KR101033381B1 - Card Manufacturing Method using a Etching Plate - Google Patents

Abstract

It provides a card manufacturing method using an etching plate.

The present invention provides an etching plate having any one of an intaglio or embossed design letters or figures on one side; Arranging and placing a card base material between the first pressing portion provided on one side of the etching plate and the second pressing portion adjacent thereto; One of the designs, letters, or figures of the etching plate is formed by the heat of a certain temperature and the pressing force of a certain strength provided from the first and second heat plates in a state where the card base material is laminated between the etching plate and the second mirror plate. Transferring to one side of the card blank; Any one of the designs, letters, or figures being transferred to cool the embossed or engraved card plate base material, and then separating the card plate base material from the second pressing portion; And arranging and bonding the IC chip to a recess formed at an arbitrary position of the separated card plate base material.

Etching Plate, Card, Mirror Plate, Hot Plate, Press

Description

Card Manufacturing Method using a Etching Plate

The present invention relates to a method for manufacturing a card using an etching plate embossed or embossed design, more specifically, to emboss or engrav a design, letters or figures formed on the outer surface of the card to reduce the friction force with the wallet The present invention relates to a card manufacturing method using an etching plate that can lower the risk of loss of a card, increase contactability upon contact, and increase the satisfaction of a card user by increasing a differentiation from other cards.

In general, a card equipped with an IC chip for use in various fields such as financial, transportation, security, and electronic commerce, etc., uses a contact card that transmits and receives data through a contact exposed on the surface, and a wireless antenna using an internal antenna coil. It can be divided into a contactless card for transmitting and receiving data.

On the surface and the back of the card, the card issuer or a specific company is affiliated with the card issuer to display the company's logo, selected advertisements, and text.

Conventionally, the process of manufacturing a card is first laminated by laminating a film sheet printed design on the surface and the back of the molded plastic sheet first, and by laminating a protective sheet on the outer surface of the film sheet is a multi-layer sheet The card | substrate base material which consists of laminated boards was produced.

Then, insert an IC chip, which is a COB module (Chip On Board Module) to which a hot-melt tape or adhesive is attached, into a recessed groove formed on one side of the card base material, and then add heat and pressure on the COB module. By bonding the hot-melt tape and the card base material, one card is manufactured.

However, the conventional card manufacturing process has the advantage that mass production is possible by attaching a film sheet to the original sheet, but since it is mass produced uniformly with one design, it is possible to distinguish between different card issuers and different users. Due to the lack of discernment, the card issuer had limitations in attracting and satisfying specific customers.

In addition, since the outer surface of the card plate base material is provided in a flat plane and simple, there is a problem that the friction force with the wallet is lowered and the card is unnecessarily drawn out of the wallet to increase the risk of card loss.

Therefore, the present invention is to solve the above problems, the purpose of which is to emboss or engrav the design, letters and figures formed on the outer surface of the card to increase the frictional force with the wallet to lower the risk of loss of the card and In order to provide a card manufacturing method using an etching plate which can increase contactability due to friction when contacting a card and enhance the user's satisfaction by increasing the differentiation from other cards.

As a specific means for achieving the above object, the present invention provides a step of providing an etching plate having any one of the design letters or figures engraved or embossed on one side; Arranging and placing a card base material between the first pressing portion provided on one side of the etching plate and the second pressing portion adjacent thereto; Any one of the designs, letters, or figures of the etching plate may be formed by heat of a constant temperature and pressure applied from the first and second hot plates while the card base material is laminated between the etching plate and the second mirror plate. Transferring to one side of the card base material; Any one of the designs, letters, or figures being transferred to cool the embossed or engraved card plate base material, and then separating the card plate base material from the second pressing portion; And arranging and bonding an IC chip to a recess formed at an arbitrary position of the separated card base material, wherein the placing and laminating the card base material is a first mirror plate having the etching plate fixed to one side thereof. And a card base material in which at least one sheet is laminated between the first pressing part to which the first heating plate is coupled, and the second pressing part to which the second mirror plate and the second coupling plate are coupled. It provides a card manufacturing method using an etching plate.

