KR101184063B1 - Apparatus For Fabricating Liquid Crystal Display Panel - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing a liquid crystal display panel, wherein the apparatus for spraying a stripping solution on a substrate at a temperature of 70 degrees to 90 degrees to remove organic matter present on the substrate and de-ionzed water (DI). A peeling unit for removing the peeling liquid by rotating a brush on the substrate while spraying the sheet toward the substrate; An IPA treatment unit spraying an isopropyl alcohol (Isopropyl alcohol, IPA) solution on the substrate to prevent solidification of the stripping solution remaining on the substrate; A hydraulic unit for cleaning the substrate sprayed with the isopropyl alcohol (IPA) solution using a high pressure; An ultrasonic unit for cleaning the substrate passing through the hydraulic unit using high frequency; And a heater for heating air, and a drying unit for drying the supplied substrate through the ultrasonic unit by using an air knife for injecting the heated air onto the substrate.

Description

Apparatus For Fabricating Liquid Crystal Display Panel

1 is a view showing a conventional liquid crystal display panel.

2 is a view showing an apparatus for manufacturing a liquid crystal display panel in which photoresist removal, cleaning, and drying processes are performed.

FIG. 3 is a diagram illustrating an apparatus for manufacturing a liquid crystal display panel in which photoresist stripping, washing, and drying processes according to a first embodiment of the present invention are performed.

4 is a view showing an apparatus for manufacturing a liquid crystal display panel in which photoresist stripping, cleaning, and drying processes according to a second embodiment of the present invention are performed.

Description of the Related Art

10,110: peeling part 20,120: IPA treatment part

30,130: brush portion 40,140: water pressure portion

50,150: ultrasonic unit 60,160: drying unit

62,162: Air Knives

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing a liquid crystal display panel, and more particularly, to an apparatus for manufacturing a liquid crystal display panel capable of improving the cleaning ability of a substrate.

1 is a perspective view illustrating a general liquid crystal display panel.

The liquid crystal display panel shown in FIG. 1 includes a color filter substrate 81 and a TFT substrate 91 bonded together with a liquid crystal 86 interposed therebetween.

The liquid crystal 86 is rotated in response to an electric field applied to the liquid crystal 86 to adjust the amount of light transmitted through the TFT substrate 91.

The color filter substrate 81 includes a color filter 82 and a common electrode 84 formed on the rear surface of the upper substrate 80a. In the color filter 82, the color filter layers of red (R), green (G), and blue (B) colors are arranged in a stripe form to transmit light of a specific wavelength band, thereby enabling color display. A black matrix (not shown) is formed between the color filters 82 of adjacent colors to absorb the light incident from the adjacent cells, thereby preventing the lowering of the contrast.

The TFT substrate 91 is formed so that the data line 99 and the gate line 94 cross each other on the front surface of the lower substrate 80b, and the TFT 90 is formed at the intersection thereof. The TFT 90 includes a gate electrode connected to the gate line 94, a source electrode connected to the data line 99, and a drain electrode facing the source electrode with a channel interposed therebetween. The TFT 90 is connected to the pixel electrode 92 through a contact hole passing through the drain electrode. The TFT 90 selectively supplies the data signal from the data line 99 to the pixel electrode 92 in response to the gate signal from the gate line 94.

The pixel electrode 92 is positioned in a cell region divided by the data line 99 and the gate line 94 and is made of a transparent conductive material having high light transmittance. The pixel electrode 99 generates a potential difference from the common electrode 84 formed on the upper substrate 80a by the data signal supplied via the drain electrode. Due to this potential difference, the liquid crystal 86 located between the lower substrate 80b and the upper substrate 80a is rotated by dielectric anisotropy. Accordingly, the light supplied from the light source via the pixel electrode 92 is transmitted toward the upper substrate 80a.

A photolithography process is used to form a semiconductor layer, an insulating layer, a plurality of electrodes, signal lines, and the like of a liquid crystal display panel having such a configuration.

For example, after the gate electrode material is deposited on the substrate by a deposition method such as sputtering, a photoresist is applied and a photolithography process using a mask is performed to form a photoresist pattern. The gate electrode material is etched using the photoresist pattern as a mask to form a gate electrode or the like.

The photoresist pattern is then removed by the strip process.

FIG. 2 is a diagram illustrating an apparatus for manufacturing a liquid crystal display panel in which a strip process, a cleaning process, and a drying process for removing a photoresist are performed.

