KR101231184B1 - Permeable membrane inspecting device of glass - Google Patents

Abstract

PURPOSE: An apparatus for inspecting a film on a substrate is provided to prevent display errors by efficiently inspecting the twist of the film coated on the surface of the substrate. CONSTITUTION: A lighting module(20) is arranged on the lower side of an inspection table(10). The lighting module irradiates light to the substrate. A camera module(30) is arranged on the upper side of the lighting module and photographs the edges of a vertical part and a horizontal part, and the surface of the substrate. An inspecting unit controls the operation of the camera module and the lighting module.

Description

Permeable membrane inspecting device of glass

The present invention is a technology for inspecting defects in film formation (eg, polyimide (PI)) applied to a surface of an organic light emitting diode (OLED) or an LCD substrate (hereinafter referred to as a "substrate"). In more detail, the present invention relates to a substrate deposition inspection apparatus for measuring the distance between the film deposition applied to the surface of the substrate and the edge portion of the substrate so as to inspect the distortion of the film deposition applied to the surface of the substrate. .

The thin film transistor liquid crystal display device includes a lower substrate on which a thin film transistor is formed, an upper substrate on which a color filter is formed, and a liquid crystal injected between the lower substrate and the upper substrate, and the process of manufacturing the liquid crystal display device is a thin film transistor. It can be divided into three parts such as (TFT) process, cell process and module process.

The TFT process is very similar to a semiconductor fabrication process, and is a process of arranging a thin film transistor on a substrate by repeating a deposition process, a photolithography process, and an etching process.

In the cell process, an alignment layer is formed on a TFT lower plate and an upper plate on which a color filter is formed, alignment is performed so that liquid crystals can be well aligned on the alignment layer, and then, spacers are dispersed and seal printing is performed. To adhere. After the bonding, the liquid crystal is injected into the inside by using a capillary phenomenon, and then the manufacturing process for the liquid crystal display device is finished by sealing the injection hole.

The module process is a step of finally determining the product quality to be delivered to the user, attaching the polarizing plate to the completed panel, mounting the driver-IC, and then printed printed circuit board (PCB) By assembling and finally assembling the backlight unit and the fixture, the liquid crystal module is completed.

On the other hand, OLED is manufactured by depositing an organic material in each cell between the top and bottom glass, the OLED has the advantage that can be driven at a low voltage and made thin, and has a wide viewing angle and fast response speed Unlike a normal LCD (Liquid Crystal Display), the image quality does not change even when viewed from the side, and no afterimage remains on the screen.

In addition, the small screen has an advantageous price competitiveness due to the image quality of LCD and simple manufacturing process.

These OLEDs have 3 (Red, Green, Blue) color independent pixel method, color conversion method (CCM), and color filter method in the color display method. The passive matrix is divided into passive matrix and active matrix.

In addition, OLED is structurally simpler than LCD and plasma display panel (PDP), and it is not only thin, but also flexible, which brightens the flexible display market.

At this time, in the process of manufacturing the substrate of the LCD or OLED, the deposition formed on the surface of the substrate must be precisely aligned according to the application, if the display failure of the substrate is poor There is a problem that occurs.

That is, when the film is applied to the surface of the substrate, the horizontal and vertical distance between the film and the edge portion of the substrate should be constant, but when the film is formed by applying the film to the surface of the substrate, the horizontal and Occasionally, vertical distances are not constant and are distorted, and conventionally, there is no equipment for inspecting the distortion of such deposition.

Accordingly, the present invention is to improve the conventional problems as described above, and to form a film applied to the surface of the substrate by configuring a device for inspecting whether the film is applied to the surface of the substrate and the horizontal and vertical distance of the substrate edge portion is constant It is an object of the present invention to provide a substrate deposition inspection apparatus that effectively inspects a twisting defect of a film, and thereby prevents a display defect due to a film deposition position unevenness in a state in which an LCD or OLED product is manufactured through a process chamber. .

