KR101130706B1 - radiant heat apparatus of LED lighting - Google Patents

radiant heat apparatus of LED lighting Download PDF

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KR101130706B1
KR101130706B1 KR1020090032911A KR20090032911A KR101130706B1 KR 101130706 B1 KR101130706 B1 KR 101130706B1 KR 1020090032911 A KR1020090032911 A KR 1020090032911A KR 20090032911 A KR20090032911 A KR 20090032911A KR 101130706 B1 KR101130706 B1 KR 101130706B1
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South Korea
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heat dissipation
heat
fixed
led lamp
fin
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KR1020090032911A
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Korean (ko)
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KR20100114398A (en
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김혜경
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김혜경
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/0035—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources the fastening means being capable of simultaneously attaching of an other part, e.g. a housing portion or an optical component
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005—Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
    • Y02B20/72—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps in street lighting

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

본 발명은 히트싱크(heat sink)용 하우징의 바닥면에 장착된 엘이디 조명등으로부터 발생되는 열을 방열시키도록 하우징 상면에 고정되는 다수개의 대롱 형상의 방열핀 방열면적을 증대시키고, 방열핀을 통한 자연 대류현상에 의해 엘이디 조명등으로부터 발생되는 열을 효과적으로 방열시킬 수 있도록 한 것으로,The present invention increases the heat dissipation area of the plurality of long heat dissipation fins fixed on the upper surface of the housing so as to dissipate heat generated from the LED lighting mounted on the bottom surface of the heat sink housing, and natural convection through the heat dissipation fins. In order to effectively dissipate heat generated by LED lights by

본 발명의 실시예에 의한 엘이디 조명등용 방열장치는,Heat dissipation device for an LED lamp according to an embodiment of the present invention,

엘이디 조명등이 장착된 인쇄회로기판이 바닥면에 고정되고, 가장자리에 환형의 안착홈이 형성되며, 엘이디 조명등으로부터 발생되는 열을 전달하는 유체가 충전되는 공간부가 형성되는 히트싱크용 바텀부재와,A bottom member for a heat sink having a printed circuit board on which an LED lamp is mounted is fixed to the bottom surface, an annular seating groove is formed at an edge thereof, and a space part in which a fluid for transferring heat generated from the LED lamp is formed;

안착홈에 대응되는 돌출부가 가장자리에 형성되고, 안착홈과 돌출부사이에 도포되는 접착제에 의한 상호접착으로 바텀부재에 밀봉상태로 고정되는 히트싱크용 탑부재와,A heat sink top member is formed at the edge corresponding to the seating recess, and is fixed to the bottom member in a sealed state by mutual adhesion by an adhesive applied between the seating recess and the protrusion,

탑부재의 돌기부 안쪽으로 장착되는 고정판에 고정되고, 탑부재에 바닥면이 밀착되도록 고정되며, 상하단이 개방된 대롱 형상의 방열핀을 포함한다.It is fixed to a fixed plate mounted inside the protrusion of the top member, and fixed to the bottom surface in close contact with the top member, and includes a heat dissipation fin of the long shape of the upper and lower ends.

엘이디 조명등, 방열장치, 방열핀, 히트싱크, 대류현상 LED lighting, heat sink, heat sink, heat sink, convection

Description

엘이디 조명등용 방열장치{radiant heat apparatus of LED lighting}Radiant heat apparatus of LED lighting

본 발명은 가로등 등에 사용되는 엘이디 조명등으로부터 발생되는 열을 대롱형상의 방열핀 및 대류방식에 의해 방열시킬 수 있도록 한 엘이디 조명등용 방열장치에 관한 것이다.The present invention relates to a heat dissipation device for an LED light that can dissipate heat generated from the LED light used in streetlights by a long heat radiation fin and a convection method.

더욱 상세하게는, 히트싱크(heat sink)용 하우징의 바닥면에 장착된 엘이디 조명등으로부터 발생되는 열을 방열시키도록 하우징 상면에 고정되는 다수개의 대롱 형상의 방열핀 방열면적을 증대시키고, 방열핀을 통한 자연 대류현상에 의해 엘이디 조명등으로부터 발생되는 열을 효과적으로 방열시킬 수 있도록 한 엘이디 조명등용 방열장치와 관련된다.More specifically, to increase the heat dissipation area of a plurality of long heat dissipation fins fixed on the upper surface of the housing so as to dissipate heat generated from the LED lighting mounted on the bottom surface of the heat sink housing, and through the heat dissipation fin The present invention relates to a heat dissipation device for an LED light that effectively dissipates heat generated from the LED light by convection.

일반적으로, 엘이디(LED; light emitting diode)는 빠른 처리속도와 낮은 전력소모 등의 이점과, 환경 친화적이면서 에너지 절약효과가 높아서 차세대 전략제품으로 각광받고 있으며, 기존의 백열등, 형광등에 비해 약 10 내지 15%정도의 낮은 전력소모와 100,000시간 이상의 반영구적인 사용수명을 갖는다. 반면에 엘이디 조명등은 내부에서 발생되는 열을 원활하게 배출시키지 못해 사용수명이 단축되는 단점을 갖는다.In general, LED (light emitting diode) is attracting attention as a next-generation strategic product because of the advantages such as high processing speed and low power consumption, and environmentally friendly and high energy saving effect, and about 10 to 10 compared to conventional incandescent and fluorescent lamps It has a low power consumption of 15% and a semi-permanent service life of more than 100,000 hours. On the other hand, LED lighting has a disadvantage of shortening the service life because it does not discharge the heat generated from the inside smoothly.

