝕刻侵蝕基板相對開孔的位置,從蝕刻溶液中取出待製品,移除磁性板與金屬遮罩,使得基板原本相對金屬遮罩的一面在相對各開孔的位置分別形成微結構體,基板的表面之複數個微結構體做為具有抗反射及抗污的複合功能層。According to the purpose of the present invention, a method for manufacturing a surface structure of a substrate is provided. The metal shield is attracted by the magnetism of the magnetic plate, so that the substrate is tightly pressed between the magnetic plate and the metal shield to form a product to be prepared, and then the product to be immersed in the etching solution, so that the etching corrodes the relative opening of the substrate. position, take out the product from the etching solution, remove the magnetic plate and the metal mask, so that the side of the substrate opposite to the metal mask forms microstructures respectively at the positions opposite to the openings, and multiple microstructures on the surface of the substrate The body is used as a composite functional layer with anti-reflection and anti-fouling.

其中,基板為玻璃或者塑膠。Wherein, the substrate is glass or plastic.

其中,各開孔係以固定孔距及孔徑分布在金屬遮罩上,或者各開孔係在預定的孔距範圍內以隨機孔距及固定的孔徑分布在金屬遮罩上,使得各開孔隨機分布在金屬遮罩。Wherein, each opening is distributed on the metal mask with a fixed hole distance and pore diameter, or each opening is distributed on the metal mask with a random hole distance and a fixed pore diameter within a predetermined hole distance range, so that each opening Randomly distributed over the metal mask.

其中,任二微結構體的中心距離的最大寬度為200~900奈米之間,各微結構體的外徑為任二微結構體的中心距離的最大寬度的0.2~0.6倍之間,且微結構體的深度微70~200奈米之間。Wherein, the maximum width of the center-to-center distance of any two microstructures is between 200 and 900 nanometers, the outer diameter of each microstructure is between 0.2 and 0.6 times the maximum width of the center-to-center distance of any two microstructures, and The depth of the microstructure is between 70 and 200 nanometers.

其中,蝕刻溶液係為酸類無機溶液,例如氫氟酸,或者蝕刻溶液係為有機溶劑,如:丙酮、異丙醇。The etching solution is an acid-based inorganic solution, such as hydrofluoric acid, or the etching solution is an organic solvent, such as acetone and isopropanol.

綜上所述,本發明利用磁性板及金屬遮罩夾住基板,且僅以一道蝕刻程序,即可在基板上製作成具有抗反射及抗污的複合功能層,相較於傳統的基板需要分別製作抗反射層及抗污層而言,減少了化學藥劑的使用量,可以簡化了製作步驟,達到降低生產成本,減少環境汙染,縮短生產製造時間的目的。To sum up, the present invention uses a magnetic plate and a metal mask to clamp the substrate, and only one etching process can be used to form a composite functional layer with anti-reflection and anti-fouling on the substrate. For the production of the anti-reflection layer and the anti-fouling layer, the usage of chemicals can be reduced, the production steps can be simplified, the production cost can be reduced, the environmental pollution can be reduced, and the production time can be shortened.

為了使本發明的目的、技術方案及優點更加清楚明白,下面結合附圖及實施例,對本發明進行進一步詳細說明。應當理解,此處所描述的具體實施例僅用以解釋本發明,但並不用於限定本發明。In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

