KR20100117797A - Radiant heat structure of led lamp - Google Patents

Radiant heat structure of led lamp Download PDF

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Publication number
KR20100117797A
KR20100117797A KR1020090036438A KR20090036438A KR20100117797A KR 20100117797 A KR20100117797 A KR 20100117797A KR 1020090036438 A KR1020090036438 A KR 1020090036438A KR 20090036438 A KR20090036438 A KR 20090036438A KR 20100117797 A KR20100117797 A KR 20100117797A
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South Korea
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heat dissipation
circuit board
printed circuit
led lamp
shade
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KR1020090036438A
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Korean (ko)
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KR101069253B1 (en
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김기창
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주식회사 워터플랜
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
    • F21K9/272—Details of end parts, i.e. the parts that connect the light source to a fitting; Arrangement of components within end parts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/77—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section
    • F21V29/773—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical diverging planar fins or blades, e.g. with fan-like or star-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

PURPOSE: A heat dissipation structure of an LED lamp is provided to dissipate heat which is generated from an LED lamp by forming a heat dissipation part between a PCB and a lamp shade. CONSTITUTION: A socket(20) is installed in a lamp shade(10). An LED lamp(40) is arranged inside the lamp shade. The LED lamp includes a printed circuit board(30) and a plurality of LEDs. The plurality of LEDs are installed on the printed circuit board. A heat dissipation part is formed between the printed circuit board and the lamp shade. The heat dissipation part comprises a pipe and a plurality of radiating fin groups. The pipe is formed into a great absolute pattern or a serpentine pattern. The plurality of radiating fin groups are arranged in the pipe.

Description

발광다이오드 램프의 방열구조{radiant heat structure of led lamp}Radiant heat structure of LED lamp

본 발명은 발광다이오드 램프의 방열구조에 관한 것으로, 더욱 상세하게는 발광다이오드 램프의 구조를 개선하여 특히 LED 램프가 발광하며 발생하는 고열과 그에 따라 전도되는 고온을 효과적으로 방출시켜 기기가 손상되는 것을 방지하는 발광다이오드 램프의 방열구조에 관한 것이다.The present invention relates to a heat dissipation structure of a light emitting diode lamp, and more particularly, to improve the structure of the light emitting diode lamp to prevent the device from being damaged by effectively releasing the high heat generated by the light emitting the LED lamp and the resulting high temperature. It relates to a heat dissipation structure of a light emitting diode lamp.

일반적으로 알려진 바와 같이 발광다이오드(LED:light emitting diode)라 함은 갈륨비소 등의 화합물에 전류를 흘려 빛을 발산하는 반도체 소자이다.As is generally known, a light emitting diode (LED) is a semiconductor device that emits light by passing a current through a compound such as gallium arsenide.

이와 같은 발광다이오드의 사용 범위는 컴퓨터 본체에서 깜박이는 작은 불빛에서부터 도심의 빌딩위에 설치된 대형 전광판, TV리모콘 버튼을 누를때마다 TV본체에 신호를 보내는 눈에 보이지 않는 광선 등을 만들때 필요한 것이다.The use range of such a light emitting diode is necessary to make a small light flickering in a computer body, a large display board installed in a city center building, an invisible light beam that sends a signal to the TV body every time the TV remote control button is pressed.

한편 발광다이오드는 전력소비가 백열전구의 20%에 불과한데다 수명이 10만 시간(형광등의 100배)에 달해 한번 설치하면 교체나 유지보수가 거의 필요 없다는 것이 최대 장점이므로 여러 가지 제품으로 대체되며 많은 신상품이 계속 출하되고 있는 실정이다.On the other hand, light emitting diodes consume only 20% of incandescent bulbs and have a lifetime of 100,000 hours (100 times greater than fluorescent lamps). This is still being shipped.

