KR100962438B1 - Plasma Display Panel - Google Patents

Abstract

The present invention includes a front substrate, a rear substrate facing the front substrate, and a partition wall formed between the front substrate and the rear substrate, the partition including an upper layer and a lower layer, wherein the partition includes a lead oxide (PbO) -based inorganic material. In addition, the etching rate of the upper layer is lower than the etching rate of the lower layer to provide a plasma display panel.

Bulkhead, plasma display panel

Description

Plasma Display Panel

The present invention relates to a plasma display panel.

In general, a plasma display panel (Barrier Rib) formed between the front substrate and the rear substrate forms a unit cell, each of the neon (Ne), helium (He) or neon and helium An inert gas containing a gas such as a mixed gas (Ne + He) and a small amount of xenon (Xe) is filled.

Therefore, when discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such plasma display panels are not only easy to thin and large in size, but also greatly improved as a result of recent technology developments, and thus are attracting attention as next generation display devices.

Sandblasting and wet chemical etching (WCE) are mainly used as a method of forming a partition on the plasma display panel. The sand blasting method is to apply a colored material to a predetermined thickness on a glass substrate, dry it, form a mask having sand blast resistance thereon in a pattern form, and then carry out sand blasting to remove portions other than partition walls, and then fire the desired material. It is a method of forming a partition.

In addition, the wet chemical etching method is a method of coating a heterogeneous colored material on a glass substrate, baking at a high temperature of 500 ° C. or higher, forming an acid resistant mask pattern, and then selectively etching the acidic liquid combination to form a partition wall. to be. In addition, the partition wall may be formed by a screen print method, an additive method, a mold method, or the like.

Meanwhile, the partition wall may be formed of a single layer or multiple layers of upper and lower layers by the above method. However, in the case of a multi-layer, barrier layers of two or more upper and lower layers are formed, and then fired and etched. When an etching method of adjusting the slope and shape of the barrier is applied, the barrier layer is formed as a single layer. Compared with the process, the cost and efficiency are inferior.

In addition, in the manufacture of two or more barrier rib layers, since the upper and lower layers having the same composition have the same etching rate, the upper layer exposed to the etchant is more etched, which makes it difficult to control the shape of the barrier rib.

Accordingly, the present invention provides a plasma display panel that is easy to adjust the shape of a multilayer partition wall.

According to an embodiment of the present invention, a plasma display panel includes a front substrate, a rear substrate facing the front substrate, and a partition wall formed between the front substrate and the rear substrate, the partition including an upper layer and a lower layer, and the partition wall is oxidized. It includes a lead (PbO) -based inorganic material, the etching rate of the upper layer may be lower than the etching rate of the lower layer.

The difference between the etching rate of the upper layer and the etching rate of the lower layer may be 10 to 20%.

Etching rate of the upper layer may be 10 to 15%.

The lead oxide (PbO) -based inorganic material is lead oxide (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), zinc oxide (ZnO), phosphoric acid (P ₂ O ₅ ), barium oxide (BaO) ) And calcium oxide (CaO) may include any one or more selected from the group consisting of.

The upper layer of the partition wall may include a glass filler.

The glass filler may be any one or more selected from the group consisting of chromium oxide (CrO), copper oxide (CuO), and magnesium oxide (MgO).

The upper layer and the lower layer may include a ceramic filler.

The ceramic filler is aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite (3Al ₂₎ O ₃ 2SiO ₂ ), magnesia (magnesia) and cordierite (cordierite) may be any one or more selected from the group consisting of.

Plasma display panel according to an embodiment of the present invention is easy to adjust the shape of the multi-layer partition wall, there is an advantage that can provide a plasma display panel with excellent reliability.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a view for explaining a plasma display panel according to an embodiment of the present invention.

Referring to FIG. 1, a plasma display panel according to an embodiment of the present invention includes a front panel 100 having a scan electrode 102 and a sustain electrode 103 formed on a front substrate 101, and a rear substrate 111 forming a rear surface thereof. The rear panel 110, in which a plurality of address electrodes 113 are arranged so as to intersect the scan electrode 102 and the sustain electrode 103, is positioned side by side with a certain distance therebetween.

In the front panel 100, a scan electrode 102 and a sustain electrode 103 are disposed in a discharge space, that is, to maintain discharge and light emission of the discharge cell. More specifically, the scan electrodes 102 and the sustain electrodes 103 including the transparent electrodes 102a and 102a formed of a transparent ITO material and the bus electrodes 102b and 103b made of an opaque metal material are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by one or more upper dielectric layers 104 that limit the discharge current and insulate the electrode pairs. A protective layer 105 on which magnesium oxide (MgO) is deposited is disposed on the upper dielectric layer 104 to facilitate discharge conditions.

