KR101131330B1 - Apparatus for preventing solution contamination - Google Patents

Abstract

The present invention relates to a liquid crystal device, and prevents the etching liquid applied to the substrate in the etching step from remaining in the cleaning step.

The liquid immersion apparatus supports the substrate in contact with the entire width direction, the first liquid squeezing roller portion for applying the etching liquid to the substrate, and the second liquid slicing portion for supporting the substrate passing through the first liquid squeezing roller roller in the full width direction and applying the diluent to the substrate. Located under the roller portion, the first liquid roller, and located under the first dip roller for supplying the etching liquid to the first liquid roller by dipping the first liquid roller, and the second liquid roller. And a second dipping portion for supplying the dilution liquid to the second liquid immersion roller portion.

Liquid closing device, etching deviation, etching liquid, diluent

Description

Liquid closing device {APPARATUS FOR PREVENTING SOLUTION CONTAMINATION}

The present invention relates to a liquid crystal device for a substrate.

In general, in the manufacturing of a printed circuit board, the substrates are sequentially processed by transferring the substrates using a transfer system in the process of processing a series of unit processes such as a plating process and an etching process. In particular, the etching process is carried out the etching step, the liquid phase step, the cleaning step while transferring the substrate by the transfer system.

This conveying system is generally a horizontal roller method. The horizontal roller type conveying system has a two-layer structure, which drives a plurality of disk rollers (comprising a plurality of disk-shaped contact portions included in one rotating shaft and one rotating shaft) arranged in a row at the top and the bottom thereof. It is generally composed of a drive unit to make. In such a conveying system, a substrate is inserted between two layers of disk roller arrangements, and the rollers rotate to move the substrate.

In the etching step, the etching solution is sprayed onto the substrate to form a metal pattern, the etching solution is preliminarily removed in the liquid phase step, the etching solution is finally removed in the cleaning step, and the etching process is completed.

In order to prevent the etching liquid from flowing into the cleaning step, a conventional liquid crystal device removes the solution on the substrate by injecting air to the substrate by using an air knife on the upper and lower sides of the substrate while moving the substrate to the disk roller. Progressed.

However, this conventional method has had some problems. In recent years, as the weight reduction and ultra-thinning of products have progressed, the horizontal roller method has a smaller roller size and a larger number of rollers. However, in the conventional liquid crystal device, the etching liquid present in the disc roller continues to react to the substrate. There was a problem of generating roller marks (shadow phenomenon).

This shadow phenomenon caused a poor appearance of the substrate, and sometimes caused a plating deviation during surface plating.

In addition, when spraying air with an air knife, the etchant evaporated and solidified on the roller to generate a scale on the roller, which caused scratches on the substrate coming in later, and shortened the life of the roller.

The present invention has been made to solve the above-mentioned problems, the contact portion is integrally cylindrical to support the entire width direction of the substrate and adopts a liquid-rolling roller for applying the etching liquid and the diluent to the entire substrate to avoid the shadow phenomenon generated on the substrate We propose a liquid removal device that can be removed.

In addition, without using an air knife, by employing a dipping portion for supplying the etching liquid and the diluent to the liquid roller, we propose a liquid-repelling apparatus that undergoes a liquid phase step in a wet manner.

The present invention relates to a liquid immersion apparatus for preventing an etching solution applied to a substrate in an etching step from remaining in the cleaning step, wherein the first liquid releasing roller unit supports the substrate in the entire width direction and applies the etching liquid to the substrate; A second liquid roller part for supporting the substrate having passed through the first liquid roller part in the full width direction and applying a dilution liquid to the substrate, and positioned under the first liquid roller part, and dipping the first liquid roller part to A first dipping portion for supplying an etchant to the first liquid squeezing roller portion, and a second dipping for lowering the second liquid squeezing roller portion and dipping the second liquid squeezing roller to supply the diluent to the second liquid squeezing roller. Contains wealth.

In addition, in the plurality of liquid rollers included in the first liquid roller, the liquid roller located at the foremost side is smaller in diameter than the liquid roller at the rear side.

In addition, the first dipping portion and the second dipping portion is characterized in that the adjacent configuration.

In addition, the first dipping portion and the second dipping portion is characterized in that it comprises a flow control valve.

