CN205510516U - Compound PCB circuit board of LED light source and optoelectronic integration module - Google Patents
Compound PCB circuit board of LED light source and optoelectronic integration module Download PDFInfo
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- CN205510516U CN205510516U CN201521058625.XU CN201521058625U CN205510516U CN 205510516 U CN205510516 U CN 205510516U CN 201521058625 U CN201521058625 U CN 201521058625U CN 205510516 U CN205510516 U CN 205510516U
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Abstract
The utility model discloses a compound PCB circuit board of LED light source, including aluminium base board, aluminium base board upper end has upwards set gradually aluminium base board and has plated layer and soldering tin layer, aluminium base board middle part indent is provided with the aluminium base board of ALC, be provided with the aluminium base board copper plate of ALC between aluminium base board of ALC and the soldering tin layer, aluminium substrate edge is located soldering tin layer upper end and is provided with first copper foil layer, aluminium base board of ALC and first copper foil layer upper end have all set gradually first thermal bonding agent layer, the polyimide film layer, second thermal bonding agent layer and second copper foil layer, aluminium substrate edge still is provided with and is located second copper foil layer upper end and is annular solder mask. The utility model also discloses an optoelectronic integration module that has a compound PCB circuit board of this LED light source. The utility model discloses whole integration combination forms, and loading and unloading are all convenient with the maintenance, have reduced the processing degree of difficulty and cost, and the radiating effect is good, inside components and parts of protection that can be fabulous.
Description
Technical field
This utility model relates to a kind of PCB, belongs to field of photoelectric technology, and a kind of LED light source is combined PCB and optoelectronic integration module.
Background technology
LED is used widely as a kind of cold light source, achieves, in field of LED illumination, the development advanced by leaps and bounds in recent years and popularizes, and this growth momentum is also continuing.It is compared to low-power LED and drives power supply and illuminator, the mid power of more than 30 watts and an exploitation difficult problem for high-power LED lighting system are greatly improved, main difficulty concentrates on efficiency and heating process, the luminous efficiency of LED light source and the radiating treatment driving power supply, the dependability of complete machine and service life, and the aspect such as the compromise control of performance and cost.The most common product design is typically to drive the separately design of power module and light source module and manufacture, and then carries out being assembled into machine system, and this will cause needing to develop multiple power specification, and product is difficult to standardize, and later maintenance maintenance also be will result in difficulty.
The key factor affecting above-mentioned many restrictions is exactly the 'bottleneck' restrictions of PCB heat dissipation design.Common practice is to increase the area of pcb board, multilayer wiring is utilized to increase the area of paving copper, thus reaching to improve the purpose of heat dispersion, this way is in addition to increasing production cost, and can become when certain LED illumination scheme has strict demand to integral product volume is thorny.
Simultaneously, common LED drive power PCB is designed with traditional PCB and produces material and the method for simple two-layer wiring, the way driving power module to separate with light source module is used the most again to isolate, such that it is able to realize higher anti-breakdown voltage, but the pcb board manufacturing process of this mode is complicated, reactance voltage breakdown capability is limited, the most significantly constrains the service life of LED illumination System.
It would therefore be desirable to one can be by multimode Integration Design, it is possible to achieve machine system miniaturization and modularity, and strengthen the novel modular structure of radiating effect, provide a kind of perfect heat-dissipating, PCB that reactance voltage breakdown capability is good simultaneously.
Utility model content
This utility model provides a kind of LED light source and is combined PCB, this pcb board solves conventional pcb board thermal diffusivity and the technical barrier of reactance voltage breakdown capability difference, meanwhile, this utility model additionally provides and a kind of have this LED light source and be combined the optoelectronic integration module of PCB.