請參閱圖1所示,本發明係提供一種基板1表面結構之製造方法,包括下列步驟: S101:將基板1夾在磁性板2與金屬遮罩3之間形成一待製品4。其中金屬遮罩3上設有複數個開孔30(如圖2所示),藉由磁性板2的磁性吸住金屬遮罩3令基板1被緊密地壓合在磁性板2與金屬遮罩3之間(如圖3所示); S102:再將待製品4浸泡在蝕刻溶液5中,使得蝕刻侵蝕基板1相對開孔30的位置; S103:從蝕刻溶液5中取出待製品4,移除磁性板2與金屬遮罩3,使得基板1相對金屬遮罩3的一面在相對各開孔30的位置分別形成微結構體60微結構體60,基板1的表面之複數個微結構體60構成具有抗反射及抗污的複合功能層6,其中微結構體60係為金字塔型、圓錐型、梯形四面體或多階梯狀體,但本發明實際實施時,並不以此為限。 Please refer to FIG. 1 , the present invention provides a method for manufacturing a surface structure of a substrate 1 , which includes the following steps: S101 : sandwiching the substrate 1 between the magnetic plate 2 and the metal shield 3 to form a to-be-made product 4 . The metal cover 3 is provided with a plurality of openings 30 (as shown in FIG. 2 ), and the metal cover 3 is attracted by the magnetism of the magnetic plate 2 so that the substrate 1 is tightly pressed against the magnetic plate 2 and the metal cover 3 (as shown in Figure 3); S102: Immerse the product 4 in the etching solution 5, so that the position of the substrate 1 relative to the opening 30 is eroded by etching; S103: Take out the product 4 from the etching solution 5, remove the magnetic plate 2 and the metal mask 3, so that the side of the substrate 1 opposite to the metal mask 3 forms microstructures 60 and microstructures respectively at positions opposite to the openings 30 60. A plurality of microstructures 60 on the surface of the substrate 1 constitute a composite functional layer 6 with anti-reflection and anti-fouling, wherein the microstructures 60 are pyramid-shaped, cone-shaped, trapezoidal tetrahedron or multi-stepped body, but this When the invention is actually implemented, it is not limited to this.

在本發明中,金屬遮罩3進一步係為精細金屬掩模板(Fine Metal Mask),金屬遮罩3係可為鐵磁性或者亞鐵磁性的金屬板所製成,進一步金屬遮罩3係為鎳鐵合金板,例如:因瓦合金板(Invar),其中金屬板經過蝕刻製程針對要製作成開孔30的位置不斷的侵蝕減薄金屬板的厚度,而在金屬板上形成各開孔30,或者是利用電鑄製程成型金屬遮罩3,或者以樹脂和金屬材料混合以製作金屬遮罩3。In the present invention, the metal mask 3 is further a fine metal mask, the metal mask 3 can be made of a ferromagnetic or ferrimagnetic metal plate, and further the metal mask 3 is made of nickel Iron alloy plate, for example: Invar alloy plate (Invar), wherein the metal plate is continuously eroded through the etching process to reduce the thickness of the metal plate for the positions where the openings 30 are to be made, and the openings 30 are formed on the metal plate, or The metal mask 3 is formed by an electroforming process, or the metal mask 3 is made by mixing resin and metal material.

請參閱圖3所示,由於金屬遮罩3係可為鐵磁性或者亞鐵磁性的金屬板所製成,因此,當基板1的一面結合磁性板2,基板1的另一面設置金屬遮罩3時,假設磁性板2相對於基板1的一面為磁性板2的N極,金屬遮罩3面對基板1的一面將受到磁性板2的磁場感應吸引而磁化成S極,此時,金屬遮罩3被磁性板2,進一步使得基板1被夾在磁性板2與金屬遮罩3之間。Please refer to FIG. 3 , since the metal mask 3 can be made of a ferromagnetic or ferrimagnetic metal plate, when one side of the substrate 1 is combined with the magnetic plate 2 , the other side of the substrate 1 is provided with a metal mask 3 At this time, it is assumed that the side of the magnetic plate 2 opposite to the substrate 1 is the N pole of the magnetic plate 2, and the side of the metal shield 3 facing the substrate 1 will be induced and attracted by the magnetic field of the magnetic plate 2 and magnetized to the S pole. The cover 3 is surrounded by the magnetic plate 2 , further causing the substrate 1 to be sandwiched between the magnetic plate 2 and the metal cover 3 .

在本發明中,基板1為玻璃或者塑膠,而蝕刻溶液5係為酸類無機溶液,例如氫氟酸,或者蝕刻溶液5係為有機溶劑,如:丙酮、異丙醇。其中酸類無機溶液係為玻璃的蝕刻溶液5,而有機溶劑係為塑膠的蝕刻溶液5。In the present invention, the substrate 1 is glass or plastic, and the etching solution 5 is an acid-based inorganic solution, such as hydrofluoric acid, or the etching solution 5 is an organic solvent, such as acetone and isopropanol. The acid-based inorganic solution is the etching solution 5 for glass, and the organic solvent is the etching solution 5 for plastic.

