KR100962437B1 - Plasma Display Panel - Google Patents

Abstract

The present invention includes a front substrate, a rear substrate facing the front substrate, and a partition wall formed between the front substrate and the rear substrate, the partition including an upper layer and a lower layer, wherein the partition wall is non-bismuth-based. A plasma display panel comprising a material, wherein the upper layer has an etch rate lower than that of the lower layer.

Bulkhead, plasma display panel

Description

Plasma Display Panel

The present invention relates to a plasma display panel.

In general, a plasma display panel (Barrier Rib) formed between the front substrate and the rear substrate forms a unit cell, each of the neon (Ne), helium (He) or neon and helium An inert gas containing a gas such as a mixed gas (Ne + He) and a small amount of xenon (Xe) is filled.

Therefore, when discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such plasma display panels are not only easy to thin and large in size, but also greatly improved as a result of recent technology developments, and thus are attracting attention as next generation display devices.

Sandblasting and wet chemical etching (WCE) are mainly used as a method of forming a partition on the plasma display panel. The sand blasting method is to apply a colored material to a predetermined thickness on a glass substrate, dry it, form a mask having sand blast resistance thereon in a pattern form, and then carry out sand blasting to remove portions other than partition walls, and then fire the desired material. It is a method of forming a partition.

In addition, the wet chemical etching method is a method of coating a heterogeneous colored material on a glass substrate, baking at a high temperature of 500 ° C. or higher, forming an acid resistant mask pattern, and then selectively etching the acidic liquid combination to form a partition wall. to be. In addition, the partition wall may be formed by a screen print method, an additive method, a mold method, or the like.

Meanwhile, the partition wall may be formed of a single layer or multiple layers of upper and lower layers by the above method. However, in the case of a multi-layer, two or more partition walls of upper and lower layers are formed, and then fired and etched. When an etching method of controlling the slope and shape of the partition is applied, the partition layer is formed of a single layer. Compared with the process, the cost and efficiency are inferior.

In addition, in the manufacture of two or more barrier rib layers, since the upper and lower layers having the same composition have the same etching rate, the upper layer exposed to the etchant is more etched, which makes it difficult to control the shape of the barrier rib.

In addition, as a material used for forming the partition walls, a paste obtained by mixing lead glass (PbO) with a glass powder and an organic substance is mainly used. However, lead oxide is known to be harmful to the human body and the environment, and thus requires additional environmental facilities in the production and use of glass powder, resulting in lower process efficiency and increased manufacturing costs.

Accordingly, the present invention provides an environmentally friendly plasma display panel that is easy to adjust the shape of the multi-layer partition wall.

According to an embodiment of the present invention, a plasma display panel includes a front substrate, a rear substrate facing the front substrate, and a partition wall formed between the front substrate and the rear substrate, the partition including an upper layer and a lower layer, wherein the partition wall is non- The non-Bi-based lead-free material may be included, and the etching rate of the upper layer may be lower than that of the lower layer.

The difference between the etching rate of the upper layer and the etching rate of the lower layer may be 10 to 20%.

The upper etching rate may be 30 to 40%.

The non-bismuth (Non-Bi) -based inorganic material may be any one or more selected from the group consisting of zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO), and phosphoric acid (P ₂ O ₅ ). It may include.

The upper layer of the partition wall may include a glass filler.

The glass filler may be any one or more selected from the group consisting of chromium oxide (CrO), copper oxide (CuO), and magnesium oxide (MgO).

The upper layer and the lower layer may include a ceramic filler.

The ceramic filler may be aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite (3Al ₂ O ₃ 2SiO ₂ ), Magnesia and cordierite may be any one or more selected from the group consisting of.

Plasma display panel according to an embodiment of the present invention has the advantage that it is easy to adjust the shape of the multi-layer partition wall, and can provide an environmentally friendly plasma display panel.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining a plasma display panel according to an embodiment of the present invention.

Referring to FIG. 1, a plasma display panel according to an embodiment of the present invention includes a front panel 100 having a scan electrode 102 and a sustain electrode 103 formed on a front substrate 101, and a rear substrate 111 forming a rear surface thereof. The rear panel 110, in which a plurality of address electrodes 113 are arranged so as to intersect the scan electrode 102 and the sustain electrode 103, is positioned side by side with a certain distance therebetween.

In the front panel 100, a scan electrode 102 and a sustain electrode 103 are disposed in a discharge space, that is, to maintain discharge and light emission of the discharge cell. More specifically, the scan electrodes 102 and the sustain electrodes 103 including the transparent electrodes 102a and 103a formed of a transparent ITO material and the bus electrodes 102b and 103b made of an opaque metal material are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by one or more upper dielectric layers 104 that limit the discharge current and insulate the electrode pairs. A protective layer 105 on which magnesium oxide (MgO) is deposited is disposed on the upper dielectric layer 104 to facilitate discharge conditions.