도 8에 도시된 바와 같이, 종래 기술에 의한 엘이디 조명등용 방열수단은, 수직통로(1)가 중앙에 관통 형성되는 관상몸체(2)와, 관상몸체(2) 외측면에 판형상으로 형성되는 방열핀(3)으로 구성되는 방열기(4)와,As shown in FIG. 8, the heat dissipation means for the LED lamp according to the prior art includes a tubular body 2 having a vertical passage 1 formed in the center thereof, and a tubular body 2 formed in a plate shape on an outer surface of the tubular body 2. A radiator 4 composed of a radiating fin 3,

수직통로(1)의 하단부에 밀착되도록 결합되는 열전도율이 우수한 동(Cu) 재질의 원주형 블록(5)과,A cylindrical block 5 made of copper (Cu) having excellent thermal conductivity coupled to closely contact the lower end of the vertical passage 1,

방열기(4)의 바닥면에 고정되고, 엘이디 조명등(6)이 장착되는 인쇄회로기판(PCB)(7)을 포함한다.And a printed circuit board (PCB) 7 fixed to the bottom surface of the radiator 4 and to which the LED lamp 6 is mounted.

전술한 바와 같이 구성되는 엘이디 조명등(6)을 점등할 경우 많은 열이 발생되고, 엘이디 조명등(6)으로부터 발생되는 열은 원주형 블록(5)을 통과해 관상몸체(2)에 전달된다. 이로 인해 엘이디 조명등(6)에서 발생되는 열은 관상몸체(2)에 방사상으로 형성된 방열핀(3)을 통해 대기중으로 방열된다.When the LED lamp 6 is configured as described above, a lot of heat is generated, and heat generated from the LED lamp 6 is transmitted to the tubular body 2 through the cylindrical block 5. As a result, heat generated from the LED lamp 6 is radiated to the atmosphere through the heat radiation fins 3 radially formed on the tubular body 2.

종래 기술의 엘이디 조명등용 방열수단에서는, 전술한 엘이디 조명등(6)으로부터 발생되는 열을 열전도율이 우수한 원주형 블록(5) 및 방열핀(3)을 통해 대기중으로 방열시킴에 따라, 원주형 블록(5)에 밀착되는 관상몸체(2) 하단부위의 방열핀과, 원주형 블록(5)으로부터 멀리 떨어진 관상몸체(2) 상단부위의 방열핀사이에 온도편차가 발생된다. 이로 인해 방열기(4)를 이용한 방열 효과가 저하되어 실용성이 떨어지는 문제점을 갖는다.In the heat dissipation means for the LED lamp of the prior art, the heat generated from the above-described LED lamp 6 is heat-radiated into the atmosphere through the columnar block 5 and the heat dissipation fins 3 having excellent thermal conductivity, so that the columnar block 5 A temperature deviation is generated between the heat dissipation fin at the lower end of the tubular body 2 in close contact with the heat dissipation fin and the heat dissipation fin at the upper end of the tubular body 2 away from the cylindrical block 5. For this reason, the heat radiation effect using the radiator 4 falls, and there exists a problem in which practicality falls.

본 발명의 실시예는, 히트싱크용 하우징의 바닥면에 장착된 엘이디 조명등으로부터 발생되는 열을 방열시키도록 하우징 상면에 고정되는 다수개의 대롱 형상의 방열핀 방열면적을 증대시키고, 방열핀을 통한 자연 대류현상에 의해 엘이디 조명등으로부터 발생되는 열을 효과적으로 방열시킬 수 있도록 한 엘이디 조명등용 방열장치와 관련된다.Embodiment of the present invention, to increase the heat dissipation area of the plurality of long heat dissipation fins fixed to the upper surface of the housing to dissipate heat generated from the LED lights, etc. mounted on the bottom surface of the heat sink housing, natural convection through the heat dissipation fins The present invention relates to a heat dissipation device for an LED light that can effectively dissipate heat generated by the LED light.

본 발명의 실시예는, 엘이디 조명등으로부터 발생되는 열을 유체가 충전된 히트싱크용 하우징에 의해 온도편차 없이 전달함에 따라, 방열 효과를 증대시킬 수 있도록 한 엘이디 조명등용 방열장치와 관련된다.Embodiment of the present invention relates to a heat dissipation device for an LED light that can increase the heat dissipation effect by transferring the heat generated from the LED light without a temperature deviation by the fluid-filled heat sink housing.