The first dipping portion may be divided into an etching solution inflow region and an etching solution outlet region.

The first dipping portion may further include an etchant tank for receiving the etchant flowing out of the etchant outflow region and then reprocessing and resupply the etchant inflow region.

In addition, the second dipping portion is characterized in that consisting of the diluent inlet area and the diluent outlet area.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings.

Prior to that, terms and words used in the present specification and claims should not be construed in a conventional and dictionary sense, and the inventor may properly define the concept of the term in order to best explain its invention It should be construed as meaning and concept consistent with the technical idea of the present invention.

The liquid crystal device according to the present invention can remove the shadow phenomenon occurring on the substrate after etching, thereby producing a uniform substrate.

In addition, since the scale does not occur in the liquefied roller, the life of the roller is extended, and scratches do not occur on the substrate.

In addition, since the dilution of the etching liquid occurs in the liquid separator roller, the efficiency of the cleaning step is increased.

The objects, specific advantages and novel features of the present invention will become more apparent from the following detailed description and the preferred embodiments associated with the accompanying drawings. In the present specification, in adding reference numerals to the components of each drawing, it should be noted that the same components as possible, even if displayed on different drawings have the same number as possible. In addition, in describing the present invention, if it is determined that the detailed description of the related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description thereof will be omitted.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view showing a liquid crystal device 100 according to a preferred embodiment of the present invention, Figure 2 is a dipping portion (first dipping portion and second dipping portion) of the liquid storage device according to a preferred embodiment of the present invention It is sectional drawing. Hereinafter, the liquid crystal device 100 according to the present embodiment will be described with reference to this.

As shown in FIG. 1, in order to prevent the etching liquid applied to the substrate 5 from remaining in the etching step, the liquid crystal device 100 according to the present embodiment may flow into the cleaning step. And a first dipping portion 30 positioned below the first liquid immersion roller portion 10 and the second liquid squeezer portion 20 while moving the substrate 5 through the second liquid squeezer roller 20. The etching solution 35 and the dilution 45 are supplied by dipping the first liquid immersion roller unit 10 and the second liquid squeezer roller 20 in the second dipping unit 40, respectively.

The substrate 5 enters the liquid crystal device 100 after undergoing an etching step. When the etching step is briefly examined, the substrate 5 on which the image of the circuit pattern is formed is applied with the etching liquid to the substrate in the etching step, and copper foil of the portion where the circuit pattern is not formed is removed by the etching liquid. In this etching step, the etching solution is supplied to the substrate by the spray method from the etching liquid spraying device 4 located above and below the etching roller portion 2 while moving the substrate 5 through the etching roller portion 2.

At this time, as shown in Fig. 1, the etching roller portion 2 is formed of two rows of etching rollers continuously arranged, and the substrate 5 is sandwiched between the upper and lower etching rollers to move the contact. In this case, in order to minimize contact with the circuit pattern of the substrate, it is common to use a disk roller having a plurality of disk-shaped contact portions arranged at a predetermined interval on one rotation shaft. Moreover, in order to narrow the space | interval between adjacent etching rollers, the number of the contact parts of adjacent etching rollers differs, and the arrangement | positioning of a contact part is comprised so that the contact part of a front side etching roller may be located between the contact parts of a rear side etching roller.

As shown in FIG. 1, the first liquid immersion roller portion 10 and the second liquid immersion roller portion 20 are formed in two stages as in the etching roller portion 2 described above. The first liquid squeezing roller 10 and the second liquid squeezing roller 20 are each composed of two liquid squeezing rollers, but the number thereof is not limited.

Here, the first liquid immersion roller unit 10 supports the substrate 5 in the overall width direction and applies the etching solution to the entire substrate 5. At this time, the liquefied rollers constituting the first liquefied roller unit 10 are configured to include a cylindrical contact portion formed continuously from one end to the end of the rotating shaft and the rotating shaft.

In addition, the first liquid immersion roller portion 10 applies the etching liquid 35 supplied from the first dipping portion 30 to be described later on both surfaces of the substrate.

At this time, the etching liquid 35 has the same component as the etching liquid injected from the etching liquid injector 4 in the above-described etching step. For example, iron chloride etchant, copper chloride etchant, alkali etchant, hydrogen peroxide / sulfuric acid etchant may be used. Such etchant may be used by adding a plurality of additives.

