KR20090012385A - Cooling apparatus of led lamp - Google Patents

Cooling apparatus of led lamp Download PDF

Info

Publication number
KR20090012385A
KR20090012385A KR1020070076142A KR20070076142A KR20090012385A KR 20090012385 A KR20090012385 A KR 20090012385A KR 1020070076142 A KR1020070076142 A KR 1020070076142A KR 20070076142 A KR20070076142 A KR 20070076142A KR 20090012385 A KR20090012385 A KR 20090012385A
Authority
KR
South Korea
Prior art keywords
cooling
heat sink
center
base block
heat
Prior art date
Application number
KR1020070076142A
Other languages
Korean (ko)
Inventor
김병호
장혁
Original Assignee
티티엠주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 티티엠주식회사 filed Critical 티티엠주식회사
Priority to KR1020070076142A priority Critical patent/KR20090012385A/en
Publication of KR20090012385A publication Critical patent/KR20090012385A/en

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
    • F21V29/717—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements using split or remote units thermally interconnected, e.g. by thermally conductive bars or heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

The present invention relates to a cooling device for LED lamps in which a flat multi-channel heat pipe is disposed to cool a metal PCB to which a high heat-emitting LED is attached.

Description

Cooling device for LED lamps {COOLING APPARATUS OF LED LAMP}

The present invention relates to a cooling device for LED lamps in which a flat multi-channel heat pipe is disposed to cool a metal PCB to which a high heat-emitting LED is attached.

In the lighting module to which the high heat generation LED 1 is applied, a heat sink 5 is coupled to the upper portion of the metal PCB 10 (see FIG. 1), or a cooling method using a water cooling unit or a thermoelectric module is used.

As shown in FIG. 9, in the case of combining the base block 5a and a general heat sink 5 composed of a plurality of cooling fins 5b, the air cooling method is limited to a coefficient of thermal conductivity in which heat cannot be cooled below a room temperature level. Because of this, the LED is not cooled enough.

In particular, in the case of a lamp using a large number of high-brightness LED, the LED junction temperature (when the environmental temperature of 20 ℃) exceeds 80 ℃, the failure rate is increased, the light intensity is characterized by a decrease. That is, due to the characteristics of the high-brightness LED emitter, the illuminance decreases when the temperature rises, but the illuminance of about 10% drops.

10 is a test result of a cooling apparatus to which a conventional heat sink is applied. As shown in FIG. 10, it can be seen that when cooling with only the conventional heat sink 5, the temperature on the metal PCB 10 is almost 68 ° C., which is 28 ° C. higher than the 40 ° C. of the present invention.

On the other hand, in the case of a water cooling unit or a thermoelectric module, an additional component configuration is required and there is a disadvantage in that the heat dissipation part is controlled by using a separate power source.

The present invention has been made in view of the above-described problem, and an object thereof is to provide a cooling device for an LED lamp that can easily control and significantly improve the heat dissipation efficiency of the LED.

In order to achieve the above object, the LED lamp cooling apparatus according to claim 1 includes a metal PCB attached to the LED chip on the lower surface, and a cooling module disposed on the upper surface of the metal PCB,

The cooling module is characterized in that the flat multi-channel heat pipe.

According to this configuration, heat pipes having a large heat transfer performance by transferring heat through the gas-liquid phase change process and flat heat pipes having a large contact area can easily control and significantly improve heat dissipation efficiency of LEDs. .

Cooling device for an LED lamp according to claim 2

The flat multi-channel heat pipe is a U-shaped flat multi-channel heat pipe, the center of the heat pipe is an evaporation area disposed on the back of the metal PCB, both sides of the heat pipe is characterized in that the condensation area. .

According to this configuration, the U-shaped heat pipe has the advantage of increasing the limit of heat transport by increasing the flow cross-sectional area in the case of the working fluid with low latent heat of evaporation, and can reduce the installation space.

The cooling apparatus for LED lamps of Claim 3

The condensation zone is provided with a side heat sink comprising a side inner heat sink and a side outer heat sink. It consists of a plurality of side inner cooling fins formed on the outer circumferential surface of the side inner base block not in contact with the inner surface, the side outer heat sink is a side outer base block in contact with the outer surface of the condensation area, and the side outer base block It is composed of a plurality of side outer cooling fins formed on the outer peripheral surface of the; A center heat sink composed of a center base block and a plurality of center cooling fins is installed in the evaporation region, wherein the center base block is engaged with the metal PCB to contact the evaporation region, and the center cooling fin is the side inner base. Characterized in that arranged in the inner space of the block.