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More preferably, the first hot plate is connected to the upper press, and the second hot plate is connected to the lower press so that the upper press is raised and lowered together with the first pressing part to be in contact with the upper surface of the card base material. The pressing plate provides a pressing force of a certain intensity directly through the etching plate, and the lower press is raised and lowered together with the second pressing unit while being directly raised and lowered through the second mirror surface plate in contact with the lower surface of the base plate. Provide a constant force.

More preferably, between the first mirror plate and the first hot plate, and between the second mirror plate and the second hot plate, the first cushion pad and the first cushion pad and the second mirror plate may absorb shocks transmitted to the first mirror plate and the second mirror plate. Each of the two cushion pads is provided.

More preferably, the first mirror plate and the second mirror plate are made of a metal plate member having a surface facing each other to be polished or polished so that the surface of the card base material is polished or matted.

Preferably, prior to the separating the card base material, the card base material is naturally cooled in the air or forcedly cooled by air or water cooling.

According to the present invention, the outer surface of the card by transferring the engraved design to the outer surface of the card by any one of the design, letters or figures are thermally compressed while pressing the intaglio or embossed etching plate to the surface of the card substrate Because it can be embossed or engraved to protrude the design exposed to the card, it can reduce the risk of losing the card from the wallet by increasing friction with the wallet in which the card is stored. While improving contactability, it is possible to increase the user's satisfaction by increasing the differentiation from other cards.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a front view showing an etching plate in a card manufacturing method using an etching plate according to a preferred embodiment of the present invention, Figure 2 is a etching plate in the card manufacturing method using an etching plate according to a preferred embodiment of the present invention 1 is a state diagram coupled to the mirror plate, Figure 3 is a state diagram for pressing the card plate base material in the card manufacturing method using an etching plate according to a preferred embodiment of the present invention, Figure 4 is an etching plate according to a preferred embodiment of the present invention In the card manufacturing method using the state is a state diagram showing a state in which the IC chip is placed by forming a groove in the base plate.

According to a preferred embodiment of the present invention, a method of manufacturing a card includes an etching plate 110 having one or more of an engraved or embossed design, letters, or figures arranged on one side thereof. to provide.

The etching plate 110 is formed of a metal plate member including a recess 111 having a plurality of designs, letters, or figures arranged therein, and a margin part 112 forming an outer edge.

In addition, the periphery of the engraved portion is provided with a cutting line 113, which is a reference line for cutting the embossed card base material 130, and an alignment line 114, which is a reference line when laminating with the card base material 130, respectively.

In the process of forming the intaglio portion 111 on one side of the etching plate 110, first, any one of a previously designed design, letters or figures is printed on the film to complete the design film.

Then, after polishing and degreasing the surface of the substantially rectangular metal plate, a positive type photoresist or negative type photoresist is selected and applied to the surface of the degreased metal plate. Will be decided.

Here, the metal plate is preferably made of a SUS material or a metal material of a metal material having a thickness of 0.01 to 1.0mm.

That is, in the positive type photoresist, the portion exposed to ultraviolet rays is dissolved in the developing solution in the developing process, so that only the photoresist of the portion corresponding to the printed portion of the design film remains.

On the other hand, in the negative type photoresist, a portion not exposed to ultraviolet rays is dissolved in a developer in a developing process, so that only a portion of the photoresist corresponding to an unprinted portion of the design film remains.

Here, the photoresist applied to the metal plate may omit the drying process accompanying the application of the liquid photoresist by using a photoresist in a dry film state.

The photoresist applied to the metal plate is left exposed to the photoresist by exposure to ultraviolet rays having a wavelength of 200 to 400 nanometers in a state where the design film is adhered, and then the metal plate is developed as a developer, followed by washing and drying the developer. .

Subsequently, the surface of the metal plate to which the photoresist is not applied is corroded as an etchant to penetrate the intaglio portion 111, the margin portion 112, the cutting line 113, and the alignment line in which one of the designs, letters, or figures is engraved. The etching plate 110 on which the 114 is formed is manufactured.

