KR101019279B1 - 이미지 센서 및 그 제조방법 - Google Patents
이미지 센서 및 그 제조방법 Download PDFInfo
- Publication number
- KR101019279B1 KR101019279B1 KR1020070074105A KR20070074105A KR101019279B1 KR 101019279 B1 KR101019279 B1 KR 101019279B1 KR 1020070074105 A KR1020070074105 A KR 1020070074105A KR 20070074105 A KR20070074105 A KR 20070074105A KR 101019279 B1 KR101019279 B1 KR 101019279B1
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- KR
- South Korea
- Prior art keywords
- photodiode
- doped region
- image sensor
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- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
- H10F39/014—Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/807—Pixel isolation structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/802—Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070074105A KR101019279B1 (ko) | 2007-07-24 | 2007-07-24 | 이미지 센서 및 그 제조방법 |
| TW101146681A TWI470779B (zh) | 2007-07-24 | 2008-07-23 | 影像感測器及其製造方法 |
| US12/219,499 US7999252B2 (en) | 2007-07-24 | 2008-07-23 | Image sensor and method for fabricating the same |
| TW097128012A TWI397172B (zh) | 2007-07-24 | 2008-07-23 | 影像感測器及其製造方法 |
| JP2008190041A JP5329142B2 (ja) | 2007-07-24 | 2008-07-23 | イメージセンサ |
| US13/194,142 US8828775B2 (en) | 2007-07-24 | 2011-07-29 | Image sensor and method for fabricating same |
| JP2012251178A JP2013042178A (ja) | 2007-07-24 | 2012-11-15 | イメージセンサ及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070074105A KR101019279B1 (ko) | 2007-07-24 | 2007-07-24 | 이미지 센서 및 그 제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20090010747A KR20090010747A (ko) | 2009-01-30 |
| KR101019279B1 true KR101019279B1 (ko) | 2011-03-07 |
Family
ID=40294480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020070074105A Active KR101019279B1 (ko) | 2007-07-24 | 2007-07-24 | 이미지 센서 및 그 제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US7999252B2 (enExample) |
| JP (2) | JP5329142B2 (enExample) |
| KR (1) | KR101019279B1 (enExample) |
| TW (2) | TWI470779B (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101543664B1 (ko) * | 2008-12-08 | 2015-08-12 | 삼성전자주식회사 | 픽셀 어레이 및 이를 포함하는 입체 영상 센서 |
| KR102009931B1 (ko) * | 2012-07-06 | 2019-08-13 | 에스케이하이닉스 주식회사 | 씨모스 이미지센서 및 그 제조 방법 |
| US9665604B2 (en) * | 2012-07-31 | 2017-05-30 | Schlumberger Technology Corporation | Modeling and manipulation of seismic reference datum (SRD) in a collaborative petro-technical application environment |
| TWI538175B (zh) * | 2013-12-24 | 2016-06-11 | 光引研創股份有限公司 | 以慢光增強吸收之鍺光偵測器 |
| US10918650B2 (en) | 2016-06-02 | 2021-02-16 | University Of South Florida | Method of treating melanoma using an inhibitor of an atypical protein kinase C |
| US11348955B2 (en) * | 2018-06-05 | 2022-05-31 | Brillnics Singapore Pte. Ltd. | Pixel structure for image sensors |
| JP7470040B2 (ja) * | 2018-07-09 | 2024-04-17 | 株式会社 資生堂 | 情報処理装置、プログラム、及び、情報処理方法 |
| CN109979955B (zh) * | 2019-04-03 | 2021-06-18 | 上海华力微电子有限公司 | 一种半导体结构及其制造方法 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031525A (ja) | 1998-06-27 | 2000-01-28 | Hyundai Electron Ind Co Ltd | イメ―ジセンサのピンドフォトダイオ―ド及びその製造方法 |
| KR20020020086A (ko) * | 2000-09-07 | 2002-03-14 | 박용 | 씨모스 이미지 센서 |
| KR20020022931A (ko) * | 2000-09-21 | 2002-03-28 | 박종섭 | 씨모스 이미지 센서의 포토다이오드 및 그의 제조방법 |
| KR20030000653A (ko) * | 2001-06-26 | 2003-01-06 | 주식회사 하이닉스반도체 | 이미지센서 제조 방법 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4419238B2 (ja) * | 1999-12-27 | 2010-02-24 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
| JP4972838B2 (ja) * | 2001-09-12 | 2012-07-11 | ソニー株式会社 | 固体撮像素子及びその製造方法 |
| JP4882207B2 (ja) * | 2004-04-28 | 2012-02-22 | ソニー株式会社 | 固体撮像素子 |
| KR101069103B1 (ko) | 2004-07-29 | 2011-09-30 | 크로스텍 캐피탈, 엘엘씨 | 전하운송효율을 향상시키기 위한 이미지센서 및 제조 방법 |
| KR100660275B1 (ko) * | 2004-12-29 | 2006-12-20 | 동부일렉트로닉스 주식회사 | 씨모스 이미지 센서 화소의 전달 트랜지스터 및 그 제조방법 |
| US7728330B2 (en) * | 2005-08-24 | 2010-06-01 | Aptina Imaging Corporation | CMOS imager with nitrided gate oxide and method of fabrication |
| JP4951898B2 (ja) * | 2005-08-26 | 2012-06-13 | ソニー株式会社 | 固体撮像素子、固体撮像素子の製造方法および固体撮像素子を用いた画像撮影装置 |
| KR100723137B1 (ko) * | 2005-11-24 | 2007-05-30 | 삼성전기주식회사 | 포토다이오드 소자 및 이를 이용한 광센서용 포토다이오드어레이 |
-
2007
- 2007-07-24 KR KR1020070074105A patent/KR101019279B1/ko active Active
-
2008
- 2008-07-23 TW TW101146681A patent/TWI470779B/zh active
- 2008-07-23 US US12/219,499 patent/US7999252B2/en active Active
- 2008-07-23 TW TW097128012A patent/TWI397172B/zh active
- 2008-07-23 JP JP2008190041A patent/JP5329142B2/ja active Active
-
2011
- 2011-07-29 US US13/194,142 patent/US8828775B2/en active Active
-
2012
- 2012-11-15 JP JP2012251178A patent/JP2013042178A/ja active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000031525A (ja) | 1998-06-27 | 2000-01-28 | Hyundai Electron Ind Co Ltd | イメ―ジセンサのピンドフォトダイオ―ド及びその製造方法 |
| KR20020020086A (ko) * | 2000-09-07 | 2002-03-14 | 박용 | 씨모스 이미지 센서 |
| KR20020022931A (ko) * | 2000-09-21 | 2002-03-28 | 박종섭 | 씨모스 이미지 센서의 포토다이오드 및 그의 제조방법 |
| KR20030000653A (ko) * | 2001-06-26 | 2003-01-06 | 주식회사 하이닉스반도체 | 이미지센서 제조 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| US20090026510A1 (en) | 2009-01-29 |
| JP2009033167A (ja) | 2009-02-12 |
| TW201320319A (zh) | 2013-05-16 |
| US20120028394A1 (en) | 2012-02-02 |
| JP2013042178A (ja) | 2013-02-28 |
| TW200924181A (en) | 2009-06-01 |
| TWI470779B (zh) | 2015-01-21 |
| US8828775B2 (en) | 2014-09-09 |
| TWI397172B (zh) | 2013-05-21 |
| US7999252B2 (en) | 2011-08-16 |
| KR20090010747A (ko) | 2009-01-30 |
| JP5329142B2 (ja) | 2013-10-30 |
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