According to this configuration, the heat sink is assembled to the flat heat pipe so as to maximize the heat dissipation efficiency while minimizing the space on the flat heat pipe.

Cooling device for an LED lamp according to claim 4

It is characterized in that the housing having a low thermal conductivity and the air flow is installed on the exterior of the cooling module.

According to this structure, the surface temperature of the lighting etc. which a user feels can be lowered by the housing | casing of material with low thermal conductivity, not only to prevent a hand burn etc. when handling lamp replacement, but also to improve heat dissipation efficiency by the air flowable housing. Can contribute.

According to the cooling device for LED lamps according to the present invention, a large heat transfer performance is exhibited through a flat plate type multichannel heat pipe, which not only significantly improves the heat dissipation efficiency of the lighting but also the control is simple.

In addition, the shape of the center heat sink and side heat sink can be maximized by maximizing heat dissipation efficiency while occupying a minimum space, and assembling the heat pipe.

In addition, by surrounding the cooling module with a high surface temperature in the housing to lower the surface temperature relatively to prevent the user's hand burns when handling the lamp, such as to improve the heat dissipation efficiency to smooth air flow.

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, where like reference numerals refer to like parts, and detailed description thereof will be omitted.

1 is a perspective view showing a separate separation of the cooling device for the LED lamp according to a preferred embodiment of the present invention, Figures 2 and 3 is a perspective view of the combination seen from the top and bottom of Figure 1, Figure 4 is a preferred embodiment of the present invention 5 and 6 are combined perspective views of the upper and lower parts of FIG. 4, FIG. 7 is a perspective view showing a state in which the housing is removed from FIG. 6, and FIG. 8 is an LED lamp of the present invention. This is a graph of the thermal test results of the cooling system.

As shown in Fig. 1 to Fig. 3, the LED lamp cooling apparatus is largely composed of a metal PCB 10 and a cooling module for cooling the metal PCB 10.

The LED chip 1 is attached to the lower surface of the metal PCB 10.

The cooling module is implemented with a U-shaped flat multichannel heat pipe 30.

The U-shaped flat multichannel heat pipe 30 has a structure having two condensation zones in one evaporation zone.

That is, in the flat plate type multichannel heat pipe 30, the evaporation region is set in the center 31 and the condensation region in both sides 33.

The center 31 contacts the upper surface of the metal PCB 10 to absorb heat, and the vapor evaporated by the absorbed heat condenses on both sides 33 and releases heat, and then the condensate (working fluid) A cycle is returned to the center 31.

For the manufacture and function of the flat multi-channel heat pipe 30 refer to the publication of Korean Patent Laid-Open No. 2002-2873, and a detailed description thereof will be omitted.

As such, the contact area is large, and the heat is transferred by using latent heat according to the phase change, thereby maintaining a large heat transfer performance and a uniform temperature distribution, thereby improving not only cooling efficiency but also durability of the metal PCB 10. . In addition, the U-shaped heat pipe has the advantage of increasing the heat transfer limit and reducing the installation space in the case of the working fluid with low latent heat of evaporation by increasing the flow cross-sectional area.

In addition, it is preferable that the side heat sink 50, 90 is further installed in the cooling module.

The side heat sinks 50 and 90 are constituted by a side inner heat sink 90 and a side outer heat sink 70.

The side inner heat sink 90 has a side inner base block 91 of the closed end surface partially in contact with the inner surface of the condensation region 33 and a side inner base block 91 which is not in contact with the inner surface of the condensation region 33. Is composed of a plurality of side inner cooling fins 93 formed on the outer circumferential surface thereof.

That is, the side inner heat sink 90 according to the present embodiment has a shape in which the center 95 is an empty track, and the side inner cooling fins 93 are formed on the curved course of the track.

In addition, the side outer heat sink 50 includes a side outer base block 51 in contact with the outer surface of the condensation region 33 and a plurality of side outer cooling fins 53 formed on the outer circumferential surface of the side outer base block 51. Consists of.

With this configuration, the side inner heat sink 90 and the side outer heat sink 70 are fastened by the fastening bolts 60 to be held in contact with the inner and outer surfaces of the condensation region 33.

As such, due to the installation of the side heat sink 90, the cooling efficiency can be doubled due to the forced heat dissipation of the condensation region 33.

In addition, it is preferable that the center heat sink 70 is disposed in the evaporation region 31.

The center heat sink 70 is composed of a center base block 71 and a plurality of center cooling fins 73.

