201219701 六、發明說明： 【發明所屬之技術領域】 本發明係提供一種L ED燈具模組之製程，尤指於可降低乙 E D損壞率及提升L E D燈具耐候性之燈具製程。 【先前技術】 由於L E D具有體積小、省電、耐震、反應快、壽命長等優 點，因此，LED已普遍的使用於螢幕顯示器或照明裝置，以當 馨作顯示、照明之光源。例如，液晶顯示器的背光源、手機的背光 源與按鍵光源、以及汽車的車燈與儀表板等等皆可看到L ed的 應用。 習知LED燈具的製程，包括以下步驟··首先，湘錫膏印 刷機在電路基板表_電鍍無（亦可為減）上_錫膏；接 著將L E D冑子零件及I c的接腳貼上或插入於電路基板之 電鑛接點中，接著包含有LED、電子零件及丨c之電路基板通 鲁過-迴焊爐，藉由迴焊爐之高溫來加溫至錫膏_化溫度以上而 將錫膏融化之後再將電路基板降溫至錫膏的融化溫度以下而將 锡膏固化使L E D、電子零件及！ c黏著於電路基板上形成電 性賴’最後將於魏基板底部塗佈導鱗後，以_或其他固 定方式來醜於散熱片上，即完^，led電路基板與散熱片 之結合。 S知之L E D與電路基板藉由上述製程，雖然可達到將匕E Dex置於電路基板均成電錢接，同時可將電絲板結合散熱 3 201219701 4，細，這樣的結合在緊密性和強度上並不足夠，尤其是在溫201219701 VI. Description of the Invention: [Technical Field] The present invention provides a process for a L ED lamp module, especially a lamp process that can reduce the E E damage rate and improve the weather resistance of the L E D lamp. [Prior Art] Since L E D has the advantages of small size, power saving, shock resistance, fast response, and long life, LEDs have been widely used in screen displays or lighting devices to be used as a light source for display and illumination. For example, the backlight of a liquid crystal display, the backlight and key source of a mobile phone, and the lights and dashboards of a car can be seen in the application of L ed. The process of the conventional LED lamp includes the following steps: · First, the Xiang tin paste printing machine is on the circuit board table _ electroplating no (also can be reduced) _ solder paste; then the LED 胄 parts and I c pin stickers Inserted into the electric ore joint of the circuit substrate, and then the circuit board containing the LED, the electronic component and the 丨c is passed through the reflow furnace, and is heated to the solder paste by the high temperature of the reflow furnace. After the solder paste is melted, the circuit board is cooled to a temperature below the melting temperature of the solder paste, and the solder paste is cured to make LEDs and electronic components. c is adhered to the circuit substrate to form an electrical ray. Finally, after the scale is coated on the bottom of the Wei substrate, it is ugly on the heat sink by _ or other fixing means, that is, the combination of the led circuit substrate and the heat sink. S knows the LED and the circuit board by the above process, although it can be achieved by placing the 匕E Dex on the circuit substrate, and the wire can be combined with the heat sink 3 201219701 4, fine, such a combination in tightness and strength Not enough, especially at temperature
度差異劇烈的變化的魏中時，有可能產生分離的結果而導致L ED加諸於電路基板的熱量無法經由散熱片散出或降低。因此業 —者將該導熱膠以緊密性更高的熱_導熱黏膠實施，當使用熱固 .型導熱黏膠來作為連結介質時，該L ED、電路板及散熱片必須 同時進行第二欠的長時瞻十分鐘）高溫（高達1 5 0度C以上） =、烤一來令熱固型導熱黏勝固化定型，此種長時間（數十分鐘）高 ▲(门達1 5 0度C以上）的烘烤，無疑的會使該L ED將容易因 馬溫產生光衰及損壞之情形。 “有知之L E D與電路基板之結合方式，以先焊接再黏 著的方式，而該熱固型導熱黏膠固化定型所需之二次高溫，造成 產生光衰及易損壞之缺失，是以，要如何開發出—可降低 L ED知壞率之l eD燈具模組製程，實為目前L ED燈具製造 業者所亟待克服之課題。 _【發明内容】 本發明之主要猶手段，乃在提供-種L E D燈具模組之製 &其主要係將電路基板底部塗料讎，㈣電路基板與散熱 片先作熱固化之結合，使電路基板與散熱片先行形成散熱模組， 接著錫膏印刷於散熱模纟竭電路基絲面之電鍵接點上 ，並將L E D、電子零件及丨c等之接腳接設於已印有齡之電錢接點， 最後再經過迴爐的重新炼融錫膏，使L ED焊接於電路基板 i ’最後將電路基板冷卻使錫膏固化。藉由電路基板無熱片先 201219701 行熱固化結合，可有效避免L E D進行二次熱處理而受損，進而 降低L E D產生光衰及損壞之機φ，以及提升L E D燈具耐候性。 