KR100996911B1 - Led의 제조방법 - Google Patents
Led의 제조방법 Download PDFInfo
- Publication number
- KR100996911B1 KR100996911B1 KR20070017200A KR20070017200A KR100996911B1 KR 100996911 B1 KR100996911 B1 KR 100996911B1 KR 20070017200 A KR20070017200 A KR 20070017200A KR 20070017200 A KR20070017200 A KR 20070017200A KR 100996911 B1 KR100996911 B1 KR 100996911B1
- Authority
- KR
- South Korea
- Prior art keywords
- led
- block copolymer
- quartz substrate
- manufacturing
- phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 229920001400 block copolymer Polymers 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000010453 quartz Substances 0.000 claims abstract description 61
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 61
- 229920003229 poly(methyl methacrylate) Polymers 0.000 claims abstract description 57
- 239000004926 polymethyl methacrylate Substances 0.000 claims abstract description 57
- 229920005604 random copolymer Polymers 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 27
- 230000007935 neutral effect Effects 0.000 claims abstract description 23
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 14
- 238000000137 annealing Methods 0.000 claims abstract description 9
- 238000010030 laminating Methods 0.000 claims abstract description 5
- 230000004048 modification Effects 0.000 claims abstract description 5
- 238000012986 modification Methods 0.000 claims abstract description 5
- 239000004793 Polystyrene Substances 0.000 claims description 34
- 238000005191 phase separation Methods 0.000 claims description 22
- 238000000034 method Methods 0.000 claims description 20
- 239000012528 membrane Substances 0.000 claims description 16
- 238000004528 spin coating Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 4
- 229910005540 GaP Inorganic materials 0.000 claims description 4
- 239000000460 chlorine Substances 0.000 claims description 4
- 229910052801 chlorine Inorganic materials 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 4
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 3
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 3
- 229910000577 Silicon-germanium Inorganic materials 0.000 claims description 3
- 229910052731 fluorine Inorganic materials 0.000 claims description 3
- 239000011737 fluorine Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 229920005553 polystyrene-acrylate Polymers 0.000 claims description 2
- 238000000605 extraction Methods 0.000 abstract description 13
- 230000002411 adverse Effects 0.000 abstract description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- 239000007789 gas Substances 0.000 description 7
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 239000002086 nanomaterial Substances 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 229920000390 Poly(styrene-block-methyl methacrylate) Polymers 0.000 description 5
- 229920002223 polystyrene Polymers 0.000 description 5
- 238000001338 self-assembly Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000002105 nanoparticle Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 238000001312 dry etching Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 102100041003 Glutamate carboxypeptidase 2 Human genes 0.000 description 2
- 101000892862 Homo sapiens Glutamate carboxypeptidase 2 Proteins 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000004581 coalescence Methods 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920001481 poly(stearyl methacrylate) Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 241000446313 Lamella Species 0.000 description 1
- QYTDEUPAUMOIOP-UHFFFAOYSA-N TEMPO Chemical group CC1(C)CCCC(C)(C)N1[O] QYTDEUPAUMOIOP-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000002789 length control Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- GDOPTJXRTPNYNR-UHFFFAOYSA-N methyl-cyclopentane Natural products CC1CCCC1 GDOPTJXRTPNYNR-UHFFFAOYSA-N 0.000 description 1
- 239000002055 nanoplate Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000006303 photolysis reaction Methods 0.000 description 1
- 230000015843 photosynthesis, light reaction Effects 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Led Devices (AREA)
Abstract
Description
Claims (14)
- (a) 말단에 히드록시기를 포함하는 폴리스티렌-폴리메틸메타크릴레이트의 랜덤공중합체를 이용하여 석영기판의 상부면에 표면개질층을 적층하고 뉴트럴 브러쉬(neutral brush)를 형성하는 단계;(b) 상기 뉴트럴 브러쉬의 상부면에 폴리스티렌-폴리메틸메타크릴레이트의 블록공중합체막을 적층하고, 어닐링함으로써 상 분리하는 단계;(c) 상기 상 분리된 블록공중합체막 중 폴리메틸메타크릴레이트 영역을 제거함으로써 나노패턴으로 이루어진 나노템플레이트를 형성하는 단계;(d) LED의 상부면과 상기 나노템플레이트가 형성된 석영기판의 하부를 부착하는 단계;(e) 상기 나노템플레이트를 이용하여 상기 석영기판을 식각하는 단계; 및(f) 상기 석영기판을 이용하여 상기 LED의 상부면을 식각하는 단계를 포함하는 LED의 제조방법.