The rear panel 110 includes a plurality of discharge spaces, that is, a closed type partition wall 112 of a well type or stripe type for partitioning discharge cells.

The partition wall 112 may be formed of a multilayer including an upper layer 112a and a lower layer 112b. The upper layer 112a of the partition wall 112 may have a lower etching rate than the lower layer 112b. The difference between the etching rate of the upper layer 112a of the partition wall 112 and the etching rate of the lower layer 112b of the partition wall 112 may be 10 to 20%. To this end, the etching rate of the upper layer 112a of the partition wall 112 may be 10 to 15%.

On the other hand, a plurality of address electrodes 113 for supplying data pulses are located.

In the plurality of discharge cells partitioned by the partition wall 112, the phosphor layer 114 for emitting visible light for image display during address discharge, preferably red (R), green (G). A blue (B) phosphor layer is located.

The lower dielectric layer 115 is positioned between the address electrode 113 and the phosphor layer 114.

Here, it is not limited that the upper dielectric layer 104 and the lower dielectric layer 115 are formed on each of the front substrate 101 and the rear substrate 111, and on the contrary, the front substrate 101 and the rear substrate 110 are not limited thereto. It is also possible for the lower dielectric layer 115 and the upper dielectric layer 104 to be formed thereon.

In FIG. 1, only an example of the plasma display panel is shown and described, and the present invention is not limited to the plasma display panel having the structure of FIG. 1. For example, although the scan electrode 102, the sustain electrode 103, and the address electrode 113 are formed in the plasma display panel of FIG. 1, the scan electrode 102 and the sustain electrode are shown in the plasma display panel of the present invention. One or more of the 103 or the address electrode 113 may be omitted.

In addition, in FIG. 1, only the case where the partition wall 112 for partitioning the discharge cells is formed on the rear substrate 111 is illustrated. Alternatively, the partition wall 112 may be formed on the front substrate 101. It may be formed on the front substrate 101 and the rear substrate 112, respectively.

Hereinafter, a partition wall composition for manufacturing a plasma display panel partition wall according to an embodiment of the present invention will be described.

The partition composition may include an inorganic powder, a binder, a dispersant, a plasticizer and a solvent.

The inorganic powder may be a lead oxide (PbO) -based inorganic material mainly composed of lead oxide (PbO), and may include silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), or the like.

The lead oxide (PbO) serves to lower the firing temperature of the composition as a main glass forming agent and to increase the coefficient of thermal expansion.

The silicon oxide (SiO ₂ ) is a light-forming glass forming agent that increases the glass transition temperature (Tg) of the partition, rapidly lowers the coefficient of thermal expansion (CTE) and etching rate, and lowers the gelation frequency.

The boron oxide (B ₂ O ₃ ) is a light-forming glass forming agent to increase the glass transition temperature (Tg) of the partition wall, lower the coefficient of thermal expansion (CTE), and serves to increase the etching rate and gelation frequency.

In addition, the lead oxide (PbO) -based inorganic material may further include any one or more selected from the group consisting of zinc oxide (ZnO), phosphoric acid (P ₂ O ₅ ), barium oxide (BaO) and calcium oxide (CaO). have.

The zinc oxide (ZnO) serves to improve the etching rate while lowering the glass transition temperature (Tg), dielectric constant, thermal expansion coefficient (CTE) and gelation frequency of the partition as a glass formula.

The phosphoric acid (P ₂ O ₅ ) is a light-forming glass forming agent that has an effect of slightly increasing the glass transition temperature (Tg) and the etching rate of the barrier rib, and lowering the dielectric constant, slightly lowering the coefficient of thermal expansion (CTE) and gelation frequency. Function

The barium oxide (BaO) is a glass formula showing a dark color, serves to lower the glass transition temperature (Tg) of the partition wall, increase the etching rate, dielectric constant, coefficient of thermal expansion (CTE) and gelation frequency.

The calcium oxide (CaO) is a light-colored glass formula that slightly increases the glass transition temperature (Tg) of the partition, slightly lowers the coefficient of thermal expansion (CTE), and lowers the etching rate and gelation frequency.

As described above, the inorganic powder of the barrier rib composition may include lead oxide (PbO) -based inorganic materials such as lead oxide (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), zinc oxide (ZnO), and phosphoric acid ( P ₂ O ₅ ), barium oxide (BaO) and calcium oxide (CaO) may include any one or more selected from the group consisting of.