The apparatus for manufacturing a liquid crystal display panel illustrated in FIG. 2 includes a peeling part (or strip part) 10, an isopropyl alcohol (hereinafter referred to as “IPA”) processing part 20, a brush part 30, and a hydraulic pressure ( and a conveyor belt 6 for moving the substrate 8 to each processing unit, including a cavitation jet unit 40, an ultrasonic unit 50, and a drying unit 60.

The peeling unit 10 includes a spray nozzle 4 for spraying a strip solution supplied from an external solution storage unit (not shown), and the strip solution 5 is discharged from the spray nozzle 4 to the substrate 8. Spray on to remove the photoresist.

The IPA processing unit 20 includes a spray nozzle 24 for spraying an IPA solution supplied from an external solution storage unit (not shown) on the front surface of the substrate 8 from which the photoresist has been removed, and the spray nozzle ( 24 serves to surface-treat the substrate 8 by spraying the IPA solution onto the substrate 8. That is, since the strip solution for removing the photoresist is attached to the surface of the substrate 8 to condense, the strip solution condenses the remaining strip solution by spraying the IPA solution onto the substrate 8 as a measure to prevent the condensation of the strip solution. Will be prevented.

The brush unit 30 rotates the brush 36 to remove strip solution while spraying de-ionzed water (hereinafter referred to as “DI”) onto the substrate 8 using the spray nozzle 34. .

The hydraulic unit 40 uses high pressure, and the ultrasonic unit 50 removes a small amount of foreign matter remaining on the substrate 8 by using high frequency.

The drying unit 60 dries the cleaned substrate 8 by using the air knife 62 for blowing compressed air.

The conveyor belt 6 is driven by a drive source such as a motor as a moving means for moving the substrate 8 to each processing unit.

The operation of the liquid crystal display panel having such a structure will be described below.

First, the substrate 8 on which the photoresist is formed by the conveyor belt 6 is positioned at the peeling part 10. In the peeling unit 10, the strip solution 5 supplied from the external solution reservoir is sprayed through the spray nozzle 4 to remove the photoresist.

The substrate 8 from which the photoresist has been removed is transferred to the IPA treatment unit 20 and surface-treated with the IPA solution. Here, the IPA solution serves to prevent the strip solution 5 from sticking to the surface of the substrate 8 to condense.

The substrate 8 surface-treated with the IPA solution is transferred to the brush portion 30. In the brush part 30, DI is injected onto the substrate 8, and the strip solution is removed by rotating the brush 36.

Subsequently, the substrate 8 is sequentially transferred to the hydraulic unit 40 and the ultrasonic unit 50 and cleaned by high pressure and high frequency to remove even a small amount of foreign matter.

As such, the cleaned substrate 8 is transferred to the drying unit 60 and dried by compressed air from the air knife 62.

On the other hand, in the conventional apparatus for manufacturing a liquid crystal display panel, as the substrate 8 gradually increases in size, a small amount of strip solution or foreign matter removed from the brush part 30 may be recontaminated on the substrate 8 again. . Such foreign matters are not reliably cleaned because the foreign matters removed in the hydraulic part 40 and the ultrasonic part 50 are recontaminated in the substrate 8.

An object of the present invention is to provide an apparatus for manufacturing a liquid crystal display panel which can improve the cleaning ability of the substrate.

The apparatus for manufacturing a liquid crystal display panel according to an embodiment of the present invention sprays a stripping solution onto a substrate at a temperature of 70 degrees to 90 degrees to remove organic substances on the substrate, and sprays a brush on the substrate while spraying DI toward the substrate. A peeling unit rotating to remove the peeling liquid; An IPA treatment unit spraying an IPA solution onto the substrate to prevent solidification of the stripping solution remaining on the substrate; A hydraulic pressure unit for cleaning the substrate sprayed with the IPA solution using a high pressure; An ultrasonic unit for cleaning the substrate passing through the hydraulic unit using high frequency; And a drying unit for drying the supplied substrate passing through the ultrasonic wave unit by using a heater for heating air and an air knife for spraying the heated air on the substrate.
The liquid crystal display panel manufacturing apparatus includes a first flipper disposed between the IPA processing unit and the pressure receiving unit to hold the substrate upside down so that the pixel array surface of the substrate having passed through the IPA processing unit faces downward. part; And a second flipper disposed between the ultrasonic part and the drying part to rotate the substrate to be seated on the conveyor belt so that the pixel array of the substrate having passed through the ultrasonic part faces upward, and passes through the second flipper. One substrate is supplied to the drying unit through the conveyor belt.
The peeling unit further includes a nozzle for spraying the DI after spraying the peeling liquid.
The peeling unit may include a first nozzle for spraying the peeling liquid; And a nozzle for injecting the DI.
Other objects and features of the present invention in addition to the above objects will be apparent from the description of the embodiments with reference to the accompanying drawings.