본 발명의 실시예는, 히트싱크용 하우징에 대해 대롱 형상의 방열핀을 조립식으로 고정하여 작업성을 향상시킬 수 있도록 한 엘이디 조명등용 방열장치와 관련된다.An embodiment of the present invention relates to a heat dissipation device for an LED lighting lamp to improve workability by prefabricating a long heat dissipation fin with respect to a heat sink housing.

본 발명의 실시예는, 히트싱크용 하우징에 대해 엘이디 조명등을 용이하게 조립 및 분해할 수 있도록 한 엘이디 조명등용 방열장치와 관련된다.Embodiments of the present invention relate to a heat dissipation device for an LED light that facilitates assembly and disassembly of the LED light for the heat sink housing.

본 발명의 실시에에 의한 엘이디 조명등용 방열장치는,Heat dissipation device for an LED lamp according to the embodiment of the present invention,

엘이디 조명등이 장착된 인쇄회로기판이 바닥면에 고정되고, 가장자리에 환형의 안착홈이 형성되며, 엘이디 조명등으로부터 발생되는 열을 전달하는 유체가 충전되는 공간부가 형성되는 히트싱크용 바텀부재와,A bottom member for a heat sink having a printed circuit board on which an LED lamp is mounted is fixed to the bottom surface, an annular seating groove is formed at an edge thereof, and a space part in which a fluid for transferring heat generated from the LED lamp is formed;

안착홈에 대응되는 돌출부가 가장자리에 형성되고, 안착홈과 돌출부사이에 도포되는 접착제에 의한 상호접착으로 바텀부재에 밀봉상태로 고정되는 히트싱크용 탑부재와,A heat sink top member is formed at the edge corresponding to the seating recess, and is fixed to the bottom member in a sealed state by mutual adhesion by an adhesive applied between the seating recess and the protrusion,

탑부재의 돌기부 안쪽으로 장착되는 고정판에 고정되고, 탑부재에 바닥면이 밀착되도록 고정되며, 상하단이 개방된 대롱 형상의 방열핀을 포함한다.It is fixed to a fixed plate mounted inside the protrusion of the top member, and fixed to the bottom surface in close contact with the top member, and includes a heat dissipation fin of the long shape of the upper and lower ends.

바람직한 실시예에 의하면, 전술한 방열핀의 하단부에 형성되는 원통형 고정부에 절개부가 길이방향으로 형성되어, 방열핀이 고정판에 형성된 관통공을 통과함에 따라 관통공에 고정부가 끼워맞춤되어 고정된다.According to a preferred embodiment, the incision portion is formed in the longitudinal direction in the cylindrical fixing portion formed on the lower end of the heat dissipation fins, the fixing portion is fitted and fixed to the through holes as the heat dissipation fins pass through the through holes formed in the fixing plate.

전술한 방열핀은 대류현상에 의한 방열성을 향상시키도록 방열핀에 개구부가 반경방향으로 형성되어 "C"자 형상으로 형성된다.The above-described heat dissipation fins are formed in a "C" shape by openings formed radially in the heat dissipation fin to improve heat dissipation due to convection.

전술한 방열핀은 대류현상에 의한 방열성을 향상시키도록 방열핀에 제1,2개구부가 반경방향으로 대향되게 형성된다.The above-described heat dissipation fins are formed such that the first and second openings face the heat dissipation fins in a radial direction so as to improve heat dissipation due to convection.

전술한 방열핀은 방열면적을 증대시켜 방열성을 향상시키도록 방열핀을 상단이 개방된 원기둥 형상으로 형성된다.The above-described heat dissipation fin is formed in a cylindrical shape with an upper end of the heat dissipation fin to increase the heat dissipation area to improve heat dissipation.

전술한 방열핀에 형성되는 제1,2개구부 중, 제1개구부는 방열핀의 상단에서 고정판까지 형성되고, 제2개구부는 제1개구부의 길이보다 짧게 방열핀의 상단에서 하측으로 형성된다.Of the first and second openings formed in the heat dissipation fin, the first opening is formed from the upper end of the heat dissipation fin to the fixing plate, and the second opening is formed at the lower end of the heat dissipation fin at a lower end than the length of the first opening.

전술한 고정판에 고정되는 방열핀의 길이를 서로 다르게 형성하되, 길이가 길고 짧은 방열핀이 고정판에 불규칙으로 배열되어 고정된다.The length of the heat dissipation fins fixed to the fixing plate is different from each other, but the long and short heat dissipation fins are irregularly arranged and fixed to the fixing plate.

위와 같이 구성되는 본 발명의 실시예에 의한 엘이디 조명등용 방열장치는 아래와 같은 이점을 갖는다.LED lighting device according to the embodiment of the present invention configured as described above has the following advantages.

엘이디 조명등이 바닥면에 장착된 히트싱크용 하우징의 상면에 고정되는 방열핀을 대롱으로 형상화하여 방열면적을 증대시키고, 방열핀을 통한 자연 대류현상에 의해 엘이디 조명등으로부터 발생되는 열을 효과적으로 방열시킬 수 있다.The LED lighting lamp is formed in the shape of a heat sink fin fixed to the upper surface of the heat sink housing mounted on the bottom surface to increase the heat dissipation area, it is possible to effectively dissipate heat generated from the LED lamp by the natural convection phenomenon through the heat sink fins.

