KR101016240B1 - Lighting device with led and led lighting device prepared thereby - Google Patents

Abstract

PURPOSE: An LED lighting apparatus sealing method and an LED lighting apparatus manufactured by the same are provided to improve the productivity by implementing the sealing electrically and waterproofing of the LED substrate rapidly. CONSTITUTION: An LED substrate(10) made of PCB substrate for lighting purpose is prepared. The LED substrate for lighting purpose is combined to a supporting frame. The resin is made in the glass transition temperature condition of 100 to 250 °C. The plate resin is formed by being combined to the top of the LED substrate for lighting.

Description

Confidential method of LED lighting device and LED lighting device produced thereby {LIGHTING DEVICE WITH LED AND LED LIGHTING DEVICE PREPARED THEREBY}

The present invention relates to an airtight method of an LED lighting device and an LED lighting device manufactured thereby, and more particularly, it is possible to perform the airtight of the upper part of the LED substrate at a much faster speed than the conventional method, and the external impact during the process This does not occur even if this occurs, it relates to the airtight method of the LED lighting apparatus and the LED lighting apparatus manufactured by this can be obtained the effect that can improve the productivity and reduce the manufacturing cost.

Conventional lighting equipment used at night or indoors is a device that converts electrical energy into light energy by receiving power, and incandescent lamps or fluorescent lamps have been generally used.

Among them, incandescent lamps are warm in color and do not need any accessory for lighting, and they can be easily combined with lighting fixtures, and have been used in recent years despite short lifespan and high power consumption.

Recently, however, there have been attempts to totally prohibit the use of incandescent lamps due to energy efficiency and environmental problems, and as a result, the use of fluorescent lamps, which have the advantages of higher electric efficiency and longer life than incandescent lamps, is increasing. The use of lighting devices using light emitting diodes (LEDs) is being promoted nationally.

The LED lighting is smaller than the conventional light source, has a long life, and has an advantage of excellent power efficiency because electrical energy is directly converted into light energy. Examples of such LED lighting fixtures are shown in Korean Patent Application Nos. 10-2007-37353, 10-2008-114261, and 10-2009-10808.

However, in the manufacture of such LED lighting device, the LED substrate for the LED coupled to the PCB is not only the LED, but also other components such as resistors, capacitors, IC chips, etc., and these components and the LED is operating the lighting Since the stable operation is possible only when the insulation and the waterproof to the external environment in the environment is possible, it is necessary to insulate and waterproof the upper portion of the printed circuit board (PCB).

Conventionally, in performing the insulation process, first, the LED substrate for LEDs coupled to the PCB is coupled to the frame having a heat dissipation fin, and then poured a liquid resin on top of the LED substrate for illumination to isolate the upper portion from the outside. Insulation treatment was performed by a curing method.

However, such a process requires a lot of time to cure the liquid resin, which leads to a decrease in productivity, a great care must be taken to prevent the liquid resin from flowing downward, and the assembly must be safely stored from external impact during the curing process. Before solidifying to some extent, there is a problem to be stored while maintaining a horizontal.

Therefore, there is an urgent need to develop a new airtight method that can solve such problems and the LED lighting device manufactured thereby.

In order to solve the problems of the prior art as described above, the present invention can be carried out airtight of the upper LED substrate at a much faster speed than the conventional method, even if an external impact occurs during the process does not occur, It is an object of the present invention to provide an airtight method of LED lighting apparatuses, and LED lighting apparatuses manufactured thereby, which can achieve an effect of improving productivity and reducing manufacturing costs.

In order to achieve the above object, the present invention

Preparing an LED substrate for illumination, the PCB substrate having at least one LED coupled thereto;

Coupling the lighting LED substrate to a support frame that supports the lighting LED substrate to be open at an upper portion thereof;

A plate-shaped resin body made of a resin having a glass transition temperature of 100 to 250 ° C., having a hollow portion corresponding to an open top surface of the lighting LED substrate coupled to the support frame, and corresponding to an LED coupled to an upper portion of the lighting LED substrate. Coupling an upper portion of the lighting LED substrate to form an assembly; And,

Heating the assembly to the glass transition temperature to allow the vitrified resin body to airtightly bond the remaining part of the lighting LED substrate except for the upper part of the LED, and then cooling the LED lighting. Provide a method of confidentiality of the Organization.