請參閱圖4所示,係在無微結構體60的基板1的底面依序設置氮化矽層12、氧化銦錫層14、發光層16及電極層18,其中基板1的折射率n=1.4~n=1.6之間,例如:玻璃的折射率n=1.46,而塑膠(例如:聚碳酸酯,Polycarbonate ,簡稱:PC)的折射率n=1.59、氧化銦錫層14的折射率約為n=1.8、發光層16的折射率約為n=1.75,基板1的厚度為2毫米(2mm)、氮化矽層12的厚度為600奈米(600nm)、氧化銦錫層14的厚度為200奈米(200nm)、發光層16的厚度為100奈米(100nm),空氣折射率則是折射率是n=1。根據司乃耳定律(Snell’s Law) n 1Sinθ 1= n 2Sinθ 2,其中θ係指光線在基板1中行進的角度,光線從高折射率材料進入低折射率介質時,若其入射角比臨界角大,光線就不會穿透進入另一介質而產生全內反射現象。以玻璃的折射率n=1.46及空氣的折射率n1為例,當光線從發光層16經過氮化矽層12、氧化銦錫層14,到達基板1(如玻璃)的內部,且光線入射角度大於的全反射臨界角(43.2度),使得光將在玻璃內全反射無進入另一介質,造成光源的穿透率不佳。 Referring to FIG. 4 , a silicon nitride layer 12 , an indium tin oxide layer 14 , a light-emitting layer 16 and an electrode layer 18 are sequentially disposed on the bottom surface of the substrate 1 without the microstructures 60 , wherein the refractive index of the substrate 1 is n= Between 1.4 and n=1.6, for example, the refractive index of glass is n=1.46, while the refractive index of plastic (eg, Polycarbonate, PC for short) is n=1.59, and the refractive index of the indium tin oxide layer 14 is about n=1.8, the refractive index of the light-emitting layer 16 is about n=1.75, the thickness of the substrate 1 is 2 mm (2 mm), the thickness of the silicon nitride layer 12 is 600 nanometers (600 nm), and the thickness of the indium tin oxide layer 14 is 200 nanometers (200 nm), the thickness of the light-emitting layer 16 is 100 nanometers (100 nm), and the refractive index of air is n=1. According to Snell's Law, n 1 Sinθ 1 = n 2 Sinθ 2 , where θ refers to the angle at which the light travels in the substrate 1 . When the critical angle is large, the light will not penetrate into another medium and cause total internal reflection. Taking the refractive index of glass n=1.46 and the refractive index of air n1 as an example, when the light passes through the silicon nitride layer 12 and the indium tin oxide layer 14 from the light-emitting layer 16 to the interior of the substrate 1 (such as glass), and the incident angle of the light is Greater than the critical angle of total reflection (43.2 degrees), the light will be totally reflected in the glass without entering another medium, resulting in poor transmittance of the light source.

請參閱圖5所示,本發明的製造方法所製成的基板1,其一面具有複數個微結構體60所構成的複合功能層6,基板1的底面同樣依序設置氮化矽層12、氧化銦錫層14、發光層16及電極層18,而且基板1氮化矽層12、氧化銦錫層14、發光層16的厚度及折射率如上述相同,當光源從發光層16經過氮化矽層12、氧化銦錫層14,到達基板1(如玻璃)的內部,由於複合功能層6的作用,使得光線不會在基板1內部全反射,使得光源可以穿過基板1進入到外部,換言之,基板1的穿透率有所提升。另外,由於複合功能層6與水滴之間的表面接觸角大於110度以上,因此,基板1具有疏水抗污的特性。表面接觸角(Contact Angle)指當液體滴在固體表面上達熱力學平衡時,固體表面和液滴切線的夾角。意即,基板1與水滴的切線夾角大於110度以上。在此氮化矽層12、氧化銦錫層14、發光層16及電極層18等組成觸控模組的相關組件進行說明光源的穿透性,但是本發明在實際實施時,並不以觸控模組為限,舉凡需要基板的光學元件,都屬於本發明所欲主張的範圍。Please refer to FIG. 5 , the substrate 1 produced by the manufacturing method of the present invention has a composite functional layer 6 formed by a plurality of microstructures 60 on one side, and the bottom surface of the substrate 1 is also provided with a silicon nitride layer 12 , The indium tin oxide layer 14 , the light-emitting layer 16 and the electrode layer 18 , and the thickness and refractive index of the silicon nitride layer 12 , the indium tin oxide layer 14 and the light-emitting layer 16 of the substrate 1 are the same as above. The silicon layer 12 and the indium tin oxide layer 14 reach the inside of the substrate 1 (such as glass). Due to the function of the composite functional layer 6, the light will not be totally reflected inside the substrate 1, so that the light source can pass through the substrate 1 and enter the outside. In other words, the penetration rate of the substrate 1 is improved. In addition, since the surface contact angle between the composite functional layer 6 and the water droplets is greater than 110 degrees, the substrate 1 has the characteristics of hydrophobicity and antifouling. Surface contact angle (Contact Angle) refers to the angle between the solid surface and the droplet tangent when the liquid droplet reaches the thermodynamic equilibrium on the solid surface. That is, the included angle between the substrate 1 and the water droplet is greater than 110 degrees. The related components of the touch module, such as the silicon nitride layer 12 , the indium tin oxide layer 14 , the light emitting layer 16 and the electrode layer 18 , are described here to illustrate the penetration of the light source. However, in the actual implementation of the present invention, touch The control module is limited, and any optical element that requires a substrate falls within the scope of the present invention.

