KR101144981B1 - Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법 - Google Patents

Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법 Download PDF

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Publication number
KR101144981B1
KR101144981B1 KR1020110046305A KR20110046305A KR101144981B1 KR 101144981 B1 KR101144981 B1 KR 101144981B1 KR 1020110046305 A KR1020110046305 A KR 1020110046305A KR 20110046305 A KR20110046305 A KR 20110046305A KR 101144981 B1 KR101144981 B1 KR 101144981B1
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KR
South Korea
Prior art keywords
cutting tip
cutting
pad conditioner
substrate
cmp pad
Prior art date
Application number
KR1020110046305A
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English (en)
Korean (ko)
Inventor
이세광
김연철
이주한
최재광
부재필
Original Assignee
삼성전자주식회사
이화다이아몬드공업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사, 이화다이아몬드공업 주식회사 filed Critical 삼성전자주식회사
Priority to KR1020110046305A priority Critical patent/KR101144981B1/ko
Application granted granted Critical
Publication of KR101144981B1 publication Critical patent/KR101144981B1/ko
Priority to US14/117,936 priority patent/US9314901B2/en
Priority to CN201280023632.9A priority patent/CN103534790B/zh
Priority to JP2014511292A priority patent/JP2014514971A/ja
Priority to DE112012002093.6T priority patent/DE112012002093B4/de
Priority to PCT/KR2012/003788 priority patent/WO2012157936A2/ko
Priority to TW101117365A priority patent/TWI535530B/zh
Priority to TW105104840A priority patent/TWI623383B/zh
Priority to JP2016092587A priority patent/JP6260802B2/ja

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
KR1020110046305A 2011-05-17 2011-05-17 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법 KR101144981B1 (ko)

Priority Applications (9)

Application Number Priority Date Filing Date Title
KR1020110046305A KR101144981B1 (ko) 2011-05-17 2011-05-17 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법
US14/117,936 US9314901B2 (en) 2011-05-17 2012-05-15 CMP pad conditioner, and method for producing the CMP pad conditioner
CN201280023632.9A CN103534790B (zh) 2011-05-17 2012-05-15 Cmp垫调整器及用于制造cmp垫调整器的方法
JP2014511292A JP2014514971A (ja) 2011-05-17 2012-05-15 Ｃｍｐパッドコンディショナーおよび前記ｃｍｐパッドコンディショナーの製造方法
DE112012002093.6T DE112012002093B4 (de) 2011-05-17 2012-05-15 Konditionierer für CMP-Pads und Verfahren zu seiner Herstellung
PCT/KR2012/003788 WO2012157936A2 (ko) 2011-05-17 2012-05-15 Cmp 패드 컨디셔너 및 상기 cmp 패드 컨디셔너 제조방법
TW101117365A TWI535530B (zh) 2011-05-17 2012-05-16 化學機械拋光墊調整器製造方法
TW105104840A TWI623383B (zh) 2011-05-17 2012-05-16 化學機械拋光墊調整器
JP2016092587A JP6260802B2 (ja) 2011-05-17 2016-05-02 Ｃｍｐパッドコンディショナーの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110046305A KR101144981B1 (ko) 2011-05-17 2011-05-17 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020120013468A Division KR20120128540A (ko) 2012-02-09 2012-02-09 Ｃｍｐ 패드 컨디셔너

Publications (1)

Publication Number Publication Date
KR101144981B1 true KR101144981B1 (ko) 2012-05-11

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110046305A KR101144981B1 (ko) 2011-05-17 2011-05-17 Ｃｍｐ 패드 컨디셔너 및 상기 ｃｍｐ 패드 컨디셔너 제조방법

Country Status (7)

Country Link
US (1) US9314901B2 (zh)
JP (2) JP2014514971A (zh)
KR (1) KR101144981B1 (zh)
CN (1) CN103534790B (zh)
DE (1) DE112012002093B4 (zh)
TW (2) TWI623383B (zh)
WO (1) WO2012157936A2 (zh)

Cited By (1)

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CN105122428A (zh) * 2013-04-19 2015-12-02 应用材料公司 多盘化学机械抛光衬垫调节器与方法

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JP6010511B2 (ja) * 2013-08-22 2016-10-19 株式会社荏原製作所 研磨パッドの表面粗さ測定方法
CN104681685A (zh) * 2013-11-28 2015-06-03 亚世达科技股份有限公司 发光二极管装置及灯具
JP6542793B2 (ja) * 2014-03-21 2019-07-10 インテグリス・インコーポレーテッド 長尺状の切削エッジを有する化学機械平坦化パッド・コンディショナ
US10430719B2 (en) 2014-11-25 2019-10-01 Stream Mosaic, Inc. Process control techniques for semiconductor manufacturing processes
WO2018063242A1 (en) * 2016-09-29 2018-04-05 Intel Corporation Chemical-mechanical planarization (cmp) pad conditioner brush-and-abrasive hybrid for multi-step, preparation- and restoration-conditioning process of cmp pad
KR20190036941A (ko) * 2017-09-28 2019-04-05 삼성전자주식회사 화학적 기계적 연마 방법 및 반도체 장치의 제조 방법

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CN105122428A (zh) * 2013-04-19 2015-12-02 应用材料公司 多盘化学机械抛光衬垫调节器与方法

Also Published As

Publication number Publication date
TW201302385A (zh) 2013-01-16
JP2016172318A (ja) 2016-09-29
TWI623383B (zh) 2018-05-11
WO2012157936A2 (ko) 2012-11-22
CN103534790B (zh) 2016-07-06
US20140094101A1 (en) 2014-04-03
TWI535530B (zh) 2016-06-01
JP6260802B2 (ja) 2018-01-17
JP2014514971A (ja) 2014-06-26
DE112012002093T5 (de) 2014-07-10
DE112012002093B4 (de) 2024-08-22
WO2012157936A3 (ko) 2013-03-21
TW201618901A (zh) 2016-06-01
US9314901B2 (en) 2016-04-19
CN103534790A (zh) 2014-01-22

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