The present invention substrate deposition inspection apparatus for achieving the above object, the inspection table; An illumination module disposed at a lower end of the inspection table and irradiating a light source to the substrate when the substrate coated with the inspection table passes; A camera module disposed on an upper end of the illumination module and photographing edges of a horizontal portion and a vertical portion of the surface of the substrate when the light source is irradiated from the illumination module to the substrate; And controlling the operation of the illumination module and the camera module, and whether the distances formed on the surface of the substrate from the image information photographed by the camera module and the distance between the horizontal and vertical edges of the substrate are within a normal range, respectively. Inspection unit for inspecting; It will be configured to include.

In addition, the camera module is a line scan camera for photographing the surface of the moving substrate and the horizontal portion and the vertical portion edge in a line scan method.

In addition, the lighting module is any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, an LED lighting device.

In addition, the inspection unit calculates the distance between the film formed on the surface of the substrate and the edges of the horizontal and vertical edges of the substrate from the image information photographed from the camera module, and then calculates the calculated value by comparing it with the normal range reference value to normal or torsion. It is equipped with an inspection program that checks for defects.

In addition, the normal range reference value for the film formed on the surface of the substrate and the distance between the horizontal and vertical edges of the substrate is pre-stored in the inspection unit.

In addition, the distance between the film formed on the surface of the substrate and the horizontal edge of the substrate is calculated by calculating (multiplying) the reference length per pixel by the pixel value between the film formed from the image information and the horizontal edge. The distance between the film formed on the surface of the substrate and the vertical edge of the substrate is calculated by calculating (multiplying) the reference length per pixel on the number of pixels between the film formed and the vertical edge measured from the image information.

As such, the present invention constitutes a device for inspecting whether the film deposited on the surface of the substrate and the horizontal and vertical distances of the edge portion of the substrate are uniform, thereby effectively preventing distortion of the film deposited on the surface of the substrate, which is difficult to visually identify. While inspecting, the manufacturing process of the LCD or OLED products is completed through the process chamber to prevent the display defect due to the deviation of the deposition position can be expected.

1 is a side view showing the structure of a substrate deposition inspection apparatus according to an embodiment of the present invention.
Figure 2 is a plan view showing a structure of a substrate deposition inspection apparatus in an embodiment of the present invention.
3 is a schematic view showing image information of a substrate on which a film is formed by a camera module in an embodiment of the present invention.
Figure 4 is an enlarged view of Figure 3 in an embodiment of the present invention an enlarged view of the edge portion of the substrate to which a single layer film is applied.
5 is a schematic block diagram of a substrate deposition inspection apparatus according to an embodiment of the present invention.
6 is an enlarged view of an edge portion of a substrate to which multilayer deposition is applied according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

1 is a side view showing a structure of a substrate deposition inspection apparatus according to an embodiment of the present invention, Figure 2 is a plan view showing a structure of a substrate deposition inspection apparatus according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention the camera 4 is a schematic view showing image information of a substrate on which a film formed by a module is formed, FIG. 4 is an enlarged view of FIG. 3 as an embodiment of the present invention, and is an enlarged view of an edge portion of a substrate to which a single layer film is applied, and FIG. An example of the schematic block diagram of a substrate deposition inspection apparatus is shown.

1 to 5, the substrate deposition inspection apparatus according to an embodiment of the present invention includes a film formation 101 including a polyimide film (hereinafter referred to as a PI film) on the surface of the substrate 100. When the pattern is formed by coating them on the substrate 100, the substrate 100 is inserted into the inspection table 10 to inspect whether the film formation 101 is twisted. The present invention provides a lighting module 20. ), The camera module 30, and the inspection unit 40.

The lighting module 20 is any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED lighting device, and is disposed in a width direction orthogonal to an input direction (length direction) of the substrate 100 at the lower end of the inspection table 10. When the substrate 100 having the film deposition 101 applied to the inspection table 10 passes, the light source is irradiated to the surface of the substrate 100 as well as to the horizontal and vertical edges H and V. Will be.

The camera module 30 is disposed on an upper end of the inspection table 10 and lines horizontal and vertical edges H and V as well as the surface of the substrate 100 passing through the inspection table 10. After photographing in a scan method, it is configured to provide it to the inspection unit 40.