Also,

Preparing an LED substrate for illumination comprising a PCB substrate having at least two LEDs coupled thereon;

Coupling the lighting LED substrate to a support frame that supports the lighting LED substrate to be open at an upper portion thereof;

Made of a resin having a glass transition temperature of 100 to 250 ℃, disposed on the open top surface of the illumination LED substrate bonded to the support frame, at least two having a hollow portion corresponding to the LED coupled to the upper portion of the illumination LED substrate Coupling a discontinuous plate-shaped resin body to an upper portion of the lighting LED substrate to form an assembly; And,

Heating the assembly to the glass transition temperature to allow the vitrified resin body to airtightly bond the remaining part of the lighting LED substrate except for the upper part of the LED, and then cooling the LED lighting. Provide a method of confidentiality of the Organization.

In addition to the present invention

In the LED lighting device,

LED substrate for illumination consisting of a PCB substrate coupled to the upper LED;

A support frame for supporting the illumination LED substrate to be open at an upper portion thereof; And,

According to the airtight method of the above-described LED lighting apparatus of the present invention, there is provided an LED lighting apparatus comprising a resin layer which is hermetically adhered to an upper surface of the LED substrate for illumination.

According to the airtight method of the LED lighting device of the present invention and the LED lighting device produced thereby, it is possible to perform the airtight (for insulation and waterproofing) of the LED substrate at a much faster speed than the conventional method, Even when an impact occurs, defects do not occur, thereby improving productivity and reducing manufacturing costs.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

The present invention relates to an airtight method of an LED lighting device, comprising the steps of: preparing an LED substrate for illumination (10) consisting of a PCB (14) substrate having at least one LED (12) coupled thereon; Coupling the illumination LED substrate 10 to a support frame 20 that supports the illumination LED substrate 10 to be opened; LEDs made of a resin having a glass transition temperature of 100 to 250 ° C., corresponding to an open top surface of the lighting LED substrate 10 coupled to the support frame 20, and coupled to an upper portion of the lighting LED substrate 10. Combining the plate-shaped resin body 30 having the hollow part 32 corresponding to (12) to an upper portion of the lighting LED substrate 10 to form an assembly; And heating the assembly to the glass transition temperature so that the remaining resin part of the lighting LED substrate 10 except for the upper part of the LED 12 is hermetically bonded to the vitrified (glass transition) resin. It consists of a configuration comprising the step of cooling.

That is, as shown in the specific example in FIG. 1, at least one LED 12 is prepared with an LED substrate 10 for illumination consisting of a PCB 14 substrate coupled thereon. The LED board for illumination does not necessarily have to be a rod-shaped as shown, and various types of substrates to which LEDs required for a conventional LED lighting apparatus are attached may correspond thereto. An example of this is as shown in the first drawing of FIG. 1.

Such a lighting LED substrate is usually coupled to a support frame provided with a heat dissipation fin or the like for supporting the substrate and dissipating heat generated from the LED. That is, the step of coupling the illumination LED substrate 10 to the support frame 20 for supporting the illumination LED substrate 10 to be opened. The shape of the support frame may be configured in various ways depending on the shape of the substrate and the coupling form with the substrate, examples of the support frame are also shown in the prior art described above, Figure 1 is a state in which the support frame is coupled The side cross section at is shown and shown. In the following drawings, the support frame is not shown for convenience of description.

Next, instead of the conventional liquid resin coating fabric is made of a resin having a glass transition temperature of 100 to 250 ℃, corresponding to the open top surface of the illumination LED substrate 10 bonded to the support frame 20, the illumination Coupling the plate-shaped resin body 30 having the hollow portion 32 corresponding to the LED 12 coupled to the upper portion of the LED substrate 10 to the upper portion of the lighting LED substrate 10 to form an assembly. do. That is, it maintains a certain level of high temperature stability under the operating condition of LED lighting (stable under 100 ℃) and at the same time, the glass transition of resin without causing thermal damage of LED in the heat treatment process to be carried out for airtightness. It may be thermally damaged when it is heated above 200 ℃.) It is made of resin having a glass transition temperature in the range that fills the gap and enables adhesion / confidence, and the LED is exposed to the outside. It joins the plate-shaped resin body which has a coverable shape on top.