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Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 3 to 4.

3 is a view showing an apparatus for manufacturing a liquid crystal display panel in which a photoresist stripping, cleaning process, and drying process are performed according to a first embodiment of the present invention.

The apparatus for manufacturing a liquid crystal display panel illustrated in FIG. 3 includes a peeling part (or strip part) 110, an IPA processing part 120, a pressure receiving part 140, an ultrasonic part 150, and a drying part 160. And a conveyor belt 106 for moving the substrate 108 to the processing portion.

The peeling unit 110 includes an injection nozzle 104 for injecting a strip solution supplied from an external solution storage unit (not shown), and the strip solution 105 is transferred from the injection nozzle 104 to the substrate 108. The photoresist is removed by spraying on the phase. In addition, the peeling unit 110 is further provided with a brush 136 made of nylon or PTFA material, the strip solution is removed by rotating the brush 136 while spraying DI. That is, the conventional brush part 30 is removed and the brush 136 is added to the peeling part 110. Here, the photoresist stripping process and stripping solution removal process is performed in an environment of about 70 degrees to 90 degrees, and DI used when stripping solution is removed by brush 136 is injection nozzle 104 for spraying strip solution 105. It may be injected through or sprayed through a separately provided injection nozzle.

As a result, the stripping solution is removed by the brush 136 immediately after the photoresist is removed by the stripping solution, thereby improving the cleaning ability. In addition, by removing the conventional brush portion 30 it is possible to reduce the volume of the device.

The IPA processing unit 120 includes a spray nozzle 124 for spraying an IPA solution supplied from an external solution storage unit (not shown) on the front surface of the substrate 108 from which the photoresist is removed, and the spray nozzle ( Spraying the IPA solution from the 124 to the substrate 108 serves to surface-treat the substrate 108. That is, the IPA solution is sprayed onto the substrate 108 to prevent condensation of a very small amount of strip solution that is not removed from the peeling part, thereby preventing condensation of a very small amount of strip solution.

The hydraulic unit 140 uses high pressure, and the ultrasonic unit 150 removes extremely small amount of foreign matter remaining on the substrate 108 using high frequency.

The drying unit 160 includes an air knife 162 for injecting compressed air to the cleaned substrate 108, and a heater 165 for supplying high-pressure compressed air to the air knife 162. The drying unit 160 sprays hot compressed air heated by the heater 165 on the surface of the substrate 108 through the air knife 162 to dry the substrate 108.

The conveyor belt 106 is driven by a drive source such as a motor as a moving means for moving the substrate 108 to each processing unit.

The operation of the liquid crystal display panel having such a structure will be described below.                     

First, the substrate 108 on which the photoresist is formed by the conveyor belt 106 is positioned at the peeling part 110. In the peeling unit 110, the strip solution 105 supplied from the external solution reservoir is sprayed through the injection nozzle 104 to remove the photoresist, and the strip solution is also removed by rotating the brush 136.

The substrate 108 from which the photoresist is removed is transferred to the IPA processing unit 120 and surface-treated with the IPA solution. Here, the IPA solution serves to prevent the very small amount of remaining strip solution 105 from sticking to the surface of the substrate 108 and condensing.

The substrate 108 surface-treated with the IPA solution is sequentially transported to the hydraulic unit 140 and the ultrasonic unit 150 and cleaned by high pressure and high frequency to remove even a small amount of foreign matter.

After the cleaning is completed, the substrate 108 is transferred to the drying unit 160 and dried by compressed air injected from the air knife 162. Here, the drying unit 160 may be provided with a heater to dry the substrate using a high-temperature compressed air.

As described above, in the apparatus for manufacturing a liquid crystal display panel according to the first exemplary embodiment of the present invention, the brush part is removed and the brush 136 is additionally provided on the peeling part 110. Accordingly, the strip solution removal process is performed immediately after the photoresist stripping process is performed in the stripping unit 110, thereby reducing the volume of the manufacturing apparatus and improving the cleaning ability.