In addition, as illustrated in FIG. 2, the etching plate 110 is adhered to one side of the first mirror surface plate 121 having a substantially rectangular plate by using an adhesive tape or an adhesive, and thus the first mirror plate 121 is formed. It is integrated with

Accordingly, the surface of the first mirror plate 121 is exposed to the outside through the space of the etching plate 110 which is etched as it is, when the adhesion between the etching plate 110 and the first mirror plate 121 The adhesive applied in between should not be exposed to the outside through the space.

Here, the first mirror surface 121 is preferably provided to be substantially the same or larger than the area of the etching plate 110.

In addition, the card plate base material 130 in which the at least one sheet is stacked is arranged between the first pressing part 120a and the second pressing part 120b, as shown in FIG. 3.

The first pressing part 120a is an upper structure in which the first mirror plate 121 and the first hot plate 122, on which the etching plate 110 is fixed, are coupled, and the second hot plate 122 is It is connected to the upper press 125.

The second pressing part 120b is a lower structure in which the second mirror plate 123 and the second hot plate 124 are coupled, and the second hot plate 124 is connected to the lower press 126.

Here, the upper press 125 is provided with a predetermined force to the lower portion through the etching plate 110 to the contact area in contact with the upper surface of the card substrate base material while lifting up and down with the first pressing portion (120a). The lower press 126 is raised and lowered together with the second pressing part 120b while pressing the force of a certain intensity to the upper part directly through the second mirror surface plate 123 in contact with the lower surface of the card base material. To provide.

In addition, the upper press 126 and the lower press 126 are transferred between the first mirror plate 121 and the first hot plate 122 and between the second mirror plate 123 and the second hot plate 124. The first cushion pad 127 and the second cushion pad 128 to absorb the shock transmitted to the first mirror plate 121 and the second mirror plate 123 by the pressing force to prevent the damage when the pressure is applied. It is preferable to provide each).

The first and second cushion pads 127 and 128 are preferably made of a material having excellent thermal conductivity and heat resistance while being able to absorb shock by attaching synthetic rubber to paper or fabric.

In addition, the first mirror plate 121 and the second mirror plate 122 is preferably made of a metal plate member that the surface facing each other is polished or polished.

On the other hand, the second pressing unit 120b may be disposed on a fixing jig (not shown) fixed to the ground.

The first mirror plate 121 and the second mirror plate 123 are detachably assembled to the first heat plate 122 and the second heat plate 124, thereby being coupled to the etching plate 110. The first mirror surface 121 and the second mirror surface 123 to be replaced with new parts in accordance with the replacement time.

The first and second heat plates 122 and 124 may be provided as electric resistance heater members that generate heat at a predetermined temperature when power is applied.

Accordingly, when power is applied in a state where the card base material 130 is stacked between the etching plate 110 and the second mirror plate 1123, heat and a constant temperature provided from the first and second heat plates 122 and 124 are constant. The plate plate base material 130 is pressed by the pressing force of the upper and lower presses 125 and 126 for a predetermined time by the pressing force of the intensity, and provides heat, thereby being etched or embossed by the etching plate 110. , Any one of letters or figures is transferred to the upper surface of the card base material 130.

Here, the heat, the pressing force, and the pressurization time provided by the first and second heat plates may be varied according to the material and thickness of the card base material.

Subsequently, when any one of an intaglio or embossed design, text, or figure of the etching plate 110 is transferred to the upper surface of the card base material 130, the first pressing part 120a is pressurized to a second pressure. Separated from the unit 120b, the power is supplied to the first and second heat plates 122 and 124, and the state mounted on the second mirror plate 123 to cool the embossed or engraved card plate base material 130 do.

At this time, the surface of the card base material 130 may be polished or matte, patterned by the first or second mirror plate 121,123 that is polished or matte.