또한, 엘이디 조명등으로부터 발생되는 열을 유체가 충전된 히트싱크용 하우징에 의해 온도편차 없이 방열핀에 전달하여 방열시킴에 따라, 열 평형기능을 갖게되므로 방열 효과를 향상시킬 수 있다.In addition, as the heat generated from the LED light is transferred to the heat dissipation fin without the temperature difference by the heat sink housing filled with the fluid to radiate heat, it has a thermal balance function can improve the heat dissipation effect.

또한, 히트싱크용 하우징에 대해 대롱 형상의 방열핀을 조립식으로 고정하여 작업성을 향상시키고, 히트싱크용 하우징에 대해 엘이디 조명등을 간편하게 조립 및 분해할 수 있다.In addition, the heat dissipation fin of the long shape is fixed to the heat sink housing in a prefabricated manner to improve workability, and the LED lighting and the like for the heat sink housing can be easily assembled and disassembled.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명하되, 이는 본 발명이 속하는 기술분야에서 통상의 지식을 가진 자가 발명을 용이하게 실시할 수 있을 정도로 상세하게 설명하기 위한 것이지, 이로 인해 본 발명의 기술적인 사상 및 범주가 한정되는 것을 의미하지는 않는 것이다.Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, which are intended to describe in detail enough to enable those skilled in the art to easily practice the invention, and therefore It does not mean that the technical spirit and scope of the present invention is limited.

도 1 내지 도 4에 도시된 본 발명의 일 실시예에 의한 엘이디 조명등용 방열장치는,1 to 4, the heat radiation device for an LED lamp according to an embodiment of the present invention,

엘이디 조명등(10)이 장착된 인쇄회로기판(PCB)(11)이 바닥면에 고정되고, 가장자리에 환형의 안착홈(12)이 형성되며, 엘이디 조명등(10)으로부터 발생되는 열을 전달하는 유체가 충전되는 공간부(13)가 형성되는 히트싱크용 바텀부재("바텀부재" 라고 함)(열전도율이 뛰어난 동(Cu) 재질이 사용됨)(14)와,The printed circuit board (PCB) 11 equipped with the LED lamp 10 is fixed to the bottom surface, an annular seating groove 12 is formed at the edge, and the fluid that transfers heat generated from the LED lamp 10. A heat sink bottom member (referred to as "bottom member") (a copper material having excellent thermal conductivity is used) 14, in which the space portion 13 to be filled is formed;

안착홈(12)에 대응되는 돌출부(15)가 가장자리에 형성되고, 안착홈(12)과 돌출부(15)사이에 도포되는 접착제(16)(에폭시 등을 말함)에 의한 상호접착으로 바텀부재(14)에 밀봉상태로 고정되는 히트싱크용 탑부재("탑부재" 라고 함)(열전도율이 뛰어난 동(Cu) 재질이 사용됨)(17)와,A protrusion 15 corresponding to the seating recess 12 is formed at the edge, and the bottom member is formed by mutual bonding by an adhesive 16 (say epoxy) applied between the seating recess 12 and the protrusion 15. 14) a heat sink top member (called "top member") fixed in a sealed state (a copper material having excellent thermal conductivity is used) 17,

탑부재(17)의 돌기부(14) 안쪽으로 장착되는 고정판(18)(열전도율이 뛰어난 동(Cu) 재질이 사용됨)에 고정되고, 탑부재(17)에 바닥면이 밀착되도록 고정되며, 상하단이 개방된 대롱 형상의 방열핀(19)을 포함한다.The fixing plate 18 (Cu material having excellent thermal conductivity is used) mounted inside the protrusion 14 of the top member 17 is fixed, and the bottom surface is fixed to the top member 17 to be in close contact with each other. An open long heat dissipation fin 19 is included.

전술한 방열핀(19)은 이의 단면형상을 원형, 타원형, 다각형 등으로 다양하게 변형할 수 있다.The above-described heat dissipation fins 19 may be variously modified in a cross-sectional shape thereof into a circle, an ellipse, a polygon, or the like.

전술한 방열핀(19)의 하단부에 형성되는 원통형 고정부(20)에 절개부(21)가 길이방향으로 형성되어, 방열핀(19)이 고정판(18)에 형성된 관통공(22)을 통과함에 따라 관통공(22)에 고정부(20)가 끼워맞춤되어 고정된다.As the cutout 21 is formed in the longitudinal direction in the cylindrical fixing portion 20 formed at the lower end of the heat dissipation fin 19, the heat dissipation fin 19 passes through the through hole 22 formed in the fixing plate 18. The fixing part 20 is fitted and fixed to the through hole 22.

전술한 방열핀(19)은 대류현상에 의한 방열성을 향상시키도록 방열핀(19)에 제1,2개구부(24,25)가 반경방향으로 대향되게 형성된다.The above-described heat dissipation fins 19 are formed such that the first and second openings 24 and 25 are radially opposed to the heat dissipation fins 19 so as to improve heat dissipation due to convection.