為了讓複合功能層6具有抗反射、增加穿透率,且具有疏水性,在本發明中,任二微結構體60的中心距離的最大寬度為200~900奈米之間,各微結構體60的外徑為任二微結構體60的中心距離的最大寬度的0.2~0.6倍之間,且微結構體60的深度微70~200奈米之間。此外,若所有的微結構體60在基板1的表面是以規則排列,例如:矩陣排列,將會造成從複合功能層6穿出的光線(影像)模糊,因此,微結構體60的排列方式為隨機排列。In order to make the composite functional layer 6 have anti-reflection, increase transmittance, and have hydrophobicity, in the present invention, the maximum width of the center distance between any two microstructures 60 is between 200 and 900 nanometers. The outer diameter of the microstructures 60 is between 0.2 and 0.6 times the maximum width of the center-to-center distance of any two microstructures 60 , and the depth of the microstructures 60 is between 70 and 200 nanometers. In addition, if all the microstructures 60 are regularly arranged on the surface of the substrate 1, for example, arranged in a matrix, the light (image) passing through the composite functional layer 6 will be blurred. Therefore, the arrangement of the microstructures 60 for random arrangement.

進一步而言,金屬遮罩3的各開孔30係以固定孔距W及孔徑ψ分布在金屬遮罩3上,但是基板1經過蝕刻溶液5侵蝕後,任二微結構體60的最大寬度、外徑及深度固定,會有影像模糊的問題。因此,在本發明中,金屬遮罩3的各開孔30係在預定的孔距範圍內以隨機孔距W及固定的孔徑ψ分布在金屬遮罩3上,使得各開孔30隨機分布在金屬遮罩3,或者以影像模擬軟體(如:LightTools)將微結構體60在前述的條件下,以不規則方式的排列出達到影像最佳化效果的光學模擬結果,再依照此光學模擬結果製作相應的開孔30排列的金屬遮罩3,再進一步利用金屬遮罩3與磁性板2夾住基板1,用以在基板1上製作出符合光學模擬結果的複合功能層6,而且任二微結構體60的最大寬度、外徑及深度在前述的尺寸範圍之內。Further, each opening 30 of the metal mask 3 is distributed on the metal mask 3 with a fixed hole distance W and a diameter ψ, but after the substrate 1 is eroded by the etching solution 5, the maximum width of any two microstructures 60, The outer diameter and depth are fixed, and there will be a problem of blurred images. Therefore, in the present invention, the openings 30 of the metal mask 3 are distributed on the metal mask 3 with a random hole distance W and a fixed aperture ψ within a predetermined hole distance range, so that the openings 30 are randomly distributed on the metal mask 3. Metal mask 3, or use image simulation software (such as LightTools) to arrange the microstructures 60 in an irregular manner to achieve the optical simulation result of image optimization under the aforementioned conditions, and then according to the optical simulation result The metal mask 3 arranged with the corresponding openings 30 is made, and the substrate 1 is further clamped by the metal mask 3 and the magnetic plate 2, so as to make a composite functional layer 6 on the substrate 1 that conforms to the optical simulation result, and any two The maximum width, outer diameter and depth of the microstructures 60 are within the aforementioned dimensional ranges.