The rear panel 110 includes a plurality of discharge spaces, that is, a closed type partition wall 112 of a well type or stripe type for partitioning discharge cells.

The partition wall 112 may be formed of a multilayer including an upper layer 112a and a lower layer 112b. The upper layer 112a of the partition wall 112 may have a lower etching rate than the lower layer 112b. The difference between the etching rate of the upper layer 112a of the partition wall 112 and the etching rate of the lower layer 112b of the partition wall 112 may be 10 to 20%. To this end, the etching rate of the upper layer 112a of the partition wall 112 may be 30 to 40%.

On the other hand, a plurality of address electrodes 113 for supplying data pulses are located.

In the plurality of discharge cells partitioned by the partition wall 112, the phosphor layer 114 for emitting visible light for image display during address discharge, preferably red (R), green (G). A blue (B) phosphor layer is located.

The lower dielectric layer 115 is positioned between the address electrode 113 and the phosphor layer 114.

Here, it is not limited that the upper dielectric layer 104 and the lower dielectric layer 115 are formed on each of the front substrate 101 and the rear substrate 111, and on the contrary, the front substrate 101 and the rear substrate 110 are not limited thereto. It is also possible for the lower dielectric layer 115 and the upper dielectric layer 104 to be formed thereon.

In FIG. 1, only an example of the plasma display panel is shown and described, and the present invention is not limited to the plasma display panel having the structure of FIG. 1. For example, although the scan electrode 102, the sustain electrode 103, and the address electrode 113 are formed in the plasma display panel of FIG. 1, the scan electrode 102 and the sustain electrode are shown in the plasma display panel of the present invention. One or more of the 103 or the address electrode 113 may be omitted.

In addition, in FIG. 1, only the case where the partition wall 112 for partitioning the discharge cells is formed on the rear substrate 111 is illustrated. Alternatively, the partition wall 112 may be formed on the front substrate 101. It may be formed on the front substrate 101 and the rear substrate 112, respectively.

Hereinafter, a partition wall composition for manufacturing a plasma display panel partition wall according to an embodiment of the present invention will be described.

The partition composition may include an inorganic powder, a binder, a dispersant, a plasticizer and a solvent.

The inorganic powder is a non-bismuth (Non-Bi) -based lead-free material and may be composed of zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ O ₅ ) as main components. .

The zinc oxide (ZnO) serves to improve the etching rate while lowering the glass transition temperature (Tg), dielectric constant, coefficient of thermal expansion (CTE) and gelation frequency of the barrier rib as a glass formula.

Boron oxide (B ₂ O ₃ ) is a light-colored glass forming agent that increases the glass transition temperature (Tg) of the partition walls and lowers the coefficient of thermal expansion (CTE), while increasing the etching rate and gelation frequency.

The barium oxide (BaO) is a glass formula having a dark color, serves to lower the glass transition temperature (Tg) of the partition wall, increase the etching rate, dielectric constant, coefficient of thermal expansion (CTE) and gelation frequency.

The phosphoric acid (P ₂ O ₅ ) is a light-forming glass forming agent has the effect of slightly increasing the glass transition temperature (Tg) and the etching rate of the partition wall, and the function of lowering the dielectric constant and slightly lowering the coefficient of thermal expansion (CTE) and gelation frequency Do it.

In addition, the inorganic powder may further include any one or more selected from the group consisting of silicon oxide (SiO ₂ ), sodium oxide (Na ₂ O), and lithium oxide (Li ₂ O).

The silicon oxide (SiO ₂ ) is a light-forming glass forming agent to increase the glass transition temperature (Tg) of the partition wall, to rapidly lower the coefficient of thermal expansion (CTE) and etching rate, and to lower the gelation frequency.

The sodium oxide (Na ₂ O) and the lithium oxide (Li ₂ O) can control the firing temperature by lowering the glass transition temperature (Tg) of the composition, and serves to slightly increase the coefficient of thermal expansion (CTE).

As described above, the inorganic powder of the partition composition is a non-bismuth (Bi) -based lead-free material, zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ O ₅ ) It may include any one or more selected from the group consisting of.

The binder may include a first monomer, a second monomer, and a third monomer.

The first monomer may use a hexa acrylate monomer, for example hexa methacrylate or 2-ethyl hexa methacrylate.

