KR20130051874A - Glass inspecting device - Google Patents

Abstract

PURPOSE: A substrate testing device is provided to precisely test a quality of the surface of a substrate by using total reflection and a scattering light source. CONSTITUTION: A substrate testing device comprises a testing stand(10), a lighting unit(20), a light source absorbing plate(30), a first camera module(40), a second camera module(60), and a testing unit. The lighting unit irradiates a light source to edge portions of the surface, left and right sides, and front and rear end sides of a substrate(100) when the substrate passes through an irradiation stand. The light source absorbing plate is arranged in the lower part of the lighting unit and absorbs the light source irradiated from the lighting unit. The first camera module photographs the surface of the substrate with the lights source which is reflected and scattered by/from the surface and the front and rear end sides of the substrate after being irradiated by the lighting unit. The second camera module photographs the left and right edge portions of the substrate with the light source which is reflected and scattered by/from the left and right edge portions of the substrate after being irradiated by the lighting unit. The testing unit tests a quality of the surface of the substrate based on the information of the images photographed by the first and second camera modules.

Description

Board inspecting device

The present invention relates to an apparatus for inspecting a quality state of an organic light emitting diode (OLED) or an LCD substrate (hereinafter, referred to as a "substrate"), and more specifically, using a light source scattered with total reflection. In addition to inspecting the quality of the substrate surface (e.g. bubbles, foreign objects, cracks, etc.), the quality of the substrate edges (e.g. cracks, broken, etc.) can be inspected. It relates to a substrate inspection apparatus.

The thin film transistor liquid crystal display device includes a lower substrate on which a thin film transistor is formed, an upper substrate on which a color filter is formed, and a liquid crystal injected between the lower substrate and the upper substrate, and the process of manufacturing the liquid crystal display device is a thin film transistor. It can be divided into three parts such as (TFT) process, cell process and module process.

The TFT process is very similar to a semiconductor fabrication process, and is a process of arranging a thin film transistor on a substrate by repeating a deposition process, a photolithography process, and an etching process.

In the cell process, an alignment layer is formed on a TFT lower plate and an upper plate on which a color filter is formed, alignment is performed so that liquid crystals can be well aligned on the alignment layer, and then, spacers are dispersed and seal printing is performed. To adhere. After the bonding, the liquid crystal is injected into the inside by using a capillary phenomenon, and then the manufacturing process for the liquid crystal display device is finished by sealing the injection hole.

The module process is a step of finally determining the product quality to be delivered to the user, attaching the polarizing plate to the completed panel, mounting the driver-IC, and then printed printed circuit board (PCB) By assembling and finally assembling the backlight unit and the fixture, the liquid crystal module is completed.

On the other hand, OLED is manufactured by depositing an organic material in each cell between the top and bottom glass, the OLED has the advantage that can be driven at a low voltage and made thin, and has a wide viewing angle and fast response speed Unlike a normal LCD (Liquid Crystal Display), the image quality does not change even when viewed from the side, and no afterimage remains on the screen.

In addition, the small screen has an advantageous price competitiveness due to the image quality of LCD and simple manufacturing process.

These OLEDs have 3 (Red, Green, Blue) color independent pixel method, color conversion method (CCM), and color filter method in the color display method. The passive matrix is divided into passive matrix and active matrix.

In addition, OLED is structurally simpler than LCD and plasma display panel (PDP), and it is not only thin, but also flexible, which brightens the flexible display market.

At this time, the equipment for manufacturing the LCD or OLED comprises a cleaning chamber, a load lock chamber, a transfer chamber and a process chamber, and the edge of the substrate as well as the surface of the substrate before the substrate is input to the process chamber The quality of the part is inspected.

That is, the apparatus for inspecting the quality state of the substrate typically includes a substrate input device, an inspection table, and a control unit, wherein the inspection table photographs an edge portion as well as the surface of the substrate when the substrate passes through the inspection table. At least one camera, and at least one lighting unit for providing a transmission light so that the shooting of the camera is made clear.

However, in the state where the camera is installed on the upper end of the conventional inspection table and the lighting unit is installed at the lower end thereof, the substrate is allowed to pass between the camera and the lighting unit, and as the transmitted light provided by the lighting unit is cracked on the surface of the substrate. In addition to the presence of foreign materials, cracks and damages at the edges could be inspected through analysis of the image information captured by the camera. Because the patterns cannot be distinguished from cracks or breakages present inside the substrate, the transmission illumination can inspect cracks or breakages inside the substrate on a transparent bare substrate without any pattern on the surface, but on the substrate where the pattern is formed. There is a problem that does not detect cracks or breakage.

