KR101158071B1 - Luminous element having arrayed cells and method of manufacturing the same - Google Patents
Luminous element having arrayed cells and method of manufacturing the same Download PDFInfo
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- KR101158071B1 KR101158071B1 KR1020050090498A KR20050090498A KR101158071B1 KR 101158071 B1 KR101158071 B1 KR 101158071B1 KR 1020050090498 A KR1020050090498 A KR 1020050090498A KR 20050090498 A KR20050090498 A KR 20050090498A KR 101158071 B1 KR101158071 B1 KR 101158071B1
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- type semiconductor
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Abstract
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device in which a plurality of cells are arrayed, and a method of manufacturing the same, comprising a substrate, an N-type semiconductor layer formed on the substrate, a light-emitting layer formed on a portion of the N-type semiconductor layer, and A plurality of light emitting cells including a formed P-type semiconductor layer, a transparent electrode layer formed on the P-type semiconductor layer to expose at least a portion of the P-type semiconductor layer, and the N-type semiconductor layer of one light-emitting cell; Provided is a light emitting device including a metal wiring connecting the P-type semiconductor layer exposed by the opening of another light emitting cell adjacent thereto. The present invention can improve the adhesiveness of the metal wiring by opening a portion of the transparent electrode layer to directly contact the metal wiring with the P-type semiconductor layer.
Light emitting element, many light emitting cell, metal wiring, transparent electrode layer, opening part, adhesiveness
Description
1 is a cross-sectional view of a light emitting device according to the prior art.
2 is a plan view of a light emitting device according to the prior art;
3 is a cross-sectional view of a light emitting device according to an embodiment of the present invention.
4 is a plan view of a light emitting device according to one embodiment;
5A to 5C are views for explaining a modification of the opening formed on the transparent electrode layer according to the present embodiment.
6A to 6D are diagrams for explaining the connection relationship of the light emitting device according to this embodiment.
7A to 7D are views for explaining the manufacturing method of the light emitting device according to the present embodiment.
8 and 9 are cross-sectional views of a light emitting device according to another embodiment of the present invention.
<Explanation of symbols for the main parts of the drawings>
10, 110:
30, 130:
50, 150:
155: opening
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device in which a plurality of cells are combined and a manufacturing method thereof, and more particularly, to a method of connecting a plurality of cells.
A light emitting diode refers to a device that generates a small number of carriers (electrons or holes) injected using a p-n junction structure of a semiconductor, and emits predetermined light by recombination thereof. Such light emitting diodes are used as display elements and backlights. In recent years, power consumption of general light emitting diodes is only several to several tens of those of conventional lighting devices, and their lifetime is several to several tens of times. Superior in terms of durability
In general, in order to use a light emitting diode for lighting, a plurality of light emitting chips may be mounted on a printed circuit board, and then the light emitting chips may be connected in series using wires, and then molded to manufacture light emitting devices, or a plurality of light emitting devices may be used. The device was connected in series to produce a light emitting device for illumination.
Such a conventional light emitting device for lighting not only has a large size but also has a big limitation in the available power source. That is, in order to use such a light emitting device in an AC power source used in a home, a separate AC / DC conversion circuit and a protection circuit must be added. The addition of this circuit not only increases the size of the device, but also increases the manufacturing cost of the device.
In addition, when connecting adjacent light emitting chips or light emitting devices by wire bonding using thermocompression, a problem occurs in that the light emitting chips or light emitting devices are damaged. In addition, there is a problem that the device does not operate because the wire connecting the light emitting chip or the light emitting device is separated.
In order to solve the above-mentioned problems, a light emitting device that can be used for lighting by connecting a light emitting chip at a wafer level has been manufactured.
1 is a cross-sectional view of a light emitting device according to the prior art, and FIG. 2 is a plan view of the light emitting device according to the prior art.
1 and 2, the conventional light emitting device is formed by forming an N-
However, the light emitting device manufactured as described above has a problem in that a metal wire connecting adjacent cells is easily shorted by pressure such as a collet during an assembly process using the device. In addition, since the adhesion between the transparent electrode layer and the metal wiring is poor, there is a problem that the metal wiring easily falls even in a small impact.
The present invention provides a light emitting device and a method of manufacturing a plurality of cells arrayed to improve the adhesion of the metal wiring by opening a portion of the transparent electrode to directly contact the metal wiring to the P-type semiconductor layer in order to solve the above problems. Its purpose is to provide.
A plurality of light emitting cells comprising an N-type semiconductor layer, a light emitting layer and a P-type semiconductor layer formed on a substrate according to the invention, and formed on the P-type semiconductor layer of each of the plurality of light-emitting cells, the P-type semiconductor layer A light emitting electrode comprising a transparent electrode layer having an opening exposing at least a portion of the light emitting layer and a metal wiring connecting the N-type semiconductor layer of one light emitting cell and the P-type semiconductor layer exposed by the opening of another light emitting cell adjacent thereto; Provided is an element.
Here, the opening has at least one opening area. In this case, the opening region has at least one of a circle shape, an ellipse shape, and a figure shape including a triangle, a rectangle, a pentagon, and the like.
In the above, the opening is formed in the region adjacent to the N-type semiconductor layer of the adjacent light emitting cell.
The transparent electrode layer uses ITO. The metal wiring overlaps at least part of the opening.