The binder may be a conventional binder used for the preparation of the partition wall, and preferably any one or more polymer resins selected from acrylic resin, epoxy resin or ethyl cellulose resin may be used.

The dispersant may be any one or more selected from the group consisting of polyamineamide, phosphate ester, polyisobutylene, oleic acid, stearic acid, fish oil, ammonium salt of polycarboxylic acid and sodium carboxymethyl.

The plasticizer may be used any one or more selected from the group consisting of phthalate-based, glycol-based and azelate-based.

The solvent may be used a conventional solvent used for the production of partition walls, for example, methyl ethyl ketone, ethanol, xylene, texanol, terpineol, butyl cellosolve, toluene, propylene glycol monomethyl ether, isopropyl alcohol At least one selected from the group consisting of acetone, trichloroethane, butanol, methyl isobutyl ketone, butyl acetate, cyclohexanone and water can be used.

Meanwhile, the partition composition of the plasma display panel according to an embodiment of the present invention may be divided into an upper layer composition forming an upper layer of the partition wall and a lower layer composition forming a lower layer of the partition wall.

The upper layer composition is a composition forming an upper layer of the partition wall, and may include the above-described inorganic powder, a binder, a dispersant, a plasticizer, and a solvent. The inorganic powder may include a ceramic filler, and may further include a glass filler. have.

The ceramic filler may include aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite ( 3Al ₂ O ₃ 2SiO ₂ ), magnesia (magnesia) and cordierite (cordierite) may include any one or more selected from the group consisting of.

In addition, the glass-based filler may be materials having excellent etching resistance to acids, and may include any one or more of chromium oxide (CrO), copper oxide (CuO), or magnesium oxide (MgO).

Here, the ceramic filler and the glass filler may be included in an amount of 20 to 60 parts by weight based on 100 parts by weight of the inorganic powder of the upper layer composition.

On the other hand, the lower layer composition is a composition for forming the lower layer of the partition wall, it may include the above-described inorganic powder, binder, dispersant, plasticizer and solvent. Unlike the above upper layer composition, the lower layer composition may include only a ceramic filler in the inorganic powder.

Here, the ceramic filler may be included in 20 to 60 parts by weight based on 100 parts by weight of the inorganic powder of the lower layer composition.

That is, the etching rate of the upper layer of a partition can be reduced by including the glass-type filler excellent in the etching resistance to an acid in an upper layer composition.

Hereinafter, a process of manufacturing the partition wall of the plasma display panel using the plasma display panel partition wall composition according to the exemplary embodiment described above will be described. Hereinafter, the formation of the two-layer partition wall using the green sheet will be disclosed.

2A through 2D are cross-sectional views illustrating processes of manufacturing a partition wall of a plasma display panel according to an exemplary embodiment of the present invention.

First, referring to FIG. 2A, the barrier rib of the plasma display panel according to the exemplary embodiment of the present invention is coated with an upper layer composition formed as an upper layer of the barrier rib on the base film 210 to form an upper layer composition layer 220. Next, the lower layer composition formed by the lower layer of a partition is apply | coated and the lower layer composition layer 230 is formed.

The upper layer composition and the lower layer composition are each mixed with the above-described inorganic powder, a binder, a plasticizer, a dispersant and a solvent, the inorganic powder of the upper composition includes a ceramic filler and a glass filler, and the inorganic powder of the lower composition It only contains a system filler.

In addition, in order to apply the upper layer and the lower layer composition, when the compositions are applied to the base film, the upper layer composition and the lower layer composition should not be mixed with each other. For this purpose, the viscosity of the upper composition must be higher than the viscosity of the lower composition. If the viscosity is the same, the flow characteristics of the compositions are the same may cause mixing phenomenon during coating. In addition, it may be designed such that there is a difference in density between the upper composition layer 220 and the lower composition layer 230.

In addition, the upper composition layer 220 and the lower composition layer 230 is different in the etching rate under the same conditions, where the upper composition layer 220 should be lower than the lower composition layer 230. To this end, a glass-based filler is added to the upper composition to design the etching rate differently.

Subsequently, the upper layer composition layer 220 and the lower layer composition layer 230 are formed on the base film 210 and dried, and the green sheet 200 is formed by attaching the protective sheet 240.

Next, referring to FIG. 2B, the green sheet 200 is transferred onto the lower substrate 300 on which the lower dielectric layer 310 and the address electrode 320 are formed.