- 제 1항에 있어서,상기 랜덤공중합체는 500∼1500rpm의 속도로 스핀코팅하여 상기 석영기판에 형성되는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 뉴트럴 브러쉬를 형성하는 단계는,상기 랜덤공중합체를 진공하에서 130∼170℃의 온도로 열처리하여 뉴트럴 브러쉬를 형성하는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 블록공중합체막은 2000∼6000rpm의 속도로 스핀코팅하여 도포되는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 블록공중합체막의 두께는 25∼40nm인 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 블록공중합체막을 상 분리하는 단계는,상기 블록공중합체막을 진공하에서 150∼190℃의 온도로 열처리하여 상 분리하는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 블록공중합체막을 이루는 폴리스티렌과 폴리메틸메타크릴레이트의 몰비는 7:3인 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 블록공중합체막에 포함된 블록공중합체의 수평균분자량은 50,000∼90,000인 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 나노템플레이트를 형성하는 단계는, 상기 상 분리된 블록공중합체막의 상부에서 200∼300nm의 파장을 갖는 UV를 조사하여 상기 블록공중합체막에 포함된 폴리메틸메타크릴레이트 영역을 제거하는 것에 의하는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 나노 패턴의 형상은 실린더 또는 라멜라 형상인 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 나노템플레이트를 이용하여 상기 석영기판을 식각하는 단계는 불소계 가스를 사용하여 식각하는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 석영기판을 이용하여 상기 LED의 상부면을 식각하는 단계는 클로린계 가스를 사용하여 식각하는 것을 특징으로 하는 LED의 제조방법.
- 제 1항에 있어서,상기 LED는 GaN, SiC, Si, GaAs, SiGe, GaP 및 ZnO로 이루어진 군으로부터 선택된 물질로 이루어진 것을 특징으로 하는 LED의 제조방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070017200A KR100996911B1 (ko) | 2007-02-20 | 2007-02-20 | Led의 제조방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20070017200A KR100996911B1 (ko) | 2007-02-20 | 2007-02-20 | Led의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080077530A KR20080077530A (ko) | 2008-08-25 |
KR100996911B1 true KR100996911B1 (ko) | 2010-11-29 |
Family
ID=39880106
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20070017200A Expired - Fee Related KR100996911B1 (ko) | 2007-02-20 | 2007-02-20 | Led의 제조방법 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100996911B1 (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9417520B2 (en) | 2013-02-18 | 2016-08-16 | Samsung Electronics Co., Ltd. | Methods of patterning block copolymer layers and patterned structures |
CN111029443A (zh) * | 2019-12-06 | 2020-04-17 | 松山湖材料实验室 | 利用金属纳米颗粒增强氮化物基led发光效率的方法 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101781517B1 (ko) | 2010-09-30 | 2017-09-26 | 삼성디스플레이 주식회사 | 블록 공중합체 및 이를 이용한 패턴 형성 방법 |
KR101881165B1 (ko) * | 2011-12-22 | 2018-08-27 | 엘지디스플레이 주식회사 | 그래핀 양자점의 제조방법, 이를 이용한 양자점 발광소자의 제조방법 |
CN103682013B (zh) * | 2012-09-11 | 2016-06-15 | 中国科学院物理研究所 | 一种在发光二极管表面制备纳米尺度球形体结构的方法 |
KR20140038113A (ko) | 2012-09-20 | 2014-03-28 | 삼성디스플레이 주식회사 | 봉지 부재, 봉지 부재를 포함하는 유기 발광 표시 장치 및 봉지 부재를 포함하는 유기 발광 표시 장치의 제조 방법 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003218383A (ja) | 2002-01-18 | 2003-07-31 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP2006209816A (ja) | 2005-01-25 | 2006-08-10 | Hitachi Global Storage Technologies Netherlands Bv | 磁気抵抗効果型ヘッドの製造方法 |
-
2007
- 2007-02-20 KR KR20070017200A patent/KR100996911B1/ko not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003218383A (ja) | 2002-01-18 | 2003-07-31 | Toshiba Corp | 半導体発光素子及びその製造方法 |