The center base block 71 is fastened by the metal PCB 10 and the bolt 12 to be in contact with the evaporation region 31 while supporting the multi-channel heat pipe 30, and the center cooling fin 73 is connected to the side inner base. It is arranged in the internal space 95 of the block 91.

By this structure, since the side heat sinks 50 and 90 and the center heat sink 70 are assembled while occupying the minimum space, they contribute to the compact.

As shown in FIG. 7, the LED lamp cooling apparatus includes a power supply unit constituting a converter (not shown) and a socket 80.

The outer periphery of the converter is provided with a cover 110 having a low thermal conductivity and vent holes 112 capable of air flow.

On the other hand, in order to protect the burn of the hand and the like when replacing the LED lamp, it is preferable that the housing 100 is installed around the cooling device.

Like the cover 110, the housing 100 has a low thermal conductivity and is installed in a smooth air flow.

That is, the housing 100 and / or the cover 110 is preferably made of a material of an insulating material such as polyethylene (PE), reinforced ceramic, ABS Plastic.

In particular, since the housing 100 is located close to the direct light unlike the cover 110, a structure suitable for cooling efficiency is preferable.

A plurality of vent holes 101 are formed on the upper surface of the housing 100, and the flow passage is secured by maintaining a predetermined distance from the upper end of the side outer heat sink 50.

A plurality of long hole-shaped vent holes 107 are formed on the side surface of the housing 100, and are spaced 1 to 3 mm apart from ends and sides of the cooling fins 53 and 93 of the side heat sink 50 and 90. It can give a user contact temperature fall effect.

In addition, a plurality of vent holes 103 and 105 are formed on the lower surface of the housing 100 and the side surfaces of the lower surface of the housing 100 to facilitate the inflow of air.

Such a housing 100 is preferably divided into two and assembled.

In addition, it is preferable to perform tab processing on the lower part of the housing 100 so that attachment and detachment of the groove (bulb) 3 may be performed.

8 is a graph of thermal testing of the cooling device for LED lamp of the present invention.

According to this graph, ② the housing vent air, ③ PCB near LED, ④ base block of center heat sink, ⑤ base block of side inner heat sink, ⑥ cooling fin of side outer heat sink, and ⑦ cooling fin of center heat sink. Experimental data by attaching a thermocouple at the location.

Comparing the data of the thermal test of the present invention and the conventional thermal test of FIG. 10 as follows.

△ Ｔ [℃] Sink-fin-base PCB Existing Cooling Module 66.6 68.0 This cooling module 40.7 40.5

According to the test results, it can be seen that the cooling module to which the present invention is applied exhibits a cooling effect of about 28 ° C. compared with the existing products.

As described above, although described with reference to a preferred embodiment of the present invention, the present invention can be variously changed or modified within the scope without departing from the spirit and scope of the present invention described in the claims Those skilled in the art will appreciate.

Although the U-shaped flat multichannel heat pipe is described as the cooling module above, the LED lamp can be cooled by the L-shaped or K-shaped flat multichannel heat pipe depending on the cooling efficiency and layout.

1 is an exploded perspective view showing a cooling device for an LED lamp according to a preferred embodiment of the present invention.

2 and 3 are a perspective view of the combination seen from the top and bottom of FIG.

4 is a front view of an LED lamp according to a preferred embodiment of the present invention.

5 and 6 are perspective views of the combination seen from the top and bottom of FIG.

7 is a perspective view showing a state in which the housing is removed in FIG.

8 is a thermal test result graph of the cooling device for LED lamp of the present invention.

9 is an exploded front view of a cooling device for an LED lamp to which a conventional heat sink is applied.

10 is a graph of thermal test results according to FIG. 9.

<Description of the symbols for the main parts of the drawings>

1: LED chip 3: groove (bulb)

5: heat sink 10: metal PCB

30: U-shaped flat multichannel heat pipe

31: evaporation zone (center) 33: condensation zone (side)

50: side outer heat sink 70: center heat sink

80: socket 90: side inner heat sink

100 housing 110 cover

Claims (4)