In particular, the conventional substrate inspection apparatus has a disadvantage in that it does not properly inspect when there is a bubble phenomenon on the surface of the substrate.

In other words, assuming that bubbles exist in a substrate, the bubbles may occur when a film is deposited on the substrate, such as a pattern. And cracks and breakages are indistinguishable. Accordingly, even if the image is analyzed, the presence of the bubble could not be properly detected.

Accordingly, the present invention is to improve the conventional problems as described above, by configuring a device for precisely inspecting the quality of the surface of the substrate using a light source that is total reflection and scattering, bubbles, foreign matter, In addition to inspecting the presence of cracks, it is also possible to inspect the cracks and cracks at the edges of the substrate, and to check the quality of the substrate before the process is introduced into the process chamber. It is an object of the present invention to provide a substrate inspection apparatus capable of preventing breakage of the substrate.

The present invention substrate inspection apparatus for achieving the above object, the inspection table; An illumination unit disposed on the inspection table and irradiating a light source to the surface of the substrate and the left, right, line, and trailing edges when the substrate passes through the inspection table; A light source absorbing plate positioned under the lighting unit and absorbing a light source irradiated from the lighting unit; A first camera module fixed to the inspection table at the upper side of the lighting unit and photographing the surface of the substrate from a light source irradiated from the lighting unit and reflected and scattered at a line and a rear end of the substrate; A second camera module fixed to an inspection table at the upper side of the lighting unit and photographing the left and right edge portions of the substrate from a light source irradiated from the lighting unit and reflected and scattered from the left and right edge portions of the substrate; And an inspection unit which controls operations of the lighting unit and the first and second camera modules, and inspects a quality state of the surface of the substrate from the image information photographed by the first and second camera modules. It will be configured to include.

In addition, when the pattern is formed on the surface of the substrate, the light source irradiated from the illumination unit to the surface and the edge portion of the substrate is reflected and scattered, the first and second camera modules are the surface and edge of the substrate from the reflected and scattered light source The part is photographed, and the inspection unit is configured to inspect the quality state of the substrate according to the image information photographed from the first and second camera modules.

The lighting unit may include: a first lighting module fixed at both ends to a fixed frame at a predetermined inclination angle, and irradiating a light source that is reflected not only to the surface of the substrate but also to the edge portions of the left and right ends and the line and rear ends when passing through the substrate; And disposed between the first lighting modules and fixed to the fixed frame while maintaining a constant gap to allow the first and second camera modules to photograph the surface and the edge of the substrate. A second lighting module for irradiating the totally reflected light source; It will be configured to include.

In addition, the first and second camera modules are line scan cameras for photographing the surface and the edge of the moving substrate in a line scan method.

In addition, the first and second lighting modules are any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED lighting device.

In addition, the inspection unit is equipped with a detection program for detecting the presence of cracks, damage, foreign matter, and bubbles in the surface and the edge portion of the substrate from the image information taken from the first and second camera modules.

In addition, the pattern formed on the surface of the substrate is formed by applying a film including a polyimide film on the substrate.

In addition, the lighting unit includes a semi-cylindrical cover fixed to both ends of the fixed frame and having a monitor hole located between the both ends of the fixed frame, and at least one illumination module surrounded by the semi-cylindrical cover.

In addition, the semi-cylindrical cover overlaps with the light source absorbing plate vertically.

The semi-cylindrical cover also has the monitor hole in the central area.

The monitor hole of the semi-cylindrical cover faces the first camera module and the second camera module.

In addition, the at least one lighting module is positioned around the monitor hole and fixed to the inner sidewall of the semi-cylindrical cover.

In addition, the at least one lighting module is symmetrically positioned around the monitor hole.

As such, the present invention constitutes an apparatus for precisely inspecting the quality of the surface of the substrate by using total reflection and a light source scattered, thereby inspecting whether bubbles, foreign substances, and cracks exist on the substrate surface. Of course, it is also possible to expect the effect of preventing the damage of the substrate during the process while checking the quality of the substrate before the substrate is introduced into the process chamber by inspecting whether the crack of the substrate edge or cracks (broken) also close.

