KR20090081206A - Plasma Display Panel Partition Wall Composition And Plasma Display Panel Comprising The Same - Google Patents

Abstract

A composition for a plasma display panel partition wall and a plasma display panel comprising the same are provided to prevent a second layered partition wall from being separated, thereby securing reliability. A composition for a plasma display panel partition wall is composed of a partition wall(112) consisting of a top layer(112a) and a bottom layer(112b). The top layer and the bottom layer are composed of a first composition and a second composition respectively. The first composition contains organic powder with a first filler and the second composition includes the organic powder with a second filler. The volume difference between the first filler occupying the first composition and the second filler occupying the second composition based on the volume of each inorganic powder is within ±3 vol%.

Description

Plasma Display Panel Partition Wall Composition And Plasma Display Panel Comprising The Same}

The present invention relates to a plasma display panel partition wall composition and a plasma display panel including the same.

In general, a plasma display panel (Barrier Rib) formed between the front substrate and the rear substrate forms a unit cell, each of the neon (Ne), helium (He) or neon and helium An inert gas containing a gas such as a mixed gas (Ne + He) and a small amount of xenon (Xe) is filled.

Therefore, when discharged by a high frequency voltage, the inert gas generates vacuum ultraviolet rays and emits phosphors formed between the partition walls to realize an image. Such plasma display panels are not only easy to thin and large in size, but also greatly improved as a result of recent technology developments, and thus are attracting attention as next generation display devices.

Sand blasting and wet chemical etching (WCE) are mainly used as a method of forming barrier ribs on a rear substrate of a plasma display panel. The sand blasting method is to apply a colored material to a predetermined thickness on a glass substrate, dry it, form a mask having sand blast resistance thereon in a pattern form, and then carry out sand blasting to remove portions other than partition walls, and then fire the desired material. It is a method of forming a partition.

The etching method is a method of forming a barrier rib by coating different kinds of colored materials on a glass substrate, firing at a high temperature of 500 ° C. or higher, forming an acid resistant mask pattern, and then selectively etching the acid-based liquid combination.

In addition, the partition wall may be formed by a screen print method, an additive method, a mold method, or the like.

Among these, the partition wall formed by the etching method produces a phenomenon in which the side surface shape of the partition wall is recessed. Accordingly, the width of the center portion is considerably reduced compared to the width of the upper end portion of the partition wall. This is due to the under cut phenomenon which occurs according to the isotropic etching rate in order to have the desired height of the partition wall. Accordingly, when the phosphor on the sidewall of the partition emits light, not only does it obstruct the light emission path, but also the discharge space is reduced, so that the light emission efficiency may be reduced.

Therefore, the method of forming the partition wall of the two-layer structure of the upper layer and the lower layer has been devised, but there is a disadvantage that the process takes a long time because two processes of forming the upper layer and the lower layer are performed.

In addition, as the barrier material used for forming the barrier rib, a paste obtained by mixing lead glass (PbO) with 50 wt% or more of glass powder and an organic substance is mainly used. However, lead oxide is known to be harmful to the human body and the environment, and thus requires additional environmental facilities in the production and use of glass powder, resulting in lower process efficiency and increased manufacturing costs.

Accordingly, the present invention provides a plasma display panel partition composition and a plasma display panel including the same, which can shorten a manufacturing time of a partition and improve process efficiency.

In order to achieve the above object, the composition for a plasma display panel partition wall of the present invention comprises a partition wall consisting of an upper layer and a lower layer, the composition comprising a first layer constituting the upper layer of the partition and the lower layer of the partition wall. The second composition each comprises an inorganic powder, the inorganic powder of the first composition comprises a first filler, the inorganic powder of the second composition comprises a second filler, the inorganic powder of the first composition The difference between the volume ratio (vol%) occupied by the first filler relative to the total volume and the volume ratio (vol%) occupied by the second filler relative to the total volume of the inorganic powder of the second composition is ± 3 volume ratio (vol%). Can be in range.

In addition, the plasma display panel of the present invention includes a front substrate, a rear substrate facing the front substrate, and a partition wall formed between the front substrate and the rear substrate, wherein the partition wall is formed of an upper layer and a lower layer, wherein the upper layer is formed of a first layer. And a second filler, wherein the lower layer includes a second filler, and the volume ratio (vol%) occupied by the first filler with respect to the total volume of the upper layer of the partition wall and the second filler with respect to the entire lower layer volume of the partition wall. The difference of the volume ratio (vol%) that occupies may be in the range of ± 3 volume ratio (vol%).

Therefore, in the process of forming the partition wall, the plasma display panel partition wall composition and plasma display including the same may be improved by preventing the film formation phenomenon of the two-layer partition wall, thereby improving process efficiency. A panel can be provided.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a diagram for describing a plasma display panel according to an exemplary embodiment.