전술한 방열핀(19)에 형성되는 제1,2개구부(24,25) 중, 제1개구부(24)는 방열핀(19)의 상단에서 고정판(18)까지 형성되고, 제2개구부(25)는 제1개구부(24)의 길이보다 짧게 방열핀(19)의 상단에서 하측으로 형성된다.Of the first and second openings 24 and 25 formed on the heat dissipation fin 19, the first opening 24 is formed from the upper end of the heat dissipation fin 19 to the fixing plate 18, and the second opening 25 is Shorter than the length of the first opening 24 is formed from the upper end of the heat radiation fin 19 to the lower side.

도 4(a-f)에 도시된 바와 같이, 전술한 고정판(18)에 고정되는 방열핀(19)의 길이를 서로 다르게 형성하되, 길이가 길고 짧은 방열핀(19)이 고정판(18)에 불규칙으로 배열되어 고정된다. 즉 고정판(18)에 형성된 관통공(22) 중, 검정색으로 채색된 관통공에 결합되는 방열핀(미 도시됨)의 길이가 짧고, 채색되지않은 관통공(22)에 결합되는 방열핀(미 도시됨)의 길이가 상대적으로 길게 형성된다.As shown in Figure 4 (af), the length of the heat dissipation fins 19 fixed to the above-mentioned fixing plate 18 is formed differently, the long and short heat dissipation fins 19 are arranged irregularly on the fixing plate 18 It is fixed. That is, among the through holes 22 formed in the fixing plate 18, the length of the heat dissipation fins (not shown) coupled to the through holes colored in black is short, and the heat dissipation fins (not shown) coupled to the unpainted through holes 22. ) Is relatively long.

이와 같이 고정판(18)에 길이가 상이하게 형성되는 방열핀을 불규칙으로 배열시킴에 따라, 엘이디 조명등(10)으로부터 발생되는 열을 대류현상에 의해 방열시킬 경우, 압력불균형으로 인해 방열효과를 증대시킬 수 있다.As such, as the heat radiation fins having different lengths are irregularly arranged on the fixing plate 18, when heat generated from the LED lamp 10 is dissipated by convection, the heat dissipation effect may be increased due to pressure imbalance. have.

도면중 미 설명부호 14a는 바텀부재(14)의 상면에 원기둥 형상으로 돌출되고 상단이 개방되는 돌출편이고, 17a는 탑부재(17)의 바닥면에 원기둥 형상으로 돌출되고 하단이 개방되는 돌출편이다.In the drawings, reference numeral 14a denotes a protruding piece that protrudes in a cylindrical shape on the top surface of the bottom member 14 and an upper end thereof is opened, and 17a is a protruding piece protruding in a cylindrical shape on the bottom surface of the top member 17 and the lower end thereof opens. .

이하에서, 본 발명의 실시예에 의한 엘이디 조명등용 방열장치의 사용예를 첨부된 도면을 참조하여 상세하게 설명한다.Hereinafter, with reference to the accompanying drawings an example of the use of the heat dissipation device for an LED lamp according to an embodiment of the present invention will be described in detail.

도 1,2,3에 도시된 바와 같이, 전술한 바텀부재(14)의 가장자리에 형성된 안 착홈(12)에 에폭시(epoxy resin) 등의 접착제(16)를 도포시킨 후, 안착홈(12)과 대응되게 탑부재(17)에 형성된 돌출부(15)를 안착홈(12)에 안착시킨다. 이때 바텀부재(14)의 중앙에 돌출된 돌출편(14a)과 탑부재(17)의 중앙에 돌출된 돌출편(17a)사이에 접착제를 도포시킴에 따라, 바텀부재(14) 상에 대해 탑부재(17)를 고정할 수 있다.1,2,3, after applying the adhesive 16, such as epoxy (epoxy resin) to the seating groove 12 formed on the edge of the bottom member 14 described above, the seating groove 12 The protrusion 15 formed in the top member 17 is seated in the seating groove 12 in correspondence with the rest. At this time, as the adhesive is applied between the protruding piece 14a protruding in the center of the bottom member 14 and the protruding piece 17a protruding in the center of the top member 17, the top is placed on the bottom member 14. The member 17 can be fixed.

전술한 바와 같이 바텀부재(14)와 탑부재(17)사이의 공간부(13)를 밀봉상태로 고정할 수 있다. 이때 바텀부재(14)의 바닥면에 고정된 엘이디 조명등(10)으로부터 발생되는 열을 방열핀(19)에 온도편차없이 전달할 수 있도록 공간부(13)에 유체가 충전된다.As described above, the space 13 between the bottom member 14 and the top member 17 may be fixed in a sealed state. At this time, the fluid is filled in the space 13 so that heat generated from the LED lamp 10 fixed to the bottom surface of the bottom member 14 can be transmitted to the heat dissipation fin 19 without temperature deviation.