For solving above-mentioned technical problem, this utility model by the following technical solutions:
LED light source is combined PCB, including aluminium base, aluminium base upper end is upwards disposed with aluminium sheet plating layer and soldering-tin layer, indent be provided with ALC aluminium base in the middle part of described aluminium base, ALC aluminium base copper plate it is provided with between ALC aluminium base and soldering-tin layer, described aluminium base edge is positioned at soldering-tin layer upper end and is provided with the first copper foil layer, described ALC aluminium base and the first copper foil layer upper end are all disposed with the first thermal adhesive layer, polyimide film, second thermal adhesive layer and the second copper foil layer, described aluminium base edge is additionally provided with the solder mask being positioned at the second copper foil layer upper end ringwise.
First prioritization scheme of PCB it is combined as LED light source, the thickness of described aluminium sheet plating layer, soldering-tin layer, the first copper foil layer, the first thermal adhesive layer, polyimide film, the second thermal adhesive layer, the second copper foil layer and solder mask is followed successively by 20,20,25,20,35,20,35,20, and unit is μm.
Composite PCB simple in construction of the present utility model, easily manufactured, there is higher bonding, waterproof and dustproof performance, insulating properties and thermal diffusivity are good, have preferable reactance voltage breakdown capability.
The invention also discloses and a kind of have this LED light source and be combined the optoelectronic integration module of PCB, this LED photovoltaic integration module includes:
LED drive power module, changes for combined-voltage, it is provided that supply voltage and LED driving voltage, and exports constant current；
Light source module, is used for providing illumination；
Radiating module, for dispelling the heat to LED drive power module and light source module；
Described LED drive power module is embedded in inside radiating module, and described light source module is connected to radiating module front end and fits with LED drive power module；Light source module includes and the getting stuck of radiating module clamping, and gets stuck and is internally provided with the light source panel of band LED lamp bead；Described surface of light source intralaminar part is fixed with above-mentioned compound PCB, and described LED lamp bead is arranged in described compound PCB.
First prioritization scheme as optoelectronic integration module, described radiating module includes and the buckle of clamping of getting stuck, buckle one middle side part is provided with module bodies, module bodies is internally provided with the port groove for embedded LED drive power module, outside port groove, surrounding is additionally provided with multiple radiated rib being connected with buckle, radiated rib inner hollow forms the heat exchange cavity of both ends open, heat exchange cavity is separated to form air flow channel and liquid heat exchange chamber, described liquid heat exchange chamber sealing two ends and liquid heat exchange intracavity portion by division board and has sealed radiator liquid up for safekeeping.
As second prioritization scheme of optoelectronic integration module, two sides of described radiated rib are respectively plane and arcwall face.
As the 3rd prioritization scheme of optoelectronic integration module, described in the surrounding that gets stuck be provided with for buckle location and the buckle I of clamping.
As the 4th prioritization scheme of optoelectronic integration module, described buckle both sides are provided with fixed plate.
As the 5th prioritization scheme of optoelectronic integration module, described module bodies upper/lower terminal is additionally provided with the buckle II for clamping LED drive power module.
Meanwhile, the invention also discloses the manufacture method of LED photovoltaic integration module, the method includes following four step:
Step one: make LED light source module；The LED lamp bead choosing equal-wattage, specification and brightness carries out luminous intensity distribution, carries out LED lamp bead arrangement by demand, and is welded on light source panel, gets stuck and utilize high temperature resistant ageing-resistant plastic material to make in outer ring.
Step 2: make LED light source and be combined PCB: employing aluminium base is heat radiation substrate, slot, aluminium base upper end sets gradually aluminium sheet plating layer and soldering-tin layer, after ALC aluminium base copper facing is set in being slotted, ALC aluminium base is set, then set gradually the first copper foil layer, the first thermal adhesive layer, polyimide film, the second thermal adhesive layer and the second copper foil layer, solder mask is finally set.
Step 3: make and drive power module；Discrete component is welded on power supply pcb board, power supply pcb board is placed in power module shell, use insulating cement to carry out embedding, complete to drive power module to make.
Step 4: make radiating module；To slot and perforate, pre-buried power supply cabling and data wire according to the geomery driving power module in the middle part of module bodies, be used for connecting driving power module and light source module.