1 is a perspective view showing the structure of a substrate inspection apparatus as an embodiment of the present invention.
Figure 2 is a front view showing the structure of a substrate inspection apparatus as an embodiment of the present invention.
Figure 3 is a side view showing the structure of a substrate inspection apparatus as an embodiment of the present invention.
Figure 4 is a plan view showing the structure of a substrate inspection apparatus as an embodiment of the present invention.
5A, 5B, and 5C are side schematic views illustrating a state in which surface photographing of a substrate moving using total reflection and scattering illumination is performed according to an embodiment of the present invention;
Figure 6 is a schematic block diagram of a substrate inspection apparatus according to an embodiment of the present invention.
Figure 7 is a perspective view showing the structure of a substrate inspection apparatus in another embodiment of the present invention.
8 is a perspective view showing the external structure of the lighting unit of FIG.
9 is a plan view showing the internal structure of the lighting unit of FIG.

Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

1 is a perspective view showing the structure of a substrate inspection apparatus according to an embodiment of the present invention, Figure 2 is a front view showing the structure of the substrate inspection apparatus according to an embodiment of the present invention, Figure 3 is an embodiment of the present invention The side view showing the structure of the board inspection apparatus is shown.

4 is a plan view showing a structure of a substrate inspection apparatus according to an embodiment of the present invention, and a, b, and c of FIG. 5 are surface photographs of a substrate moving by using total reflection and scattering illumination as an embodiment of the present invention. Figure 6 is a schematic side view showing a state made, Figure 6 shows a schematic block diagram of a substrate inspection apparatus according to an embodiment of the present invention.

1 to 6, the apparatus for inspecting quality of a substrate according to an embodiment of the present invention includes a film including a polyimide film (hereinafter referred to as a PI film) on the surface of the substrate 100. By forming a pattern by coating them on the substrate 100, or is configured on the inspection table 10 is inserted into the substrate 100 to inspect the quality of the state of the substrate 100, the pattern is not formed on the surface, In the present invention, when the pattern is formed on the substrate 100, the quality state is inspected through scattering and total reflection illumination, and even when the pattern is not formed on the substrate 100, the quality state is inspected through scattering and total reflection illumination. To this end, it includes a lighting unit 20, light source absorbing plate 30, the first and second camera modules 40, 60, and the inspection unit 50.

The lighting unit 20 includes bar-shaped structures formed in a width direction perpendicular to an input direction (length direction) of the substrate 100 in the inspection table 10, and both sides of the inspection table 10. Both ends are fixed through the fixing frame 11 provided in the part to irradiate the light source to the surface of the substrate 100 and the edge portions of the left and right and front and rear ends when the substrate 100 passes through the inspection table 10, It includes the first and second lighting modules (21, 22).

The first lighting module 21 is fixed to the fixed frame 11 as any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED illuminator, and the front end side of the substrate 100 is connected to the inspection table 10. When passing through or passing through, it is to irradiate light sources scattered or reflected to the surface as well as the left and right edge portions of the substrate 100.

That is, when no cracks or foreign substances exist on the surface of the substrate 100 on which the pattern is formed, the light source irradiated from the first lighting module 21 is not scattered on the surface of the substrate 100, but the substrate ( If cracks or foreign substances are present on the surface of 100, the light source irradiated from the first illumination module 21 is scattered by cracks or foreign substances present on the surface of the substrate 100.

The second lighting module 22 is any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED illuminator, and the substrate by the first camera module 40 at the rear end side of the first lighting module 21. It is a plurality of structures fixed at both ends to the fixed frame 11 while maintaining a predetermined gap (gap) to enable the photographing of the surface and the edge portion of 100, and is configured to irradiate the light source is totally reflected.

That is, when no bubble exists on the surface of the substrate 100, the light source irradiated from the second illumination module 22 is refracted and scattered by the pattern and the film of the substrate 100, but the substrate 100 is scattered. This is because when the bubble exists on the surface of), the light source irradiated from the second lighting module 22 is totally reflected by the bubble.

Here, the first lighting module 21 maintains the installation angle of symmetry after the line so as to irradiate the light source to the vertical line of the inspection table 10 around the second lighting module 22, as well as the second lighting module Located at the left and right ends of the (22), to form an arrangement structure surrounding the second lighting module (22).

The light source absorbing plate 30 is disposed below the lighting unit 20, that is, on the same vertical line as the second lighting module 22, and is configured to absorb the light source irradiated from the lighting unit 20.

