WO2022260194A1 - Led light module comprising heat sink using carbonaceous material - Google Patents

Led light module comprising heat sink using carbonaceous material Download PDF

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Publication number
WO2022260194A1
WO2022260194A1 PCT/KR2021/007242 KR2021007242W WO2022260194A1 WO 2022260194 A1 WO2022260194 A1 WO 2022260194A1 KR 2021007242 W KR2021007242 W KR 2021007242W WO 2022260194 A1 WO2022260194 A1 WO 2022260194A1
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WO
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Prior art keywords
heat dissipation
heat sink
carbon
led light
light module
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PCT/KR2021/007242
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French (fr)
Korean (ko)
Inventor
조대형
Original Assignee
주식회사 씨엔와이더스
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Priority to PCT/KR2021/007242 priority Critical patent/WO2022260194A1/en
Publication of WO2022260194A1 publication Critical patent/WO2022260194A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the present invention relates to an LED lighting module including a heat sink using a carbon material, and more particularly, to an LED lighting module including a heat sink using a carbon material having a hollow column shape whose cross section increases as the distance from the attachment surface increases. it's about
  • LED lighting devices are lighting fixtures using light emitting diodes (LEDs). Compared to conventional lighting methods, LED lighting devices consume less power and have a longer lifespan, which can reduce operating costs. It has the advantage of being able to produce lighting.
  • the LED lighting device is relatively weak against heat due to the structure of the LED, and deterioration due to heat is a major factor in shortening the lifespan of the LED lighting device. While light is emitted in a small area of the LED element, local heat is generated in the corresponding part, and heat dissipation is not smooth due to its structure. In particular, when the LED elements are densely installed, the LED driving circuit malfunctions due to the heat generated from the LED elements or the life span of the LED is shortened.
  • heat dissipation structures such as heat sinks are added to LED lighting modules
  • most of the heat dissipation structures including heat sinks are made of metal materials such as aluminum, so they are relatively heavy and basically Since it is corrosive, it requires additional post-processing to prevent corrosion after manufacturing, which increases the cost.
  • heat dissipation performance is deteriorated.
  • An object of the present invention is to provide a heat sink structure for improving heat dissipation performance of an LED module.
  • the present invention is to reduce the weight of the LED lighting module by using a carbon material for the heat sink of the LED module.
  • the present invention is to increase the corrosion resistance of the LED lighting module by using a carbon material for the heat sink of the LED module.
  • An LED lighting module including a heat sink using a carbon material for achieving the above technical problem includes an LED module for driving a plurality of LEDs; and a heat sink coupled to the LED module, wherein the heat sink includes a base portion on which the LED module can be mounted; and a plurality of heat dissipation horns protruding from the upper surface of the base portion, wherein the heat dissipation horns are formed of a carbon material or a carbon composite material, and the area of an inner cross section increases as the distance from the base portion, which is an attachment surface, increases. It may be a hollow pillar shape.
  • the heat dissipation horn may have a hollow column shape in which an area of an external cross section increases as the distance from the base portion, which is an attachment surface, increases.
  • the inner cross section of the heat dissipation horn may be circular or prismatic.
  • the external cross section of the heat dissipation horn may be circular or prismatic.
  • the carbon composite material may be obtained by adding the carbon material to a polymer compound.
  • the carbon material is selected from carbon nanotubes, carbon graphite, carbon fibers and carbon graphene
  • the polymer compound is an epoxy resin, a phenol resin, a polyimide resin, a polyamide resin, and a polypropylene. can be selected from.
  • the heat sink may be obtained by extruding the carbon material and/or the carbon composite material.
  • the heat sink may be formed by injection molding the carbon material and/or the carbon composite material on the base plate 112 formed of metal.
  • the heat sink has a heat dissipation structure including heat dissipation horns and a base made of the carbon material and/or the carbon composite material, and a heat dissipation adhesive and/or screws are applied to a base plate formed of metal. It may be formed by fixing using.
  • the heat sink may be formed by coating the carbon material and/or the carbon composite material on a heat dissipation structure including metal heat dissipation horns and a base portion.
  • the LED lighting module including a heat sink using a carbon material according to the present invention, there is an effect of improving heat dissipation performance of the LED lighting module.
  • the corrosion resistance of the LED lighting module is improved, there is an effect of reducing the manufacturing and / or maintenance cost of the LED lighting module.
  • FIG. 1 illustrates an upper surface (heat sink) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
  • FIG. 2 shows a lower surface (LED module) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
  • FIG 3 illustrates a structure of a heat dissipation horn that may be included in a heat sink according to an embodiment of the present invention.
  • FIG. 4 is a plan view of a heat sink structure according to an embodiment of the present invention.
  • FIG. 5 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
  • FIG. 6 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
  • one component when it is described that one component is “connected” to another component, it should be understood that it includes the case where it is directly connected as well as the case where it is connected through another component in the middle, and “direct connection” or “direct connection” It should be understood that one component is connected to another component only when it is described as “connected” without other components in the middle. Likewise, other expressions describing relationships between components should be understood in the same sense.
  • the present invention relates to an LED lighting module including a heat sink using a carbon material, and more particularly, to an LED lighting module including a heat sink using a carbon material having a hollow column shape whose cross section increases as the distance from the attachment surface increases. it's about
  • FIG. 1 illustrates an upper surface (heat sink) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
  • An LED lighting module 1 may include a heat sink 100 and an LED module 200 .
  • the LED module 200 which is the light emitting part, is assembled to the LED lighting device to face downward, the heat sink 100 portion is located on the upper surface, and the LED module 200 is located on the lower surface.
  • the heat sink 100 forms the outer shape of the LED lighting module 1, and the base portion 110 to which the LED module 200 can be mounted and the heat generated from the LED module 200 A heat dissipation unit 150 that efficiently dissipates heat may be included.
  • the base portion 110 of the heat sink 100 may include an installation bracket 115 to be coupled to an LED lighting device in a rectangular shape, and the installation bracket 115 includes an LED. It may include a coupling hole 117 that can be coupled to the lighting device.
  • the LED lighting module 1 according to the present invention may be coupled to the LED lighting device using the coupling hole 117 .
  • the base portion 110 of the heat sink 100 may include a cable lead-out hole 119 through which a cable supplying power to the LED module 200 may be connected.
  • the heat dissipating part 150 of the heat sink 100 may include a plurality of heat-dissipating horns 160 protruding from the upper surface of the base part 110 .
  • the heat dissipation horn 160 may have a hollow columnar shape in which a cross section increases as the distance from the base portion 110, which is an attachment surface, increases.
  • the heat dissipation horn 160 may be manufactured in the shape of a truncated inverted cone or fallopian tube with a circular cross section and a radius of the circle increasing as the distance from the base portion 110, which is an attachment surface, increases.
  • the heat sink 100 may be made of a carbon material or a carbon composite material obtained by adding a carbon material to a polymer compound.