In addition, the first liquid immersion roller unit 10 is a two-stage arrangement of the top and the bottom. The liquid immersion roller immersed in the first dipping portion 30 rotates to bury the etching liquid 35 in the contact portion of the liquid squeegee, The etching liquid 35 is supplied to the upper liquid releasing roller disposed in close proximity to the liquid releasing roller. As the substrate is thinned, the upper and lower liquid crystal rollers are arranged to be spaced apart by a few micrometers. When the lower liquid roller is rotated by the etching liquid 35, the etching liquid 35 is supplied in contact with the upper liquid liquid roller.

Then, before the substrate 5 enters the first liquid roller part 10, the liquid roller is driven to supply the etching liquid 35 to the upper liquid roller and the lower liquid roller in advance. When the substrate enters, the etching liquid is applied to the upper and lower surfaces of the substrate. Apply (35) contact. In the etching step, since etching occurs while passing through the disk roller, etching deviation occurs between the contact surface between the disk-shaped contact portion and the substrate and the surface contacting the substrate. As in the related art, when the liquid phase step is performed using an air knife while moving a substrate by a disk roller, the etching deviation develops into a shadow phenomenon. The first liquid immersion roller unit 10 according to the present embodiment supplies the etching liquid 35 to the entire substrate to reduce the etching deviation generated in the etching step.

Here, the second liquid crystal roller part 20 supports the substrate 5 transferred from the first liquid roller portion 10 in contact with the entire width direction and applies the diluent 45 to the entire substrate 5. The shape, arrangement, and driving method of the second liquid crystal roller unit 20 are the same as those of the first liquid roller unit 10, and thus detailed description thereof will be omitted.

At this time, the second liquid immersion roller part 20 supplies the diluent 45 to the substrate 5 to dilute the etching liquid 35 supplied from the first liquid squeeze roller part 10 to the substrate 5 and additionally. The etching is stopped. The diluent 45 may employ a washing solution used in the washing step after the liquid-repelling step, and pure water that does not contain ions is preferably used. This diluent 45 is mixed with the etchant 35 supplied to the substrate to lower the concentration of the etchant, whereby the etchant loses its function and the etching is stopped.

The second liquid crystal roller unit 20 also operates in advance before the substrate enters, supplies the diluent 45 to the liquid crystal rollers at the upper and lower ends, and then contacts the substrate 5 when the substrate 5 enters.

As shown in FIG. 1, the first dipping portion 30 is positioned below the first liquid roller portion 10 and supplies the etching liquid 35 to the first liquid roller portion 10.

Referring to FIG. 2, the first dipping portion 30 shown in FIG. 1 will be described in detail.

The first dipping portion 30 is a structure that can hold the etching solution 35 at a predetermined height in a shape capable of containing the etching solution 35. As illustrated in FIG. 2, the first dipping portion 30 is open and has a box shape in which the liquid squeezer is dipping and may contain the etching liquid 35. However, such a box shape is merely an example, and the shape of the first dipping portion 30 is not limited.

In addition, the first dipping portion 30 maintains the etching solution 35 at a constant height, and the etching solution 35 is introduced through the etching solution inlet 31 in order to keep the components of the etching solution 35 constant. Since the amount of the etching solution 35 of the first dipping portion 30 decreases as the etching solution 35 is supplied to the substrate 5, the etching solution 35 can be continuously dipped into the first dipping portion 35. ) Is supplied through the etchant inlet 31.

In addition, the etchant flows out through the etchant outlet 32 so that the etchant 35 contained in the first dipping portion 30 can maintain a constant concentration and component ratio. Therefore, the etching solution 35 of the first dipping portion 30 may be circulated through the etching solution inlet 31 and the etching solution outlet 32 to maintain a certain height, a certain concentration, and a predetermined component ratio.

At this time, the circulating etching solution 35 is preferably adjusted to the flow rate of the etching solution 35 of the etching solution inlet 31 and the etching solution outlet 32 so that when the immersion roller is dipped to a depth of about the radius. The reason why the liquid immersion roller is dipped to half the depth is because a certain amount of etching liquid can be supplied to the substrate 5. Therefore, a flow rate control valve (not shown) may be provided at the etching solution inlet 31 or the etching solution outlet 32 to adjust the inflow and outflow amounts of the etching solution.