FIG. 4 is a view illustrating an apparatus for manufacturing a liquid crystal display panel in which a photoresist stripping, cleaning process, and drying process are performed according to a second embodiment of the present invention.                     

Referring to FIG. 4, the apparatus for manufacturing a liquid crystal display panel includes a peeling unit 110, an IPA processing unit 120, a first flipper unit 180, a hydraulic pressure unit 140, an ultrasonic unit 150, and a second flipper unit ( 190 and a drying unit 160, and a conveyor belt 106 for moving the substrate 108 to each processing unit.

The peeling unit 110 includes an injection nozzle 104 for injecting a strip solution supplied from an external solution storage unit (not shown), and the strip solution 105 is transferred from the injection nozzle 104 to the substrate 108. The photoresist is removed by spraying on the phase. In addition, the stripping part 110 is provided with a brush 136 made of nylon or PTFA, thereby removing the stripping solution by rotating the brush 136. That is, the brush 136 is added to the peeling part 110 in the same manner as in the first embodiment of the present invention. Here, the photoresist stripping process and stripping solution removal process are performed in an environment of about 70 degrees to 90 degrees, and de-ionzed water (hereinafter referred to as "DI") used when stripping strips are removed by the brush 136. The spray solution may be sprayed through the spray nozzle 104 for spraying the strip solution 105 or sprayed through a separate spray nozzle.

Immediately after the photoresist is removed by the stripping solution, the stripping solution is removed by the brush 136, thereby improving cleaning ability and reducing the volume of the device.

The IPA processing unit 120 includes a spray nozzle 24 for spraying an IPA solution supplied from an external solution storage unit (not shown) on the front surface of the substrate 108 from which the photoresist is removed, and the spray nozzle ( 24 serves to surface-treat the substrate 108 by spraying the IPA solution onto the substrate 108. As a measure for preventing condensation of a very small amount of strip solution that is not removed from the peeling unit 110, the IPA solution is sprayed onto the substrate 108 to prevent condensation of a very small amount of strip solution.

The first flipper unit 180 includes a flipper (not shown) for flipping the substrate 108 by 180 degrees (① 180 degrees rotation) so that the pixel array formed on the substrate 108 faces the ground (or below). And a substrate adsorption portion 182 for lifting the substrate 108 turned upside down toward the ground and holding it by vacuum adsorption (②).

The flipper is a device capable of transferring and transporting substrates, semiconductor chips, etc., which are known in many of the prior applications 10-2002-0017584, 10-2001-0064256, and the like. In addition, the substrate adsorption unit 182 may include a holding unit (not shown) for holding the substrate 108 and a vacuum suction unit (not shown) for allowing the substrate 108 to be adsorbed to the holding unit by vacuum adsorption. It includes.

In the hydraulic pressure unit 140 and the ultrasonic unit 150, a very small amount of foreign matter is removed using high pressure and high frequency, respectively. The injection nozzles 147 and 153 of the hydraulic pressure unit 140 and the ultrasonic unit 150 are positioned under the substrate 108 held by the substrate adsorption unit 182 so that high pressure and high frequency are directed toward the substrate 108. Spray upwards. Thus, a portion of the foreign material removed by the high pressure and the high frequency is not recontaminated on the pixel array surface of the substrate 108. This improves the cleaning power.

The second flipper portion 190 has a flipper, which flips over the substrate flipped (①) from the first flipper portion 180 so that the pixel array of the substrate 108 faces the normal direction (or upward). (180 degrees rotation) serves to seat the substrate 108 on the conveyor belt 106.

The drying unit 160 includes an air knife 162 for injecting compressed air through the conveyor belt 106 to the substrate 108 supplied from the opening second flipper unit 190, and compressed air having high temperature to the air knife 162. It is provided with a heater 165 for supplying. The drying unit 160 sprays hot compressed air heated by the heater 165 on the surface of the substrate 108 through the air knife 162 to dry the substrate 108.

The conveyor belt 106 is driven by a drive source such as a motor as a moving means for moving the substrate 108 to each processing unit.

The operation of the liquid crystal display panel having such a structure will be described below.

First, the substrate 108 on which the photoresist is formed by the conveyor belt 106 is positioned at the peeling part 110. In the stripping unit 110, the strip solution 105 supplied from the external solution storage unit is sprayed through the injection nozzle 104 to remove the photoresist, and the strip solution is also removed by rotating the brush 136.