It includes a metal PCB to which the LED chip is attached to the lower surface, and a cooling module disposed on the upper surface of the metal PCB The cooling module is a cooling device for an LED lamp, characterized in that the flat multi-channel heat pipe. The method of claim 1, The flat multichannel heat pipe is a U-shaped flat multichannel heat pipe, The center of the heat pipe is an evaporation region disposed on the rear surface of the metal PCB, Cooling device for an LED lamp, characterized in that both sides of the heat pipe is a condensation area. The method of claim 2, In the condensation area, a side heat sink comprising a side inner heat sink and a side outer heat sink is installed. The side inner heat sink may include a side inner base block of a closed end surface partially contacting the inner surface of the condensation region, and a plurality of side inner cooling fins formed on an outer circumferential surface of the side inner base block that does not contact the inner surface of the condensation region. Composed, The side outer heat sink is composed of a side outer base block in contact with the outer surface of the condensation region, and a plurality of side outer cooling fins formed on the outer circumferential surface of the side outer base block, In the evaporation zone, a center heat sink composed of a center base block and a plurality of center cooling fins is installed. The center base block is in contact with the metal PCB in contact with the evaporation region, The center cooling fin is a cooling device for an LED lamp, characterized in that disposed in the inner space of the side inner base block. The method according to any one of claims 1 to 3, Cooling device for an LED lamp, characterized in that the housing is installed on the exterior of the cooling module is low heat conductivity and air flow.
KR1020070076142A 2007-07-30 2007-07-30 Cooling apparatus of led lamp KR20090012385A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070076142A KR20090012385A (en) 2007-07-30 2007-07-30 Cooling apparatus of led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070076142A KR20090012385A (en) 2007-07-30 2007-07-30 Cooling apparatus of led lamp

Publications (1)

Publication Number Publication Date
KR20090012385A true KR20090012385A (en) 2009-02-04

Family

ID=40683153

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070076142A KR20090012385A (en) 2007-07-30 2007-07-30 Cooling apparatus of led lamp

Country Status (1)

Country Link
KR (1) KR20090012385A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100948315B1 (en) * 2009-04-06 2010-04-01 (주)솔라이트 Radiant heat plate of downright led lamp
WO2011030949A1 (en) * 2009-09-08 2011-03-17 Jeong Byung Chun Light-emitting diode lamp
KR101130706B1 (en) * 2009-04-15 2012-03-23 김혜경 radiant heat apparatus of LED lighting
KR101248011B1 (en) * 2012-02-17 2013-03-27 장영환 Led guard lamp
KR101322492B1 (en) * 2013-06-03 2013-10-28 김용민 Led lighting device
KR200471596Y1 (en) * 2012-08-29 2014-03-10 배기선 Heat dissipating device for led lighting apparatus
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100948315B1 (en) * 2009-04-06 2010-04-01 (주)솔라이트 Radiant heat plate of downright led lamp
KR101130706B1 (en) * 2009-04-15 2012-03-23 김혜경 radiant heat apparatus of LED lighting
WO2011030949A1 (en) * 2009-09-08 2011-03-17 Jeong Byung Chun Light-emitting diode lamp
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
US9562680B2 (en) 2009-11-09 2017-02-07 LG Innotek., Ltd. Lighting device
KR101248011B1 (en) * 2012-02-17 2013-03-27 장영환 Led guard lamp
KR200471596Y1 (en) * 2012-08-29 2014-03-10 배기선 Heat dissipating device for led lighting apparatus
KR101322492B1 (en) * 2013-06-03 2013-10-28 김용민 Led lighting device

Similar Documents

Publication Publication Date Title
JP6098849B2 (en) Light bulb type LED lighting fixture
US8313220B2 (en) LED lighting fixture
US8267550B2 (en) LED lamp for easy assembly and fixation
US20090059594A1 (en) Heat dissipating apparatus for automotive LED lamp
US20100328951A1 (en) Luminaire system with thermal chimney effect
JP2015517185A5 (en)
KR20090012385A (en) Cooling apparatus of led lamp
US20090168429A1 (en) Light source module with a thermoelectric cooler
US20090236626A1 (en) Led lamp
TW201100272A (en) Water-cooling module for LED headlamp
RU2546492C1 (en) Semiconductor device with cooling
US20130294070A1 (en) High bay light
KR20100098890A (en) Liquid-cooling type led lamp for lighting
KR200451042Y1 (en) Led lighting device having heat convection and heat conduction effects and heat dissipating assembly therefor
US20120186798A1 (en) Cooling module for led lamp
KR20110022921A (en) Led lighting lamp with a cooler
KR20080003317U (en) Refrigrator of Large output LED Lamp Street Lighting
EP2244002B1 (en) LED lighting device capable of uniformly dissipating heat
JP5390781B2 (en) Light source cooling device
CN202660385U (en) LED (Light-Emitting Diode) spotlight
RU167546U1 (en) LED LAMP
CN220249926U (en) LED lamp module with multiple heat dissipation functions
TWM449903U (en) LED lamp
CN217235324U (en) LED bulb with heat dissipation shell
CN214580888U (en) LED lamp heat radiation structure, car light and vehicle

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E601 Decision to refuse application