Step 5: assemble；LED light source it is combined in PCB is fixed on LED light source module and is connected with LED lamp bead, power module is driven to embed radiating module, and complete the electrical equipment with light source module and be connected, only reserve power supply line and the control data wire for Based Intelligent Control after being completed.
Optoelectronic integration module entirety integrated combination of the present utility model forms, and reduces product size, has saved occupation of land space, load and unload and keep in repair the most very convenient, decreases difficulty of processing and cost；Radiating module structure is simple, and good heat dissipation effect, it is possible to fabulous protection internal component utilizes the manufacture method of this LED photovoltaic integration module can also quickly carry out module handling, easy to maintenance, provides cost savings and process time.
In sum, compared with prior art, the beneficial effects of the utility model are: LED light source of the present utility model is combined PCB simple in construction, easily manufactured, having higher bonding, waterproof and dustproof performance, insulating properties and thermal diffusivity are good, have preferable reactance voltage breakdown capability；Optoelectronic integration module entirety integrated combination forms; reduce product size; save occupation of land space; handling and maintenance are the most very convenient, decrease difficulty of processing and cost, and the radiating module structure of optoelectronic integration module is simple; good heat dissipation effect; protection internal component that can be fabulous, the manufacture method of this LED photovoltaic integration module is the most simple and convenient, time saving and energy saving.
Accompanying drawing explanation
With detailed description of the invention, this utility model is described in further detail below in conjunction with the accompanying drawings.
Fig. 1 is the sectional view that this utility model is combined PCB；
Fig. 2 is front view of the present utility model；
Fig. 3 is top view of the present utility model；
Fig. 4 is rearview of the present utility model；
Fig. 5 is the structural representation of this utility model radiated rib；
Fig. 6 air effect schematic diagram by radiated rib；
Label in figure is expressed as: 1, LED lamp bead；2, light source panel；3, get stuck；4, fixed plate；5, buckle I；6, radiated rib；7, buckle II；8, module bodies；9, buckle；10, LED drive power module；11, port groove；12, liquid heat exchange chamber；13, division board；14, air flow channel；15, solder mask；16, the second copper foil layer；17, the second thermal adhesive layer；18, polyimide film；19, the first thermal adhesive layer；20, the first copper foil layer；21, soldering-tin layer；22, aluminium base plating layer；23, aluminium base；24, ALC aluminium base copper plate；25, ALC aluminium base.
Detailed description of the invention
Below in conjunction with the accompanying drawings this utility model is further described.Embodiment of the present utility model includes but not limited to the following example.
Embodiment one
As shown in Figure 1, LED light source is combined PCB, including aluminium base 23, aluminium base 23 upper end is upwards disposed with aluminium base plating layer 22 and soldering-tin layer 21, indent be provided with ALC aluminium base 25 in the middle part of described aluminium base 23, ALC aluminium base copper plate 24 it is provided with between ALC aluminium base 25 and soldering-tin layer 21, described aluminium base 23 edge is positioned at soldering-tin layer upper end and is provided with the first copper foil layer 20, described ALC aluminium base 25 and the first copper foil layer 20 upper end are all disposed with the first thermal adhesive layer 19, polyimide film 18, second thermal adhesive layer 17 and the second copper foil layer 16, described aluminium base 23 edge is additionally provided with the solder mask 15 being positioned at the second copper foil layer 16 upper end ringwise.
In the present embodiment, the effect of each Rotating fields is:
Solder mask 15: export for negative film, for the green oil uplifting window in full wafer welding resistance, it is therefore an objective to allow welding.
Owing to it is negative film output, so there being the part of solder mask not go up green oil, but tin plating.
First copper foil layer 20 is with the second copper foil layer 16: the two is the most identical, is used to electrical equipment interconnection, to realize the functional requirement that electrical equipment connects；First copper foil layer and the second copper foil layer are PCB copper-clad laminate, PCB copper-clad laminate is the baseplate material making printed circuit board, it is in addition to being used as to support various components and parts, and the electrical equipment connection between them or electric insulation can be realized, the transmission speed of signal, energy loss and characteristic impedance etc. in circuit are had a great impact.The main raw material(s) manufacturing PCB copper-clad laminate is resin, paper, glass cloth, Copper Foil.