JP2006209816A (ja) | 2005-01-25 | 2006-08-10 | Hitachi Global Storage Technologies Netherlands Bv | 磁気抵抗効果型ヘッドの製造方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9417520B2 (en) | 2013-02-18 | 2016-08-16 | Samsung Electronics Co., Ltd. | Methods of patterning block copolymer layers and patterned structures |
CN111029443A (zh) * | 2019-12-06 | 2020-04-17 | 松山湖材料实验室 | 利用金属纳米颗粒增强氮化物基led发光效率的方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20080077530A (ko) | 2008-08-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5275191B2 (ja) | 発光素子及びその製造方法 | |
JP4077312B2 (ja) | 発光素子の製造方法および発光素子 | |
KR100996911B1 (ko) | Led의 제조방법 | |
US8455082B2 (en) | Polymer materials for formation of registered arrays of cylindrical pores | |
KR101284422B1 (ko) | 기판 상에 형성된 반원통 어레이의 그래포에피택셜 자기 조립 | |
KR100709655B1 (ko) | 반도체 발광 장치 및 그것의 제조 방법 | |
US7709079B2 (en) | Methods for forming improved self-assembled patterns of block copolymers | |
TW200921786A (en) | Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces | |
JP2011515537A (ja) | 等しい優先性で両ブロックを湿潤にするために、制約を受ける上部界面を有するブロック共重合体膜の熱アニーリング | |
WO2011036778A1 (ja) | パターン形成方法 | |
KR101005300B1 (ko) | 광가교 및 열가교성 표면개질용 랜덤공중합체를 이용한태양전지의 제조방법 | |
JP2008109152A (ja) | 発光素子の製造方法および発光素子 | |
JP4455645B2 (ja) | 発光素子 | |
KR100938565B1 (ko) | 광가교 및 열가교성 표면개질용 랜덤공중합체 및 이를이용한 led의 제조방법 | |
KR100968241B1 (ko) | 태양전지의 제조방법 | |
KR100951855B1 (ko) | 삼중블록공중합체를 이용한 발광다이오드 제조방법 | |
JP2009081369A (ja) | ステンシルマスク製造方法 | |
JP5881763B2 (ja) | 半導体装置または記録媒体の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20070220 |
|
A201 | Request for examination | ||
PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20080222 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20070220 Comment text: Patent Application |
|
PG1501 | Laying open of application | ||
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20091127 Patent event code: PE09021S01D |
|
E902 | Notification of reason for refusal | ||
PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20100525 Patent event code: PE09021S01D |
|
E701 | Decision to grant or registration of patent right | ||
PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20101111 |
|
GRNT | Written decision to grant | ||
PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20101122 Patent event code: PR07011E01D |
|
PR1002 | Payment of registration fee |
Payment date: 20101123 End annual number: 3 Start annual number: 1 |
|
PG1601 | Publication of registration | ||
FPAY | Annual fee payment |
Payment date: 20130717 Year of fee payment: 4 |
|
PR1001 | Payment of annual fee |
Payment date: 20130717 Start annual number: 4 End annual number: 4 |
|
FPAY | Annual fee payment |
Payment date: 20151030 Year of fee payment: 6 |
|
PR1001 | Payment of annual fee |
Payment date: 20151030 Start annual number: 6 End annual number: 6 |
|
FPAY | Annual fee payment |
Payment date: 20160928 Year of fee payment: 7 |
|
PR1001 | Payment of annual fee |
Payment date: 20160928 Start annual number: 7 End annual number: 7 |
|
FPAY | Annual fee payment |
Payment date: 20181025 Year of fee payment: 9 |
|
PR1001 | Payment of annual fee |
Payment date: 20181025 Start annual number: 9 End annual number: 9 |
|
PC1903 | Unpaid annual fee |
Termination category: Default of registration fee Termination date: 20210903 |