Sequentially forming an N-type semiconductor layer, a light emitting layer, and a P-type semiconductor layer on the substrate according to the present invention, and etching a portion of the P-type semiconductor layer, the light-emitting layer, and the N-type semiconductor layer to form a plurality of light emitting cells. Separating the P-type semiconductor layer and a portion of the light emitting layer of each light emitting cell to expose a portion of the N-type semiconductor layer, forming a transparent electrode layer on the P-type semiconductor layer, and Etching a portion of the transparent electrode layer to form an opening that exposes a portion of the P-type semiconductor layer; and the P-type semiconductor layer exposed by the N-type semiconductor layer of one light emitting cell and the opening of another light emitting cell adjacent thereto. It provides a method of manufacturing a light emitting device comprising the step of connecting to a metal wiring.
Here, the metal wiring is formed through an air bridge process.
Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention in more detail. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in various forms, and only the embodiments are intended to complete the disclosure of the present invention, and to those skilled in the art to fully understand the scope of the invention. It is provided to inform you. Wherein like reference numerals refer to like elements throughout.
3 is a cross-sectional view of a light emitting device according to an embodiment of the present invention, Figure 4 is a plan view of a light emitting device according to an embodiment.
3 and 4, the light emitting device according to the present embodiment includes an N-
Here, the
The
The N-
In addition, the P-
The N-
As the
Although not shown in the drawing, various material layers for improving the characteristics, purpose of use, and light emitting efficiency of the
The
The
5A to 5C are views for explaining a modification of the opening formed on the transparent electrode layer according to the present embodiment.
The
The
Hereinafter, the connection relationship between the plurality of light emitting
6A to 6D are diagrams for describing a connection relationship between light emitting devices according to the present embodiment.
As shown in FIG. 6A, in the light emitting device of the present invention, a plurality of light emitting
Hereinafter, the manufacturing method of the light emitting element which has the above-mentioned structure is demonstrated.
7A to 7D are views for explaining a method of manufacturing a light emitting device according to the present embodiment.
Referring to FIG. 7A, the
Referring to FIG. 7B, a portion of the P-
Referring to FIG. 7C, the
Referring to FIG. 7D, the photoresist is coated on the entire structure, and then a portion of the N-
In the above description, the P-
As described above, the present invention can improve the adhesiveness of the metal wiring by opening a portion of the transparent electrode to directly contact the metal wiring with the P-type semiconductor layer.
Although the invention has been described with reference to the accompanying drawings and the preferred embodiments described above, the invention is not limited thereto, but is defined by the claims that follow. Accordingly, those skilled in the art will appreciate that various modifications and changes may be made thereto without departing from the spirit of the following claims.
Claims (8)
Priority Applications (1)
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KR1020050090498A KR101158071B1 (en) | 2005-09-28 | 2005-09-28 | Luminous element having arrayed cells and method of manufacturing the same |
Applications Claiming Priority (1)
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KR1020050090498A KR101158071B1 (en) | 2005-09-28 | 2005-09-28 | Luminous element having arrayed cells and method of manufacturing the same |
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KR20070035745A KR20070035745A (en) | 2007-04-02 |
KR101158071B1 true KR101158071B1 (en) | 2012-06-22 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2014038794A1 (en) | 2012-09-07 | 2014-03-13 | 서울바이오시스 주식회사 | Wafer level light-emitting diode array |
DE202013012471U1 (en) | 2012-08-07 | 2017-02-17 | Seoul Viosys Co., Ltd. | Light-emitting diode array on wafer level |
KR101949505B1 (en) | 2012-08-28 | 2019-02-18 | 서울바이오시스 주식회사 | Light emitting diode array on wafer level and method of forming the same |
US9318529B2 (en) | 2012-09-07 | 2016-04-19 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
KR101893579B1 (en) | 2012-09-07 | 2018-08-30 | 서울바이오시스 주식회사 | Light emitting diode array on wafer level |
KR101892213B1 (en) | 2012-08-07 | 2018-08-28 | 서울바이오시스 주식회사 | Light emitting diode array on wafer level and method of forming the same |
US10388690B2 (en) | 2012-08-07 | 2019-08-20 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
US10804316B2 (en) | 2012-08-07 | 2020-10-13 | Seoul Viosys Co., Ltd. | Wafer level light-emitting diode array |
KR101798134B1 (en) | 2016-10-14 | 2017-11-16 | 서울바이오시스 주식회사 | Light emitting diode array on wafer level and method of forming the same |
CN111933654A (en) * | 2020-08-19 | 2020-11-13 | 惠科股份有限公司 | Display device and method for manufacturing the same |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050014343A (en) * | 2003-07-30 | 2005-02-07 | 에피밸리 주식회사 | Semiconductor Light Emitting Device |
KR20050052474A (en) * | 2002-08-29 | 2005-06-02 | 시로 사카이 | Light-emitting device having light-emitting elements |
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2005
- 2005-09-28 KR KR1020050090498A patent/KR101158071B1/en active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050052474A (en) * | 2002-08-29 | 2005-06-02 | 시로 사카이 | Light-emitting device having light-emitting elements |
KR20050014343A (en) * | 2003-07-30 | 2005-02-07 | 에피밸리 주식회사 | Semiconductor Light Emitting Device |
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