或者,以試算表軟體(如:excel),將微結構體60在前述的條件下以隨機試算條件以不規格排列金屬遮罩3的各開孔30分布位置,再依照前述不規格排列分布位置在金屬遮罩3上設置開孔30。使得金屬遮罩3與磁性板2夾住基板1,基板1經過蝕刻溶液5侵蝕後,在基板1上製作的複合功能層6的任二微結構體60的最大寬度、外徑及深度在前述的尺寸範圍之內。Alternatively, using a spreadsheet software (eg, excel), the microstructures 60 are randomly arranged in random trial calculation conditions in the distribution positions of the openings 30 of the metal mask 3, and then the distribution positions are arranged in accordance with the aforementioned irregularities Openings 30 are provided on the metal shield 3 . Make the metal mask 3 and the magnetic plate 2 sandwich the substrate 1, and after the substrate 1 is eroded by the etching solution 5, the maximum width, outer diameter and depth of any two microstructures 60 of the composite functional layer 6 fabricated on the substrate 1 are as described above. within the size range.

據上所述,本發明利用磁性板2及金屬遮罩3夾住基板1,且僅以一道蝕刻程序,即可在基板1上製作成具有抗反射及抗污的複合功能層6,相較於傳統的基板1需要分別製作抗反射層及抗污層而言,減少了化學藥劑的使用量,可以簡化了製作步驟,達到降低生產成本,減少環境汙染,縮短生產製造時間的目的。此外,為了解決微結構體60規則排列會造成影像模糊的問題,再以各種不同的方式設計金屬遮罩3上的各開孔30的分布位置,以令各開孔30以隨機不規則的方式分布在金屬遮罩3上,進而使得金屬遮罩3與磁性板2夾住基板1,基板1經過蝕刻溶液5侵蝕後,在基板1上製作的複合功能層6的任二微結構體60的最大寬度、外徑及深度在前述的尺寸範圍之內。According to the above, the present invention utilizes the magnetic plate 2 and the metal mask 3 to clamp the substrate 1, and can fabricate the composite functional layer 6 with anti-reflection and anti-fouling on the substrate 1 by only one etching process. The traditional substrate 1 needs to manufacture the anti-reflection layer and the anti-fouling layer separately, which reduces the usage of chemicals, simplifies the manufacturing steps, reduces the production cost, reduces the environmental pollution, and shortens the manufacturing time. In addition, in order to solve the problem of image blur caused by the regular arrangement of the microstructures 60, the distribution positions of the openings 30 on the metal mask 3 are designed in various ways, so that the openings 30 are randomly and irregularly arranged. Distributed on the metal mask 3, so that the metal mask 3 and the magnetic plate 2 sandwich the substrate 1, and after the substrate 1 is eroded by the etching solution 5, any two microstructures 60 of the composite functional layer 6 fabricated on the substrate 1 Maximum width, outer diameter and depth are within the aforementioned dimensional ranges.

上列詳細說明係針對本發明的可行實施例之具體說明,惟前述的實施例並非用以限制本發明之專利範圍,凡未脫離本發明技藝精神所為之等效實施或變更,均應包含於本案之專利範圍中。The above detailed descriptions are specific descriptions of feasible embodiments of the present invention, but the foregoing embodiments are not intended to limit the patent scope of the present invention. Any equivalent implementation or modification that does not depart from the technical spirit of the present invention shall be included in the within the scope of the patent in this case.

1:基板 12:氮化矽層 14:氧化銦錫層 16:發光層 18:電極層 2:磁性板 3:金屬遮罩 30:開孔 4:待製品 5:蝕刻溶液 6:複合功能層 60:微結構體 W:孔距 ψ:孔徑 S101~S103:步驟流程1: Substrate 12: Silicon nitride layer 14: Indium tin oxide layer 16: Light-emitting layer 18: Electrode layer 2: Magnetic plate 3: Metal mask 30: Opening 4: Products to be prepared 5: Etching solution 6: Composite functional layer 60: Microstructures W: hole distance ψ: aperture S101~S103: Step flow

圖1係本發明的製造流程示意圖。 圖2係本發明的金屬遮罩的示意圖。 圖3係本發明的磁性板、金屬遮罩及基板間的磁性吸附示意圖。 圖4係基板無微結構體的光路示意圖。 圖5係基板具有微結構體的光路示意圖。 FIG. 1 is a schematic diagram of the manufacturing process of the present invention. FIG. 2 is a schematic diagram of the metal mask of the present invention. FIG. 3 is a schematic diagram of magnetic adsorption among the magnetic plate, the metal mask and the substrate of the present invention. FIG. 4 is a schematic diagram of the optical path of the substrate without microstructures. FIG. 5 is a schematic diagram of the optical path of the substrate with microstructures.