그러나 이와 같은 발광다이오드의 램프에서 가장 큰 장점은 10만 시간에 가까운 수명이지만 그에 수반하여 발광다이오드가 발광할 때 발생되는 고열에 의해 결국 발광다이오드 및 인쇄회로기판의 수명을 더 평균 수명보다 더 길게 연장할 수 없는 문제점이 되고 있다.However, the biggest advantage of such a light emitting diode lamp is the life of nearly 100,000 hours, but with the high heat generated when the light emitting diode emits light, the life of the light emitting diode and the printed circuit board is extended longer than the average life. It becomes an impossible problem.

따라서 본 발명이 해결하고자 하는 기술적 과제, 즉 본 발명의 목적은 종래 와 같은 일반적인 발광다이오드 램프의 구조를 개선함으로써 발광다이오드 램프의 발광시 발생하는 고열을 방열시킴으로써 램프의 수명을 더욱 연장할 수 있는 발광다이오드 램프의 방열구조를 제공하는데 있다.Therefore, the technical problem to be solved by the present invention, that is, the object of the present invention by improving the structure of a conventional light emitting diode lamp as in the prior art by radiating the high heat generated during the light emitting of the light emitting diode lamp light emission that can further extend the life of the lamp To provide a heat dissipation structure of a diode lamp.

본 발명의 다른 목적은 발광다이오드의 램프가 발광하며 발생하는 고열을 공기의 대류 작용에 편승시킴으로써 방열 효과를 가일층 향상시킬 수 있는 발광다이오드 램프의 방열구조를 제공하는데 있다.Another object of the present invention is to provide a heat dissipation structure of a light emitting diode lamp which can further improve the heat dissipation effect by piggybacking the high heat generated by the light emitting diode lamp to the convection action of air.

상기의 목적을 해결하기 위한 본 발명의 제1 실시 예는, 전원과 접속되는 소켓을 갖춘 갓; 상기 갓의 내측에 구비되는 인쇄회로기판과 그 인쇄회로기판에 접촉되며 발광하는 다수의 LED가 배열된 LED 램프; 및 상기 갓은 그 외체가 설정된 간격을 두고 절결되며 통풍구가 형성된 것을 더 포함하며; 상기 인쇄회로기판과 상기 갓의 사이에는 열 방출부가 구비된 것을 더 포함하는 발광다이오드 램프의 방열구조를 제공한다.A first embodiment of the present invention for solving the above object, the shade having a socket connected to the power source; An LED lamp in which a plurality of LEDs arranged in contact with the printed circuit board and the printed circuit board provided inside the shade and emitting light are arranged; And the shade is cut out at a predetermined interval and the vent hole is formed. It provides a heat dissipation structure of the LED lamp further comprises a heat dissipation portion between the printed circuit board and the shade.

본 발명의 목적을 효과적으로 구현하기 위한 제1 변형 예는, 상기 열 방출부는 상기 인쇄회로기판에 놓여지며 그 외주연이 원 형으로 절곡 형성된 파이프; 및상기 통풍구의 사이에 상응하며 위치되도록 상기 파이프에 설치되는 다수의 방열핀 군으로 구비된 발광다이오드 램프의 방열구조를 제공한다.A first modified example for effectively realizing the object of the present invention, the heat dissipation portion is placed on the printed circuit board and the outer circumference is bent in a circular shape; And a heat dissipation structure of a light emitting diode lamp provided with a plurality of heat dissipation fin groups installed on the pipe so as to correspond to and be positioned between the ventilation holes.

본 발명의 목적을 효과적으로 구현하기 위한 제2 변형 예는, 상기 통풍구가 형성된 상기 갓의 상방 하측면에는 상기 방열핀 군이 끼워지는 다수의 결합 홈이 배열된 것이 효과적이다.In a second modified example for effectively implementing the object of the present invention, it is effective that a plurality of coupling grooves in which the heat dissipation fin group is fitted are arranged on the upper and lower side surfaces of the shade formed with the ventilation holes.

상기한 바와 같이 이루어진 본 발명에 따른 발광다이오드 램프의 방열구조에 의하면 다음과 같은 효과를 얻을 수 있다.According to the heat dissipation structure of the light emitting diode lamp according to the present invention made as described above can obtain the following effects.