First thermal adhesive layer 19 is with the second thermal adhesive layer 17: the two is the most identical, the Rotating fields that first thermal adhesive layer and the i.e. heat adhesive of the second thermal adhesive layer are constituted, heat adhesive i.e. hot-melt adhesive, it is referred to as thermoplasticity binding agent, first thermal adhesive layer and the second thermal adhesive layer are in addition to playing traditional adhesive effect in the present embodiment, also have the effect that (1) melt temperature and ratio of viscosities ordinary resin are low, can shape under low-temp low-pressure, the load caused to element and electronic unit is little；(2) when using as encapsulating material, bonding, waterproof and dustproof performance height；(3) insert molding of element and electronic unit can be realized, thus simplified assembling process, cut down cost.
Polyimide film 18: as the interconnection system of the insulation film on printed circuit board upper strata, it is possible to achieve less machine drilling size, makes printed circuit board obtain more high density and intensity.
Soldering-tin layer 21: include top layer tin paste layer and bottom tin paste layer two parts, refers to the surface mount pad being exposed, and needs to be coated with the part of soldering paste the most before welding.It is easy to pad carry out hot air leveling and make welding steel mesh.
Aluminium base plating layer 22: reduce impedance, improve capacity of resisting disturbance, reduce pressure drop, improve power-efficient；It is connected with ground wire, reduces loop area.
Aluminium base 23: belong to highly heat-conductive material, in order to movable good heat dissipation characteristics.Surface, by the pure glue of high heat conduction, is connected with heat spreader module, it is possible to obtain good radiating effect.
ALC aluminium base 25: have excessive heat conductivity, can realize high heat conduction, has again insulation characterisitic, it is possible to obtain higher pressure (anti-voltage breakdown) ability simultaneously.ALC aluminium base can arrange two-layer, thus obtains higher voltage endurance capability.
ALC aluminium base copper plate 24: identical with aluminium sheet copper plate effect.
The present embodiment simple in construction, on the basis of not increasing PCB size of main body, significantly improve the radiating effect of pcb board and the anti-high electrical breakdown ability of pcb board is greatly improved so that pcb board service life and stability increase, be particularly well-suited in some, powerful need for electricity.
Embodiment 2
The present embodiment is substantially the same manner as Example 1, difference is: the thickness of described aluminium base plating layer 22, soldering-tin layer the 21, first copper foil layer the 20, first thermal adhesive layer 19, polyimide film the 18, second thermal adhesive layer the 17, second copper foil layer 16 and solder mask 15 is followed successively by 20,20,25,20,35,20,35,20, and unit is μm.
In the present embodiment, above layers structure is arranged with thickness successively, is possible not only to increase substantially the effect of each Rotating fields, meets electrical equipment demand, simultaneously can also maximized raising radiating effect, improve simultaneously and stablize the voltage endurance capability of pcb board.
Embodiment 3
As Figure 1-5, optoelectronic integration module, this optoelectronic integration module includes:
LED drive power module 10, changes for combined-voltage, it is provided that supply voltage and LED driving voltage, and exports constant current；
Light source module, is used for providing illumination；
Radiating module, for dispelling the heat to LED drive power module 10 and light source module；
Described LED drive power module 10 is embedded in inside radiating module, and described light source module is connected to radiating module front end and fits with LED drive power module 10；Light source module include with radiating module clamping get stuck 3, get stuck the 3 light source panels 2 being internally provided with band LED lamp bead 1；Described light source panel 2 is internal is fixed with the compound PCB as described in embodiment 1 or embodiment 2, and described LED lamp bead 1 is arranged in described compound PCB.