Next, when the assembly is heated to a glass transition temperature (Tg, Glass Transition Temperature) or higher of the plate-shaped resin body, the plate-shaped resin body is glass transition (vitrified), the resin body and the substrate to reduce the surface area The gap between the resin body and the parts such as the LED is filled to fill all the gaps between the substrate and airtight while forming an insulating layer.Then, the LED is made airtight / adhesive when cooled by a method such as being left at room temperature. You can get a lighting fixture. That is, the assembly is heated to at least the glass transition temperature so that the remaining vitrified (glass transition) resin body is hermetically adhered to the remaining portion of the LED substrate 10 for illumination except for the upper portion of the LED 12. The cooling step is performed. In this case, since the glass sheet is generated by heating the solid plate resin body above the glass transition temperature of the resin, the airtight adhesion is completed even with a short heating time of 3 to 5 minutes, and the process is completed by simply cooling it afterwards. Therefore, productivity and process cost are reduced.

In addition, as shown in the specific example of Figure 2, in order to more secure the contact and airtight between the LED side and the hollow side of the plate-shaped resin body, preferably, the resin body 30 is the thickness of the PCB substrate A first thinner than the height of the LED 12 protruding from the (14), corresponding to the open top surface of the LED panel for illumination 10, and corresponding to the LED 12 coupled to the upper portion of the LED panel for illumination 10 The LED 12 having a first plate-shaped resin body 34 having a hollow portion 32 'and a second hollow portion 36 corresponding to the LED 12 coupled to the upper portion of the lighting LED substrate 10. A second plate-shaped resin body 38 surrounding the periphery, and the first plate-shaped resin body 34 and the second plate-shaped resin body 38 are laminated and bonded to an upper portion of the lighting LED substrate 10. To form an assembly.

As shown in the specific example of FIG. 2, after laminating the first plate-shaped resin body 34, the LED protrudes slightly above the upper surface of the first plate-shaped resin body 34, and the second plate-shaped When the resin body 38 is laminated in the form of sandwiching the protruding LED, an assembly having a shape similar to the perspective view shown in the end of FIG. 2 is formed, and the cross-sectional structure thereof is as shown in the end of FIG. Next, when all of them are heated, more resin may flow between the side of the LED and the side of the hollow parts of the plate-shaped resin body according to the addition of the second plate-shaped resin body, so that the airtightness and adhesion between the sides may be smoothly performed. Can exhibit airtight-adhesive properties. In addition, the plate-shaped resin body may be manufactured by using a mold or the like in a form corresponding to the shape in which the first and second plate-shaped resin bodies are combined. That is, the plate-shaped resin body may be formed of an integral plate-shaped resin body in which the first plate-shaped resin body and the second plate-shaped resin body are combined.

Alternatively, when the number of LEDs mounted on the LED board for lighting has a plurality, the tolerance of the hollow part may not be taken strictly. In other words, when a plurality of LEDs are mounted on one lighting LED substrate, the LEDs to be mounted are not uniformly arranged at all times, but the position of the LEDs to be mounted is not always constant but is uniformly arranged. Therefore, the hollow portion of the plate-shaped resin body to be fitted to the LED can not be fitted in a position that fits properly to each LED, in order to allow the hollow portion to be fitted to each LED is allowed in the tolerance of the LED size itself and the arrangement of each LED The size and position should be set in consideration of the tolerances. Therefore, a gap may occur between the LED side and the hollow portion of the plate-shaped resin body, and if the gap is too large, a problem may occur in which airtightness is less after heat treatment. Therefore, even if the tolerance for the size of the LED itself is eliminated, in the case of removing the tolerance for the arrangement of each LED, it is possible to significantly reduce the gap between the LED and the hollow part to improve the airtight adhesion.