따라서, 전술한 엘이디 조명등(10)(15W - 20W의 정도)을 점등시킬 경우 발생되는 열은 열전도율이 우수한 바텀부재(14)에 전달된다. 바텀부재(14)에 전달되는 열은 바텀부재(14)와 탑부재(17)사이의 공간부(13)에 충전된 유체에 의해 온도편차없이 탑부재(17)에 밀착고정된 방열핀(19)에 전달된다.Therefore, the heat generated when the above-mentioned LED lamp 10 (about 15W-20W) is turned on is transferred to the bottom member 14 having excellent thermal conductivity. The heat transmitted to the bottom member 14 is radiated fins 19 which are tightly fixed to the top member 17 without temperature deviation by the fluid filled in the space 13 between the bottom member 14 and the top member 17. Is passed on.

이때, 방열핀(19)이 대롱 형상으로 형성되므로 방열면적이 증대된다. 또한 방열핀(19)의 상단이 개방되고, 방열핀(19)에 제1,2개구부(24,25)가 반경방향으로 대향되게 형성됨에 따라, 자연대류 현상에 의해 방열핀(19)을 통한 방열성을 향상시킬 수 있다(종래의 방열핀보다 5 ～ 10℃이상의 방열효과를 갖게됨).At this time, since the heat radiation fins 19 are formed in a long shape, the heat radiation area is increased. In addition, as the upper end of the heat dissipation fin 19 is opened, and the first and second openings 24 and 25 are formed to face the heat dissipation fin 19 in the radial direction, heat dissipation through the heat dissipation fin 19 is improved by natural convection. (The heat dissipation effect is 5-10 ℃ or more than conventional heat dissipation fins).

도 5에 도시된 바와 같이, 전술한 방열핀(19)은 고정판(18)에 형성된 관통공(22)에 끼워맞춤으로 고정할 수 있다. 즉 관통공(22)에 대롱 형상의 방열핀(19)을 고정판(18) 밑에서 결합시킬 경우, 방열핀(19) 하측에 형성된 경사부(26)에 고 정판(18)의 관통공(22)이 안착된다(관통공(22)의 내경이 경사부(26)의 외경보다 작다).As shown in FIG. 5, the above-described heat dissipation fins 19 may be fixed by fitting to the through holes 22 formed in the fixing plate 18. That is, when the long heat radiation fin 19 is coupled to the through hole 22 under the fixed plate 18, the through hole 22 of the fixing plate 18 is seated on the inclined portion 26 formed below the heat radiation fin 19. (The inner diameter of the through hole 22 is smaller than the outer diameter of the inclined portion 26).

이때 고정판(18)에 대해 방열핀(19)을 조금 더 가압할 경우, 방열핀(19)에 형성된 제2개구부(25) 및 고정부(20)에 형성된 절개부(21)에 의해 방열핀(19)의 고정부(20)가 탄성변형되어 관통공(22)을 통과할 수 있다. 이와 같이 방열핀(19)의 고정부(20)가 관통공(22)에 결합되므로 고정판(18)에 대해 방열핀(19)을 끼워맞춰 고정할 수 있다.At this time, when pressing the heat radiation fin 19 a little more against the fixing plate 18, the second opening 25 formed in the heat radiation fin 19 and the cutout 21 formed in the fixing portion 20 of the heat radiation fin 19 The fixing part 20 may elastically deform and pass through the through hole 22. As described above, since the fixing part 20 of the heat dissipation fin 19 is coupled to the through hole 22, the heat dissipation fin 19 may be fitted to and fixed to the fixing plate 18.

따라서, 전술한 탑부재(17) 상면에 접착제(16)를 도포시킨 후, 다수의 방열핀(19)이 고정된 고정판(18)을 탑부재(17)에 안착시켜 고정할 수 있다. 이때 방열핀(19)의 바닥면에 형성된 환형의 플랜지(27)가 탑부재(17) 상에 밀착되도록 고정된다.Therefore, after the adhesive 16 is applied to the upper surface of the top member 17 described above, the fixing plate 18 on which the plurality of heat dissipation fins 19 is fixed may be seated on the top member 17 and fixed. At this time, the annular flange 27 formed on the bottom surface of the heat dissipation fin 19 is fixed to be in close contact with the top member 17.

전술한 엘이디 조명등(10)으로부터 발생되어 전달되는 열을 원활하게 방열시킬 수 있도록 방열핀(19)을 상하단이 개방된 대롱 형상으로 형성하여 방열면적을 증대시킬 수 있다. 또한 엘이디 조명등(10)의 열을 자연 대류현상에 의해 방열시킬 수 있도록 방열핀(19)에 제1,2개구부(24,25)가 반경방향으로 대향되게 형성된다.The heat dissipation fins 19 may be formed in a long shape having upper and lower ends open to smoothly dissipate heat generated from the LED lamp 10 described above, thereby increasing the heat dissipation area. In addition, the first and second openings 24 and 25 are formed to face the radiating fins 19 in a radial direction so as to radiate heat of the LED lamp 10 by natural convection.

