KR101015688B1 - Apparatus for manufacturing printed circuit board and method for manufacturing printed circuit board using the same - Google Patents

Abstract

The present invention discloses a printed circuit board manufacturing apparatus capable of performing both via hole formation, plating layer formation and via hole formation for a printed circuit board, and a method of manufacturing a printed circuit board using the same. The printed circuit board manufacturing apparatus includes a vacuum chamber; A gas injection unit injecting a processing gas into the vacuum chamber; A susceptor disposed in the vacuum chamber and on which a substrate is seated; a sputtering target portion facing the susceptor; A voltage source part mounted on the sputtering target part and applying a voltage to the sputtering target part; And a shutter unit disposed between the sputtering target unit and the susceptor and selectively opening and closing.

Plasma, Etching, Film Formation, Shutter, Printed Circuit Board

Description

APPARATUS FOR MANUFACTURING PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING THE SAME}

The present invention relates to a printed circuit board manufacturing apparatus and a method of manufacturing a printed circuit board using the same, and specifically includes a shutter that can be opened or closed in accordance with an etching and film forming process to perform both via hole formation, desmear process, and plating layer formation. The present invention relates to a printed circuit board manufacturing apparatus and a method of manufacturing a printed circuit board using the same.

Printed circuit boards are classified into single-sided, double-sided, and multi-layered structures according to the formation positions of the insulating layer and the circuit layer. Here, in the cross-sectional structure, a circuit layer is formed on one side of the insulating layer, and in the double-sided structure, the circuit layers are formed on both sides of the insulating layer, respectively. In addition, the multilayer structure includes a plurality of insulating layers and circuit layers alternately stacked.

Meanwhile, as electronic components are miniaturized, thinned, densified, and packaged, printed circuit boards also require high density and miniaturization. Accordingly, printed circuit boards tend to be used in double-sided or multi-layered structures in single-sided structures.

The double-sided structure and the multi-layered structure include forming a via hole in an insulating layer for interlayer connection, and forming a plating layer in the insulating layer including the via hole. In addition, the desmear process of removing the smear generated after the via hole is further performed, thereby improving the reliability of the printed circuit board.

As such, in order to manufacture a printed circuit board having a double-sided or multi-layered structure, a via hole forming process, a plating process, and a desmear process are performed. Defects such as breakage may occur during transport.

In addition, when the substrate is transferred to other equipment for each process, it may be exposed to the outside may be contaminated by foreign matter. The foreign matter may not only cause defects of the printed circuit board but also reduce reliability.

In particular, in the case of a multilayer printed circuit board in which via holes, a desmear process, a plating layer, and a circuit layer forming process are repeatedly formed several times as compared to a double-sided structure, productivity and cost may be more serious. Here, since the number of via holes increases as the number of layers of the printed circuit board increases, the number of laser shots increases, and thus productivity may be further reduced.

SUMMARY OF THE INVENTION An object of the present invention is to provide a printed circuit board manufacturing apparatus capable of performing via hole formation, a desmear process, and plating layer formation, and a method of manufacturing a printed circuit board using the same.

In order to achieve the above technical problem, an aspect of the present invention provides a printed circuit board manufacturing apparatus. The printed circuit board manufacturing apparatus includes a vacuum chamber; A gas injection unit injecting a processing gas into the vacuum chamber; A susceptor disposed inside the vacuum chamber and on which a substrate is seated; A sputtering target portion facing the susceptor; A voltage source part mounted on the sputtering target part and applying a voltage to the sputtering target part; And a shutter unit disposed between the sputtering target unit and the susceptor, the shutter unit being selectively opened and closed.

Here, the printed circuit board manufacturing apparatus includes a shutter driver for opening and closing the shutter unit.

In addition, an area of the shutter unit may be larger than an area of the sputtering target unit.

In addition, the susceptor may be grounded.

Another aspect of the present invention to provide a printed circuit board manufacturing apparatus to achieve the above technical problem. The manufacturing method includes providing a base substrate having a metal pattern formed on at least one surface of the insulating layer and the insulating layer; Forming a via hole in the insulating layer by performing a plasma etching process using the metal pattern as an etching mask; Forming a plating layer by performing a plasma deposition process on the metal pattern including the via hole; And forming a circuit layer by performing an electroplating process and an etching process on the base substrate including the plating layer.