In the present embodiment, LED drive power module 10 is changed and power supply for the voltage of optoelectronic integration module, design power can be divided into a few gauge modules, and realized the requirement of more power requirements by permutation and combination；Radiating module can realize more preferable radiating efficiency and effect so that the system temperature under the conditions of high-power applications will not be too high and cause thrashing；Light source module part provides reliable light source, carries out integrated combination design with driving power module and radiating module, forms an overall module.Processed by encapsulating at three's assemblage gap, play water proof and dust proof effect.
The LED drive power module 10 of the present embodiment, light source module and radiating module use compound mode to form integral structure, easy to loading and unloading, quick, and integral heat sink is effective, and anti-voltage breakdown capability is strong, safety and stability.
The manufacture method of the present embodiment LED photovoltaic integration module is as follows, including following five steps:
Step one: make LED light source module；The LED lamp bead 1 choosing equal-wattage, specification and brightness carries out luminous intensity distribution, carries out LED lamp bead 1 by demand and arranges, and is welded on light source panel 2, gets stuck and 3 utilize high temperature resistant ageing-resistant plastic material to make in outer ring.
Step 2: make LED light source and be combined PCB: using aluminium base 23 is heat radiation substrate, slot, aluminium base 23 upper end sets gradually aluminium base plating layer 22 and soldering-tin layer 21, after ALC aluminium base copper facing 24 is set in being slotted, ALC aluminium base 25 is set, then set gradually first copper foil layer the 20, first thermal adhesive layer 19, polyimide film the 18, second thermal adhesive layer 17 and the second copper foil layer 16, solder mask 15 is finally set.
Step 3: make and drive power module；Discrete component is welded on power supply pcb board, power supply pcb board is placed in power module shell, use insulating cement to carry out embedding, complete to drive power module to make.
Step 4: make radiating module；To slot and perforate, pre-buried power supply cabling and data wire according to the geomery driving power module in the middle part of module bodies 8, be used for connecting driving power module and light source module.
Step 5: assemble；LED light source it is combined in PCB is fixed on LED light source module and is connected with LED lamp bead 1, power module is driven to embed radiating module, and complete the electrical equipment with light source module and be connected, only reserve power supply line and the control data wire for Based Intelligent Control after being completed.
The manufacture method operation of the present embodiment is simple, easy to assembly, has saved process time and cost.
Embodiment 4
The present embodiment optimizes radiating module on the basis of embodiment 3, particularly as follows: described radiating module includes and the buckle 9 of 3 clampings of getting stuck, buckle 9 one middle side part is provided with module bodies 8, module bodies 8 is internally provided with the port groove 11 for embedded LED drive power module 10, outside port groove 11, surrounding is additionally provided with multiple radiated rib 6 being connected with buckle 9, radiated rib 6 inner hollow forms the heat exchange cavity of both ends open, heat exchange cavity is separated to form air flow channel 14 and liquid heat exchange chamber 12 by division board 13, described liquid heat exchange chamber 12 sealing two ends and inside, liquid heat exchange chamber 12 have sealed radiator liquid up for safekeeping.
The LED drive power module 10 of the present embodiment is directly embedded into port groove 11, and light source module is fitted in radiating module and LED drive power module 10 front end again, the most easy to loading and unloading, and integrated combination forms, reduce product size, save occupation of land space, easily manufactured, low cost；In LED drive power module 10 is wrapped in by radiating module, and dispelled the heat by multiple radiated ribs 6, it is thus possible to the heat that LED drive power module 10 and light source module produce is discharged, the radiating efficiency of radiating module all can be improved in air flow channel 14 in radiated rib 6 and liquid heat exchange chamber 12, air flow channel 14 makes radiated rib 6 increase with extraneous air contact area, carry out heat exchange by air and reach quick heat radiating purpose, and absorbed heat rapidly by internal heat dissipating liquid and passed through air exchange in liquid heat exchange chamber 12, reach the purpose of quick heat radiating equally, liquid heat exchange heat absorption is fast, the heat absorption that can will produce in time, and taken away by air exchange, the mode using this liquid and air exchange heat radiation to combine carries out radiating and cooling, absorb heat fast and rapid heat dissipation, good cooling effect.