That is, after peeling the protective sheet of the green sheet 200, the lower substrate 300 is arranged so that the surface of the lower layer composition layer 230 in contact with the surface. In this case, the direction in which the green sheet is arranged may be horizontal or vertical to the direction of the address electrode 320, and there is no particular limitation.

Next, the heated roller is moved on the green sheet so as to transfer the upper layer composition layer 220 and the lower layer composition layer 230 onto the lower substrate 300 to be thermocompressed.

Then, as shown in Figure 2c, the base film 210 of the green sheet is peeled off. Subsequently, the lower substrate 300 to which the upper composition layer 220 and the lower composition layer 230 are transferred are heat-treated at a temperature of 500 ° C. or higher to fire the upper composition layer 220 and the lower composition layer 230.

Next, referring to FIG. 2D, the mask is positioned on the lower substrate 300 on which the upper layer composition layer 220 and the lower layer composition layer 230 are formed, and then etched to include the upper layer 330 and the lower layer 340. The partition wall 350 is formed.

In the etching process, due to the glass filler included in the upper layer composition layer 220, the upper layer 330 and the lower layer 340 of the partition wall may have a difference in etching rate.

In more detail, the etching rate of the upper layer 330 of the barrier rib may be lower than the etching rate of the lower layer 340 of the barrier rib. That is, while the upper layer 330 of the partition is etched and then the lower layer 340 of the partition is etched, the upper layer 330 of the partition is less damaged by the etchant and thus has a structural or mechanically stable rectangular or trapezoidal cross-sectional shape. It is possible to form a partition having a.

To this end, in the plasma display panel partition wall composition according to an embodiment of the present invention, a glass filler may be further added to the upper layer composition. Hereinafter, the detailed description will be disclosed in the experimental example described later.

Therefore, the partition wall of the plasma display panel according to an embodiment of the present invention can be manufactured.

Hereinafter, an embodiment according to a method of manufacturing a partition of a plasma display panel of the present invention will be described. However, the following embodiments are merely preferred embodiments of the present invention, and the present invention is not limited to the following embodiments.

Experiment: Measurement of the etching rate of the partition according to the filler included in the plasma display panel partition composition

Experimental Example 1

An inorganic powder, a binder, a plasticizer, a dispersant, and a solvent were mixed to prepare a plasma display panel partition composition.

The inorganic powder is lead oxide (PbO) -based inorganic materials lead oxide (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), phosphoric acid (P ₂ O ₅ ), barium oxide (BaO) and calcium oxide The main component was (CaO), and 21 g of aluminum oxide (Al ₂ O ₃ ), a ceramic filler, and 21 g of magnesium oxide (MgO), a glass filler, were mixed, and a total of 70 g was mixed.

Next, the partition composition was prepared by mixing 70 g of the prepared inorganic powder, 15 g of ethyl cellulose as a binder, 2.5 g of polyisobutylene as a dispersant, 2.5 g of phthalate as a plasticizer, and 10 g of butylcarbitol acetate (BCA) as a solvent.

Next, the barrier composition was coated on a glass substrate with a thickness of 200 μm, dried, and then fired at a temperature of 500 ° C. to form a barrier layer.

Then, the prepared barrier layer was etched to measure the etching rate.

Experimental Example 2

Under the same conditions as in Experimental Example 1, the inorganic powder was lead oxide (PbO) -based inorganic powder (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), phosphoric acid (P ₂ O ₅ ), Barium oxide (BaO) and calcium oxide (CaO) as main components, 21g of aluminum oxide (Al ₂ O ₃ ), ceramic filler, 3.5g of titanium oxide (TiO ₂ ), and magnesium oxide (MgO) of glass filler ) 17.5 g were mixed and a total of 70 g was mixed to prepare a partition layer.

Experimental Example 3

Under the same conditions as in Experimental Example 1, the inorganic powder was lead oxide (PbO) -based inorganic powder (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), phosphoric acid (P ₂ O ₅ ), Barium oxide (BaO) and calcium oxide (CaO) as main components, and a total of 70 g by mixing 14 g of ceramic oxide aluminum oxide (Al ₂ O ₃ ) and 14 g of glass oxide magnesium oxide (MgO) And the partition layer was produced.

Experimental Example 4

Under the same conditions as in Experimental Example 1, the inorganic powder was lead oxide (PbO) -based inorganic powder (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), phosphoric acid (P ₂ O ₅ ), Barium oxide (BaO) and calcium oxide (CaO) as main components, and 42 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, were mixed and a total of 70 g was mixed to prepare a partition layer.