The plasma etching process and the plasma film forming process may use the same printed circuit manufacturing apparatus.

The printed circuit board manufacturing apparatus may include a vacuum chamber, a gas injection unit for injecting a processing gas into the vacuum chamber, a susceptor disposed in the vacuum chamber, a sputtering target portion facing the susceptor, and the sputtering target portion is seated. And a voltage source unit for applying a voltage to the sputtering target unit, and a shutter unit disposed between the sputtering target unit and the susceptor and selectively opening and closing.

The shutter unit may be closed to prevent the sputtering target unit from being sputtered in the plasma etching process.

In addition, the shutter unit may be opened in the plasma film forming process.

Another aspect of the present invention to achieve the above technical problem provides a manufacturing method of a printed circuit board to a printed circuit board manufacturing apparatus. The manufacturing method includes providing an insulating layer and a base substrate having a metal pattern formed on at least one side of the insulating layer in a vacuum chamber capable of performing an etching and a film forming process; Injecting a first processing gas into the vacuum chamber; Forming the first process gas into a first plasma to etch the insulating layer exposed by the metal pattern to form a via hole; Injecting a second processing gas into the vacuum chamber; And forming the second processing gas into a second plasma to form a plating layer on the base substrate on which the via hole is formed.

Here, the method may further include closing the shutter unit to block the sputtering target unit of the printed circuit board manufacturing apparatus prior to the step of introducing the first processing gas.

The method may further include removing residual gas inside the vacuum chamber before the input of the second processing gas.

The method may further include opening the shutter unit to open the sputtering target unit of the printed circuit board manufacturing apparatus prior to the step of introducing the second processing gas.

The apparatus for manufacturing a printed circuit board of the present invention can perform both via hole formation, desmear process, and plating layer formation, thereby improving productivity of the printed circuit board.

In addition, since the via hole formation, the desmearing process, and the plating layer formation are all performed in one device, the probability of exposure to external foreign matters is low, thereby reducing defects due to foreign matters.

In addition, since the via hole formation, the desmear process, and the plating layer formation are all performed in one device, transfer of the printed circuit board can be minimized, thereby reducing breakage defects caused by the transfer.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings of a printed circuit board manufacturing apparatus. The following embodiments are provided by way of example so that those skilled in the art can fully understand the spirit of the present invention. Therefore, the present invention is not limited to the embodiments described below, but may be embodied in other forms. In the drawings, the size and thickness of the device may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a cross-sectional view of an apparatus for manufacturing a printed circuit board according to a first embodiment of the present invention.

Referring to FIG. 1, a printed circuit board manufacturing apparatus includes a vacuum chamber 110 in which plasma is formed. The vacuum chamber 110 is in communication with the vacuum pump 190, the interior of the vacuum chamber 110 may be maintained in a vacuum state by the vacuum pump 190 during the process.

The vacuum chamber 110 is connected to the gas injection unit 120. The gas injection unit 120 supplies a processing gas to the vacuum chamber 110. Here, the processing gas may be an etching gas when the printed circuit board manufacturing apparatus performs an etching process. For example, examples of the etching gas may be a single gas of any one of N 2, O 2, Ar, H 2, CF 4, and a halogen-based gas, or a mixed gas in which two or more thereof are mixed. Here, examples of the halogen-based gas may be CF 4, CCl 4, CBrF 3, and the like. Etching gas is selected according to the material to be etched, it is not limited in the embodiment of the present invention.

On the other hand, the processing gas may be an inert gas and a reaction gas when the printed circuit board manufacturing apparatus performs the deposition process. Here, examples of the inert gas may be Ar, Xe, and H2. In addition, examples of the reaction gas may be a single gas of any one of O 2, O 3, N 2, and a fluorine-based gas, or a mixed gas of two or more thereof. The reaction gas may be selected according to the material to be formed, and is not limited in the embodiment of the present invention.

Although not shown in the drawing, the gas injection unit 120 may selectively input the type of processing gas into the vacuum chamber 110 through a valve. In addition, the vacuum chamber 110 may further include an exhaust port for removing residual gas therein.

The susceptor 130 on which the substrate S is seated is disposed in the vacuum chamber 110. The susceptor 130 is grounded.

On the other hand, the sputtering target portion 150 facing the susceptor 130 is disposed. The sputtering target unit 150 is connected to the voltage source unit 140. For example, the sputtering target unit 150 may be seated on the voltage source unit 140.