첫째, 일반적인 발광다이오드 램프의 구조를 개선함으로써 발광다이오드 램프의 발광시 발생하는 고열을 방열시킴으로써 램프의 수명을 더욱 연장할 수 있는 효과가 있다.First, it is possible to further extend the life of the lamp by dissipating high heat generated when the light emitting diode lamp emits light by improving the structure of a general light emitting diode lamp.

본 발명의 다른 목적은 발광다이오드의 램프가 발광하며 발생하는 고열을 공기의 대류 작용에 편승시킴으로써 방열 효과를 가일층 향상시킬 수 있는 효과가 있다.Another object of the present invention has the effect of further improving the heat dissipation effect by piggybacking the high heat generated by the lamp of the light emitting diode to the convection action of the air.

이하에서는 첨부된 도면을 참고로 하여 본 발명의 바람직한 실시 예들을 보다 상세히 설명하기로 한다.Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

도 1 내지 도 2에는 본 발명에 따른 발광다이오드 램프의 분해 사시도와 결합상태를 보인 사시도가 도시되어 있으며, 도 3 내지 도 4에는 본 발명에서 적용되는 갓과 열 방출부를 보인 저면도와 평면도가 각각 도시되어 있으며, 도 5에는 도 3과 도 4의 결합상태를 보인 저면도가 도시되어 있다.1 to 2 are shown a perspective view showing an exploded perspective view and a combined state of the light emitting diode lamp according to the present invention, Figures 3 to 4 are a bottom view and a plan view showing the shade and the heat dissipation part applied in the present invention, respectively 5 is a bottom view showing the combined state of FIGS. 3 and 4.

도면에 표현된 바와 같이, 본 발명에 따른 발광다이오드의 램프의 갓(10)은 전원과 접속되는 소켓(20)을 갖추고 있다.As represented in the figure, the shade 10 of the lamp of the LED according to the invention has a socket 20 which is connected to a power source.

상기 소켓(20)은 여러 가지 형태의 것이 적용될 수 있지만 본 발명의 구조에서는 크게 무관한다.The socket 20 may be applied in various forms, but is largely irrelevant in the structure of the present invention.

상기 갓(10)의 내측에는 인쇄회로기판(30)이 배열되며, 상기 인쇄회로기판(30)에는 다수의 LED가 배열된 LED 램프(40)가 구비된다.A printed circuit board 30 is arranged inside the shade 10, and the printed circuit board 30 includes an LED lamp 40 in which a plurality of LEDs are arranged.

여기서 본 발명의 특징부는 상기 갓(10)은 그 외체가 설정된 간격을 두고 절결되며 통풍구(11)가 형성되며, 상기 인쇄회로기판(30)과 상기 갓(10)의 사이에는 열 방출부(50)가 구비된다는 점이다.Here, the feature of the present invention is that the shade 10 is cut out at a set interval of the outer body and the vent opening 11 is formed, the heat dissipation portion 50 between the printed circuit board 30 and the shade 10 ) Is provided.

상기 열 방출부(50)는 상기 인쇄회로기판(30)에 놓여지며 그 외주연이 원 형으로 절곡 형성된 파이프(51)와 상기 통풍구(11)의 사이에 상응하며 위치되도록 상기 파이프(51)에 설치되는 다수의 방열핀 군(52)으로 구비된다.The heat dissipation part 50 is placed on the printed circuit board 30 and the outer periphery of the pipe 51 is formed so as to correspond to and positioned between the pipe 51 and the vent hole 11 formed in a circular shape. It is provided with a plurality of heat radiation fin group 52 is installed.

상기 파이프(51)는 단일체의 것이 각각 태극문양으로 절곡된 형태로 형성될 수 있지만, 두개 이상의 파이프가 서로 연결되며 형성될 수도 있다.The pipe 51 may be formed in the form of a single body bent in a taiji pattern, respectively, two or more pipes may be formed connected to each other.

또한 상기 파이프(51)는 태극문양 또는 "S"자 형상으로 형성될 수 있지만 진원 형상으로 형성될 수도 있다.In addition, the pipe 51 may be formed in a taeguk pattern or "S" shape, but may also be formed in a round shape.

