KR101019279B1 - 이미지 센서 및 그 제조방법 - Google Patents

이미지 센서 및 그 제조방법 Download PDF

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Publication number
KR101019279B1
KR101019279B1 KR1020070074105A KR20070074105A KR101019279B1 KR 101019279 B1 KR101019279 B1 KR 101019279B1 KR 1020070074105 A KR1020070074105 A KR 1020070074105A KR 20070074105 A KR20070074105 A KR 20070074105A KR 101019279 B1 KR101019279 B1 KR 101019279B1
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South Korea
Prior art keywords
photodiode
doped region
image sensor
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KR1020070074105A
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English (en)
Korean (ko)
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KR20090010747A (ko
Inventor
임연섭
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크로스텍 캐피탈, 엘엘씨
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Priority to KR1020070074105A priority Critical patent/KR101019279B1/ko
Application filed by 크로스텍 캐피탈, 엘엘씨 filed Critical 크로스텍 캐피탈, 엘엘씨
Priority to JP2008190041A priority patent/JP5329142B2/ja
Priority to TW101146681A priority patent/TWI470779B/zh
Priority to US12/219,499 priority patent/US7999252B2/en
Priority to TW097128012A priority patent/TWI397172B/zh
Publication of KR20090010747A publication Critical patent/KR20090010747A/ko
Application granted granted Critical
Publication of KR101019279B1 publication Critical patent/KR101019279B1/ko
Priority to US13/194,142 priority patent/US8828775B2/en
Priority to JP2012251178A priority patent/JP2013042178A/ja
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10Integrated devices
    • H10F39/12Image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/014Manufacture or treatment of image sensors covered by group H10F39/12 of CMOS image sensors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/807Pixel isolation structures
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80Constructional details of image sensors
    • H10F39/802Geometry or disposition of elements in pixels, e.g. address-lines or gate electrodes

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
KR1020070074105A 2007-07-24 2007-07-24 이미지 센서 및 그 제조방법 Active KR101019279B1 (ko)

Priority Applications (7)

Application Number Priority Date Filing Date Title
KR1020070074105A KR101019279B1 (ko) 2007-07-24 2007-07-24 이미지 센서 및 그 제조방법
TW101146681A TWI470779B (zh) 2007-07-24 2008-07-23 影像感測器及其製造方法
US12/219,499 US7999252B2 (en) 2007-07-24 2008-07-23 Image sensor and method for fabricating the same
TW097128012A TWI397172B (zh) 2007-07-24 2008-07-23 影像感測器及其製造方法
JP2008190041A JP5329142B2 (ja) 2007-07-24 2008-07-23 イメージセンサ
US13/194,142 US8828775B2 (en) 2007-07-24 2011-07-29 Image sensor and method for fabricating same
JP2012251178A JP2013042178A (ja) 2007-07-24 2012-11-15 イメージセンサ及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070074105A KR101019279B1 (ko) 2007-07-24 2007-07-24 이미지 센서 및 그 제조방법

Publications (2)

Publication Number Publication Date
KR20090010747A KR20090010747A (ko) 2009-01-30
KR101019279B1 true KR101019279B1 (ko) 2011-03-07

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KR1020070074105A Active KR101019279B1 (ko) 2007-07-24 2007-07-24 이미지 센서 및 그 제조방법

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US (2) US7999252B2 (enExample)
JP (2) JP5329142B2 (enExample)
KR (1) KR101019279B1 (enExample)
TW (2) TWI470779B (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101543664B1 (ko) * 2008-12-08 2015-08-12 삼성전자주식회사 픽셀 어레이 및 이를 포함하는 입체 영상 센서
KR102009931B1 (ko) * 2012-07-06 2019-08-13 에스케이하이닉스 주식회사 씨모스 이미지센서 및 그 제조 방법
US9665604B2 (en) * 2012-07-31 2017-05-30 Schlumberger Technology Corporation Modeling and manipulation of seismic reference datum (SRD) in a collaborative petro-technical application environment
TWI538175B (zh) * 2013-12-24 2016-06-11 光引研創股份有限公司 以慢光增強吸收之鍺光偵測器
US10918650B2 (en) 2016-06-02 2021-02-16 University Of South Florida Method of treating melanoma using an inhibitor of an atypical protein kinase C
US11348955B2 (en) * 2018-06-05 2022-05-31 Brillnics Singapore Pte. Ltd. Pixel structure for image sensors
JP7470040B2 (ja) * 2018-07-09 2024-04-17 株式会社 資生堂 情報処理装置、プログラム、及び、情報処理方法
CN109979955B (zh) * 2019-04-03 2021-06-18 上海华力微电子有限公司 一种半导体结构及其制造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031525A (ja) 1998-06-27 2000-01-28 Hyundai Electron Ind Co Ltd イメ―ジセンサのピンドフォトダイオ―ド及びその製造方法
KR20020020086A (ko) * 2000-09-07 2002-03-14 박용 씨모스 이미지 센서
KR20020022931A (ko) * 2000-09-21 2002-03-28 박종섭 씨모스 이미지 센서의 포토다이오드 및 그의 제조방법
KR20030000653A (ko) * 2001-06-26 2003-01-06 주식회사 하이닉스반도체 이미지센서 제조 방법

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4419238B2 (ja) * 1999-12-27 2010-02-24 ソニー株式会社 固体撮像素子及びその製造方法
JP4972838B2 (ja) * 2001-09-12 2012-07-11 ソニー株式会社 固体撮像素子及びその製造方法
JP4882207B2 (ja) * 2004-04-28 2012-02-22 ソニー株式会社 固体撮像素子
KR101069103B1 (ko) 2004-07-29 2011-09-30 크로스텍 캐피탈, 엘엘씨 전하운송효율을 향상시키기 위한 이미지센서 및 제조 방법
KR100660275B1 (ko) * 2004-12-29 2006-12-20 동부일렉트로닉스 주식회사 씨모스 이미지 센서 화소의 전달 트랜지스터 및 그 제조방법
US7728330B2 (en) * 2005-08-24 2010-06-01 Aptina Imaging Corporation CMOS imager with nitrided gate oxide and method of fabrication
JP4951898B2 (ja) * 2005-08-26 2012-06-13 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法および固体撮像素子を用いた画像撮影装置
KR100723137B1 (ko) * 2005-11-24 2007-05-30 삼성전기주식회사 포토다이오드 소자 및 이를 이용한 광센서용 포토다이오드어레이

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000031525A (ja) 1998-06-27 2000-01-28 Hyundai Electron Ind Co Ltd イメ―ジセンサのピンドフォトダイオ―ド及びその製造方法
KR20020020086A (ko) * 2000-09-07 2002-03-14 박용 씨모스 이미지 센서
KR20020022931A (ko) * 2000-09-21 2002-03-28 박종섭 씨모스 이미지 센서의 포토다이오드 및 그의 제조방법
KR20030000653A (ko) * 2001-06-26 2003-01-06 주식회사 하이닉스반도체 이미지센서 제조 방법

Also Published As

Publication number Publication date
US20090026510A1 (en) 2009-01-29
JP2009033167A (ja) 2009-02-12
TW201320319A (zh) 2013-05-16
US20120028394A1 (en) 2012-02-02
JP2013042178A (ja) 2013-02-28
TW200924181A (en) 2009-06-01
TWI470779B (zh) 2015-01-21
US8828775B2 (en) 2014-09-09
TWI397172B (zh) 2013-05-21
US7999252B2 (en) 2011-08-16
KR20090010747A (ko) 2009-01-30
JP5329142B2 (ja) 2013-10-30

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