  • the carbon material may include, but is not limited to, carbon nano-tube, carbon graphite, carbon fiber, and carbon graphene.
  • the polymer compound may include an epoxy resin, a phenol resin, a poly-imide resin, a poly-propylene resin, a poly-amide resin, and the like. , but not limited thereto.
  • carbon materials are relatively light in weight, have high thermal conductivity and strength, and have low corrosivity, so they are suitable for use in heat dissipation structures.
  • the heat sink 100 may be formed by extruding (or injecting) or die casting a carbon composite material. According to another embodiment of the present invention, the heat sink 100 may be formed by injection molding a carbon material or a carbon composite material on the base plate 112 formed of metal. According to another embodiment of the present invention, the heat sink 100 may be formed by coating a carbon material or a carbon composite material on a basic structure formed of metal.
  • the heat sink 100 is coated with a carbon material or a carbon composite material on a base plate 112 formed of metal, and a heat dissipation horn 160 manufactured by a separate extrusion or die casting method.
  • a heat dissipation structure including, it may be assembled by a method of fixing the base plate 112 and the heat dissipation structure using a heat dissipation adhesive and/or screws.
  • FIG. 2 shows a lower surface (LED module) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
  • the LED module 200 includes a PCB substrate 220 on which a plurality of LEDs 210 are mounted, a waterproof gasket 230 installed on an edge of the PCB substrate, and a An LED cover 240 covering the front surface may be included.
  • the LED module 200 may be coupled to the heat sink 100 using an adhesive and/or a coupling screw 250 .
  • FIG 3 illustrates a structure of a heat dissipation horn that may be included in a heat sink according to an embodiment of the present invention.
  • the heat dissipation horn 160 protruding from the upper surface of the base portion 110 of the heat sink 100 is a hollow column whose cross section increases as it moves away from the base portion 110, which is an attachment surface. can have a shape.
  • the heat dissipation horn 160 has a circular cross section and a truncated shape in which the radius of the circle increases as it moves away from the base portion 110, which is an attachment surface. It can be made in the shape of a cone or a fallopian tube.
  • the heat dissipation horn 160 has a rectangular cross section and a truncated shape in which the length of one side increases as it moves away from the base part 110, which is an attachment surface. It can be made in the shape of an inverted pyramid.
  • 3(b) shows an embodiment in which the cross section of an inverted pyramid is a rectangle, but according to another embodiment of the present invention, the cross section includes a case in which the cross section is a triangle, pentagon, hexagon, etc., but is not necessarily limited thereto not.
  • the cross section of the heat dissipating horn 160 may be manufactured in a rectangular shape on the outside and a circular shape on the inside, and the base portion 110 as an attachment surface. ), the length of one side of the outer section increases and the radius of the inner hole increases.
  • 3(c) shows the outside as a rectangle and the inside as a circle, but according to another embodiment of the present invention, the outside is circular and the inside is angular, but is not limited thereto, and the creation of a skilled artisan Various combinations are possible in the range of abilities.
  • the outside of the heat radiation horn 160 has a constant cross section, and the inside of the heat radiation horn 160 is the base portion 110, which is an attachment surface. It can be manufactured in the shape of a hollow column whose cross section increases as it moves away from it. 3(d) shows the outer and inner cross-sections in a circular shape, but according to another embodiment of the present invention, both the outer and inner sides are angular, or only one of them is angular, but is not necessarily limited thereto.
  • the heat dissipation horn 160 which is a hollow pillar shape whose cross section increases as it moves away from the base part 110, which is an attachment surface, can dissipate heat through the inner surface as well as the outer surface of the pillar. Therefore, the cross-sectional area that can dissipate heat is wide, and the heat dissipation efficiency is improved.
  • the air whose temperature is elevated by the heat dissipated from the heat dissipation horn 160 becomes lighter and rises upward. Because of the enlarged shape, the air in contact with the inner surface of the heat dissipation horn 160 rises smoothly, and as a result, the efficiency of heat dissipation increases.
  • FIG. 4 is a top plan view of a heat sink structure according to an embodiment of the present invention.
  • the heat dissipation horns 160 may be disposed crossing each other on the upper surface of the base portion 110, but may be disposed in other ways, and the present invention relates to the heat dissipation horns 160 It is not limited to a specific arrangement method.
  • FIG. 5 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
  • the heat generated from the plurality of LEDs 210 of the LED module 200 located below is conducted to the heat sink 100 directly and/or through the PCB substrate 220, and the base portion After passing through 110, heat is effectively dissipated into the air through the heat dissipation horn 160.
  • FIG. 6 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
  • the heat sink 100 may be formed by extruding or die casting a carbon material and/or a carbon composite material.
  • the heat sink 100 injects a carbon material and/or a carbon composite material thereon based on a base plate 112 formed of metal. It can be formed by molding. According to this embodiment, the base plate 112 formed of metal facilitates coupling with the LED module 200, holds the distortion due to contraction of the carbon material and / or carbon composite material formed part, and the LED module It is possible to improve heat dissipation performance by completely adhering to (200).
  • a carbon composite material or a carbon material is coated on the base plate 112 formed of metal, and a heat dissipation horn is performed by a separate extrusion or die casting method.
  • a heat dissipation structure including the 160 and the base portion 110 may be manufactured, and the base plate 112 and the heat dissipation structure may be assembled by a method of fixing the heat dissipation structure using a heat dissipation adhesive and/or screws.
  • the heat sink 100 may be formed by coating a carbon material and/or a carbon composite material on a basic structure formed of metal.

Abstract

The present invention relates to an LED light module comprising: an LED module driving a plurality of LEDs; and a heat sink coupled to the LED module. The heat sink comprises: a base part on which the LED module may be mounted; and a plurality of heat dissipating horns protruding on the top surface of the base part. The heat dissipating horns: comprise a carbonaceous material or a carbon composite material; and are in a hollow cylindrical shape of which the area of the internal cross section gradually increases in the direction away from the base part which is an attached surface. According to the LED light module comprising the heat sink using a carbonaceous material of the present invention, the LED light module has enhanced heat dissipation performance and corrosion resistance, and the weight of the LED light module may be reduced.

Description

탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈LED lighting module including heat sink using carbon material
본 발명은 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈에 관한 것으로서, 더욱 상세하게는 부착면에서 멀어질수록 단면이 커지는 속이 빈 기둥 형상의 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈에 관한 것이다. The present invention relates to an LED lighting module including a heat sink using a carbon material, and more particularly, to an LED lighting module including a heat sink using a carbon material having a hollow column shape whose cross section increases as the distance from the attachment surface increases. it's about
LED 조명 장치는 발광 다이오드(LED)를 이용한 조명기구로서, 기존 조명 방식과 비교하여, 소비전력이 낮고 수명이 길어 운영 비용을 절감할 수 있으며, 수은, 온실가스 등의 배출이 없는 친환경 소재로서 다양한 조명 연출이 가능한 장점이 있다.LED lighting devices are lighting fixtures using light emitting diodes (LEDs). Compared to conventional lighting methods, LED lighting devices consume less power and have a longer lifespan, which can reduce operating costs. It has the advantage of being able to produce lighting.