Radiator liquid in the present embodiment can be the liquid such as water, liquid nitrogen, alcoholic solution, and the present embodiment uses the alcoholic solution of alcohol content 50% as radiator liquid.
Embodiment 5
As shown in Figure 6, the present embodiment optimizes following structure on the basis of embodiment 4, particularly as follows: the two of described radiated rib 6 sides are respectively plane and arcwall face.
Two sides of the present embodiment radiated rib 6 are respectively plane and arcwall face, making radiated rib 6 cross section form side is plane, opposite side is the structure of arcwall face, radiated rib 6 is made to more conform to aerodynamic principle when heat radiation, heat radiation Airflow moves direction always, and flow velocity is highly improved.If Fig. 5 is the effect schematic diagram that air passes through radiated rib 6, arrow represents air circulating direction, when cold air is by the initiating terminal of radiated rib 6, produces heat exchange with radiated rib 6, air is heated thus produces flow velocity, according to Nu Libai law, when hot-air is by arcwall face, due to its arcuate structure, thermal current is accelerated, thus accelerate air circulation, faster, more take away the heat that radiated rib 6 absorbs, play good radiating effect.
Embodiment 6
The present embodiment adds following structure on the basis of embodiment 4 or embodiment 5, particularly as follows: described in get stuck 3 surrounding be provided with for buckle 9 location and the buckle I 5 of clamping.
The present embodiment is installed and integrally-built stability for convenience, get stuck 3 surrounding be respectively provided with buckle I 5, local corresponding corresponding with on buckle 9 of buckle I 5, location clamping, simple installation during installation, and clamping is firm.
Embodiment 7
The present embodiment adds following structure in embodiment 4-embodiment 6 on the basis of any embodiment: described buckle 9 both sides are provided with fixed plate 4.
The present embodiment fixed plate 4 is used for fixing overall structure, by buckle 9 load-bearing, it is possible to reduce the displacement of light source module and LED drive power module 10, it is to avoid occur that gap cannot realize the effects such as waterproof and dustproof.
Embodiment 8
This province embodiment adds following structure in above-described embodiment 4-embodiment 7 on the basis of any embodiment: described module bodies 8 upper/lower terminal is additionally provided with the buckle II 7 for clamping LED drive power module 10.
In the present embodiment, for clamping LED drive power module 10, prevent its displacement from affecting heat radiation and connection, at module bodies 8 upper/lower terminal, buckle II 7 is set, can be by LED drive power module 10 clamping by buckle II 7, in LED drive power module 10, relevant position is provided with the draw-in groove of correspondence, plays good clamping effect, and LED drive power module 10 can also play the effect of a location and installation by buckle II 7 simultaneously.
It is embodiment of the present utility model as mentioned above.Described previously for each preferred embodiment of the present utility model, preferred implementation in each preferred embodiment is if not the most contradictory or premised on a certain preferred implementation, each preferred implementation can arbitrarily stack combinations use, design parameter in described embodiment and embodiment is merely to clearly state the utility model proof procedure of utility model people, and be not used to limit scope of patent protection of the present utility model, scope of patent protection of the present utility model is still as the criterion with its claims, the equivalent structure change that every utilization description of the present utility model and accompanying drawing content are made, in like manner should be included in protection domain of the present utility model.
Claims (8)
- null1.LED light source is combined PCB，Including aluminium base (23)，It is characterized in that，Aluminium base (23) upper end is upwards disposed with aluminium base plating layer (22) and soldering-tin layer (21)，Described aluminium base (23) middle part indent is also provided with ALC aluminium base (25)，ALC aluminium base copper plate (24) it is provided with between ALC aluminium base (25) and soldering-tin layer (21)，Described aluminium base (23) edge is positioned at soldering-tin layer upper end and is provided with the first copper foil layer (20)，Described ALC aluminium base (25) and the first copper foil layer (20) upper end are all disposed with the first thermal adhesive layer (19)、Polyimide film (18)、Second thermal adhesive layer (17) and the second copper foil layer (16)，Described aluminium base (23) edge is additionally provided with the solder mask (15) being positioned at the second copper foil layer (16) upper end ringwise.