한편, 상기 통풍구(11)가 형성된 상기 갓(10)의 상방 하측면에는 상기 방열핀 군(52)이 끼워지는 다수의 결합 홈(12)이 배열된다.Meanwhile, a plurality of coupling grooves 12 into which the heat dissipation fin group 52 is fitted are arranged on the upper and lower side surfaces of the shade 10 in which the ventilation holes 11 are formed.

상기 결합 홈(12)에는 상기 방열핀 군(52)의 한 쪽 끝단부를 끼운 상태에서 일정한 충격과 압력을 가해 방열핀 군(52)을 일체로 고정시킬 수 있다.The heat dissipation fin group 52 may be integrally fixed to the coupling groove 12 by applying a constant impact and pressure in a state where one end of the heat dissipation fin group 52 is fitted.

상기와 같이 구성된 본 발명의 동작에 대해 설명한다.The operation of the present invention configured as described above will be described.

본 발명이 결합된 상태는 도 2와 같은 상태가 된다.The combined state of the present invention becomes a state as shown in FIG.

상기와 같은 상태에서 사용하다보면 종래와 동일하게 LED 램프(40)가 발광하며 고열이 발생된다.When used in the above state, as in the conventional LED lamp 40 emits light and high heat is generated.

또 이와 같이 발생된 고열은 상기 LED 램프(40)와 상기 인쇄회로기판(30)으로 직접 전도된다.In addition, the generated high heat is directly conducted to the LED lamp 40 and the printed circuit board 30.

이때 본 발명의 특징부는 상기 LED 램프(40)가 발광하며 발생되는 고열은 상기 열 방출부(50), 즉 상기 파이프(51)와 상기 방열핀 군(52)으로 전도된 후 상기 갓(10)에 형성된 상기 통풍구(11)를 통하여 방출된다.At this time, the feature of the present invention is that the high heat generated by the LED lamp 40 is emitted to the heat dissipation unit 50, that is, the pipe 51 and the heat dissipation fin group 52 and then to the shade 10 It is discharged through the vent 11 formed.

따라서 LED 램프(40)의 가장 취약한 단점이라고 할 수 있는 고온, 고열에 대한 수명 단축 및 부품 손상의 우려는 해결된다.Therefore, the shortcomings of the shortcomings of the high temperature, high temperature and component damage, which are the weakest disadvantages of the LED lamp 40, are solved.

이상에서 상세히 설명한 바와 같은 본 발명은 해당 분야에 속하는 기술분야의 당업자들이 본 발명의 그 기술적 사상이나 필수적 특징을 변경하지 않고서 다른 구체적인 형태로 실시될 수 있다는 것을 이해할 수 있을 것이다. As described in detail above, the present invention can be understood by those skilled in the art that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention.

그러므로 이상에서 기술한 실시 예들은 모든 면에서 예시적인 것이며 한정적인 것이 아닌 것으로서 이해되어야 하고, 본 발명의 범위는 상기 상세한 설명보다는 후술하는 특허청구범위에 의하여 나타내어지며, 특허청구범위의 의미 및 범위 그리고 그 등가개념으로부터 도출되는 모든 변경 또는 변형된 형태가 본 발명의 범위에 포함되는 것으로 해석되어야 한다.Therefore, the exemplary embodiments described above are to be understood as illustrative and not restrictive in all respects, and the scope of the present invention is indicated by the following claims rather than the detailed description, and the meaning and scope of the claims and All changes or modifications derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

도 1은 본 발명에서 적용되는 LED 램프의 분해 사시도1 is an exploded perspective view of an LED lamp applied in the present invention

도 2는 본 발명에 따른 LED 램프의 결합상태를 보인 사시도Figure 2 is a perspective view showing a combined state of the LED lamp according to the invention

도 3은 본 발명에서 적용되는 갓의 저면도Figure 3 is a bottom view of the shade applied in the present invention

도 4는 본 발명에서 적용되는 열 방출부의 저면도Figure 4 is a bottom view of the heat dissipation unit applied in the present invention

도 5는 본 발명에 따른 갓과 열 방출부의 결합상태를 보인 저면도Figure 5 is a bottom view showing a coupling state and the heat dissipation unit according to the present invention