Meanwhile, in FIG. 2, two liquefied rollers are dipped in the first dipping unit 30, but the number of dipping rollers may be changed.

In addition, as shown in FIG. 2, the second dipping portion 40 is positioned under the second liquid roller portion 20 and supplies the diluent 45 to the second liquid roller portion 20.

Since the shape and structure of the second dipping portion 40 is similar to the shape and structure of the first dipping portion 30 described above, a detailed description thereof will be omitted. The second dipping portion 40 also has a box shape to hold the diluent 45, and includes a diluent inlet 41 and a diluent outlet 42 to maintain a predetermined amount of the diluent 45, and each includes a flow control valve. can do.

Diluent 45 lowers the concentration of the etchant to stop additional etching. In addition, the diluent 45 serves as a preclean to remove the result of the etching reaction. Therefore, the efficiency of the cleaning step performed after the liquid phase step is increased.

Unlike the conventional method using the air knife, the liquid immersion apparatus 100 can prevent the phenomenon that the etching liquid evaporates and solidifies on the liquid squeezing roller (scale generation in the liquid squeezing roller) because the liquid squeezing method 100 removes the etching liquid. . Therefore, the life of the liquid crystal roller is extended, and damage to the substrate due to the scale of the liquid roller can also be prevented.

In this case, as shown in FIG. 2, the first dipping portion 30 and the second dipping portion 40 are preferably configured to be adjacent to each other. The first dipping portion 30 and the second dipping portion 40 may be configured separately, but in this case, more space is required since the first dipping portion 30 and the dipping portion 40 are separated from each other. Therefore, the first dipping portion 30 and the second dipping portion 40 formed integrally with the separation wall therebetween can reduce the number of unnecessary liquefied rollers, it is possible to reduce the volume of the liquefied device.

3 is a cross-sectional view showing a liquid crystal device 200 according to another preferred embodiment of the present invention. 4 is a cross-sectional view illustrating a dipping portion (a first dipping portion and a second dipping portion) of a liquid crystal device according to another preferred embodiment of the present invention. Hereinafter, the liquid crystal device 200 according to the present embodiment will be described with reference to this. However, detailed description of the same configuration as the liquid crystal device 100 described with reference to FIGS. 1 and 2 will be omitted.

As shown in FIG. 3, in the liquid immersion roller included in the first liquid releasing roller unit 10, the liquid squeezing roller located at the foremost side is preferably smaller in diameter than the rear liquid squeezing roller. As the substrate 5 is thinned, when the substrate 5 is transferred from the etching step to the liquid phase step, a problem may occur in the liquid roller. This problem is because the first liquid immersion roller 10 has a cylindrical contact portion and is dipped in the first dipping portion 30 to supply the etching liquid 35 to the substrate 5 so that the wettability of the substrate and the liquid squeezer roller is high, and This occurs because there is a difference in the amount of etching liquid supplied to the liquefied roller and the lower liquefied roller.

This curling phenomenon can be prevented by using a roller having a small diameter on the front side of the liquefied roller. The roller at the foremost side having a smaller diameter focuses on guiding the substrate 5 rather than supplying the etching liquid 35. After the small-sized front-side liquid squeezer with a small load on the substrate allows the substrate 5 to enter the liquid squeezer 200 without curling, the rear rollers supply etching liquid to the substrate 5.

As shown in FIG. 4, the first dipping portion 30 may have a configuration separated into the etching liquid inflow region 30-1 and the etching liquid outflow region 30-2. The etchant inlet 31 is positioned in the etchant inlet region 30-1 so that the etchant 35 enters, and the etchant outlet 32 is connected to the etchant outlet region 30-2 so that the etchant 35 exits. The etching liquid 35 is circulated.

In addition, the etchant inflow area 30-1 and the etchant outflow area 30-2 are separated by the separating wall 33. The height of the separating wall 33 is lower than the height of the outer wall and does not reach the liquid roller. The etching liquid moves from the etching liquid inflow region 30-1 to the etching liquid outflow region 30-2 through the separation wall 33. Since the first dipping portion 30 has such a structure, the etching liquid 35 contained in the first dipping portion 30 can maintain a constant concentration and a constant component ratio.