- LED light source the most according to claim 1 is combined PCB, it is characterized in that, the thickness of described aluminium base plating layer (22), soldering-tin layer (21), the first copper foil layer (20), the first thermal adhesive layer (19), polyimide film (18), the second thermal adhesive layer (17), the second copper foil layer (16) and solder mask (15) is followed successively by 20,20,25,20,35,20,35,20, and unit is μm.
- 3. optoelectronic integration module, this LED photovoltaic integration module includes:LED drive power module (10), changes for combined-voltage, it is provided that supply voltage and LED driving voltage, and exports constant current；Light source module, is used for providing illumination；Radiating module, for dispelling the heat to LED drive power module (10) and light source module；Described LED drive power module (10) is embedded in inside radiating module, and described light source module is connected to radiating module front end and fits with LED drive power module (10)；Light source module includes get stuck (3) with radiating module clamping, and get stuck (3) are internally provided with the light source panel (2) of band LED lamp bead (1)；It is characterized in that, described light source panel (2) is internal is fixed with compound PCB as claimed in claim 1 or 2, and described LED lamp bead (1) is arranged in described compound PCB.
- Optoelectronic integration module the most according to claim 3, it is characterized in that, described radiating module includes and the buckle (9) of (3) clamping of getting stuck, buckle (9) one middle side part is provided with module bodies (8), module bodies (8) is internally provided with the port groove (11) for embedded LED drive power module (10), port groove (11) outside surrounding is additionally provided with multiple radiated rib (6) being connected with buckle (9), radiated rib (6) inner hollow forms the heat exchange cavity of both ends open, heat exchange cavity is separated to form air flow channel (14) and liquid heat exchange chamber (12) by division board (13), described liquid heat exchange chamber (12) sealing two ends and liquid heat exchange chamber (12) inside have sealed radiator liquid up for safekeeping.
- Optoelectronic integration module the most according to claim 4, it is characterised in that two sides of described radiated rib (6) are respectively plane and arcwall face.
- Optoelectronic integration module the most according to claim 4, it is characterised in that described in get stuck the surrounding of (3) be provided with for buckle (9) location and the buckle I (5) of clamping.
- Optoelectronic integration module the most according to claim 4, it is characterised in that described buckle (9) both sides are provided with fixed plate (4).
- Optoelectronic integration module the most according to claim 4, it is characterised in that described module bodies (8) upper/lower terminal is additionally provided with the buckle II (7) for clamping LED drive power module (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521058625.XU CN205510516U (en) | 2015-12-18 | 2015-12-18 | Compound PCB circuit board of LED light source and optoelectronic integration module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521058625.XU CN205510516U (en) | 2015-12-18 | 2015-12-18 | Compound PCB circuit board of LED light source and optoelectronic integration module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205510516U true CN205510516U (en) | 2016-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521058625.XU Withdrawn - After Issue CN205510516U (en) | 2015-12-18 | 2015-12-18 | Compound PCB circuit board of LED light source and optoelectronic integration module |
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| CN (1) | CN205510516U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472870A (en) * | 2015-12-18 | 2016-04-06 | 成都赛昂电子科技有限公司 | Composite PCB, LED photoelectric integrated module and manufacturing method for integrated module |
-
2015
- 2015-12-18 CN CN201521058625.XU patent/CN205510516U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105472870A (en) * | 2015-12-18 | 2016-04-06 | 成都赛昂电子科技有限公司 | Composite PCB, LED photoelectric integrated module and manufacturing method for integrated module |
| CN105472870B (en) * | 2015-12-18 | 2018-01-23 | 成都赛昂电子科技有限公司 | The electrical integrated module of compound PCB, LED light and its manufacture method |
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