To this end, preparing a lighting LED substrate 10 consisting of a PCB substrate 14, the at least two LEDs 12 are coupled to the top; Coupling the illumination LED substrate 10 to a support frame 20 that supports the illumination LED substrate 10 to be opened; Made of a resin having a glass transition temperature of 100 to 250 ℃, the LED is disposed on the open top surface of the lighting LED substrate 10 coupled to the support frame 20, the LED coupled to the upper portion of the lighting LED substrate 10 Coupling at least two discontinuous plate-shaped resin bodies 30 'having hollow portions 32 corresponding to the upper portions of the illumination LED substrate 10 to form an assembly; And heating the assembly to the glass transition temperature so that the vitrified resin body is hermetically adhered to the remaining portion of the lighting LED substrate 10 except for the upper portion of the LED 12 and then cooled. Including airtight method of LED lighting fixtures can be performed.

A specific example thereof is as shown in FIG. 3. That is, the discontinuous plate-shaped resin body formed in the hollow part in consideration of the tolerance of the size of the LED itself may be fitted to the LED, ignoring the tolerance for the arrangement of the LED, and the tolerance for the LED arrangement may be It can be offset by discontinuous parts.

The discontinuous portion may be left as it is, if there are no parts to be hermetically sealed or insulated separately from the discontinuous portion. Preferably, for airtightness of the portion, i) the liquid resin is applied to the discontinuous section of the plate-shaped resin body and then cured. Or ii) applying a resin powder having a glass transition temperature of 100 to 250 ° C. in the discontinuous section of the plate-shaped resin body or inserting a plate-shaped resin body (one or a plurality) corresponding to the discontinuous section. After heating to a glass transition temperature, the step of cooling and curing may be further included.

In the case of the i) for applying the liquid resin may be carried out before or after the heating step for the contact airtight of the assembly in which the plate-shaped resin body is bonded, in the case of the ii) for applying the resin powder, the plate-shaped resin body is bonded Before or after the heating step for contact airtightness of the assembly, or as a separate step, or by forming a granulated resin body assembly, in addition to applying a resin powder to the discontinuous portion through a heat treatment to heat the whole at once In addition, the heat treatment of the discontinuous section in the heating step for contact airtight of the assembly in which the plate-shaped resin body is combined may also be made.

In addition, the bonding through such a plate-like resin body, as shown in the specific example in Figure 4, between the additional LED plate and the support frame for illumination, further inserting a separate lower plate-like resin body 40 and heating it, Cooling can also be applied to join the LED board and the support frame for lighting. That is, the plate-like resin body as described above may be additionally added between the illumination LED substrate and the support frame and also applied to join the illumination LED substrate and the support frame through a process of heating it, and the heating process may be applied to the substrate. The heat treatment for vitrification of the upper plate-like resin body may be performed all at once, or may be carried out separately.

As the resin applied to the plate-shaped resin body, a common thermoplastic resin may be applied thereto, and preferably, a resin for hot-melt may be manufactured, and in this case, a typical ethylene vinyl acetate resin and styrene-based resin for hot melt may be used. Block copolymers, polyesters, polyamides, and polyurethane-based resins.

In addition, the plate-shaped resin body further includes an intaglio recessed portion corresponding to other components other than the LED bonded to the PCB substrate on the lower surface of the plate-shaped resin body to facilitate adhesion with other components, the number of platelets after adhesion The top of the retardation can be made flat.

In addition, the present invention provides an LED lighting device that is hermetically sealed by the above-described method, which includes: an LED lighting device (10) consisting of a PCB substrate (14) having an LED (12) coupled thereon; A support frame 20 for supporting the lighting LED substrate 10 to be open at an upper portion thereof; And, through the airtight method of the LED lighting apparatus of the present invention described above may be made of a configuration including a resin layer which is airtightly bonded to the upper surface of the LED substrate for illumination.

The LED lighting device may correspond to various conventional LED lighting devices, and a specific example thereof may include a bar-type LED lighting device, and in this case, a resin layer that is hermetically adhered to an upper surface of the LED board for lighting. Is characterized in that it is formed through the airtight method of the present invention.

In addition, it may further include a lower plate-like resin body 40 between the lighting LED substrate and the support frame, the lower plate-like resin body to serve to insulate and waterproof the lower portion of the lighting LED substrate.