As the second monomer, an acrylate monomer having an alkyl group having 1 to 5 carbon atoms may be used, for example, methacrylate, iso-butyl methacrylate, normal-butyl methacrylate, methyl methacrylate and ethyl methacrylate. At least one selected from the group consisting of a rate.

The third monomer may be a polar group-containing monomer, for example, may be any one or more selected from the group consisting of methacrylate, acrylate, 2-hydroxy ethyl methacrylate and methacrylic acid.

Herein, the binder may include a first monomer, a second monomer, and a third monomer, each of the contents may include 60 to 85 parts by weight based on 100 parts by weight of the total binder, and the second monomer may include It may include 10 to 20 parts by weight, and the third monomer may include 5 to 20 parts by weight.

The plasticizer serves to impart flexibility to the dry film, and for example, butyl benzyl phthalate, dioctyl phthalate, diisooctyl phthalate, dicapryl phthalate, dibutyl phthalate, and the like may be used. It can also be mixed and used.

As the solvent, the binder may be dissolved, and a boiling point of 150 ° C. or more may be used while being well mixed with a crosslinking agent and other additives. For example, ethyl carbitol, butyl carbitol, ethyl carbitol acetate, butyl carbitol acetate, Texanol, terpin oil, dipropylene glycol methyl ether, dipropylene glycol ethyl ether, dipropylene glycol monomethyl ether acetate, cellosolve acetate, butyl cellosolve acetate and tripropylene glycol Can be.

The solvent may be included in a certain ratio with respect to the content of the binder, it may be included in an amount of 100 to 500 parts by weight based on 100 parts by weight of the binder.

In addition, the partition composition according to an embodiment of the present invention may further include an additive. The additives may include antioxidants, ultraviolet light absorbers to improve resolution, sensitizers to improve sensitivity, dispersants to improve dispersibility, and the like.

In addition, polymerization inhibitors and polyester-modified dimethylpolysiloxanes, polyhydroxycarboxylic acid amides, silicone-based polyacrylate copolymers or fluorine-based paraffin compounds which improve the storage properties of coating compositions such as phosphoric acid, phosphate esters and carboxylic acid-containing compounds It may further include a leveling agent for improving the flatness of the film during printing, such as.

Meanwhile, the partition composition of the plasma display panel according to an embodiment of the present invention may be divided into an upper layer composition forming an upper layer of the partition wall and a lower layer composition forming a lower layer of the partition wall.

The upper layer composition is a composition forming an upper layer of the partition wall, and may include the above-described inorganic powder, a binder, a dispersant, a plasticizer, and a solvent. The inorganic powder may include a ceramic filler, and may further include a glass filler. have.

The ceramic filler may include aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite ( 3Al ₂ O ₃ 2SiO ₂ ), magnesia (magnesia) and cordierite (cordierite) may include any one or more selected from the group consisting of.

In addition, the glass-based filler may be materials having excellent etching resistance to acids, and may include any one or more of chromium oxide (CrO), copper oxide (CuO), or magnesium oxide (MgO).

Here, the ceramic filler and the glass filler may be included in an amount of 20 to 60 parts by weight based on 100 parts by weight of the inorganic powder of the upper layer composition.

The lower layer composition is a composition forming a lower layer of the partition wall, and may include the above-described inorganic powder, a binder, a dispersant, a plasticizer, and a solvent. Unlike the above upper layer composition, the lower layer composition may include only a ceramic filler in the inorganic powder.

Here, the ceramic filler may be included in 20 to 60 parts by weight based on 100 parts by weight of the inorganic powder of the lower layer composition.

That is, the etching rate of the upper layer of a partition can be reduced by further including the glass-type filler excellent in the etching resistance to an acid in an upper layer composition.

Hereinafter, a process of manufacturing the partition wall of the plasma display panel using the plasma display panel partition wall composition according to the exemplary embodiment described above will be described. Hereinafter, the formation of the two-layer partition wall using the green sheet will be disclosed.

2A through 2D are cross-sectional views illustrating processes of manufacturing a partition wall of a plasma display panel according to an exemplary embodiment of the present invention.

First, referring to FIG. 2A, the barrier rib of the plasma display panel according to the exemplary embodiment of the present invention is coated with an upper layer composition formed as an upper layer of the barrier rib on the base film 210 to form an upper layer composition layer 220. Next, the lower layer composition formed by the lower layer of a partition is apply | coated and the lower layer composition layer 230 is formed.

The upper layer composition and the lower layer composition are each mixed with the above-described inorganic powder, a binder, a plasticizer, a dispersant and a solvent, the inorganic powder of the upper composition includes a ceramic filler and a glass filler, and the inorganic powder of the lower composition It only contains a system filler.