그러나, LED 조명 장치는 LED 구조상 열에 상대적으로 약하고, 열에 의한 열화는 LED 조명 장치의 수명을 단축시키는 주요한 요인이다. LED 소자는 작은 면적에서 빛이 발생하면서 해당 부분에 국부적인 열이 발생하여, 그 구조상 열 발산이 원활하지 않다. 특히, LED 소자들을 밀집하여 설치하는 경우에는, LED 소자들로부터 발생하는 열에 의하여 LED 구동 회로가 오작동하거나, LED 수명이 단축되는 문제점이 발생한다.However, the LED lighting device is relatively weak against heat due to the structure of the LED, and deterioration due to heat is a major factor in shortening the lifespan of the LED lighting device. While light is emitted in a small area of the LED element, local heat is generated in the corresponding part, and heat dissipation is not smooth due to its structure. In particular, when the LED elements are densely installed, the LED driving circuit malfunctions due to the heat generated from the LED elements or the life span of the LED is shortened.
이를 해결하기 위하여, LED 조명 모듈에 히트 싱크 등의 방열 구조를 추가한 제품들이 사용되고 있으나, 히트 싱크를 비롯한 대부분의 방열 구조가 알루미늄 등 금속 소재를 이용하여 제작되고 있어서, 상대적으로 무게가 무겁고 기본적으로 부식성이 있어서 제조 후에 부식방지를 위한 추가적인 후처리 작업이 요구되므로 비용이 증가한다. 또한, 단순한 방열 구조로 인하여 방열 성능이 저하되는 문제점이 있었다.In order to solve this problem, products in which heat dissipation structures such as heat sinks are added to LED lighting modules are used, but most of the heat dissipation structures including heat sinks are made of metal materials such as aluminum, so they are relatively heavy and basically Since it is corrosive, it requires additional post-processing to prevent corrosion after manufacturing, which increases the cost. In addition, due to a simple heat dissipation structure, there is a problem in that heat dissipation performance is deteriorated.
결국, LED 조명 모듈의 방열 성능을 높이면서, 전체적인 무게를 줄일 수 있으며, 내부식성이 우수한 방열 구조에 대한 요구가 있었으나, 종래의 기술에 따르면 이를 제공할 수 없는 문제점이 있었고, 본 발명은 이를 해결하기 위한 것이다.As a result, while increasing the heat dissipation performance of the LED lighting module, reducing the overall weight, and there was a demand for a heat dissipation structure with excellent corrosion resistance, there was a problem that it could not be provided according to the prior art, and the present invention solves this problem It is to do.
본 발명은 LED 모듈의 방열 성능을 높이기 위한 히트 싱크 구조를 제공하기 위한 것이다.An object of the present invention is to provide a heat sink structure for improving heat dissipation performance of an LED module.
또한, 본 발명은 LED 모듈의 히트 싱크에 탄소 소재를 사용하여, LED 조명 모듈의 무게를 줄이기 위한 것이다.In addition, the present invention is to reduce the weight of the LED lighting module by using a carbon material for the heat sink of the LED module.
또한, 본 발명은 LED 모듈의 히트 싱크에 탄소 소재를 사용하여, LED 조명 모듈의 내부식성을 증가시키기 위한 것이다.In addition, the present invention is to increase the corrosion resistance of the LED lighting module by using a carbon material for the heat sink of the LED module.
상기 기술적 과제를 달성하기 위한 본 발명의 일 실시예에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈은, 복수의 LED를 구동하는 LED 모듈; 및 상기 LED 모듈과 결합되는 히트 싱크를 포함하고, 상기 히트 싱크는 상기 LED 모듈이 장착될 수 있는 베이스부; 및 상기 베이스부의 상면에 돌출 형성되는 복수의 방열혼을 포함하며, 상기 방열혼은 탄소 소재 또는 탄소 복합소재를 포함하여 형성되고, 부착면인 상기 베이스부에서 멀어질수록 내부 단면의 면적이 커지는 속이 빈 기둥 형상일 수 있다.An LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention for achieving the above technical problem includes an LED module for driving a plurality of LEDs; and a heat sink coupled to the LED module, wherein the heat sink includes a base portion on which the LED module can be mounted; and a plurality of heat dissipation horns protruding from the upper surface of the base portion, wherein the heat dissipation horns are formed of a carbon material or a carbon composite material, and the area of an inner cross section increases as the distance from the base portion, which is an attachment surface, increases. It may be a hollow pillar shape.
본 발명의 일 실시예에 따르면, 상기 방열혼은 부착면인 상기 베이스부에서 멀어질수록 외부 단면의 면적이 커지는 속이 빈 기둥 형상일 수 있다.According to one embodiment of the present invention, the heat dissipation horn may have a hollow column shape in which an area of an external cross section increases as the distance from the base portion, which is an attachment surface, increases.
본 발명의 일 실시예에 따르면, 상기 방열혼의 내부 단면은 원형 또는 각형일 수 있다.According to one embodiment of the present invention, the inner cross section of the heat dissipation horn may be circular or prismatic.
본 발명의 일 실시예에 따르면, 상기 방열혼의 외부 단면은 원형 또는 각형일 수 있다.According to one embodiment of the present invention, the external cross section of the heat dissipation horn may be circular or prismatic.
본 발명의 일 실시예에 따르면, 상기 탄소 복합소재는 고분자 화합물에 상기 탄소 소재를 첨가한 것일 수 있다.According to one embodiment of the present invention, the carbon composite material may be obtained by adding the carbon material to a polymer compound.
본 발명의 일 실시예에 따르면, 상기 탄소 소재는 탄소 나노튜브, 카본 그라파이트, 탄소 섬유 및 탄소 그래핀 중에서 선택된 것이고, 상기 고분자 화합물은 에폭시 수지, 페놀 수지, 폴리이미드 수지, 폴리아미드 수지 및 폴리 프로필렌 중에서 선택될 수 있다.According to one embodiment of the present invention, the carbon material is selected from carbon nanotubes, carbon graphite, carbon fibers and carbon graphene, and the polymer compound is an epoxy resin, a phenol resin, a polyimide resin, a polyamide resin, and a polypropylene. can be selected from.
본 발명의 일 실시예에 따르면, 상기 히트 싱크는 상기 탄소 소재 및/또는 상기 탄소 복합소재를 압출 성형한 것일 수 있다.According to one embodiment of the present invention, the heat sink may be obtained by extruding the carbon material and/or the carbon composite material.
본 발명의 일 실시예에 따르면, 상기 히트 싱크는 금속으로 형성된 베이스판(112)을 기초로 그 위에 상기 탄소 소재 및/또는 상기 탄소 복합소재를 사출 성형한 것일 수 있다.According to one embodiment of the present invention, the heat sink may be formed by injection molding the carbon material and/or the carbon composite material on the base plate 112 formed of metal.
