TWI398596B - LED lamp module of the process - Google Patents

Description

LED lamp module process

The invention provides a process for an LED lamp module, in particular to a lamp process which can reduce the LED damage rate and improve the weather resistance of the LED lamp.

Because LED has the advantages of small size, power saving, shock resistance, fast response, long life, etc., LED has been widely used in screen displays or lighting devices as a light source for display and illumination. For example, LED backlights, backlights and key sources for mobile phones, and automotive lights and dashboards can all be seen in LED applications.

The process of the conventional LED lamp includes the following steps: First, the solder paste is printed on the plating contact (or the jack) on the surface of the circuit board by using a solder paste printer; then, the pins of the LED, the electronic component and the IC are mounted. Attached or inserted into the plating contact of the circuit board, and then the circuit board including the LED, the electronic component, and the IC is heated by a high temperature of the reflow furnace to a melting temperature of the solder paste by a reflow furnace. After the solder paste is melted, the circuit substrate is cooled down to the melting temperature of the solder paste to cure the solder paste, and the LED, the electronic component and the IC are adhered to the circuit substrate to form an electrical connection, and finally the thermal adhesive is applied to the bottom of the circuit substrate. After that, it is attached to the heat sink by screwing or other fixing means, that is, the combination of the conventional LED circuit substrate and the heat sink is completed.

Conventional LEDs and circuit boards are manufactured by the above process, and although the LEDs are disposed on the circuit substrate to form an electrical connection, and the circuit substrate can be combined with the heat sink, such a combination is not sufficient in terms of tightness and strength. Especially in an environment where the temperature difference is drastically changed, there is a possibility that the result of the separation causes the heat applied to the circuit substrate by the LED to be dissipated or reduced via the heat sink. Therefore, the manufacturer implements the thermal conductive adhesive with a more compact thermosetting thermal conductive adhesive. When a thermosetting thermal conductive adhesive is used as the bonding medium, the LED, the circuit board and the heat sink must be simultaneously used for the second time. Time (tens of minutes) high temperature (up to 150 degrees C or more) baking, to make the thermosetting thermal adhesive curing and setting, this long time (tens of minutes) high temperature (up to 150 degrees C or more) baking, no doubt This will make the LED easy to cause light decay and damage due to high temperature.

In view of the combination of the conventional LED and the circuit substrate, the method of soldering and re-adhesive, and the secondary high temperature required for curing the thermosetting heat-conductive adhesive causes the LED to have a light decay and a loss of damage. How to develop a LED lamp module process that can reduce the LED damage rate is a problem that LED lamp manufacturers are currently to overcome.

The main technical means of the present invention is to provide a process for an LED lamp module, which mainly applies a thermal conductive adhesive to a bottom of a circuit substrate, and then combines the circuit substrate and the heat sink for thermal curing to make the circuit substrate and the heat sink. The heat dissipation module is formed first, and then the solder paste is printed on the plating contact on the surface of the circuit board of the heat dissipation module, and the pins of the LED, the electronic component and the IC are connected to the plating contact on which the solder paste is printed, and finally After re-melting the solder paste through the reflow furnace, the LED is soldered on the circuit board, and finally the circuit substrate is cooled to solidify the solder paste. By combining the thermal curing of the circuit substrate and the heat sink, the LED can be effectively prevented from being damaged by the secondary heat treatment, thereby reducing the probability of LED light decay and damage, and improving the weather resistance of the LED lamp.

In order to enable the examiner to better understand the process of the present invention and the effects that can be achieved, the following description is in conjunction with the following: First, please refer to Figures 1, 2, 3, 4 and 5, the LED lamp module of the present invention. The process steps are as follows: the thermal conductive adhesive 2 is applied on the bottom of the circuit substrate 1 (which can be implemented by a thermosetting thermal conductive adhesive), and then the circuit substrate 1 coated with the thermal conductive adhesive 2 and the heat sink 3 are thermally cured. In combination, the circuit board 1 and the heat sink 3 are first formed to form a heat dissipation module, and then the surface of the circuit board 1 of the heat dissipation module is subjected to solder paste printing, so that the solder paste 4 is filled on the plating contact 11 on the surface of the circuit substrate 1 ( In practice, it is also possible to plate the through holes to perform the above steps, and then connect the pins of the LEDs, the electronic parts and the ICs to the plating contacts 11 on which the solder paste 4 has been printed, and then place the circuit substrate 1 in the reflow furnace. The solder paste 4 is re-melted, and the pins of the LED, the electronic component, and the IC are soldered to the circuit board 1. Finally, the circuit board 1 is cooled to cure the solder paste 4, thereby completing the manufacturing process of the present invention.

The invention firstly applies the thermal conductive adhesive 2 to the bottom of the circuit substrate 1, and then combines with the heat sink 3 for thermal curing, so that the circuit substrate 1 and the heat sink 3 are first formed into a heat dissipation module, and then the solder paste 4 is printed on the heat dissipation mold. On the plating contact 11 on the surface of the circuit board 1 of the group, the pins of the LED, the electronic component and the IC are attached to the plating contact 11 on which the solder paste 4 is printed, and finally the circuit substrate 1 of the heat dissipation module is passed back. The soldering furnace re-melts the solder paste 4 so that the pins of the LED, the electronic component, and the IC can be soldered to the circuit board 1. Since the high temperature required for the combination of the circuit board 1 and the heat sink 3 in the heat curing is about 150 degrees C, the curing operation of the heat curing time is about 25 minutes to 50 minutes, thereby effectively preventing the LED from proceeding again. The secondary heat treatment can effectively reduce the probability of light decay and damage of the LED, thereby improving the yield of the LED lamp module and improving the weather resistance of the LED lamp.

In summary, the process of the LED lamp module of the present invention does have a high degree of industrial use value, and has the requirements of novelty and progress, and the application for the invention patent is filed according to law, and the reviewing committee is allowed to grant the invention patent right. To the sense of virtue.

1. . . Circuit substrate

11. . . Plating joint

2. . . Thermal adhesive

3. . . heat sink

4. . . Solder paste

Figure 1 is a flow chart of the process of the LED lamp module of the present invention.

2 is an exploded perspective view of the circuit substrate and the heat sink of the present invention.

Figure 3 is a schematic view showing the combination of the circuit substrate and the heat sink of the present invention.

4 is a schematic view showing the LED, the electronic component, and the IC of the present invention disposed on a circuit board.

Figure 5 is a schematic cross-sectional view of the four sections.

Claims (3)

The process of the LED lamp module is as follows: firstly, the bottom of the circuit substrate is coated with a thermal conductive adhesive, and then the circuit substrate and the heat sink are thermally cured, so that the circuit substrate and the heat sink are first formed into a heat dissipation module. Then, the solder paste is printed on the plating contact on the surface of the circuit board of the heat dissipation module, and the pins of the LED, the electronic component and the IC are connected to the plating contact on which the solder paste is printed, and finally passed through the reflow furnace. Re-melting the solder paste to solder the LED to the circuit board. The process of the LED lamp module according to claim 1, wherein the thermal adhesive is a thermosetting thermal adhesive. The process of the LED lamp module according to claim 1, wherein the plated contact is a plated through hole.