Referring to FIG. 1, a plasma display panel according to an embodiment of the present invention includes a front panel 100 having a scan electrode 102 and a sustain electrode 103 formed on a front substrate 101, and a rear substrate 111 forming a rear surface thereof. The rear panel 110, in which a plurality of address electrodes 113 are arranged so as to intersect the scan electrode 102 and the sustain electrode 103, is positioned side by side with a predetermined distance therebetween.

In the front panel 100, a scan electrode 102 and a sustain electrode 103 are disposed in a discharge space, that is, to maintain discharge and light emission of the discharge cell. More specifically, a scan electrode 102 and a sustain electrode 103 including a transparent electrode 102a formed of a transparent ITO material and a bus electrode 102b made of an opaque metal material are included in pairs. The scan electrode 102 and the sustain electrode 103 are covered by one or more upper dielectric layers 104 that limit the discharge current and insulate the electrode pairs. A protective layer 105 on which magnesium oxide (MgO) is deposited is disposed on the upper dielectric layer 104 to facilitate discharge conditions.

The rear panel 110 includes a plurality of discharge spaces, that is, a closed type partition wall 112 of a well type or stripe type for partitioning discharge cells. The partition wall 112 may be formed of two layers, an upper layer 112a and a lower layer 112b, but may not be limited thereto. Also, a plurality of address electrodes 113 are provided for supplying data pulses.

In the plurality of discharge cells partitioned by the partition wall 112, the phosphor layer 114 for emitting visible light for image display during address discharge, preferably red (R), green (G). A blue (B) phosphor layer is located.

The lower dielectric layer 115 is positioned between the address electrode 113 and the phosphor layer 114.

Here, the upper dielectric layer 104 and the lower dielectric layer 115 are not limited to each of the front substrate 101 and the rear substrate 111 is formed is not limited, on the contrary, the front substrate 101 and the rear substrate 110 It is also possible for the lower dielectric layer 115 and the upper dielectric layer 104 to be formed.

In FIG. 1, only an example of the plasma display panel is shown and described, and the present invention is not limited to the plasma display panel having the structure of FIG. 1. For example, although the scan electrode 102, the sustain electrode 103, and the address electrode 113 are formed in the plasma display panel of FIG. 1, the scan electrode 102 and the sustain electrode are shown in the plasma display panel of the present invention. One or more of the 103 or the address electrode 113 may be omitted.

In addition, in FIG. 1, only the case where the partition wall 112 for partitioning the discharge cells is formed on the rear substrate 111 is illustrated. Alternatively, the partition wall 112 may be formed on the front substrate 101. It may be formed on the front substrate 101 and the rear substrate 112, respectively.

Here, the plasma display panel according to an embodiment of the present invention is formed with a partition wall 112 for partitioning the discharge cell between the front substrate 101 and the rear substrate 111, the partition 112 is lead oxide It is formed by using a variety of barrier materials, which are different oxides and do not include any other matter is changeable.

Hereinafter, a composition for partitioning a plasma display panel according to an embodiment of the present invention will be described in more detail.

The partition composition of the plasma display panel according to an embodiment of the present invention includes an upper layer and a lower layer, and is used to partition the discharge cells of the front substrate, and may include an inorganic powder, a binder, a dispersant, a plasticizer, and a solvent.

The inorganic powder does not contain lead oxide and may contain zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), and phosphoric acid (P ₂ O ₅ ) as main components.

Inorganic powders include zinc oxide (ZnO), boron oxide (B ₂ O ₃ ) and phosphoric acid (P ₂ O ₅ ), which is composed of barium oxide (BaO), calcium oxide (CaO) and silicon oxide (SiO ₂ ) It may further include any one or more selected from.

The zinc oxide (ZnO) serves to improve the etching rate while reducing the glass transition temperature (Tg), dielectric constant, coefficient of thermal expansion (CTE) and gelation frequency of the partition as a glass formula.

The boron oxide (B ₂ O ₃ ) is a light-forming glass forming agent to increase the glass transition temperature (Tg) of the partition wall, lower the coefficient of thermal expansion (CTE), and serves to increase the etching rate and gelation frequency.

The phosphoric acid (P ₂ O ₅ ) is a light-forming glass forming agent has an effect of slightly increasing the glass transition temperature (Tg) and the etching rate of the partition wall, lowering the dielectric constant, and slightly lowers the coefficient of thermal expansion (CTE) and gelation frequency Do it.

As described above, the inorganic powder according to an embodiment of the present invention includes zinc oxide (ZnO), boron oxide (B ₂ O ₃ ), and phosphoric acid (P ₂ O ₅ ) as main components.

In addition, the inorganic powder may further include barium oxide (BaO). The barium oxide (BaO) is a glass formula showing a dark color, serves to lower the glass transition temperature (Tg) of the partition wall, increase the etching rate, dielectric constant, coefficient of thermal expansion (CTE) and gelation frequency.