Experimental Example 5

Under the same conditions as in Experimental Example 1, the inorganic powder was lead oxide (PbO) -based inorganic powder (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), phosphoric acid (P ₂ O ₅ ), Barium oxide (BaO) and calcium oxide (CaO) as main components, and 21 g of aluminum oxide (Al ₂ O ₃ ), a ceramic filler, and 11 g of titanium oxide (TiO ₂ ) are mixed to mix a total of 70 g. The layer was prepared.

Experimental Example 6

Under the same conditions as in Experimental Example 1, the inorganic powder was lead oxide (PbO) -based inorganic powder (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), phosphoric acid (P ₂ O ₅ ), Barium oxide (BaO) and calcium oxide (CaO) as main components, and 28 g of aluminum oxide (Al ₂ O ₃ ), which is a ceramic filler, were mixed and a total of 70 g was mixed to prepare a partition layer.

The etching rate of the barrier rib layer prepared according to Experimental Examples 1 to 6 was measured and shown in Table 1 below.

Mineral Powder Total 70 (g)
Etch rate of barrier layer (%) Ceramic Filler (g) Glass filler (g) Experimental Example 1 21 21 12.1 Experimental Example 2 24.5 17.5 13.8 Experimental Example 3 14 14 14.1 Experimental Example 4 42 0 30.5 Experimental Example 5 32 0 30.1 Experimental Example 6 28 0 31.3

Herein, the etching rate (%) of the partition wall is obtained by applying the partition composition to a thickness of 200 µm and firing to form a partition layer of 110 µm, and etching the partition layer for 3 minutes with a 3% nitric acid solution. The thickness is calculated by the percentage.

As shown in Table 1, looking at the etching rate of the barrier rib layer prepared by Experimental Examples 1 to 6, the etching rate of the barrier rib layer prepared by Experimental Examples 1 to 3 further comprising a glass filler is 10 to 15 It can be seen that the etching rate of the partition layer produced by Experimental Examples 4 to 6 containing only a ceramic filler and only about 30% is about%.

Here, as described above, the etching rate of the upper layer of the partition wall must be lower than the etching rate of the lower layer of the partition wall, so that it is easy to control the shape of the partition wall during the etching process of the partition wall.

Therefore, as shown in Table 1, forming the composition of Experimental Examples 1 to 3 having a low etching rate as the upper layer of the partition wall, and forming the composition of Experimental Examples 4 to 6 with a high etching rate as the lower layer of the partition wall It can be seen that it can be easy to control.

Therefore, the partition wall of the plasma display panel according to an embodiment of the present invention has a difference in the etching rate between the upper layer and the lower layer, and thus, a structurally stable trapezoidal or rectangular partition wall shape may be manufactured during the etching process for fabricating the partition wall. .

Therefore, the plasma display panel according to an embodiment of the present invention has an advantage of providing a plasma display panel that can easily control the shape of the partition wall by forming a difference in etching rate between the upper layer and the lower layer of the partition wall by 10% or more. There is this.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood that the invention may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 illustrates a plasma display panel according to an exemplary embodiment of the present invention.

2A to 2D are cross-sectional views of processes for manufacturing barrier ribs of a plasma display panel according to an exemplary embodiment of the present invention.

Claims (8)

Front substrate; A rear substrate facing the front substrate; And A partition wall formed between the front substrate and the rear substrate, the partition including an upper layer and a lower layer, The partition wall includes lead oxide (PbO), silicon oxide (SiO ₂ ), boron oxide (B ₂ O ₃ ), zinc oxide (ZnO), phosphoric acid (P ₂ O ₅ ), barium oxide (BaO), and calcium oxide (CaO). Lead oxide (PbO) -based inorganic material containing any one or more selected from the group consisting of, The upper layer of the partition includes a glass filler and a ceramic filler, the lower layer of the partition includes a ceramic filler, And an etching rate of the upper layer is lower than that of the lower layer. The method of claim 1, And a difference between the etching rate of the upper layer and the etching rate of the lower layer is 16.4 to 19.2%. The method of claim 1, The upper layer has an etching rate of 12.1 to 14.1% plasma display panel. delete delete The method of claim 1, The glass filler is any one or more selected from the group consisting of chromium oxide (CrO), copper oxide (CuO) and magnesium oxide (MgO). delete The method of claim 1, The ceramic filler is aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite (3Al ₂₎ At least one selected from the group consisting of O ₃ 2SiO ₂ ), magnesia and cordierite.

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