That is, the light source absorbing plate 30 is taken when the surface and the edge portion of the substrate 100 by the first and second camera modules 40 and 60 are taken, the first and second illumination modules 21 ( 22) absorbs the light source, and thus the image information photographed by the first and second camera modules 40 and 60 has a shaded area (eg, black) that is separated from the surroundings, and thus the inspection The unit 50 can easily detect the presence of cracks or foreign substances, breakage or bubbles in the shaded area.

The first camera module 40 photographs the surface of the moving substrate 100 by a line scan method, and is positioned above the lighting unit 20, that is, on the same vertical line as the second lighting module 22. The surface of the substrate 100 is fixed to the inspection table 10 and is photographed from a light source irradiated from the illumination unit 20 to be scattered or reflected from the surface of the substrate 100.

In this case, the surface photographing of the substrate 100 by the first camera module 40 may be performed through a predetermined gap formed between the plurality of second lighting modules 22.

The second camera module 60 is a line scan method for the edge portion of the substrate 100 moving according to the light source irradiated from the first and second light source modules 21 and 22 to the edge portion of the substrate 100. It is configured to shoot with.

The inspection unit 50 controls on / off operations of the first and second illumination modules 21 and 22 and the first and second camera modules 40 and 60 included in the lighting unit 20. Of course, the control program is installed, as well as the quality of the surface and / or the edge portion of the substrate 100 from the image information photographed by the first and second camera modules 40, 60, that is, cracks, foreign matter, The detection program which detects whether a damage or a bubble exists is mounted.

Substrate inspection apparatus using a total reflection and scattering illumination according to an embodiment of the present invention configured as described above, as shown in Figures 1 to 6 attached, first, the inspection unit 50 when the substrate 100 is put into the inspection table 10 side The operation of the first and second camera modules 40, 60 as well as the lighting unit 20 provided on the inspection table 10.

That is, the inspection unit 50 is fixed to the fixing frame 11 of the inspection table 10 as well as the first camera module 40 fixedly installed on the upper side of the inspection table 10 of the first bar-shaped , 2 bar to control the operation of the lighting module 21, 22 and the second camera module 60,

As shown in FIG. 5A, the first lighting module 21 is configured to absorb light by the light absorbing plate 30 when the front end side of the substrate 100 passes through the inspection table 10. Irradiating the light source to the leading edge side and the surface of the), the plurality of second lighting module 22 is the substrate 100 so that the light source is absorbed by the light absorbing plate 30 as shown in Figure 5b The light source is irradiated to the surface and the edge portion of the light source, and the first lighting module 21 is a light source absorbing plate 30 when the rear end side of the substrate 100 passes through the inspection table 10 as shown in FIG. The light source is irradiated to the left and right sides of the substrate 100 as well as to the rear edge portion and the surface of the substrate 100 to absorb the light source.

Then, the first camera module 40 positioned above the inspection table 10 may include a substrate passing through the inspection table 10 through a predetermined gap formed between the plurality of second lighting modules 22. After photographing the edges of the front and rear ends, as well as the surface of the surface 100, and transmitting them to the inspection unit 50, the second camera module 60 is left of the substrate 100 passing through the inspection table 10. , After photographing the right edge portion is transmitted to the inspection unit 50.

In this case, when a pattern is formed on the substrate 100, when no crack or foreign matter is generated on the surface of the substrate 100, the light source irradiated by the first illumination module 21 is the substrate 100. Scattering does not occur much by the pattern at the surface and the edge of the light source. However, when cracks or foreign substances exist on the surface of the substrate 100, the light source irradiated from the first lighting module 21 may be a surface of the substrate 100. And cracks or foreign substances present in the edge portion is generated a lot of scattering, when the first camera module 40 is photographed on the surface of the substrate 100 is irradiated with the light source in the scattered state, the first camera module 40 The information according to the scattering of the light source is projected onto the image information photographed by).

Then, the inspection unit 50 is able to detect the presence of cracks or foreign substances on the surface of the substrate 100 from the information projected by the light source scattering by running the detection program.

On the other hand, when no pattern is formed on the substrate 100, when no cracks or foreign substances are generated on the surface of the substrate 100, the light source irradiated by the first lighting module 21 is the substrate 100. Although scattering does not occur at the surface of the substrate 100, if a crack or a foreign substance is present on the surface of the substrate 100, the light source irradiated from the first lighting module 21 is present at the surface and the edge of the substrate 100. Or images that are taken by the first camera module 40 when the first camera module 40 photographs the surface of the substrate 100 that is refracted and scattered by foreign matter and irradiated with the light source in the refractive and scattered state. Information on the light source refraction and scattering is projected onto the information.