【實施方式】 為使貴審查員能更了解本發明之製程及所能達成之功效， 茲配合圖式說明如後： 五所示，本發明L E D燈 首先’請參閱圖一、二In the Weizhong time when the degree of difference is drastically changed, there is a possibility that the result of the separation causes the heat applied to the circuit substrate by the L ED to be dissipated or reduced via the heat sink. Therefore, the thermal adhesive is implemented by a more compact thermal-thermal adhesive. When a thermosetting thermal adhesive is used as the bonding medium, the L ED, the board and the heat sink must be simultaneously used as the second. Long time lag of 10 minutes) High temperature (up to 150 degrees C or more) =, roasting to make the thermosetting heat conduction sticky curing stereotype, this long time (tens of minutes) high ▲ (door up to 1 500) Baking above C, undoubtedly will make the L ED easy to cause photo-damage and damage due to Ma Wen. "The combination of the LED and the circuit board is known to be welded and then adhered. The thermostatic heat-conductive adhesive cures the secondary high temperature required for the shaping, resulting in the loss of light decay and easy damage. How to develop a process that can reduce the L ED know-how rate, which is a problem that the current L ED luminaire manufacturers urgently need to overcome. _ [Summary] The main means of the present invention is to provide The LED lamp module system is mainly composed of a circuit substrate bottom coating, (4) a combination of a circuit substrate and a heat sink for thermal curing, so that the circuit substrate and the heat sink are first formed into a heat dissipation module, and then the solder paste is printed on the heat dissipation mold. Exhausting the key contacts of the base surface of the circuit, and connecting the pins of LEDs, electronic parts and 丨c to the printed money contacts, and finally re-smelting the solder paste through the furnace. The L ED is soldered to the circuit substrate i 'finally, the circuit substrate is cooled to solidify the solder paste. By the thermal curing of the circuit substrate without the hot film first 201219701, the LED can be effectively prevented from being damaged by the secondary heat treatment, thereby reducing the LED. The machine for generating light decay and damage φ, and improving the weather resistance of the LED lamp. [Embodiment] In order to enable the examiner to better understand the process of the present invention and the effect that can be achieved, the following description is provided with the following description: The LED lamp of the present invention firstly 'please refer to Figure 1 and 2
具模組之製程的步驟：係先於電路基板丨底部塗料熱膠2 (實 施時可以熱固型導熱黏膠來實施），接著將塗有導熱膠2之電路基 板1與散熱片3作熱固化之結合，使電路基板u散熱片3先行 形成散熱模組’而後將散熱模_電路基板丨之表面做锡膏印刷 之處理’使錫膏4填充於電路基板！表面之統接(實務The process of the module process is: before the circuit substrate 涂料 bottom coating hot glue 2 (implemented by the thermosetting type thermal conductive adhesive), and then the circuit board 1 coated with the thermal adhesive 2 and the heat sink 3 are heated The combination of the curing causes the circuit board u heat sink 3 to form the heat dissipation module first, and then the surface of the heat dissipation mold _ the circuit board 做 is solder paste printed 'fills the solder paste 4 on the circuit substrate! Surface connection (practice