The substrate 108 from which the photoresist is removed is transferred to the IPA processing unit 120 and surface-treated with the IPA solution. Here, the IPA solution serves to prevent the very small amount of remaining strip solution 105 from sticking to the surface of the substrate 108 and condensing.

Subsequently, the substrate 108 is supplied to the first flipper unit 180 to be flipped by the flipper so that the pixel array faces the ground, and then held by the substrate adsorption unit 182.

The substrate 108 held by the substrate adsorption unit 182 is sequentially moved to the hydraulic unit 140 and the ultrasonic unit 150 to be cleaned by high pressure and high frequency to remove even a small amount of foreign matter. Here, each of the injection nozzles 147 and 153 of the hydraulic unit 140 and the ultrasonic unit 150 is positioned below the substrate 108 held by the substrate adsorption unit 182 to provide high pressure and high frequency to the substrate 108. By spraying upwards, a portion of the foreign material is not recontaminated to the pixel array surface of the substrate 108. This improves the cleaning power.

The cleaned substrate 108 is dried by compressed air from the air knife 162 transferred to the drying unit 160. Here, the drying unit 160 may be provided with a heater 165 to dry the substrate 108 by using high-pressure compressed air.

As described above, the apparatus for manufacturing a liquid crystal display panel according to the second embodiment of the present invention performs a peeling process by adding a brush in the peeling part, and uses a known flipper, a substrate absorber, and the like to array the substrate toward the ground. The substrate is cleaned in the held state. As a result, the foreign matter removed during the substrate cleaning in the hydraulic pressure unit and the ultrasonic unit is prevented from adhering to the array surface of the substrate, thereby improving the cleaning power.

As described above, in the apparatus and method for manufacturing a liquid crystal display panel according to the present invention, the brush portion is removed and the brush is additionally provided in the peeling portion as compared with the conventional art. Accordingly, the strip solution removal process is performed immediately after the photoresist stripping process is performed in the peeling unit, thereby reducing the volume of the manufacturing apparatus and improving the cleaning ability. In addition, the substrate is cleaned while holding the array of the substrate facing the ground using a known flipper, a substrate adsorber, or the like. Thereby, the foreign matter removed at the time of cleaning the substrate is not proposed to adhere to the substrate, thereby improving the cleaning power.                     

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

Claims (11)

The peeling liquid is sprayed on the substrate at a temperature of 70 ° to 90 ° to remove organic substances on the substrate, and the brush is rotated on the substrate while spraying de-ionzed water (DI) toward the substrate. Peeling part to remove; An IPA treatment unit spraying an isopropyl alcohol (Isopropyl alcohol, IPA) solution on the substrate to prevent solidification of the stripping solution remaining on the substrate; A hydraulic unit for cleaning the substrate sprayed with the isopropyl alcohol (IPA) solution using a high pressure; An ultrasonic unit for cleaning the substrate passing through the hydraulic unit using high frequency; And A heater for heating air and a drying unit for drying the supplied substrate through the ultrasonic unit by using an air knife for injecting the heated air onto the substrate, The peeling part, And a nozzle for spraying the deionized water (DI) after the spraying of the stripping solution. The method of claim 1, A first flipper unit disposed between the IPA processing unit and the pressure receiving unit and holding the substrate upside down so that the pixel array surface of the substrate passing through the IPA processing unit faces downward; And And a second flipper disposed between the ultrasonic part and the drying part to rotate the substrate to be seated on the conveyor belt so that the pixel array of the substrate passing through the ultrasonic part faces upward. And a substrate passing through the second flipper is supplied to the drying unit through the conveyor belt. delete delete delete delete delete delete delete delete The peeling liquid is sprayed on the substrate at a temperature of 70 ° to 90 ° to remove organic substances on the substrate, and the brush is rotated on the substrate while spraying de-ionzed water (DI) toward the substrate. Peeling part to remove; An IPA treatment unit spraying an isopropyl alcohol (Isopropyl alcohol, IPA) solution on the substrate to prevent solidification of the stripping solution remaining on the substrate; A hydraulic unit for cleaning the substrate sprayed with the isopropyl alcohol (IPA) solution using a high pressure; An ultrasonic unit for cleaning the substrate passing through the hydraulic unit using high frequency; And A heater for heating air and a drying unit for drying the supplied substrate through the ultrasonic unit by using an air knife for injecting the heated air onto the substrate, The peeling part, A first nozzle for spraying the stripping liquid; And And a second nozzle for spraying the deionized water (DI).

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