The voltage source unit 140 is connected to the high frequency power supply 160. Here, the voltage source unit 140 provides the sputtering target unit 150 with the voltage necessary for generating a plasma from the high plate power source 160 to the sputtering target unit 150 and the susceptor 130. Plasma is formed in between.

Here, the apparatus for manufacturing a printed circuit board may be applied to a film forming process or an etching process by adjusting plasma forming conditions such as gas and processing time introduced into the vacuum chamber 110. Here, examples of the etching process may be a via hole forming process, a dismiss process, or the like, in a manufacturing process of a printed circuit board. In addition, an example of the film forming process may be a plating layer forming process.

However, when the apparatus for manufacturing a printed circuit board performs an etching process, the substrate S may be contaminated due to the sputtering of the sputtering target unit 150.

In order to prevent this, the shutter unit 170 is disposed between the sputtering target unit 150 and the susceptor 130. The shutter unit 170 may be selectively opened and closed according to a film forming process or an etching process. That is, the shutter unit 170 opens to expose the sputtering target unit 150 when the PCB manufacturing apparatus performs the film forming process.

On the other hand, the shutter unit 170 is closed to block the sputtering target unit 150 when the PCB manufacturing apparatus performs an etching process. As a result, the shutter unit 170 may prevent the plasma from colliding with the sputtering target unit, thereby preventing the sputtering target unit 150 from being deposited onto the substrate S for sputtering and etching.

Here, the area of the shutter unit 170 is larger than the area of the sputtering target unit 150. As a result, the shutter unit 170 may completely block the sputtering target unit 150, thereby preventing the plasma from colliding with the sputtering target unit 150. In addition, when the sputtering target unit 150 is sputtered, it is possible to more effectively prevent the sputtered material from being deposited onto the substrate S.

The opening of the shutter unit 170 may be performed by folding the shutter unit 170 toward at least one of the upper side and the left side of the vacuum chamber. However, in the embodiment of the present invention is not limited to the folding direction of the shutter unit 170. In addition, the closing of the shutter unit may be performed by folding the shutter unit 170 in a direction facing the sputtering target unit 150.

Here, opening and closing of the shutter unit 170 may be performed by the shutter driver 180. Here, the shutter driver 180 may be an air compressor.

In the exemplary embodiment of the present invention, the apparatus for manufacturing a printed circuit board includes a shutter unit capable of exposing or blocking the sputtering target unit according to an etching and a deposition process, thereby performing both via hole formation, desmear process, and plating layer formation through one device. can do.

Therefore, the manufacturing process of the printed circuit board can be further simplified, and the defect rate can be reduced.

Hereinafter, a manufacturing process of a printed circuit board using the printed circuit board manufacturing apparatus will be described in more detail with reference to the accompanying drawings.

2 to 3 are cross-sectional views of a printed circuit board manufacturing apparatus for explaining a manufacturing process of a printed circuit board according to a second embodiment of the present invention.

4 to 8 are cross-sectional views of a printed circuit board for explaining a manufacturing process of a printed circuit board according to a second embodiment of the present invention.

Here, the manufacturing process of the printed circuit board according to the second embodiment uses the apparatus for manufacturing a printed circuit board according to the first embodiment described above, and the repeated description of the printed circuit board according to the first embodiment will be omitted. .

2 and 4, in order to manufacture a printed circuit board, a base substrate S is first provided to a printed circuit board manufacturing apparatus.

The base substrate S includes an insulating layer 200 and a metal pattern 210 formed on at least one surface thereof. Here, the metal pattern 210 may be formed by performing an exposure and etching process on the metal layer disposed on the insulating layer 200.

The printed circuit board manufacturing apparatus includes a vacuum chamber 110 in which plasma is formed, a gas injection unit 120 for injecting a processing gas into the vacuum chamber 110, and a susceptor disposed in the vacuum chamber 110. 130, a sputtering target unit 150 facing the susceptor 130, a voltage source unit 140 on which the sputtering target unit 150 is seated and applying a voltage to the sputtering target unit 150, and A shutter unit 170 may be disposed between the sputtering target unit 150 and the susceptor 130 to selectively open and close the sputtering target unit 150.

Here, the base substrate (S) is seated on the susceptor 130 disposed in the vacuum chamber 110, and maintains the interior of the vacuum chamber 110 in a vacuum atmosphere using a vacuum pump.