전술한 제1,2개구부(24,25)의 사이즈가 상이하게 형성된다. 즉 방열핀(19)에 형성된 제1개구부(24)가 상단 개구부에서부터 고정부(20)까지 형성되고, 제2개구부(25)가 제1개구부(24)보다 짧게 방열핀(19)에 형성된다. 이로 인해 자연 대류현상에 의해 엘이디 조명등(10)의 열을 방열시킬 경우 압력불균형으로 인해 방열효과를 증대시킬 수 있다.The sizes of the first and second openings 24 and 25 described above are formed differently. That is, the first opening 24 formed in the heat dissipation fin 19 is formed from the upper opening to the fixing portion 20, and the second opening 25 is formed in the heat dissipation fin 19 shorter than the first opening 24. Therefore, when heat dissipating heat of the LED lamp 10 due to natural convection, it is possible to increase the heat dissipation effect due to pressure imbalance.

도 6에 도시된 바와 같이, 본 발명의 다른 실시예에 의한 엘이디 조명등용 방열장치는, 전술한 고정판(18)에 고정되는 방열핀(19)은 방열면적을 증대시켜 방열성을 향상시키도록 방열핀(19)을 상단이 개방된 원기둥 형상으로 형성된다.As shown in FIG. 6, the heat dissipation device for the LED lamp according to another embodiment of the present invention, the heat dissipation fins 19 fixed to the fixing plate 18 described above may increase the heat dissipation area to improve heat dissipation. ) Is formed in a cylindrical shape with an open top.

이때, 방열면적으로 증대시킬 수 있도록 원기둥 형상으로 형성된 방열핀(19)를 제외한 구성은, 본 발명의 일 실시예에 의한 엘이디 조명등용 방열수단의 구성과 실질적으로 동일하게 적용되므로, 이들의 구성 및 사용에 대한 상세한 설명은 생략한다.At this time, the configuration except for the heat radiation fin 19 formed in a cylindrical shape so as to increase the heat radiation area is applied substantially the same as the configuration of the heat radiation means for the LED lighting according to an embodiment of the present invention, the configuration and use thereof Detailed description thereof will be omitted.

도 7에 도시된 바와 같이, 본 발명의 또 다른 실시예에 의한 엘이디 조명등용 방열장치는, 전술한 고정판(18)에 고정되는 방열핀(19)은 대류현상에 의한 방열성을 향상시키도록 상단이 개방된 방열핀(19)에 개구부(23)가 반경방향으로 형성되어 "C"자 형상으로 형성된다.As shown in Figure 7, the heat dissipation device for an LED lamp according to another embodiment of the present invention, the heat dissipation fin 19 is fixed to the above-mentioned fixing plate 18 is open at the top to improve heat dissipation due to convection phenomenon The opening 23 is formed in the radiating fin 19 in the radial direction to form a "C" shape.

이때, 개구부(23)가 반경방향으로 형성된 방열핀(19)를 제외한 구성은, 본 발명의 일 실시예에 의한 엘이디 조명등용 방열수단의 구성과 실질적으로 동일하게 적용되므로, 이들의 구성 및 사용에 대한 상세한 설명은 생략한다.At this time, the configuration except for the heat radiation fin 19, the opening 23 is formed in the radial direction, is applied substantially the same as the configuration of the heat radiation means for the LED lamp according to an embodiment of the present invention, for their configuration and use Detailed description will be omitted.

도 1은 본 발명의 일 실시예에 의한 엘이디 조명등용 방열장치의 사시도,1 is a perspective view of a heat radiation device for an LED lamp according to an embodiment of the present invention,

도 2는 본 발명의 일 실시예에 의한 엘이디 조명등용 방열장치의 분리사시도,2 is an exploded perspective view of a heat dissipating device for an LED lamp according to an embodiment of the present invention;

도 3은 본 발명의 일 실시예에 의한 엘이디 조명등용 방열장치의 사용상태도,Figure 3 is a state of use of the heat dissipation device for an LED lamp according to an embodiment of the present invention,

도 4(a-f)는 본 발명의 일 실시예에 의한 엘이디 조명등용 방열장치에서, 길이가 상이한 방열핀이 고정판에 불규칙으로 배열되는 것을 평면도,4 (a-f) is a plan view of the heat dissipation device for LED lamps according to an embodiment of the present invention, the heat radiation fins of different lengths are irregularly arranged on the fixing plate,

도 5은 본 발명의 일 실시예에 의한 엘이디 조명등용 방열장치에서, 방열핀이 고정판의 관통공에 끼워맞춤되어 고정되는 것을 설명하기 위한 사시도,5 is a perspective view for explaining that the heat dissipation fin is fitted to the through hole of the fixing plate in the heat dissipation device for LED lighting according to an embodiment of the present invention,

도 6은 본 발명의 다른 실시예에 의한 엘이디 조명등용 방열장치의 사시도,6 is a perspective view of a heat dissipating device for an LED lamp according to another embodiment of the present invention;

도 7은 본 발명의 또 다른 실시예에 의한 엘이디 조명등용 방열장치의 사시도,7 is a perspective view of a heat dissipating device for an LED lamp according to another embodiment of the present invention;

도 8은 종래 기술에 의한 엘이디 조명등용 방열장치의 개략도이다.8 is a schematic diagram of a heat dissipation device for an LED lamp according to the prior art.