On the other hand, one etch roller is dipped in the etchant inflow area 30-1 and the etchant outflow area 30-2, respectively, but this is only one example and the number of the axial rollers may be modified.

At this time, the first dipping part 30 receives the etchant 35 flowing out of the etchant outflow region 30-2, readjusts the component ratio, and supplies the etchant tank 34 to the etchant inflow region 30-1. ) May be further included. The etchant 35 flowing out of the etchant outflow region part 30-1 is in a state in which only a part of components is different from the supplied etchant 35. For example, the etching solution 35 may include hydrogen peroxide, which hydrogen is generated over time and loses its properties and turns into water. Therefore, the waste of the etching solution 35 can be prevented by adjusting the ratio of hydrogen peroxide to the leaked etching solution 35 and flowing it back into the first dipping portion 30. However, in order to maintain the etching solution 35 at a constant component ratio, the etching liquid tank 34 needs to be supplemented with some components constituting the etching solution 35 such as hydrogen peroxide, and a supplement solution inlet for supplementing some components is not shown in FIG. 4. .

And, as shown in FIG. 4, the second dipping portion 40 may have a configuration separated into a diluent inflow area 40-1 and a diluent outflow area 40-2. The diluent inlet 41 is connected to the diluent inlet area 40-1 so that the diluent 45 enters, and the diluent outlet 42 is connected to the diluent outlet 40-2 so that the dilution 45 exits. The dilution 45 is circulated. Diluent 45 is also moved through the separation wall 44 upper side. This second dipping portion 40 has an advantage of supplying the uncontaminated diluent liquid to the second liquid crystal roller 20.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit and scope of the invention. Therefore, such modifications or variations will have to belong to the claims of the present invention.

1 is a cross-sectional view showing a liquid crystal device according to a preferred embodiment of the present invention.

2 is a cross-sectional view showing a dipping portion (a first dipping portion and a second dipping portion) of a liquid crystal device according to a preferred embodiment of the present invention.

3 is a cross-sectional view showing a liquid crystal device according to another preferred embodiment of the present invention.

4 is a cross-sectional view illustrating a dipping portion (a first dipping portion and a second dipping portion) of a liquid crystal device according to another preferred embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

2 ; Etching roller section 4; Etching Liquid Injector

5; Substrate 10; First liquid roller part

20; 2nd liquid-liquid roller part 30; First dipping part

30-1; Etching liquid inflow region 30-2; Etching liquid outflow area

31; Etching liquid inlet 32; Etch solution outlet

33, 43; Partition wall 34; Etchant tank

35; Etching liquid 40; 2nd dipping part

40-1; Diluent inlet area 40-2; Diluent Outflow Area

41; Diluent inlet 42; Diluent Outlet

45; diluent

Claims (7)

In the liquid-repelling apparatus for preventing the etching liquid applied to the substrate in the etching step remaining in the cleaning step, A first liquid roller part for supporting the substrate in the overall width direction and applying an etching solution to the substrate; A second liquid roller part for supporting the substrate having passed through the first liquid roller part in the full width direction and applying a diluent to the substrate; A first dipping part positioned under the first liquid squeezing roller part and supplying the etching liquid to the first liquid squeezing roller by dipping the first liquid squeezing roller part; And Located at the lower side of the second liquid immersion roller portion, including a second dipping portion for dipping the second liquid immersion roller portion to supply the diluent to the second liquid immersion roller portion, In the plurality of liquid rollers included in the first liquid roller, The liquid collector which is located at the foremost side has a smaller diameter than the liquid roller at the rear side. delete The method according to claim 1, And the first dipping portion and the second dipping portion are adjacent to each other. The method according to claim 1, And the first dipping portion and the second dipping portion include a flow control valve. The method according to claim 1, And the first dipping portion is divided into an etchant inflow area and an etchant outflow area. The method according to claim 5, And the first dipping portion further comprises an etchant tank for receiving the etchant flowing out of the etchant outflow region and then reprocessing and resupplying the etchant inflow portion. The method according to claim 1, And the second dipping portion is configured to be divided into a diluent inflow region portion and a dilution liquid outlet region portion.

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