2 and 5, the via hole 230 penetrating the insulating layer 200 is formed using the metal pattern 210 as an etching mask.

In detail, in order to form the via hole 230 in the insulating layer 200, the PCB manufacturing apparatus blocks the sputtering target unit 150 by closing the shutter unit 170. Accordingly, the sputtering target unit 150 may be prevented from being sputtered during the plasma etching process of forming the via hole 230.

Meanwhile, the gas injection unit 120 injects a first process gas, that is, an etching gas, into the vacuum chamber 110. Here, the etching gas may be selected according to the material of the insulating layer. For example, the insulating layer may be a multilayer film in which a resin layer, a glass fiber layer, or the like are laminated or a resin layer made of different materials is stacked. Here, when the insulating layer is a multilayer film, the etching gas may be selected and introduced into the vacuum chamber 110 according to a material forming each layer. In this case, when etching the resin layer, such as epoxy resin and polyimide resin, examples of the etching gas may be N2, O2, Ar / H2 and CF4. In addition, when etching the glass fiber layer, examples of the etching gas may be N2, O2, Ar / H2, CF4 and halogen-based gas.

Power is applied to the sputtering target unit 150. At this time, the susceptor 130 is grounded. As a result, an etching plasma is formed from the first processing gas between the sputtering target unit 150 and the susceptor 130. The etching plasma etches the insulating layer 200 exposed from the metal pattern 210 to form a via hole 230.

In this case, residues may be removed from the bottom and side surfaces of the via hole 230 by the etching plasma P1. This eliminates the need for a separate desmear process.

3 and 6, the plating layer 240 is formed by performing a plasma film forming process on the metal pattern 210 including the via hole 230.

In detail, to form the plating layer 240, the printed circuit board manufacturing apparatus opens the sputtering target unit 150 by opening the shutter unit 170.

Meanwhile, a second process gas, that is, an inert gas and a reaction gas, may be introduced into the vacuum chamber 110 through the gas injection unit 120. Here, examples of the inert gas may be Ar, Xe, and H2. In addition, examples of the reaction gas may be a single gas of any one of O 2, O 3, N 2, and a fluorine-based gas, or a mixed gas of two or more thereof.

Power is applied to the sputtering target unit 150. At this time, the susceptor 130 is grounded. As a result, the sputtering plasma P2 is formed from the second processing gas between the sputtering target unit 150 and the susceptor 130.

The sputtering plasma P2 collides with the sputtering target unit 150, and the sputtering target unit 150 is sputtered. Atoms or atomic groups of the sputtered sputtering target portion 150 are ionized when passing through the sputtering plasma P2 and are deposited on the base substrate S on which the metal pattern 210 is formed. That is, the plating layer 240 is formed on the metal pattern 210 including the via hole 230.

In addition, before the second processing gas is input, a process of discharging the gas remaining in the vacuum chamber 110, that is, the first processing gas may be further added.

220 shown in the drawings but not described in the detailed description is a metal layer. The metal layer 220 may be a copper layer.

Referring to FIG. 7, the base substrate S on which the first plating layer 240 is formed is discharged from the printed circuit board manufacturing apparatus.

The metal pattern 210 and the metal layer 220 may be electrically connected to each other through the first plating layer 240 and the via hole 230.

Thereafter, the base substrate S including the first plating layer 240 is subjected to an electroplating process to form the second plating layer 250.

Thereafter, the first and second plating layers 240 and 250 may be exposed and etched to form circuit layers 260 and 270 that are disposed on both surfaces of the insulating layer 200 and are connected through the via holes 230. ), A printed circuit board can be manufactured.

In the embodiment of the present invention, it has been described as manufacturing a printed circuit board having a double-sided structure, but the present invention is not limited thereto. A circuit board may also be manufactured.

Therefore, in the embodiment of the present invention, as the plasma etching process and the plasma film forming process are performed using the same printed circuit board manufacturing apparatus, it is possible to improve the productivity of the printed circuit board.

That is, as a printed circuit board is manufactured by using a single device for forming a via hole, a desmear process, and a plating layer, exposure of a foreign material due to transfer of the printed circuit board can be minimized, thereby preventing the exposure of the printed circuit board by foreign matter. Defects can be reduced.

In addition, as a printed circuit board is manufactured using a single device for via hole formation, a desmear process, and a plating layer formation, defects such as damage due to transfer of the printed circuit board may be reduced.