上亦可以電麟孔來實施）上，接著將L E D、電子零件及I C 之接腳接設於已印有錫膏4之電難點！ i中，再將電路基板工 放入迴焊爐中重聽_膏4，使L E D、電子轉及丨c之接 腳焊接於電路基板i上，最赌電路基板i冷卻使錫膏相化， 即完成本發明之製作流程。 本發明藉由將電路基板1底部先塗料熱膠2，再與散熱片 ★，乍:固化之結合’使電路基板1與散熱片3先行形成散熱模 ’、且’接者錫膏4 _於散__電路基板1表面之電鍍接點丄 1上將L ED、電子零件及！ c之接腳貼設於已印有錫膏*之 電f接點11巾’最後將散熱模組的電絲板1經過迴焊爐重新 炫^錫膏4 ’使LED、電子零件及I C之接腳能焊接於電路基 201219701 « - 板1上。由於該電路基板1及散熱片3於熱固化之結合所需的的 高溫約為15 0度C，熱固化時間約2 5分鐘〜5 〇分鐘之固化 動作先行施作，藉此，可有效避免L ED再進行二次熱處理，進 此有效降低led的光衰及受損之機率，以提升該LED燈具模 組之良率，以及提升L E D燈具耐候性。 綜上所述，本發明之L ED燈具模組之製程，確實具有高度 產業利用·，並具備新穎性及進步性之要件，爰依法提出發明 φ專利之申睛，懇請f審查委員能准予發明專利權，至感德便。 【圖式簡單說明】 圖一係本發明L E D燈具模組之製程之流程圖。 圖一係本發明電路基板與散熱片之立體分解圖。 圖二係本發明電路基板及散熱片之結合示意圖。 圖四係本發明L E D、電子零件及工c設置於電路基板之示意圖。 圖五係圖四剖面示意圖。 鲁【主要元件符號說明】 1電路基板 11電鍍接點 2導熱膠 3散熱片 4錫膏It can also be implemented on the electric lining hole. Then, the pins of the L E D, the electronic parts and the I C are connected to the electric difficulty that has been printed with the solder paste 4! In i, the circuit board is placed in the reflow oven to listen to the paste 4, and the pins of the LED, the electrons, and the crucible c are soldered to the circuit board i, and the circuit board i is cooled to phase the solder paste. That is, the production process of the present invention is completed. The invention firstly coats the hot glue 2 on the bottom of the circuit substrate 1, and then combines with the heat sink ★, 乍: curing to make the circuit substrate 1 and the heat sink 3 form a heat dissipation mold first, and the solder paste 4 _ Disperse the __ circuit board contacts on the surface of the circuit board 丄1 on the L ED, electronic parts and! The pin of c is attached to the electric f-contact 11 that has been printed with solder paste*. Finally, the wire board 1 of the heat-dissipating module is re-glazed by the reflow oven. ^ Solder paste 4' enables LEDs, electronic parts and ICs. The pins can be soldered to the circuit base 201219701 « - on board 1. Since the high temperature required for the combination of the circuit board 1 and the heat sink 3 in the heat curing is about 150 degrees C, the curing action of the heat curing time is about 25 minutes to 5 minutes, which can be effectively avoided. L ED is further subjected to secondary heat treatment, thereby effectively reducing the probability of light decay and damage of the LED, thereby improving the yield of the LED lamp module and improving the weather resistance of the LED lamp. In summary, the process of the L ED luminaire module of the present invention does have a high degree of industrial utilization, and has the requirements of novelty and advancement, and the invention of the φ patent is proposed according to law, and the review committee can grant the invention. Patent rights, to the sense of virtue. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a flow chart showing the process of the L E D lamp module of the present invention. 1 is an exploded perspective view of a circuit substrate and a heat sink of the present invention. 2 is a schematic view showing the combination of the circuit substrate and the heat sink of the present invention. Figure 4 is a schematic view showing the L E D, the electronic component, and the work c of the present invention disposed on a circuit board. Figure 5 is a schematic cross-sectional view of the four sections. Lu [main component symbol description] 1 circuit substrate 11 plating contacts 2 thermal adhesive 3 heat sink 4 solder paste