In addition, in order to apply the upper layer and the lower layer composition, when the compositions are applied to the base film, the upper layer composition and the lower layer composition should not be mixed with each other. For this purpose, the viscosity of the upper composition must be higher than the viscosity of the lower composition. If the viscosity is the same, the flow characteristics of the compositions are the same may cause mixing phenomenon during coating. In addition, it may be designed such that there is a difference in density between the upper composition layer 220 and the lower composition layer 230.

In addition, the upper composition layer 220 and the lower composition layer 230 is different in the etching rate under the same conditions, where the upper composition layer 220 should be lower than the lower composition layer 230. To this end, the glass-based filler is further added to the upper composition to design the etching rate differently.

Subsequently, the upper layer composition layer 220 and the lower layer composition layer 230 are formed on the base film 210 and then dried, and the green sheet 200 is formed by attaching the protective sheet 240.

Next, referring to FIG. 2B, the green sheet 200 is transferred onto the lower substrate 300 on which the lower dielectric layer 310 and the address electrode 320 are formed.

That is, after peeling the protective sheet of the green sheet 200, the lower substrate 300 is arranged so that the surface of the lower layer composition layer 230 is in contact with the surface. In this case, the direction in which the green sheet is arranged may be horizontal or vertical to the direction of the address electrode 320, and there is no particular limitation.

Next, the heated roller is moved on the green sheet so as to transfer the upper layer composition layer 220 and the lower layer composition layer 230 onto the lower substrate 300 to be thermocompressed.

Then, as shown in Figure 2c, the base film 210 of the green sheet is peeled off. Subsequently, the lower substrate 300 to which the upper composition layer 220 and the lower composition layer 230 are transferred are heat-treated at a temperature of 500 ° C. or higher to fire the upper composition layer 220 and the lower composition layer 230.

Next, referring to FIG. 2D, the mask is positioned on the lower substrate 300 on which the upper layer composition layer 220 and the lower layer composition layer 230 are formed, and then etched to include the upper layer 330 and the lower layer 340. The partition wall 350 is formed.

In the etching process, due to the glass filler included in the upper layer composition layer 220, the upper layer 330 and the lower layer 340 of the partition wall may have a difference in etching rate.

In more detail, the etching rate of the upper layer 330 of the barrier rib may be lower than that of the lower layer 340 of the barrier rib. That is, while the upper layer 330 of the partition is etched and then the lower layer 340 of the partition is etched, the upper layer 330 of the partition is less damaged by the etchant and thus has a structural or mechanically stable rectangular or trapezoidal cross-sectional shape. It is possible to form a partition having a.

To this end, in the plasma display panel partition wall composition according to an embodiment of the present invention, a glass filler may be further added to the upper layer composition. Hereinafter, a detailed description will be disclosed in the experimental example described later.

Therefore, the partition wall of the plasma display panel according to an embodiment of the present invention can be manufactured.

Hereinafter, an embodiment according to a method of manufacturing a partition of a plasma display panel of the present invention will be described. However, the following embodiments are merely preferred embodiments of the present invention, and the present invention is not limited to the following embodiments.

Experiment: Measurement of the etching rate of the partition according to the filler included in the plasma display panel partition composition

Experimental Example 1

An inorganic powder, a binder, a plasticizer, a dispersant, and a solvent were mixed to prepare a plasma display panel partition composition.

The inorganic powder is a non-bismuth (non-Bi) -based lead-free material, with zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO), and phosphoric acid (P ₂ O ₅ ) as main components. A total of 70 g was mixed by mixing 21 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, and 21 g of magnesium oxide (MgO), which is a glass filler.

Next, the partition composition was prepared by mixing 70 g of the prepared inorganic powder, 15 g of ethyl cellulose as a binder, 2.5 g of polyisobutylene as a dispersant, 2.5 g of phthalate as a plasticizer, and 10 g of butylcarbitol acetate (BCA) as a solvent.

Next, the barrier composition was coated on a glass substrate with a thickness of 200 μm, dried, and then fired at a temperature of 500 ° C. to form a barrier layer.

Then, the prepared barrier layer was etched to measure the etching rate.

Experimental Example 2

Under the same conditions as in Experimental Example 1, the inorganic powder is a non-bismuth (Non-Bi) -based lead-free material, zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ O ₅ ) is a main component, and a total of 70 g is mixed by mixing 21 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, 3.5 g of titanium oxide (TiO 2), and 17.5 g of magnesium oxide (MgO), which is a glass filler. And the partition layer was produced.