*도면중 주요 부분에 사용된 부호의 설명* Explanation of symbols used in the main part of the drawing

10; 엘이디 조명등10; LED lighting

11; 인쇄회로기판(PCB)11; Printed Circuit Board (PCB)

12; 안착홈12; Home

13; 공간부13; Space

14; 바텀부재14; Bottom member

15; 돌출부15; projection part

16; 접착제16; glue

17; 탑부재17; Top member

18; 고정판18; Fixed plate

19; 방열핀19; Heat dissipation fin

20; 고정부20; Fixture

21; 절개부21; Incision

22; 관통공22; Through hole

23; 개구부23; Opening

24; 제1개구부24; First opening

25; 제2개구부25; 2nd opening

Claims (6)

엘이디 조명등이 장착된 인쇄회로기판이 바닥면에 고정되고, 가장자리에 환형의 안착홈이 형성되며, 상기 엘이디 조명등으로부터 발생되는 열을 전달하는 유체가 충전되는 공간부가 형성되는 히트싱크용 바텀부재;A bottom member for a heat sink in which a printed circuit board on which an LED lamp is mounted is fixed to a bottom surface, an annular seating groove is formed at an edge thereof, and a space portion in which a fluid for transferring heat generated from the LED lamp is formed; 상기 안착홈에 대응되는 돌출부가 가장자리에 형성되고, 상기 안착홈과 돌출부사이에 도포되는 접착제에 의한 상호접착으로 상기 바텀부재에 밀봉상태로 고정되는 히트싱크용 탑부재; 및A heat sink top member having a protrusion corresponding to the seating groove formed at an edge thereof and fixed to the bottom member in a sealed state by mutual adhesion by an adhesive applied between the seating recess and the protrusion; And 상기 탑부재의 돌기부 안쪽으로 장착되는 고정판에 고정되고, 상기 탑부재에 바닥면이 밀착되도록 고정되며, 상하단이 개방된 대롱 형상의 방열핀을 포함하는 것을 특징으로 하는 엘이디 조명등용 방열장치.Fixed to the fixed plate is mounted to the inside of the projection of the top member, the bottom surface is fixed to be in close contact with the top member, the heat radiation device for an LED lamp, characterized in that it comprises a long heat dissipation fin open upper and lower ends. 제1항에 있어서, 상기 방열핀의 하단부에 형성되는 원통형 고정부에 절개부가 길이방향으로 형성되어, 상기 방열핀이 상기 고정판에 형성된 관통공을 통과함에 따라 상기 관통공에 고정부가 끼워맞춤되어 고정되는 것을 특징으로 하는 엘이디 조명등용 방열장치.The method of claim 1, wherein the incision is formed in the longitudinal direction in the cylindrical fixing portion formed on the lower end of the heat dissipation fins, as the heat dissipation fins pass through the through holes formed in the fixing plate to be fixed to the through holes are fitted Heat radiator for LED lighting characterized in that. 제2항에 있어서, 상기 방열핀은 대류현상에 의한 방열성을 향상시키도록 상 기 방열핀에 개구부가 반경방향으로 형성되어 "C"자 형상으로 형성되는 것을 특징으로 하는 엘이디 조명등용 방열장치.The heat dissipation device of claim 2, wherein the heat dissipation fin is formed in a “C” shape by openings formed in the radial direction to improve heat dissipation due to convection. 제2항에 있어서, 상기 방열핀은 대류현상에 의한 방열성을 향상시키도록 상기 방열핀에 제1,2개구부가 반경방향으로 대향되게 형성되는 것을 특징으로 하는 엘이디 조명등용 방열장치.The heat dissipation device of claim 2, wherein the heat dissipation fins are formed such that the first and second openings are radially opposed to the heat dissipation fins so as to improve heat dissipation due to convection. 제2항에 있어서, 상기 방열핀은 방열면적을 증대시켜 방열성을 향상시키도록 상기 방열핀을 상단이 개방된 원기둥 형상으로 형성되는 것을 특징으로 하는 엘이디 조명등용 방열장치.The heat dissipation device of claim 2, wherein the heat dissipation fin is formed in a cylindrical shape with an upper end of the heat dissipation fin open to increase the heat dissipation area to improve heat dissipation. 제4항에 있어서, 상기 방열핀에 형성되는 제1,2개구부 중, 상기 제1개구부는 상기 방열핀의 상단에서 상기 고정판까지 형성되고, 상기 제2개구부는 상기 제1개구부의 길이보다 짧게 상기 방열핀의 상단에서 하측으로 형성되는 것을 특징으로 하는 엘이디 조명등용 방열장치.5. The heat dissipation fin of claim 4, wherein the first opening is formed from an upper end of the heat dissipation fin to the fixing plate, and the second opening is shorter than a length of the first opening. LED lighting lamp heat dissipation, characterized in that formed from the top to the lower side.
KR1020090032911A 2009-04-15 2009-04-15 radiant heat apparatus of LED lighting KR101130706B1 (en)

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WO2022260194A1 (en) * 2021-06-10 2022-12-15 주식회사 씨엔와이더스 Led light module comprising heat sink using carbonaceous material

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