Then, the inspection unit 50 is able to detect the presence of cracks or foreign substances on the surface of the substrate 100 from the information projected by the light source refraction and scattering by running the detection program.

On the other hand, when there is no bubble on the surface of the substrate 100 in the state that the pattern is not formed on the substrate 100, the light source irradiated from the second illumination module 22 to the substrate 100 Is transmitted, but when bubbles exist on the surface of the substrate 100, the light source irradiated from the second illumination module 22 is totally reflected by bubbles formed on the surface of the substrate 100.

When the first camera module 40 photographs the surface of the substrate 100 to which the light source in the total reflection state is irradiated, the information according to the total reflection of the light source is directly reflected on the image information photographed by the first camera module 40. do.

Then, the inspection unit 50 is able to detect the presence of bubbles on the surface of the substrate 100 from the information projected by the total reflection of the light source by running the detection program.

In this case, the detection operation such as cracking or damage to the edge portion of the substrate 100 may be performed simultaneously with the operation of detecting whether cracks, foreign substances, and bubbles are present on the surface of the substrate 100, or may be independently performed. It could be.

Next, a substrate inspection apparatus according to another embodiment of the present invention will be described with reference to FIGS. 7 to 9.

7 is a perspective view showing the structure of a substrate inspection apparatus according to another embodiment of the present invention, FIG. 8 is a perspective view showing the external structure of the lighting unit of FIG. 7, and FIG. 9 is a flat view showing the internal structure of the lighting unit of FIG. 8. .

7 to 9, a substrate inspection apparatus according to another embodiment of the present invention includes an inspection table 10A, an illumination unit 20A, a light source absorbing plate 30A, and first and second camera modules 40A and 60A. It includes as shown in FIG. The inspection table 10A, the light source absorbing plate 30A, and the first and second camera modules 40A and 60A may include the inspection table 10, the light source absorbing plate 30, and the first and second camera modules of FIG. 40 and 60 have the same shape and the same connection relationship.

However, the lighting unit 20A has a different shape from the lighting unit 20 of FIG. 1. In more detail, the lighting unit 20A has a semi-cylindrical cover 21A and a plurality of lighting modules 26A and 29A as shown in FIGS. 7 to 9. The semi-cylindrical cover 21A is fixed to both ends of the fixing frame 11A of the inspection table 10A as shown in FIG. The semi-cylindrical cover 21A vertically overlaps the light source absorbing plate 30A.

The semi-cylindrical cover 21A has a monitor hole 23A located between both ends of the fixed frame 11A. The monitor hole 23A is located in the central region of the semi-cylindrical cover 21A. The monitor hole 23A is configured to face the first camera modules 40A and the second camera modules 60A. The monitor hole 23A is located along the first camera modules 40A and the second camera modules 60A.

The monitor hole 23A penetrates the semi-cylindrical cover 21A as shown in FIG. 8. The plurality of lighting modules 26A, 29A are configured to be surrounded by a semi-cylindrical cover 21A. The plurality of lighting modules 26A and 29A are positioned around the monitor hole 23A and fixed to the inner side wall of the semi-cylindrical cover 21A as shown in FIG. 9. The plurality of lighting modules 26A and 29A are symmetrically positioned around the monitor hole 23A.

The plurality of lighting modules 26A and 29A may be located at one inner sidewall of the semi-cylindrical cover 21A. In this case, the illumination unit 20A, the light source absorbing plate 30A, the first and second camera modules 40A and 60A, and the inspection unit 50A are provided with respect to the substrate 100 and the illumination unit 20 of FIG. 1. , The light source absorbing plate 30 and the first and second camera modules 40 and 60, and the inspection unit 50 of FIG. 6.

To this end, the substrate inspection apparatus according to another embodiment of the present invention may move the glass substrate 100 toward the inspection table 10. In the case where the glass substrate 100 is inserted into the inspection table 10, the glass substrate 100 is positioned below the semi-cylindrical cover 21A. The plurality of lighting modules 26A and 29A irradiate light onto the glass substrate 100.

The glass substrate 100 is treated under the same process conditions as in FIGS. 1 to 6. Light of the plurality of illumination modules 26A and 29A is irradiated toward the glass substrate from the inner sidewall of the semicylindrical cover 21A. The light of the plurality of illumination modules 26A, 29A is beam focused toward the bottom of the semi-cylindrical cover 21A by the shape of the semi-cylindrical cover 21A during reflection, scattering, and / or total reflection from the substrate 100. (beam collection).