본 발명의 일 실시예에 따르면, 상기 히트 싱크는 상기 탄소 소재 및/또는 상기 탄소 복합소재로 제조된 방열혼들 및 베이스부를 포함하는 방열 구조를 금속으로 형성된 베이스판에 방열접착제 및/또는 나사를 이용하여 고정하여 형성된 것일 수 있다.According to one embodiment of the present invention, the heat sink has a heat dissipation structure including heat dissipation horns and a base made of the carbon material and/or the carbon composite material, and a heat dissipation adhesive and/or screws are applied to a base plate formed of metal. It may be formed by fixing using.
본 발명의 일 실시예에 따르면, 상기 히트 싱크는 금속으로 형성된 방열혼들 및 베이스부를 포함하는 방열 구조에 상기 탄소 소재 및/또는 상기 탄소 복합소재를 코팅하여 형성된 것일 수 있다.According to one embodiment of the present invention, the heat sink may be formed by coating the carbon material and/or the carbon composite material on a heat dissipation structure including metal heat dissipation horns and a base portion.
본 발명에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈에 따르면, LED 조명 모듈의 방열 성능을 향상시킬 수 있는 효과가 있다.According to the LED lighting module including a heat sink using a carbon material according to the present invention, there is an effect of improving heat dissipation performance of the LED lighting module.
또한, 본 발명에 따르면, LED 조명 모듈의 무게를 감소시킬 수 있는 효과가 있다.In addition, according to the present invention, there is an effect that can reduce the weight of the LED lighting module.
또한, 본 발명에 따르면, LED 조명 모듈의 내부식성이 향상되어, LED 조명 모듈의 제조 및/또는 유지 관리 비용이 감소하는 효과가 있다. In addition, according to the present invention, the corrosion resistance of the LED lighting module is improved, there is an effect of reducing the manufacturing and / or maintenance cost of the LED lighting module.
도 1은 본 발명의 일 실시예에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈의 상면(히트 싱크)을 도시한 것이다.1 illustrates an upper surface (heat sink) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
도 2는 본 발명의 일 실시예에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈의 하면(LED 모듈)을 도시한 것이다.2 shows a lower surface (LED module) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
도 3은 본 발명의 일 실시예에 따른 히트 싱크에 포함될 수 있는 방열혼의 구조를 도시한 것이다.3 illustrates a structure of a heat dissipation horn that may be included in a heat sink according to an embodiment of the present invention.
도 4은 본 발명의 일 실시예에 따른 히트 싱크 구조의 평면도를 도시한 것이다. 4 is a plan view of a heat sink structure according to an embodiment of the present invention.
도 5는 본 발명의 일 실시예에 따른 히트 싱크 구조의 단면도를 도시한 것이다.5 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
도 6은 본 발명의 일 실시예에 따른 히트 싱크 구조의 단면도를 도시한 것이다.6 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
본 발명에 관한 설명에서 사용하는 용어는 다음과 같이 이해되어야 한다. 먼저, 본 명세서에서 단수형 또는 복수형으로 표현된 부분은 필수불가결한 경우를 제외하고는 단수형 및 복수형인 경우를 모두 포함하는 것으로 해석될 수 있다. 또한, "제1", "제2" 등의 용어는 하나의 구성요소를 다른 구성요소로부터 구별하기 위한 용어로서만 사용되고, 이들 용어들에 의하여 권리범위가 한정되어서는 안 된다. Terms used in the description of the present invention should be understood as follows. First, parts expressed in the singular or plural in this specification may be interpreted as including both singular and plural cases except for indispensable cases. In addition, terms such as "first" and "second" are used only as terms for distinguishing one component from another, and the scope of rights should not be limited by these terms.
또한, 하나의 구성요소가 다른 구성요소와 "연결"되어 있다고 기재한 경우에는 직접 연결된 경우와 함께, 중간에 다른 구성요소를 통하여 연결된 경우도 포함하는 것으로 이해되어야 하며, "직접 연결" 또는 "바로 연결"되어 있다고 기재한 경우에만 중간에 다른 구성요소가 없이 하나의 구성요소와 다른 구성요소가 연결된 것으로 이해되어야 한다. 마찬가지로 구성요소들 사이의 관계를 설명하는 다른 표현들도 동일한 취지로 이해되어야 한다.In addition, when it is described that one component is “connected” to another component, it should be understood that it includes the case where it is directly connected as well as the case where it is connected through another component in the middle, and “direct connection” or “direct connection” It should be understood that one component is connected to another component only when it is described as "connected" without other components in the middle. Likewise, other expressions describing relationships between components should be understood in the same sense.
본 발명은 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈에 관한 것으로서, 더욱 상세하게는 부착면에서 멀어질수록 단면이 커지는 속이 빈 기둥 형상의 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈에 관한 것이다. The present invention relates to an LED lighting module including a heat sink using a carbon material, and more particularly, to an LED lighting module including a heat sink using a carbon material having a hollow column shape whose cross section increases as the distance from the attachment surface increases. it's about
도 1은 본 발명의 일 실시예에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈의 상면(히트 싱크)을 도시한 것이다.1 illustrates an upper surface (heat sink) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
본 발명의 일 실시예에 따른 LED 조명 모듈(1)은 히트 싱크(100)와 LED 모듈(200)을 포함할 수 있다. 본 발명의 일 실시예에 따른 LED 조명 모듈(1)은 LED 조명 장치에 발광부인 LED 모듈(200)이 아래로 향하도록 조립되므로, 히트 싱크(100) 부분이 상면에 위치하고, LED 모듈(200)은 하면에 위치하게 된다.An LED lighting module 1 according to an embodiment of the present invention may include a heat sink 100 and an LED module 200 . In the LED lighting module 1 according to an embodiment of the present invention, since the LED module 200, which is the light emitting part, is assembled to the LED lighting device to face downward, the heat sink 100 portion is located on the upper surface, and the LED module 200 is located on the lower surface.
본 발명의 일 실시예에 따르면, 히트 싱크(100)는 LED 조명 모듈(1)의 외형을 이루면서, LED 모듈(200)이 장착될 수 있는 베이스부(110) 및 LED 모듈(200)에서 발생하는 열을 효율적으로 배출하는 방열부(150)를 포함할 수 있다. According to one embodiment of the present invention, the heat sink 100 forms the outer shape of the LED lighting module 1, and the base portion 110 to which the LED module 200 can be mounted and the heat generated from the LED module 200 A heat dissipation unit 150 that efficiently dissipates heat may be included.