Experimental Example 3

Under the same conditions as in Experimental Example 1, the inorganic powder is a non-bismuth (Non-Bi) -based lead-free material, zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ O ₅ ) as a main component, and 14 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, and 14 g of magnesium oxide (MgO), which is a glass filler, were mixed and a total of 70 g was mixed to prepare a partition layer.

Experimental Example 4

Under the same conditions as in Experimental Example 1, the inorganic powder is a non-bismuth (Non-Bi) -based lead-free material, zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ O ₅ ) was used as a main component, and 42 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, was mixed and a total of 70 g was mixed to prepare a partition layer.

Experimental Example 5

Under the same conditions as in Experimental Example 1, the inorganic powder is a non-bismuth (Non-Bi) -based lead-free material, zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ O ₅ ) as a main component, a total of 70 g by mixing 21 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, and 11 g of titanium oxide (TiO ₂ ), were mixed to prepare a partition layer.

Experimental Example 6

Under the same conditions as in Experimental Example 1, the inorganic powder is a non-bismuth (Non-Bi) -based lead-free material, zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO) and phosphoric acid (P ₂ The main component was O ₅ ), and 28 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, was mixed and a total of 70 g was mixed to prepare a partition layer.

The etching rate of the barrier rib layer prepared according to Experimental Examples 1 to 6 was measured and shown in Table 1 below.

Mineral Powder Total 70 (g)
Etch rate of barrier layer (%) Ceramic Filler (g) Glass filler (g) Experimental Example 1 21 21 34.1 Experimental Example 2 24.5 17.5 38.4 Experimental Example 3 14 14 40.3 Experimental Example 4 42 0 51.9 Experimental Example 5 32 0 53.8 Experimental Example 6 28 0 55.2

Herein, the etching rate (%) of the partition wall is obtained by applying the partition composition to a thickness of 200 µm and firing to form a partition layer of 110 µm, and etching the partition layer for 3 minutes with a 3% nitric acid solution. The thickness is calculated by the percentage.

As shown in Table 1, looking at the etching rate of the barrier rib layer prepared by Experimental Examples 1 to 6, the etching rate of the barrier rib layer prepared by Experimental Examples 1 to 3 including a glass-based filler is 30 to 40% It is understood that the etching rate of the barrier rib layer manufactured by Experimental Examples 4 to 6 including the ceramic filler is 50% or more.

Here, as described above, the etching rate of the upper layer of the partition wall must be lower than the etching rate of the lower layer of the partition wall, so that the shape of the partition wall can be easily controlled during the etching process of the partition wall.

Therefore, as shown in Table 1, forming the composition of Experimental Examples 1 to 3 having a low etching rate as the upper layer of the partition wall, and forming the composition of Experimental Examples 4 to 6 with a high etching rate as the lower layer of the partition wall It can be seen that it can be easy to control.

Therefore, the partition wall of the plasma display panel according to an embodiment of the present invention has a difference in the etching rate between the upper layer and the lower layer, and thus, a structurally stable trapezoidal or rectangular partition wall shape may be manufactured during the etching process for fabricating the partition wall. .

Therefore, the plasma display panel according to an embodiment of the present invention has an advantage of providing a plasma display panel that can easily control the shape of the partition wall by forming a difference in etching rate between the upper layer and the lower layer of the partition wall by 10% or more. There is this.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 illustrates a plasma display panel according to an exemplary embodiment of the present invention.

2A to 2D are cross-sectional views of processes for manufacturing barrier ribs of a plasma display panel according to an exemplary embodiment of the present invention.

Claims (8)

Front substrate; A rear substrate facing the front substrate; And A partition wall formed between the front substrate and the rear substrate, the partition including an upper layer and a lower layer, The barrier rib is non-bismuth (Non-Bi) including any one or more selected from the group consisting of zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), barium oxide (BaO), and phosphoric acid (P ₂ O ₅ ). Including a system lead-free material, The upper layer of the partition includes a glass filler and a ceramic filler, the lower layer of the partition includes a ceramic filler, And an etching rate of the upper layer is lower than that of the lower layer. The method of claim 1, And a difference between the etching rate of the upper layer and the etching rate of the lower layer is 11.6 to 21.1%. The method of claim 1, And the etching rate of the upper layer is 34.1 to 40.3%. delete delete The method of claim 1, The glass filler is any one or more selected from the group consisting of chromium oxide (CrO), copper oxide (CuO) and magnesium oxide (MgO). delete The method of claim 1, The ceramic filler may be aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite (3Al ₂ O ₃ 2SiO ₂ ), A plasma display panel, which is at least one selected from the group consisting of magnesia and cordierite.

Images