The beam focusing may make the intensity of light in the region corresponding to the occupied area of the semi-cylindrical cover 21A on the substrate 100 positioned below the semi-cylindrical cover 21A uniform. After the light is focused, some of the light may pass through the monitor window 23A of the semi-cylindrical cover 21A. Some of the light is focused on the first camera modules 40A and the second camera modules 60A to project the image of the substrate 100 onto the first camera modules 40A and the second camera modules 60A. You can. Thereafter, the image of the substrate 100 may be transferred to the inspection unit 50 of FIG. 6.

Although the technical concept of the substrate inspection apparatus of the present invention has been described together with the accompanying drawings, this is illustrative of the best embodiment of the present invention and is not intended to limit the present invention.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention as defined by the appended claims. It is to be understood that such changes and modifications are within the scope of the claims.

10, 10A; Examination table 11, 11A; Fixed frame
20, 20A; Lighting unit 21A; Semi-cylindrical cover
21, 22; 1,2 lighting module 23A; Monitor window
26A, 29A; Lighting module 30, 30A; Light absorption plate
40, 40A; A first camera module 50; Inspection unit
60, 60A; A second camera module 100; Board

Claims (12)

Inspection table;
An illumination unit disposed on the inspection table and irradiating a light source to the surface of the substrate and the left, right, line, and trailing edges when the substrate passes through the inspection table;
A light source absorbing plate positioned under the lighting unit and absorbing a light source irradiated from the lighting unit;
A first camera module fixed to the inspection table at the upper side of the lighting unit and photographing the surface of the substrate from a light source irradiated from the lighting unit and reflected and scattered at a line and a rear end of the substrate;
A second camera module fixed to an inspection table at the upper side of the lighting unit and photographing the left and right edge portions of the substrate from a light source irradiated from the lighting unit and reflected and scattered from the left and right edge portions of the substrate; And
An inspection unit for controlling the operation of the lighting unit and the first and second camera modules and inspecting a quality state of the surface of the substrate from the image information photographed by the first and second camera modules; Substrate inspection apparatus, characterized in that comprising a. According to claim 1, When the pattern is formed on the surface of the substrate, the light source irradiated from the illumination unit to the surface and the edge portion of the substrate is reflected and scattered, the first and second camera modules from the reflected and scattered light source is the substrate Photographing the surface and edge portions of the substrate, and the inspection unit configured to inspect the quality state of the substrate according to the image information photographed from the first and second camera modules. The method of claim 1 or 2, wherein the lighting unit,
Both ends are fixed to the fixed frame at a predetermined inclination angle, the first illumination module for irradiating the light source reflected to the edges of the left, right end and the line, rear end, as well as the surface of the substrate when passing through the substrate; And
Is disposed between the first lighting module is fixed to the fixed frame while maintaining a constant gap to enable the photographing of the surface and the edge portion of the substrate by the first and second camera modules, the total reflection to the surface of the substrate A second lighting module irradiating a light source; Substrate inspection apparatus, characterized in that comprising a. The apparatus of claim 3, wherein the first and second camera modules are line scan cameras which photograph the surface and the edge of the moving substrate in a line scan method. The apparatus of claim 3, wherein the first and second lighting modules are any one of an Xe-lamp, a halogen lamp, a high frequency fluorescent lamp, and an LED illuminator. The method of claim 3, wherein the inspection unit is equipped with a detection program for detecting the presence of cracks, damage, foreign matter, and bubbles on the surface and the edge of the substrate from the image information taken from the first and second camera modules Board inspection apparatus. The apparatus according to claim 1, wherein the illumination unit
A semi-cylindrical cover fixed to both ends of the fixed frame and having a monitor hole located between the both ends of the fixed frame; And
And at least one illumination module surrounded by the semi-cylindrical cover. The substrate inspection apparatus of claim 7, wherein the semi-cylindrical cover overlaps the light source absorbing plate vertically. 8. The apparatus of claim 7, wherein the semi-cylindrical cover has the monitor hole in a central area. The substrate inspection apparatus of claim 7, wherein the monitor hole of the semi-cylindrical cover faces the first camera module and the second camera module. The apparatus of claim 7, wherein the at least one lighting module is positioned around the monitor hole and fixed to an inner sidewall of the semi-cylindrical cover. The apparatus of claim 7, wherein the at least one lighting module is symmetrically positioned around the monitor hole.

Images