1 is a cross-sectional view of an apparatus for manufacturing a printed circuit board according to a first embodiment of the present invention.

2 to 3 are cross-sectional views of a printed circuit board manufacturing apparatus for explaining a manufacturing process of a printed circuit board according to a second embodiment of the present invention.

4 to 8 are cross-sectional views of a printed circuit board for explaining a manufacturing process of a printed circuit board according to a second embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

110: vacuum chamber 120: gas injection portion

130: susceptor 140: voltage source unit

150: sputtering target portion 170: shutter portion

180: shutter drive unit 190: vacuum pump

200: insulating layer 210: metal pattern

220: metal layer 230: via hole

240: first plating layer 250: second plating layer

260, 270: circuit layer

Claims (15)

A vacuum chamber; A gas injection unit injecting a processing gas into the vacuum chamber; A valve provided in the gas injecting unit to selectively input the type of the processing gas into the vacuum chamber according to a film forming process or an etching process; A susceptor disposed inside the vacuum chamber and on which a substrate is seated; A sputtering target portion facing the susceptor; A voltage source part mounted on the sputtering target part and applying a voltage to the sputtering target part; And A shutter unit disposed between the sputtering target unit and the susceptor and selectively opened and closed according to the film forming process or the etching process; Printed circuit board manufacturing apparatus comprising a. The method of claim 1, The apparatus for manufacturing a printed circuit board further includes a shutter driver configured to open and close the shutter by driving the shutter unit. The method of claim 1, The area of the shutter portion is larger than the area of the sputtering target portion manufacturing apparatus for manufacturing a printed circuit board. The method of claim 1, The susceptor is grounded printed circuit board manufacturing apparatus. Providing a base substrate having a metal pattern formed on at least one surface of the insulating layer and the insulating layer; Forming a via hole in the insulating layer by performing a plasma etching process using the metal pattern as an etching mask; Forming a plating layer by performing a plasma film forming process on the metal pattern including the via hole; And Forming a circuit layer by performing an electroplating process and an etching process on the base substrate including the plating layer; Including; The plasma etching process and the plasma film forming process is performed in the same vacuum chamber provided in the same printed circuit manufacturing apparatus. The method of claim 5, The printed circuit board manufacturing apparatus includes a vacuum chamber, a gas injection unit for injecting a processing gas into the vacuum chamber, a susceptor disposed in the vacuum chamber, a sputtering target portion facing the susceptor, and the sputtering target portion is seated therein. And a voltage source unit for applying a voltage to the sputtering target unit, and a shutter unit disposed between the sputtering target unit and the susceptor to selectively open and close the sputtering target unit. The method of claim 6, The method of manufacturing a printed circuit board in which the shutter unit is closed in the plasma etching process. The method of claim 6, The method of manufacturing a printed circuit board in which the shutter unit is opened in the plasma film forming process. Providing an insulating layer and a base substrate having a metal pattern formed on at least one side of the insulating layer in a vacuum chamber capable of performing an etching and a film forming process; Injecting a first processing gas into the vacuum chamber; Forming the first process gas into a first plasma to etch the insulating layer exposed by the metal pattern to form a via hole; Injecting a second processing gas into the vacuum chamber; Forming the second processing gas into a second plasma to form a first plating layer on the base substrate on which the via holes are formed; Discharging the base substrate including the first plating layer from the vacuum chamber; Forming a second plating layer by performing a plating process on the base substrate including the first plating layer; And Etching the first and second plating layers to form a circuit layer; Method of manufacturing a printed circuit board comprising a. The method of claim 9, And closing the shutter unit to block the sputtering target unit of the printed circuit board manufacturing apparatus before the step of inputting the first processing gas. The method of claim 9, And removing residual gas inside the vacuum chamber before the inputting of the second processing gas. The method of claim 9, And opening the shutter unit to open the sputtering target unit of the printed circuit board manufacturing apparatus before the inputting of the second processing gas. The method of claim 1, The processing gas is any one of the etching gas for the etching process or the inert gas and the reaction gas for the film forming process. The method of claim 9, The first process gas of any one or two or more of N2, O2, Ar, H2, CF4 and halogen-based gas manufacturing method of a printed circuit board. The method of claim 9, The second processing gas is a manufacturing method of a printed circuit board comprising an inert gas and a reaction gas.

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