In addition, the card base material 130 may be left in the air for a predetermined time, but may be naturally cooled, but is not limited thereto. The cooling time may be shortened by forcibly cooling by any one of air cooling or water cooling. .

Subsequently, as shown in FIG. 4, the cooling completed card plate base material 130 is separated from the second mirror plate 123, and then the recess 131 having a predetermined depth at an arbitrary position of the separated card plate base material 130. ) Are formed, and then the IC chip 132 is disposed in the grooves 131 and fixed to the grooves 131 by the adhesive.

At this time, the groove 131 is preferably formed in a position that does not overlap with the embossed or engraved design by the etching plate 110.

When the mounting of the IC chip 132 is completed, any one of a design, a letter, or a figure has an embossed or engraved protrusion 135 having a projection base 135 along the transferred cutting line 133. By individually cutting, the card 100 on which the IC chip is mounted is manufactured.

While the invention has been shown and described with respect to particular embodiments, it will be understood that various changes and modifications can be made in the art without departing from the spirit or scope of the invention as set forth in the claims below. It will be appreciated that those skilled in the art can easily know.

1 is a front view showing an etching plate in a card manufacturing method using an etching plate according to a preferred embodiment of the present invention.

2 is a state diagram in which the etching plate is bonded to the first mirror plate in the card manufacturing method using the etching plate according to an embodiment of the present invention.

Figure 3 is a state diagram for pressing the card plate base material in the card manufacturing method using an etching plate according to a preferred embodiment of the present invention.

4 is a state diagram illustrating a state in which an IC chip is disposed by forming a recess in a card plate base material in a card manufacturing method using an etching plate according to a preferred embodiment of the present invention.

   Explanation of symbols on the main parts of the drawings

110: etching plate 120a: first pressing portion

120b: second pressing portion 121: the first mirror plate

122: first hot plate 123: second mirror plate

124: second hot plate 125: upper press

126: lower press 127: first cushion pad

128: second cushion pad 130: card plate base material

Claims (6)

Providing an etching plate having any one of an engraved or embossed design letter or figure on one side thereof; Arranging and placing a card base material between the first pressing portion provided on one side of the etching plate and the second pressing portion adjacent thereto; Any one of the designs, letters, or figures of the etching plate may be formed by heat of a constant temperature and pressure applied from the first and second hot plates while the card base material is laminated between the etching plate and the second mirror plate. Transferring to one side of the card base material; Any one of the designs, letters, or figures being transferred to cool the embossed or engraved card plate base material, and then separating the card plate base material from the second pressing portion; And Arranging and bonding an IC chip to a recess formed at an arbitrary position of the separated card plate base material, The stacking and laminating of the card base material may include a first pressing part in which a first mirror plate and a first heating plate are fixed to one side, and a second mirror plate and a second coupling plate are combined. A card manufacturing method using an etching plate, characterized in that the laminating and placing the card substrate base material laminated at least one sheet between the pressing portion. delete The method of claim 1, The first hot plate is connected to the upper press, and the second hot plate is connected to the lower press so that the upper press is raised and lowered together with the first pressing part, so that the etching plate is in contact with the upper surface of the card base material. It provides a pressing force of a certain intensity to the lower portion through, and the lower press is raised and lowered with the second pressing portion while the pressing force of a constant strength to the upper portion through the second mirror plate to the contact area in contact with the lower surface of the card base material Card manufacturing method using an etching plate, characterized in that to provide. The method according to claim 1 or 3, A first cushion pad and a second cushion pad are disposed between the first mirror plate and the first heating plate and between the second mirror plate and the second heating plate to absorb shocks transmitted to the first mirror plate and the second mirror plate. Card manufacturing method using an etching plate, characterized in that each provided. The method of claim 1, The first mirror plate and the second mirror plate is a card manufacturing method using an etching plate characterized in that the surface facing each other made of a metal plate member that is polished or polished to the surface of the card substrate base material glossy or matte . The method of claim 1, Prior to the separating the card base material, the card base material is a card manufacturing method using an etching plate, characterized in that the natural cooling in the air or forced cooling by air or water cooling method.

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