That is, the camera module 30 moves from the illumination module 20 to the surface of the substrate 100, as well as the surface of the substrate 100 that moves in accordance with the light source irradiated to the horizontal and vertical edges (H) (V). Of course, the horizontal and vertical edges (H) (V) is configured to shoot in a line scan method.

The inspection unit 40 is equipped with a control program for controlling the operation of the lighting module 20 and the camera module 30 on / off, as well as the substrate (from the image information taken by the camera module 30) The distances d1 and d2 of the film formation 101 applied on the surface of the substrate 100 and the horizontal and vertical edges H and V of the substrate 100 are within a normal range, or are abnormal distances due to twisting. It is equipped with an inspection program that checks whether or not it is maintained.

That is, the inspection unit 40 is a film 101 applied to the surface of the substrate 100 from the image information photographed from the camera module 30 and the horizontal and vertical edges (H) (V) of the substrate 100. After calculating the distance (d1) (d2) of the) and compares the calculated value with the pre-stored normal range reference value to check whether the normal or torsional failure.

At this time, the distance d1 between the film deposition 101 applied on the surface of the substrate 100 and the horizontal edge H of the substrate 100 is measured by the image information 101 and the horizontal edge H. It is calculated by calculating (multiplying) a reference length (for example, 46 μm) per pixel to a pixel value between the substrates 101 and the substrate 100 of the film deposition 101 applied to the surface of the substrate 100. The distance d2 of the vertical edge V is calculated (multiplied) by the reference length per pixel (e.g. 46 占 퐉) to the number of pixels between the film formation 101 and the vertical edge V measured from the image information. Is configured to calculate.

In the substrate deposition inspection apparatus according to the embodiment of the present invention configured as described above, as shown in FIGS. 1 to 5, the inspection unit when the substrate 100 having the deposition film 100 coated on the surface is first injected into the inspection table 10. 40 is to control the operation of the camera module 30 as well as the lighting module 20 provided on the inspection table (10).

That is, the inspection unit 40 controls the camera module 30 fixedly installed at the upper end of the inspection table 10 as well as the bar module lighting module 20 fixedly disposed at the lower end of the inspection table 10. The lighting module 20 irradiates the light source to the substrate 100 passing through the inspection table 10, and the camera module 30 positioned above the inspection table 10 controls the inspection table 10. After photographing the horizontal and vertical edge (H) (V) in the substrate 100 passing through it is transmitted to the inspection unit 40.

Then, the inspection unit 40 starts the inspection program to detect whether the film formation 101 applied to the surface of the substrate 100 is twisted from the image information photographed from the camera module 30.

That is, the inspection unit 40 has a normal range reference value for the distance d1 between the film formation 101 applied on the surface of the substrate 100 and the horizontal edge H of the substrate 100, and the substrate 100. Information on the normal range reference value for the distance d2 between the film deposition 101 applied on the surface of the substrate 100 and the vertical edge V of the substrate 100 is previously stored. Is set arbitrarily so that the reference values can vary),

The inspection unit 40 has a reference length per pixel (eg, pixel number) between the film formation 101 and the horizontal edge H measured from the image information photographed from the camera module 30. 46 μm) is calculated (multiplied) to calculate the distance d1 between the film formation 101 applied on the surface of the substrate 100 and the horizontal edge H of the substrate 100, and the camera module 30. A reference length (for example, 46 μm) per pixel is calculated (multiplied) on the number of pixels between the film formation 101 and the vertical edge V measured from the image information photographed and provided. The distance d2 between the film formation 101 applied to the surface and the vertical edge V of the substrate 100 is calculated.

Next, the inspection unit 40 is a distance d1 (d2) between the calculated film deposition 101 applied to the surface of the substrate 100 and the horizontal and vertical edges H and V of the substrate 100. ) Is compared with the pre-stored normal range reference value, and it is determined whether the film formation 101 applied to the surface of the substrate 100 is applied in a torsion state or normally.

For example, since one pixel has a length of 46 μm in the image information photographed from the camera module 30, the horizontal edge of the substrate 100 in the image information photographed from the camera module 30. Assuming that the distance d1 between H) and the deposition 101 is measured at 252 pixels, the distance d1 between the horizontal edge H and the deposition 101 is 252 pixels × 46 μm = 11.592 mm The calculated distance (d1 = 11.592mm) is determined to be within the normal range reference value range previously stored in the inspection unit 40.

