KR101218228B1 - 균일 비율에서의 물질 기화 방법 - Google Patents

균일 비율에서의 물질 기화 방법 Download PDF

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Publication number
KR101218228B1
KR101218228B1 KR1020087002085A KR20087002085A KR101218228B1 KR 101218228 B1 KR101218228 B1 KR 101218228B1 KR 1020087002085 A KR1020087002085 A KR 1020087002085A KR 20087002085 A KR20087002085 A KR 20087002085A KR 101218228 B1 KR101218228 B1 KR 101218228B1
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South Korea
Prior art keywords
vaporization
heating element
column
organic material
rate
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KR1020087002085A
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English (en)
Korean (ko)
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KR20080031028A (ko
Inventor
마이클 롱
브루스 에드워드 코페
Original Assignee
글로벌 오엘이디 테크놀러지 엘엘씨
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/246—Replenishment of source material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/12—Organic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/548—Controlling the composition

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020087002085A 2005-07-27 2008-01-25 균일 비율에서의 물질 기화 방법 Active KR101218228B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/190,653 2005-07-27
US11/190,653 US7989021B2 (en) 2005-07-27 2005-07-27 Vaporizing material at a uniform rate
PCT/US2006/028238 WO2007015948A1 (en) 2005-07-27 2006-07-20 Method for vaporizing material at a uniform rate

Publications (2)

Publication Number Publication Date
KR20080031028A KR20080031028A (ko) 2008-04-07
KR101218228B1 true KR101218228B1 (ko) 2013-01-04

Family

ID=37432381

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020087002085A Active KR101218228B1 (ko) 2005-07-27 2008-01-25 균일 비율에서의 물질 기화 방법

Country Status (7)

Country Link
US (2) US7989021B2 (https=)
EP (1) EP1924721B1 (https=)
JP (1) JP5139287B2 (https=)
KR (1) KR101218228B1 (https=)
CN (1) CN100575537C (https=)
TW (1) TWI382100B (https=)
WO (1) WO2007015948A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7972443B2 (en) * 2008-11-14 2011-07-05 Global Oled Technology Llc Metering of particulate material and vaporization thereof
US8062427B2 (en) 2008-11-14 2011-11-22 Global Oled Technology Llc Particulate material metering and vaporization
CN102883960B (zh) * 2010-02-16 2015-08-19 耐斯特科技有限公司 具有复合灵活壁的流体容器
JP2013104127A (ja) * 2011-11-16 2013-05-30 Mitsubishi Heavy Ind Ltd 真空蒸着装置
KR102073745B1 (ko) * 2013-04-02 2020-02-05 주식회사 선익시스템 증발원 및 이를 구비한 증착장치
CN106947941B (zh) * 2017-04-13 2019-12-06 合肥鑫晟光电科技有限公司 蒸镀系统
CN108060392B (zh) * 2017-12-14 2023-07-18 深圳先进技术研究院 一种可控线性蒸发装置及镀膜方法
KR20200076389A (ko) * 2018-12-19 2020-06-29 주식회사 포스코 Pvd 도금 공정에서의 도금층 제어 장치 및 방법
DE102020123764A1 (de) * 2020-09-11 2022-03-17 Apeva Se Verfahren zum Erzeugen eines zeitlich konstanten Dampfflusses sowie Verfahren zum Einstellen eines Arbeitspunktes einer Vorrichtung zum Erzeugen eines Dampfes
EP4053303A1 (en) * 2021-03-01 2022-09-07 Carl Zeiss Vision International GmbH Vapor deposition method for coating a spectacle lens, physical vapor deposition system and crucible for physical vapor deposition

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US2447789A (en) 1945-03-23 1948-08-24 Polaroid Corp Evaporating crucible for coating apparatus
JPS59177365A (ja) * 1983-03-24 1984-10-08 Matsushita Electric Ind Co Ltd 蒸発方法とその装置
US4861989A (en) * 1983-08-30 1989-08-29 Research Corporation Technologies, Inc. Ion vapor source for mass spectrometry of liquids
CN2122671U (zh) * 1992-05-26 1992-11-25 王守成 螺旋管式旋转薄膜蒸发器
EP0585848A1 (de) 1992-09-02 1994-03-09 Hoechst Aktiengesellschaft Verfahren und Vorrichtung zur chemischen Gasphasenabscheidung dünner Schichten
US6296711B1 (en) 1998-04-14 2001-10-02 Cvd Systems, Inc. Film processing system
US6358323B1 (en) * 1998-07-21 2002-03-19 Applied Materials, Inc. Method and apparatus for improved control of process and purge material in a substrate processing system
JP2000068055A (ja) 1998-08-26 2000-03-03 Tdk Corp 有機ｅｌ素子用蒸発源、この有機ｅｌ素子用蒸発源を用いた有機ｅｌ素子の製造装置および製造方法
US6202591B1 (en) * 1998-11-12 2001-03-20 Flex Products, Inc. Linear aperture deposition apparatus and coating process
US6237529B1 (en) * 2000-03-03 2001-05-29 Eastman Kodak Company Source for thermal physical vapor deposition of organic electroluminescent layers
US20020015855A1 (en) * 2000-06-16 2002-02-07 Talex Sajoto System and method for depositing high dielectric constant materials and compatible conductive materials
JP4570232B2 (ja) * 2000-10-20 2010-10-27 株式会社アルバック プラズマディスプレイ保護膜形成装置および保護膜形成方法
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TW552313B (en) * 2001-08-13 2003-09-11 Jusung Eng Co Ltd Method of forming a MOCVD-TiN thin film
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Also Published As

Publication number Publication date
EP1924721A1 (en) 2008-05-28
US7989021B2 (en) 2011-08-02
US20070026146A1 (en) 2007-02-01
KR20080031028A (ko) 2008-04-07
JP5139287B2 (ja) 2013-02-06
JP2009503256A (ja) 2009-01-29
WO2007015948A1 (en) 2007-02-08
US20110247562A1 (en) 2011-10-13
CN101248206A (zh) 2008-08-20
TW200710240A (en) 2007-03-16
TWI382100B (zh) 2013-01-11
CN100575537C (zh) 2009-12-30
EP1924721B1 (en) 2014-07-02

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