The present invention described above is not limited to the above-described embodiment and the accompanying drawings, and various modifications and changes made by those skilled in the art without departing from the spirit and scope of the present invention described in the claims below. Changes are also included within the scope of the invention.

1 is a view sequentially showing a schematic method of an embodiment of the airtight method of the LED lighting device of the present invention.

2 is a view sequentially showing a schematic method of another embodiment of the airtight method of the LED lighting device of the present invention.

3 is a view sequentially showing a schematic method of another embodiment of the airtight method of the LED lighting device of the present invention.

4 is a schematic cross-sectional view of the airtight by the airtight method of the LED lighting apparatus of the present invention and in the case of further performing the bonding between the substrate and the support frame.

Explanation of symbols on the main parts of the drawings

10: LED substrate for illumination 12: LED

14: PCB substrate 20: support frame

30, 30 ': plate-shaped resin body 32: hollow part

32 ': 1st hollow part 34: 1st plate-shaped resin body

36: 2nd hollow part 38: 2nd plate-shaped resin body

40: lower plate-like resin body

Claims (7)

Preparing an LED substrate for illumination, the PCB substrate having at least one LED coupled thereto; Coupling the lighting LED substrate to a support frame that supports the lighting LED substrate to be open at an upper portion thereof; A plate-shaped resin body made of a resin having a glass transition temperature of 100 to 250 ° C., having a hollow portion corresponding to an open top surface of the lighting LED substrate coupled to the support frame, and corresponding to an LED coupled to an upper portion of the lighting LED substrate. Coupling an upper portion of the lighting LED substrate to form an assembly; And, Heating the assembly to the glass transition temperature to allow the vitrified resin body to airtightly bond the remaining part of the lighting LED substrate except for the upper part of the LED, and then cooling the LED lighting. Confidential Method of the Organization. The method of claim 1, The resin body is a) a first plate-like resin body having a first hollow portion that is thinner than the height of the LED protruding from the PCB substrate, corresponding to the open top surface of the LED substrate for illumination, and corresponding to the LED coupled to the top of the LED substrate for illumination And a second plate-shaped resin body surrounding the LED having a second hollow portion corresponding to the LED coupled to the upper portion of the lighting LED substrate, or b) the first plate-shaped resin body and the second plate-shaped resin body It consists of an integral plate-like resin body of the combined form, In the case of a), the first plate-like resin body and the second plate-like resin body is laminated and bonded to the upper portion of the LED substrate for lighting to form an assembly of the LED lighting mechanism, characterized in that. Preparing an LED substrate for illumination comprising a PCB substrate having at least two LEDs coupled thereon; Coupling the lighting LED substrate to a support frame that supports the lighting LED substrate to be open at an upper portion thereof; Made of a resin having a glass transition temperature of 100 to 250 ℃, disposed on the open top surface of the illumination LED substrate bonded to the support frame, at least two having a hollow portion corresponding to the LED coupled to the upper portion of the illumination LED substrate Coupling a discontinuous plate-shaped resin body to an upper portion of the lighting LED substrate to form an assembly; And, Heating the assembly to the glass transition temperature to allow the vitrified resin body to airtightly bond the remaining part of the lighting LED substrate except for the upper part of the LED, and then cooling the LED lighting. Confidential Method of the Organization. The method of claim 3, The airtight method of the LED lighting device, characterized in that it further comprises the step of curing after applying the liquid resin in the discontinuous section of the plate-shaped resin body. The method of claim 3, Applying a resin powder having a glass transition temperature of 100 to 250 ℃ in the discontinuous section of the plate-shaped resin body, or inserting a plate-shaped resin body corresponding to the discontinuous section, then heated to a glass transition temperature and then cooled and cured further Airtight method of LED lighting apparatus comprising a. 6. The method according to any one of claims 1 to 5, The airtight method of the LED lighting device, characterized in that the plate-shaped resin body is made of a resin for hot melt. In the LED lighting device, LED substrate for illumination consisting of a PCB substrate coupled to the upper LED; A support frame for supporting the illumination LED substrate to be open at an upper portion thereof; And, An LED lighting apparatus comprising a resin body layer which is hermetically adhered to an upper surface of the LED substrate for illumination through the airtight method of the LED lighting apparatus according to any one of claims 1 to 5.

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