In addition, since one pixel (Pixel) has a length of 46㎛ in the image information taken from the camera module 30, the vertical edge (V) of the substrate 100 in the image information taken from the camera module 30 Assuming that the distance d2 between the film deposition 101 and the film formation 101 is measured to be 147 pixels, the distance d2 between the vertical edge V and the film formation 101 is 1472 pixels x 46 탆 = 6.762 mm. The calculated distance (d1 = 6.762mm) is checked to be within the normal range reference value range previously stored in the inspection unit 40.

Therefore, when the inspection unit 40 determines that the distance d1 (d2) calculated from the comparison result is the same as or similar to the reference value within the normal range, the film forming film 101 is applied to the surface of the substrate 100. ) Is determined to be normally applied without twisting.

On the other hand, the embodiment of the attached Figures 1 to 5 has been described in that the film forming 101 is applied to the surface of the substrate 100 in a single layer, the inspection of the torsional defect for the single layer film forming 101, The inspection unit 40, on the other hand, as shown in FIG. 6 attached to the other hand, when the film deposition 101, 101a, 101b is applied in multiple layers on the surface of the substrate 100, such multilayer film formation 101 (101a) ( Torsional failure for 101b) can also be checked.

That is, when the multilayer film forming 101, 101a, 101b is applied to the substrate 100 as shown in FIG. 6, the inspection unit 40 preferentially provides the horizontal and vertical edges of the substrate 100. The film 101b farthest away from H) V, i.e., the film 101b applied to the surface of the substrate 100 is the smallest, starting from the smallest, and sequentially, the distance of which is 101b → 101a → 101. (d1 ", d2") (d1 ', d2') (d1, d2) may be calculated, and this calculation method is performed in the same manner as the above-described embodiment of FIGS. 1 to 5, respectively.

Although the technical concept of the substrate deposition inspection apparatus of the present invention has been described together with the accompanying drawings, this is illustrative of the best embodiments of the present invention and is not intended to limit the present invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that such changes and modifications are within the scope of the claims.

10; Examination table 20; Lighting module
30; Camera module 40; Inspection unit
100; Substrates 101, 101a, 101b; Tabernacle

Claims (6)

Inspection table;
An illumination module disposed at a lower end of the inspection table and irradiating a light source to the substrate when the substrate coated with the inspection table passes;
A camera module disposed on an upper end of the illumination module and photographing edges of a horizontal portion and a vertical portion of the surface of the substrate when the light source is irradiated from the illumination module to the substrate; And
The operation of the lighting module and the camera module is controlled, and the image information captured by the camera module is inspected to determine whether the distances formed on the surface of the substrate and the distance between the horizontal and vertical edges of the substrate are within a normal range, respectively. An inspection unit; Substrate film deposition inspection apparatus comprising a. The apparatus of claim 1, wherein the camera module is a line scan camera that photographs the surface of the moving substrate and the edges of the horizontal and vertical portions in a line scan manner. The apparatus of claim 1, wherein the illumination module is any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED illuminator. The method of claim 1, wherein the inspection unit calculates the distance between the film formed on the surface of the substrate and the edges of the horizontal and vertical edges of the substrate from the image information photographed from the camera module, and compares the calculated value with a normal range reference value. And a test program for inspecting whether or not a normal or torsion defect is mounted. The method of claim 4, wherein
And a normal range reference value for the distance between the film deposited on the surface of the substrate and the edges of the horizontal and vertical portions of the substrate is stored in the inspection unit. The method of claim 5, wherein
The distance between the film deposition applied to the surface of the substrate and the horizontal edge of the substrate is calculated by calculating (multiplying) the reference length per pixel by the pixel number Pixel between the film formation and the horizontal edge measured from the image information,
The distance between the film deposited on the surface of the substrate and the vertical edge of the substrate is calculated by calculating (multiplying) the reference length per pixel on the number of pixels between the film formed from the image information and the vertical edge. Inspection device.

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