KR101165791B1 - 측정된 전기적 특성에 기초한 제조 공정 제어 방법 및 장치 - Google Patents

측정된 전기적 특성에 기초한 제조 공정 제어 방법 및 장치 Download PDF

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KR101165791B1
KR101165791B1 KR1020057005288A KR20057005288A KR101165791B1 KR 101165791 B1 KR101165791 B1 KR 101165791B1 KR 1020057005288 A KR1020057005288 A KR 1020057005288A KR 20057005288 A KR20057005288 A KR 20057005288A KR 101165791 B1 KR101165791 B1 KR 101165791B1
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electrical performance
recipe
feature
operating
forming
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KR20050055729A (ko
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로버트 제이. 총
진 왕
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어드밴스드 마이크로 디바이시즈, 인코포레이티드
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

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  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • General Factory Administration (AREA)
KR1020057005288A 2002-09-30 2003-09-19 측정된 전기적 특성에 기초한 제조 공정 제어 방법 및 장치 Expired - Lifetime KR101165791B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/262,620 2002-09-30
US10/262,620 US6912437B2 (en) 2002-09-30 2002-09-30 Method and apparatus for controlling a fabrication process based on a measured electrical characteristic
PCT/US2003/029037 WO2004032224A1 (en) 2002-09-30 2003-09-19 Method and apparatus for controlling a fabrication process based on a measured electrical characteristic

Publications (2)

Publication Number Publication Date
KR20050055729A KR20050055729A (ko) 2005-06-13
KR101165791B1 true KR101165791B1 (ko) 2012-07-17

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KR1020057005288A Expired - Lifetime KR101165791B1 (ko) 2002-09-30 2003-09-19 측정된 전기적 특성에 기초한 제조 공정 제어 방법 및 장치

Country Status (9)

Country Link
US (1) US6912437B2 (https=)
JP (1) JP5214091B2 (https=)
KR (1) KR101165791B1 (https=)
CN (1) CN100345270C (https=)
AU (1) AU2003270675A1 (https=)
DE (1) DE10393371T5 (https=)
GB (1) GB2410377B (https=)
TW (1) TWI327644B (https=)
WO (1) WO2004032224A1 (https=)

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US7117059B1 (en) * 2005-04-18 2006-10-03 Promos Technologies Inc. Run-to-run control system and operating method of the same
KR100735012B1 (ko) * 2006-01-23 2007-07-03 삼성전자주식회사 제품 파라미터들의 통계적 분포 특성을 평가하는 방법
DE102007035833B3 (de) * 2007-07-31 2009-03-12 Advanced Micro Devices, Inc., Sunnyvale Fortgeschrittene automatische Abscheideprofilzielsteuerung und Kontrolle durch Anwendung von fortgeschrittener Polierendpunktsystemrückkopplung
US8338192B2 (en) * 2008-05-13 2012-12-25 Stmicroelectronics, Inc. High precision semiconductor chip and a method to construct the semiconductor chip
US8606379B2 (en) * 2008-09-29 2013-12-10 Fisher-Rosemount Systems, Inc. Method of generating a product recipe for execution in batch processing
US8224475B2 (en) * 2009-03-13 2012-07-17 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for advanced process control
US8112168B2 (en) * 2009-07-29 2012-02-07 Texas Instruments Incorporated Process and method for a decoupled multi-parameter run-to-run controller
US20110195636A1 (en) * 2010-02-11 2011-08-11 United Microelectronics Corporation Method for Controlling Polishing Wafer
KR101121858B1 (ko) * 2010-04-27 2012-03-21 주식회사 하이닉스반도체 반도체 소자의 제조 방법
US8832634B2 (en) * 2012-09-05 2014-09-09 Lsi Corporation Integrated circuit characterization based on measured and static apparent resistances
JP2014053505A (ja) * 2012-09-07 2014-03-20 Toshiba Corp 半導体装置の製造方法、半導体ウェーハ及び半導体装置の製造装置
US9405289B2 (en) 2012-12-06 2016-08-02 Tokyo Electron Limited Method and apparatus for autonomous identification of particle contamination due to isolated process events and systematic trends
US9879968B2 (en) * 2014-10-23 2018-01-30 Caterpillar Inc. Component measurement system having wavelength filtering
TWI553436B (zh) * 2015-06-10 2016-10-11 A control system that monitors and obtains production information through a remote mobile device
KR20170136225A (ko) 2016-06-01 2017-12-11 엘에스산전 주식회사 시뮬레이션 장치
US11346882B2 (en) * 2017-11-03 2022-05-31 Tokyo Electron Limited Enhancement of yield of functional microelectronic devices
US11244873B2 (en) * 2018-10-31 2022-02-08 Tokyo Electron Limited Systems and methods for manufacturing microelectronic devices
CN113053767B (zh) * 2021-03-09 2022-09-06 普迪飞半导体技术(上海)有限公司 栅极结构中氮化钛层厚度的确定方法、装置、设备与介质
US11868119B2 (en) 2021-09-24 2024-01-09 Tokyo Electron Limited Method and process using fingerprint based semiconductor manufacturing process fault detection
KR102760991B1 (ko) * 2022-02-25 2025-01-24 포항공과대학교 산학협력단 반도체 파라미터 설정 장치 및 방법

Citations (1)

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KR100332187B1 (ko) 1998-02-12 2002-04-12 포만 제프리 엘 공정의 모니터링 방법 및 그 장치

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Also Published As

Publication number Publication date
CN1685495A (zh) 2005-10-19
AU2003270675A1 (en) 2004-04-23
TW200408807A (en) 2004-06-01
US6912437B2 (en) 2005-06-28
WO2004032224A1 (en) 2004-04-15
JP5214091B2 (ja) 2013-06-19
GB2410377B (en) 2006-08-16
GB0505102D0 (en) 2005-04-20
KR20050055729A (ko) 2005-06-13
JP2006501674A (ja) 2006-01-12
GB2410377A (en) 2005-07-27
DE10393371T5 (de) 2005-10-20
TWI327644B (en) 2010-07-21
CN100345270C (zh) 2007-10-24
US20040093110A1 (en) 2004-05-13

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