1:基板 1: Substrate

2:磁性板 2: Magnetic plate

3:金屬遮罩 3: Metal mask

4:待製品 4: Products to be prepared

5:蝕刻溶液 5: Etching solution

6:複合功能層 6: Composite functional layer

60:微結構體 60: Microstructures

S101~S103:步驟流程 S101~S103: Step flow

Claims (10)

一種基板表面結構之製造方法,包括下列步驟: 將一基板夾設在一磁性板與一金屬遮罩之間做為一待製品,其中該金屬遮罩上設有複數個開孔; 將該待製品浸泡在蝕刻溶液中,使得該蝕刻溶液蝕刻侵蝕該基板相對開孔的位置; 從該蝕刻溶液中取出該待製品,移除該磁性板與該金屬遮罩,該基板相對該金屬遮罩的各開孔的位置分別形成一微結構體,該複數微結構體做為具有抗反射及抗污的複合功能層。 A method for manufacturing a substrate surface structure, comprising the following steps: A substrate is sandwiched between a magnetic plate and a metal cover as a product to be prepared, wherein the metal cover is provided with a plurality of openings; Immerse the product to be prepared in an etching solution, so that the etching solution erodes the position of the substrate relative to the opening; Take out the product from the etching solution, remove the magnetic plate and the metal mask, a microstructure is formed at the positions of the substrate relative to the openings of the metal mask, and the plurality of microstructures are used as anti- Reflective and anti-fouling composite functional layer. 如請求項1所述的基板表面結構之製造方法,其中該基板為玻璃。The method for manufacturing a surface structure of a substrate according to claim 1, wherein the substrate is glass. 如請求項1所述的基板表面結構之製造方法,其中該基板為塑膠。The method for manufacturing a substrate surface structure as claimed in claim 1, wherein the substrate is plastic. 如請求項1所述的基板表面結構之製造方法,其中各該開孔係以固定孔距及孔徑分布在金屬遮罩上。The method for manufacturing a surface structure of a substrate as claimed in claim 1, wherein each of the openings is distributed on the metal mask with a fixed pitch and a pore size. 如請求項1所述的基板表面結構之製造方法,其中各該各開孔係在預定的孔距範圍內以隨機孔距及固定的孔徑分布在金屬遮罩上。The method for manufacturing a substrate surface structure as claimed in claim 1, wherein each of the openings is distributed on the metal mask with a random hole distance and a fixed hole diameter within a predetermined hole distance range. 如請求項1所述的基板表面結構之製造方法,其中任二該微結構體的中心距離的最大寬度為200~900奈米之間。The method for manufacturing a substrate surface structure according to claim 1, wherein the maximum width of the center-to-center distance between any two of the microstructures is between 200 and 900 nanometers. 如請求項2所述的基板表面結構之製造方法,其中該蝕刻溶液係為酸類無機溶液。The method for producing a substrate surface structure according to claim 2, wherein the etching solution is an acid-based inorganic solution. 如請求項3所述的基板表面結構之製造方法,其中該蝕刻溶液係為有機溶劑。The method for manufacturing a substrate surface structure according to claim 3, wherein the etching solution is an organic solvent. 如請求項6所述的基板表面結構之製造方法,其中各該微結構體的外徑為任二該微結構體的中心距離的最大寬度的0.2~0.6倍之間。The method for manufacturing a substrate surface structure according to claim 6, wherein the outer diameter of each of the microstructures is between 0.2 and 0.6 times the maximum width of the center-to-center distance of any two of the microstructures. 如請求項9所述的基板表面結構之製造方法,其中各該微結構體的深度微70~200奈米之間。The method for manufacturing a substrate surface structure according to claim 9, wherein the depth of each of the microstructures is between 70 and 200 nanometers.
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CN112979172A (en) 2021-06-18

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