본 발명의 일 실시예에 따르면, 히트 싱크(100)의 베이스부(110)는 직사각형 형상으로 LED 조명 장치에 결합될 수 있도록 설치 브라켓(115)을 포함할 수 있고, 설치 브라켓(115)에는 LED 조명 장치에 결합될 수 있는 결합홀(117)을 포함할 수 있다. 본 발명에 따른 LED 조명 모듈(1)은 결합홀(117)을 이용하여 LED 조명 장치에 결합될 수 있다.According to one embodiment of the present invention, the base portion 110 of the heat sink 100 may include an installation bracket 115 to be coupled to an LED lighting device in a rectangular shape, and the installation bracket 115 includes an LED. It may include a coupling hole 117 that can be coupled to the lighting device. The LED lighting module 1 according to the present invention may be coupled to the LED lighting device using the coupling hole 117 .
본 발명의 일 실시예에 따르면, 히트 싱크(100)의 베이스부(110)에는 LED 모듈(200)에 전원을 공급하는 케이블을 연결할 수 있는 케이블 인출공(119)를 포함할 수 있다. According to one embodiment of the present invention, the base portion 110 of the heat sink 100 may include a cable lead-out hole 119 through which a cable supplying power to the LED module 200 may be connected.
본 발명의 일 실시예에 따르면, 히트 싱크(100)의 방열부(150)는 베이스부(110)의 상면에 돌출 형성되는 복수의 방열혼(heat-dissipating horn, 160)을 포함할 수 있다. 본 발명의 일 실시예에 따르면, 방열혼(160)은 부착면인 베이스부(110)에서 멀어질수록 단면이 커지는 속이 빈 기둥 형상을 가질 수 있다. 예를 들어, 방열혼(160)은 단면이 원형이고 부착면인 베이스부(110)에 멀어질수록 원의 반지름이 커지는 절두형 역원뿔 또는 나팔관 모양으로 제작될 수 있다. According to an embodiment of the present invention, the heat dissipating part 150 of the heat sink 100 may include a plurality of heat-dissipating horns 160 protruding from the upper surface of the base part 110 . According to one embodiment of the present invention, the heat dissipation horn 160 may have a hollow columnar shape in which a cross section increases as the distance from the base portion 110, which is an attachment surface, increases. For example, the heat dissipation horn 160 may be manufactured in the shape of a truncated inverted cone or fallopian tube with a circular cross section and a radius of the circle increasing as the distance from the base portion 110, which is an attachment surface, increases.
본 발명의 일 실시예에 따르면, 히트 싱크(100)는 탄소 소재 또는 고분자 화합물에 탄소 소재를 첨가한 탄소 복합소재로 제작될 수 있다. 예를 들어, 탄소 소재로는 탄소 나노튜브(carbon nano-tube), 카본 그라파이트(carbon graphite), 탄소 섬유(carbon fiber), 탄소 그래핀(carbon graphene) 등을 포함할 수 있으나, 이에 한정되지 않는다. 또한, 고분자 화합물로는 에폭시(epoxy) 수지, 페놀(phenol) 수지, 폴리이미드(poly-imide) 수지, 폴리 프로필렌(poly-propylene) 수지, 폴리 아미드(poly-amide) 수지 등을 포함할 수 있으나, 이에 한정되지 않는다.According to an embodiment of the present invention, the heat sink 100 may be made of a carbon material or a carbon composite material obtained by adding a carbon material to a polymer compound. For example, the carbon material may include, but is not limited to, carbon nano-tube, carbon graphite, carbon fiber, and carbon graphene. . In addition, the polymer compound may include an epoxy resin, a phenol resin, a poly-imide resin, a poly-propylene resin, a poly-amide resin, and the like. , but not limited thereto.
탄소 소재는 아래 표 1과 같이, 방열 구조에 널리 사용되는 금속인 알루미늄과 비교하면, 상대적으로 무게는 가벼우면서, 열전도도 및 강도가 높고, 부식성이 낮아서 방열 구조에 사용되기에 적합하다.As shown in Table 1 below, compared to aluminum, which is a metal widely used in heat dissipation structures, carbon materials are relatively light in weight, have high thermal conductivity and strength, and have low corrosivity, so they are suitable for use in heat dissipation structures.
구분division 알루미늄 소재aluminum material 탄소 소재carbon material
1. 무게(비중)1. Weight (specific gravity) 2.71 (g/cm3, 20 ℃)2.71 (g/cm 3 , 20 ℃) 1.84~2.01.84 to 2.0
2. 열전도도2. Thermal conductivity 237 W/mk237W/mk 3000~5000 W/mk3000~5000 W/mk
3. 강도3. robbery 강도가 낮음low intensity 강도가 높음high intensity
4. 부식성4. Corrosiveness 전기전위가 낮아 부식됨
무기산류에 잘 침식됨Corrosion due to low electric potential
Well eroded by inorganic acids 		부식성이 없음non-corrosive
본 발명의 일 실시예에 따르면, 히트 싱크(100)는 탄소 복합소재를 압출(또는 사출)하거나 다이 캐스팅(die casting)하는 방법에 의하여 형성될 수 있다. 본 발명의 다른 일 실시예에 따르면, 히트 싱크(100)는 금속으로 형성된 베이스판(112)을 기초로 그 위에 탄소 소재 또는 탄소 복합소재를 사출 성형하여 형성될 수 있다. 본 발명의 다른 일 실시예에 따르면, 히트 싱크(100)는 금속으로 형성된 기본 구조에 탄소 소재 또는 탄소 복합소재를 코팅하여 형성될 수 있다.According to an embodiment of the present invention, the heat sink 100 may be formed by extruding (or injecting) or die casting a carbon composite material. According to another embodiment of the present invention, the heat sink 100 may be formed by injection molding a carbon material or a carbon composite material on the base plate 112 formed of metal. According to another embodiment of the present invention, the heat sink 100 may be formed by coating a carbon material or a carbon composite material on a basic structure formed of metal.
본 발명의 다른 일 실시예에 따르면, 히트 싱크(100)는 금속으로 형성된 베이스판(112)에 탄소 소재 또는 탄소 복합소재를 코팅하고, 별도의 압출 또는 다이 캐스팅 방법으로 제작된 방열혼(160)을 포함하는 방열 구조를 제작하여, 베이스판(112)과 방열 구조를 방열접착제 및/또는 나사를 이용하여 고정하는 방법으로 조립될 수 있다.According to another embodiment of the present invention, the heat sink 100 is coated with a carbon material or a carbon composite material on a base plate 112 formed of metal, and a heat dissipation horn 160 manufactured by a separate extrusion or die casting method. By manufacturing a heat dissipation structure including, it may be assembled by a method of fixing the base plate 112 and the heat dissipation structure using a heat dissipation adhesive and/or screws.
도 2는 본 발명의 일 실시예에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈의 하면(LED 모듈)을 도시한 것이다.2 shows a lower surface (LED module) of an LED lighting module including a heat sink using a carbon material according to an embodiment of the present invention.