*도면의주요부분에대한부호의설명** Explanation of symbols on the main parts of the drawings *

10 : 갓 11 : 통풍구10: lampshade 11: vent

12 : 결합 홈 20 : 소켓12: coupling groove 20: socket

30 : 인쇄회로기판 40 : LED 램프30: printed circuit board 40: LED lamp

50 : 열 방출부 51 : 파이프50: heat dissipation part 51: pipe

51 : 방열핀 군51: heat sink fin group

Claims (3)

전원과 접속되는 소켓을 갖춘 갓;Lampshade with socket connected to a power source; 상기 갓의 내측에 구비되는 인쇄회로기판과 그 인쇄회로기판에 접촉되며 발광하는 다수의 LED가 배열된 LED 램프; 및 An LED lamp in which a plurality of LEDs arranged in contact with the printed circuit board and the printed circuit board provided inside the shade and emitting light are arranged; And 상기 갓은 그 외체가 설정된 간격을 두고 절결되며 통풍구가 형성된 것을 더 포함하며;The lampshade further includes a cutout of the outer body at set intervals and an air vent formed therein; 상기 인쇄회로기판과 상기 갓의 사이에는 열 방출부가 구비된 것을 더 포함하는 발광다이오드 램프의 방열구조.A heat dissipation structure of a light emitting diode lamp further comprising a heat dissipation portion between the printed circuit board and the shade. 제 1 항에 있어서,The method of claim 1, 상기 열 방출부는 상기 인쇄회로기판에 놓여지며 그 외주연이 원 형으로 절곡 형성된 파이프; 및The heat dissipation unit is placed on the printed circuit board and the outer periphery of the pipe bent in a circular shape; And 상기 통풍구의 사이에 상응하며 위치되도록 상기 파이프에 설치되는 다수의 방열핀 군으로 구비된 발광다이오드 램프의 방열구조.A heat dissipation structure of a light emitting diode lamp provided with a plurality of heat dissipation fin groups installed in the pipe so as to correspond to and positioned between the ventilation holes. 제 2 항에 있어서,The method of claim 2, 상기 통풍구가 형성된 상기 갓의 상방 하측면에는 상기 방열핀 군이 끼워지 는 다수의 결합 홈이 배열된 것을 더 포함하는 발광다이오드 램프의 방열구조.And a plurality of coupling grooves in which the heat dissipation fin group is fitted are arranged on the upper and lower side surfaces of the shade formed with the ventilation holes.
KR1020090036438A 2009-04-27 2009-04-27 radiant heat structure of led lamp KR101069253B1 (en)

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102705725A (en) * 2012-05-02 2012-10-03 浙江全加好科技有限公司 High-power LED (light-emitting diode) bulb lamp with metal cooling device
KR101310367B1 (en) * 2012-05-23 2013-09-23 주식회사 포스코엘이디 Optical semiconductor based illuminating apparatus
WO2013176355A1 (en) * 2012-05-23 2013-11-28 주식회사 포스코엘이디 Optical semiconductor illumination device
US8757841B2 (en) 2010-11-08 2014-06-24 Lg Innotek Co., Ltd. Lighting device

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KR101322492B1 (en) 2013-06-03 2013-10-28 김용민 Led lighting device

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JP4840185B2 (en) * 2007-02-17 2011-12-21 日亜化学工業株式会社 Lighting device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8757841B2 (en) 2010-11-08 2014-06-24 Lg Innotek Co., Ltd. Lighting device
US9039242B2 (en) 2010-11-08 2015-05-26 Lg Innotek Co., Ltd. Lighting device
CN102705725A (en) * 2012-05-02 2012-10-03 浙江全加好科技有限公司 High-power LED (light-emitting diode) bulb lamp with metal cooling device
KR101310367B1 (en) * 2012-05-23 2013-09-23 주식회사 포스코엘이디 Optical semiconductor based illuminating apparatus
WO2013176355A1 (en) * 2012-05-23 2013-11-28 주식회사 포스코엘이디 Optical semiconductor illumination device

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