본 발명의 일 실시예에 따르면, LED 모듈(200)은 다수의 LED(210)가 실장된 PCB 기판(220), 상기 PCB 기판의 가장자리에 설치되는 방수용 개스킷(230, gasket), 상기 PCB 기판의 전면을 커버하는 LED 커버(240)를 포함할 수 있다. 본 발명의 일 실시예에 다르면, LED 모듈(200)은 접착제 및/또는 결합 나사(250)를 이용하여 히트 싱크(100)와 결합될 수 있다.According to one embodiment of the present invention, the LED module 200 includes a PCB substrate 220 on which a plurality of LEDs 210 are mounted, a waterproof gasket 230 installed on an edge of the PCB substrate, and a An LED cover 240 covering the front surface may be included. According to one embodiment of the present invention, the LED module 200 may be coupled to the heat sink 100 using an adhesive and/or a coupling screw 250 .
도 3은 본 발명의 일 실시예에 따른 히트 싱크에 포함될 수 있는 방열혼의 구조를 도시한 것이다.3 illustrates a structure of a heat dissipation horn that may be included in a heat sink according to an embodiment of the present invention.
본 발명의 일 실시예에 따르면, 히트 싱크(100)의 베이스부(110)의 상면에 돌출 형성되는 방열혼(160)은 부착면인 베이스부(110)에서 멀어질수록 단면이 커지는 속이 빈 기둥 형상을 가질 수 있다.According to one embodiment of the present invention, the heat dissipation horn 160 protruding from the upper surface of the base portion 110 of the heat sink 100 is a hollow column whose cross section increases as it moves away from the base portion 110, which is an attachment surface. can have a shape.
본 발명의 일 실시예에 따르면, 도 3(a)에 도시된 것과 같이, 방열혼(160)은 단면이 원형이고 부착면인 베이스부(110)에 멀어질수록 원의 반지름이 커지는 절두형 역원뿔 또는 나팔관 모양으로 제작될 수 있다. According to one embodiment of the present invention, as shown in FIG. 3 (a), the heat dissipation horn 160 has a circular cross section and a truncated shape in which the radius of the circle increases as it moves away from the base portion 110, which is an attachment surface. It can be made in the shape of a cone or a fallopian tube.
본 발명의 다른 일 실시예에 따르면, 도 3(b)에 도시된 것과 같이, 방열혼(160)은 단면이 사각형이고 부착면인 베이스부(110)에 멀어질수록 한 변의 길이가 커지는 절두형 역각뿔 형상으로 제작될 수 있다. 도 3(b)는 역각뿔의 단면이 사각형인 실시예를 도시하고 있으나, 본 발명의 다른 일 실시예에 따르면 단면이 삼각, 오각, 육각 등 다른 각형인 경우를 포함하나, 반드시 이에 한정되는 것은 아니다. According to another embodiment of the present invention, as shown in FIG. 3 (b), the heat dissipation horn 160 has a rectangular cross section and a truncated shape in which the length of one side increases as it moves away from the base part 110, which is an attachment surface. It can be made in the shape of an inverted pyramid. 3(b) shows an embodiment in which the cross section of an inverted pyramid is a rectangle, but according to another embodiment of the present invention, the cross section includes a case in which the cross section is a triangle, pentagon, hexagon, etc., but is not necessarily limited thereto not.
본 발명의 다른 일 실시예에 따르면, 도 3(c)에 도시된 것과 같이, 방열혼(160)의 단면이 외부는 사각형이고, 내부는 원형으로 제작될 수 있고, 부착면인 베이스부(110)에서 멀어질수록 외부 단면의 한 변의 길이가 커지고, 내부홀의 반지름이 커지는 모양으로 제작될 수 있다. 도 3(c)는 외부를 사각형으로 내부를 원형으로 도시하였으나, 본 발명의 다른 일 실시예에 따르면 외부를 원형으로 내부를 각형인 경우를 포함하나, 반드시 이에 한정되는 것은 아니고 통상의 기술자의 창작 능력 범위에서 다양한 조합이 가능하다.According to another embodiment of the present invention, as shown in FIG. 3(c), the cross section of the heat dissipating horn 160 may be manufactured in a rectangular shape on the outside and a circular shape on the inside, and the base portion 110 as an attachment surface. ), the length of one side of the outer section increases and the radius of the inner hole increases. 3(c) shows the outside as a rectangle and the inside as a circle, but according to another embodiment of the present invention, the outside is circular and the inside is angular, but is not limited thereto, and the creation of a skilled artisan Various combinations are possible in the range of abilities.
본 발명의 다른 일 실시예에 따르면, 도 3(d)에 도시된 것과 같이, 방열혼(160)의 외부는 단면이 일정하고, 방열혼(160)의 내부는 부착면인 베이스부(110)에서 멀어질수록 단면이 커지는 속이 빈 기둥 모양으로 제작될 수 있다. 도 3(d)는 외부 및 내부의 단면을 원형으로 도시하였으나, 본 발명의 다른 일 실시예에 따르면 외부 및 내부가 모두 각형이거나 어느 하나만 각형인 경우를 포함하나, 반드시 이에 한정되는 것은 아니다.According to another embodiment of the present invention, as shown in FIG. 3 (d), the outside of the heat radiation horn 160 has a constant cross section, and the inside of the heat radiation horn 160 is the base portion 110, which is an attachment surface. It can be manufactured in the shape of a hollow column whose cross section increases as it moves away from it. 3(d) shows the outer and inner cross-sections in a circular shape, but according to another embodiment of the present invention, both the outer and inner sides are angular, or only one of them is angular, but is not necessarily limited thereto.
본 발명의 일 실시예에 따라, 부착면인 베이스부(110)에서 멀어질수록 단면이 커지는 속이 빈 기둥 형상인 방열혼(160)은 기둥의 외부면뿐만 아니라 내부면을 통하여도 열을 발산할 수 있으므로 열을 발산할 수 있는 단면적이 넓어서 방열 효율이 향상된다. 또한, 방열혼(160)으로부터 방열된 열에 의하여 온도가 높아진 공기는 가벼워지므로 위로 상승하게 되는데, 본 발명의 일 실시예에 따른 방열혼(160)은 베이스부(110)에서 멀어질수록 내부 단면이 커지는 형상이므로, 방열혼(160)의 내부면과 접촉한 공기가 원활하게 상승하게 되고, 결과적으로 열 발산의 효율이 높아진다. According to an embodiment of the present invention, the heat dissipation horn 160, which is a hollow pillar shape whose cross section increases as it moves away from the base part 110, which is an attachment surface, can dissipate heat through the inner surface as well as the outer surface of the pillar. Therefore, the cross-sectional area that can dissipate heat is wide, and the heat dissipation efficiency is improved. In addition, the air whose temperature is elevated by the heat dissipated from the heat dissipation horn 160 becomes lighter and rises upward. Because of the enlarged shape, the air in contact with the inner surface of the heat dissipation horn 160 rises smoothly, and as a result, the efficiency of heat dissipation increases.
도 4는 본 발명의 일 실시예에 따른 히트 싱크 구조를 위에서 내려다본 평면도를 도시한 것이다.4 is a top plan view of a heat sink structure according to an embodiment of the present invention.
본 발명의 일 실시예에 따르면, 히트 싱크(100)의 베이스부(110)의 상면에는 부착면에서 멀어질수록 단면이 커지는 속이 빈 기둥 형상의 방열혼(160)들이 도 4와 같이 오와 열을 맞추어 정렬되도록 배치할 수 있다. 이러한 실시예에 따르면, 방열혼(160)들 사이로 공기의 순환이 원할하게 되므로 방열 성능이 향상될 수 있다.According to one embodiment of the present invention, on the upper surface of the base part 110 of the heat sink 100, the heat dissipation horns 160 in a hollow column shape, the cross section of which increases as the distance from the attachment surface increases, are arranged in rows as shown in FIG. can be arranged so that they are aligned. According to this embodiment, since air is smoothly circulated between the heat dissipation horns 160, heat dissipation performance may be improved.
본 발명의 다른 일 실시예에 따르면, 방열혼(160)들은 베이스부(110)의 상면에 서로 교차하여 배치될 수 있으나, 이외에도 다른 방식으로 배치될 수 있으며, 본 발명은 방열혼(160)들의 특정한 배치 방식에 한정되지 않는다.According to another embodiment of the present invention, the heat dissipation horns 160 may be disposed crossing each other on the upper surface of the base portion 110, but may be disposed in other ways, and the present invention relates to the heat dissipation horns 160 It is not limited to a specific arrangement method.
도 5는 본 발명의 일 실시예에 따른 히트 싱크 구조에 대한 단면도를 도시한 것이다. 5 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
도 5(a)는 도 4에 표시된 a-b 사이의 단면도를 도시한 것이고, 도 5(b)는 도 4에 표시된 c-d 사이의 단면도를 도시한 것이다.FIG. 5(a) is a cross-sectional view taken between a-b indicated in FIG. 4, and FIG. 5(b) is a cross-sectional view taken between c-d indicated in FIG.
본 발명의 일 실시예에 따른 LED 조명 모듈(1)은 LED 모듈(200)이 아래로 향하도록 LED 조명 장치에 설치된다. 결과적으로 LED 조명 모듈(1)은 도 1과 같은 방식으로 설치되고, 결과적으로 베이스부(110)에 설치된 방열혼(160)들은 도 5(a) 및 도 5(b)와 같이 위로 갈수록 단면이 커지는 형상으로 설치된다. The LED lighting module 1 according to an embodiment of the present invention is installed in the LED lighting device so that the LED module 200 faces downward. As a result, the LED lighting module 1 is installed in the same manner as in FIG. 1, and as a result, the heat dissipation horns 160 installed on the base part 110 have a cross section going upward as shown in FIGS. 5(a) and 5(b). It is installed in an enlarged shape.
본 발명의 일 실시예에 따르면, 아래에 위치한 LED 모듈(200)의 다수의 LED(210)에서 발생한 열은 직접 및/또는 PCB 기판(220)을 통하여 히트 싱크(100)로 전도되고, 베이스부(110)를 거쳐서 방열혼(160)을 통하여 공기중으로 효과적으로 방열된다. According to one embodiment of the present invention, the heat generated from the plurality of LEDs 210 of the LED module 200 located below is conducted to the heat sink 100 directly and/or through the PCB substrate 220, and the base portion After passing through 110, heat is effectively dissipated into the air through the heat dissipation horn 160.
도 6은 본 발명의 일 실시예에 따른 히트 싱크 구조에 대한 단면도를 도시한 것이다. 6 is a cross-sectional view of a heat sink structure according to an embodiment of the present invention.
도 6에서 검정색으로 표시된 것은 탄소 소재 또는 탄소 복합소재에 의하여 제조된 부분이고, 회색으로 표시된 부분은 알루미늄 등 열전도도가 높은 금속으로 형성된 부분이다.In FIG. 6, a portion marked in black is a part made of a carbon material or a carbon composite material, and a part marked in gray is a part formed of a metal having high thermal conductivity such as aluminum.
본 발명의 일 실시예에 따르면, 도 6(a)에 도시된 바와 같이, 히트 싱크(100)는 탄소 소재 및/또는 탄소 복합소재를 압출하거나 다이 캐스팅하는 방법에 의하여 형성될 수 있다. According to one embodiment of the present invention, as shown in FIG. 6 (a), the heat sink 100 may be formed by extruding or die casting a carbon material and/or a carbon composite material.
본 발명의 다른 일 실시예에 따르면, 도 6(b)에 도시된 바와 같이, 히트 싱크(100)는 금속으로 형성된 베이스판(112)을 기초로 그 위에 탄소 소재 및/또는 탄소 복합소재를 사출 성형하여 형성될 수 있다. 이러한 실시예에 따르면, 금속으로 형성된 베이스판(112)은 LED 모듈(200)과의 결합을 용이하게 하고, 탄소 소재 및/또는 탄소 복합소재가 형성된 부분의 수축으로 인한 뒤틀림을 잡아주고, LED 모듈(200)과 완전히 밀착하도록 하여 방열 성능을 향상시킬 수 있다.According to another embodiment of the present invention, as shown in FIG. 6 (b), the heat sink 100 injects a carbon material and/or a carbon composite material thereon based on a base plate 112 formed of metal. It can be formed by molding. According to this embodiment, the base plate 112 formed of metal facilitates coupling with the LED module 200, holds the distortion due to contraction of the carbon material and / or carbon composite material formed part, and the LED module It is possible to improve heat dissipation performance by completely adhering to (200).
본 발명의 다른 일 실시예에 따르면, 도 6(b)에 도시된 방열 구조는 금속으로 형성된 베이스판(112)에 탄소 복합소재 또는 탄소 소재를 코팅하고, 별도의 압출 또는 다이 캐스팅 방법으로 방열혼(160) 및 베이스부(110)을 포함하는 방열 구조를 제작하여, 베이스판(112)과 방열 구조를 방열접착제 및/또는 나사를 이용하여 고정하는 방법으로 조립될 수 있다.According to another embodiment of the present invention, in the heat dissipation structure shown in FIG. 6 (b), a carbon composite material or a carbon material is coated on the base plate 112 formed of metal, and a heat dissipation horn is performed by a separate extrusion or die casting method. A heat dissipation structure including the 160 and the base portion 110 may be manufactured, and the base plate 112 and the heat dissipation structure may be assembled by a method of fixing the heat dissipation structure using a heat dissipation adhesive and/or screws.
본 발명의 다른 일 실시예에 따르면, 도 6(c)에 도시된 바와 같이, 히트 싱크(100)는 금속으로 형성된 기본 구조에 탄소 소재 및/또는 탄소 복합소재를 코팅하여 형성될 수 있다. According to another embodiment of the present invention, as shown in FIG. 6(c), the heat sink 100 may be formed by coating a carbon material and/or a carbon composite material on a basic structure formed of metal.
본 발명에 따른 탄소 소재를 이용한 히트 싱크를 포함하는 LED 조명 모듈에 대하여 본원의 도면에 따라 상기와 같이 설명하였으나, 본 발명은 본원에 도시 및 설명된 구성 및 방법으로만 국한되는 것이 아니다. 본원에 개시된 것 이외의 다양한 재료 및 구조가 본 발명의 구성으로 사용될 수 있고, 그 권리범위에 있어서도 본원에 개시된 구성 및 방법으로 한정되는 것이 아니다. 당해 기술분야의 통상의 기술자들은 당해 기술분야의 통상의 기술을 이용하여 다양한 변형 및 수정이 가능함을 이해할 것이다.Although the LED lighting module including a heat sink using a carbon material according to the present invention has been described as described above according to the drawings of the present application, the present invention is not limited to only the configurations and methods shown and described herein. Various materials and structures other than those disclosed herein may be used in the configuration of the present invention, and the scope of rights is not limited to the configuration and method disclosed herein. Those skilled in the art will understand that various variations and modifications are possible using conventional techniques in the art.

Claims (10)

  1. LED 조명 모듈로서,As an LED lighting module,
    복수의 LED를 구동하는 LED 모듈; 및An LED module driving a plurality of LEDs; and
    상기 LED 모듈과 결합되는 히트 싱크를 포함하고,A heat sink coupled to the LED module;
    상기 히트 싱크는the heat sink
    상기 LED 모듈이 장착될 수 있는 베이스부; 및a base portion on which the LED module can be mounted; and
    상기 베이스부의 상면에 돌출 형성되는 복수의 방열혼을 포함하며,It includes a plurality of heat dissipation horns protruding from the upper surface of the base part,
    상기 방열혼은 탄소 소재 또는 탄소 복합소재를 포함하여 형성되고, 부착면인 상기 베이스부에서 멀어질수록 내부 단면의 면적이 커지는 속이 빈 기둥 형상인,The heat dissipation horn is formed of a carbon material or a carbon composite material, and has a hollow column shape in which the area of the inner cross section increases as the distance from the base part, which is an attachment surface, increases.
    LED 조명 모듈.LED light module.
  2. 제1항에 있어서,According to claim 1,
    상기 방열혼은 부착면인 상기 베이스부에서 멀어질수록 외부 단면의 면적이 커지는 속이 빈 기둥 형상인,The heat dissipation horn has a hollow column shape in which the area of the outer cross section increases as it moves away from the base part, which is an attachment surface.
    LED 조명 모듈.LED light module.
  3. 제1항에 있어서,According to claim 1,
    상기 방열혼의 내부 단면은 원형 또는 각형인,The inner cross section of the heat dissipation horn is circular or angular,
    LED 조명 모듈.LED light module.
  4. 제2항에 있어서,According to claim 2,
    상기 방열혼의 외부 단면은 원형 또는 각형인,The outer cross section of the heat dissipation horn is circular or angular,
    LED 조명 모듈.LED light module.
  5. 제1항에 있어서,According to claim 1,
    상기 탄소 복합소재는 고분자 화합물에 상기 탄소 소재를 첨가한 것인,The carbon composite material is obtained by adding the carbon material to a polymer compound,
    LED 조명 모듈.LED light module.
  6. 제5항에 있어서,According to claim 5,
    상기 탄소 소재는 탄소 나노튜브, 카본 그라파이트, 탄소 섬유 및 탄소 그래핀 중에서 선택된 것이고, 상기 고분자 화합물은 에폭시 수지, 페놀 수지, 폴리이미드 수지, 폴리아미드 수지 및 폴리 프로필렌 중에서 선택된 것인, The carbon material is selected from carbon nanotube, carbon graphite, carbon fiber and carbon graphene, and the polymer compound is selected from epoxy resin, phenol resin, polyimide resin, polyamide resin and polypropylene,
    LED 조명 모듈.LED light module.
  7. 제1항에 있어서,According to claim 1,
    상기 히트 싱크는 상기 탄소 소재 및/또는 상기 탄소 복합소재를 압출 성형한 것인,The heat sink is obtained by extruding the carbon material and / or the carbon composite material,
    LED 조명 모듈.LED light module.
  8. 제1항에 있어서,According to claim 1,
    상기 히트 싱크는 금속으로 형성된 베이스판(112)을 기초로 그 위에 상기 탄소 소재 및/또는 상기 탄소 복합소재를 사출 성형한 것인,The heat sink is formed by injection molding the carbon material and / or the carbon composite material on the base plate 112 formed of metal.
    LED 조명 모듈.LED light module.
  9. 제1항에 있어서,According to claim 1,
    상기 히트 싱크는 상기 탄소 소재 및/또는 상기 탄소 복합소재로 제조된 방열혼들 및 베이스부를 포함하는 방열 구조를 금속으로 형성된 베이스판에 방열접착제 및/또는 나사를 이용하여 고정하여 형성된 것인,The heat sink is formed by fixing a heat dissipation structure including heat dissipation horns and a base made of the carbon material and/or the carbon composite material to a base plate formed of metal using a heat dissipation adhesive and/or screws,
    LED 조명 모듈.LED light module.
  10. 제1항에 있어서,According to claim 1,
    상기 히트 싱크는 금속으로 형성된 방열혼들 및 베이스부를 포함하는 방열 구조에 상기 탄소 소재 및/또는 상기 탄소 복합소재를 코팅하여 형성된,The heat sink is formed by coating the carbon material and / or the carbon composite material on a heat dissipation structure including heat dissipation horns and a base portion formed of metal,
    LED 조명 모듈.LED light module.
PCT/KR2021/007242 2021-06-10 2021-06-10 Led light module comprising heat sink using carbonaceous material WO2022260194A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060028754A (en) * 2004-09-29 2006-04-03 후지쯔 가부시끼가이샤 Radiating fin and method for manufacturing the same
KR20100027148A (en) * 2007-07-02 2010-03-10 스타라이트 고교 가부시키가이샤 Resin heat sink
KR20100114398A (en) * 2009-04-15 2010-10-25 김혜경 Radiant heat apparatus of led lighting
KR20160095388A (en) * 2015-02-03 2016-08-11 주식회사 아모센스 Bulb type LED light device
KR101881436B1 (en) * 2017-10-19 2018-07-24 테크젠정공(주) manufacturing method for High-capacity heat sink coated with carbon nanotube and graphene mixture

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060028754A (en) * 2004-09-29 2006-04-03 후지쯔 가부시끼가이샤 Radiating fin and method for manufacturing the same
KR20100027148A (en) * 2007-07-02 2010-03-10 스타라이트 고교 가부시키가이샤 Resin heat sink
KR20100114398A (en) * 2009-04-15 2010-10-25 김혜경 Radiant heat apparatus of led lighting
KR20160095388A (en) * 2015-02-03 2016-08-11 주식회사 아모센스 Bulb type LED light device
KR101881436B1 (en) * 2017-10-19 2018-07-24 테크젠정공(주) manufacturing method for High-capacity heat sink coated with carbon nanotube and graphene mixture

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