In addition, the inorganic powder may further include calcium oxide (CaO). The calcium oxide (CaO) is a light-forming glass formula to slightly increase the glass transition temperature (Tg) of the partition, slightly lower the coefficient of thermal expansion (CTE), and serves to lower the etching rate and gelation frequency.

In addition, the inorganic powder may further include silicon oxide (SiO ₂ ). The silicon oxide (SiO ₂ ) serves as a glass forming agent having a bright color, increasing the glass transition temperature (Tg) of the partition, rapidly lowering the coefficient of thermal expansion (CTE) and etching rate, and lowering the gelation frequency.

The binder may be a conventional binder used for the preparation of the partition wall, and preferably any one or more polymer resins selected from acrylic resin, epoxy resin or ethyl cellulose resin may be used.

The dispersant may be any one or more selected from the group consisting of polyamineamide, phosphate ester, polyisobutylene, oleic acid, stearic acid, fish oil, ammonium salt of polycarboxylic acid and sodium carboxymethyl.

The plasticizer may be used any one or more selected from the group consisting of phthalate-based, glycol-based and azelate-based.

The solvent may be used a conventional solvent used for the preparation of the partition wall, for example, methyl ethyl ketone, ethanol, xylene, texanol, terpineol, butyl cellosolve, toluene, propylene glycol monomethyl ether, isopropyl alcohol At least one selected from the group consisting of acetone, trichloroethane, butanol, methyl isobutyl ketone, butyl acetate, cyclohexanone and water can be used.

In addition, the composition for plasma display panel partition wall according to the embodiment of the present invention may include a first composition to form an upper layer of the partition wall and a second composition to form a lower layer of the partition wall.

The first composition is a composition forming an upper layer of the partition wall, and may include the above-described inorganic powder, a binder, a dispersant, a plasticizer, and a solvent, and the inorganic powder may further include a first filler.

The first filler may be a ceramic filler, aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO) ₂ ), mullite (3Al ₂ O ₃ 2SiO ₂ ), magnesia (magnesia) and cordierite (cordierite) may include any one or more selected from the group.

The second composition is a composition for forming a lower layer of the partition wall, and may include an inorganic powder, a binder, a dispersant, a plasticizer, and a solvent, as in the aforementioned first composition, and the inorganic powder may further include a second filler. have.

The second filler may use the same material as the aforementioned first filler.

As described above, the plasma display panel partition wall composition according to an embodiment of the present invention has a volume ratio (vol%) of the first filler to the total volume of the inorganic powder of the first composition and the inorganic material of the second composition. The difference of the volume ratio (vol%) occupied by the second filler with respect to the total volume of the powder may be within a range of ± 3 volume ratio (vol%).

Hereinafter, a process of manufacturing the partition wall of the plasma display panel using the composition for plasma display panel partition wall according to the embodiment of the present invention described above is as follows. In the following, the formation of the two-layer partition wall using the green sheet is disclosed.

2A through 2D are cross-sectional views illustrating processes of manufacturing a partition wall of a plasma display panel according to an exemplary embodiment of the present invention.

First, referring to FIG. 2A, the partition wall of the plasma display panel according to an embodiment of the present invention is coated with a first composition formed on the base film 210 as an upper layer of the partition wall to form the first composition layer 220. Next, the second composition, which is formed as the lower layer of the partition wall, is then applied to form the second composition layer 230.

The first composition and the second composition are each mixed with the above-described inorganic powder, binder, plasticizer, dispersant and solvent, the inorganic powder of the first composition comprises a first filler, the inorganic powder of the second composition Contains 2 fillers.

At this time, the volume ratio (vol%) of the first filler to the total volume of the inorganic powder of the first composition and the volume ratio (vol%) of the second filler to the total volume of the inorganic powder of the second composition. Adjust the first filler and the second filler so that the difference is within the range of ± 3 volume ratio (vol%).

In addition, in order to apply the first and second compositions, when the compositions are applied to the base film, the first composition and the second composition should not be mixed with each other. For this purpose, the viscosity of the first composition must be higher than the viscosity of the second composition. If the viscosity is the same, the flow characteristics of the compositions are the same may cause mixing phenomenon during coating. In addition, it may be designed such that a density difference exists between the first composition layer 220 and the second composition layer 230.

In addition, the first composition layer 220 and the second composition layer 230 have different etching rates under the same conditions, where the first composition layer 220 should have a lower etching rate than the second composition layer 230. To this end, the etch rate is designed differently by adjusting the volume ratio of the first filler added to the first composition and the second filler added to the second composition.

Therefore, the first composition layer 220 and the second composition layer 230 are formed on the base film 210 and dried, and the green sheet 200 is formed by attaching the protective sheet 240.

Next, referring to FIG. 2B, the green sheet 200 is transferred onto the lower substrate 300 on which the lower dielectric layer 310 and the address electrode 320 are formed.

That is, after the protective sheet of the green sheet 200 is peeled off, the surface of the second composition layer 230 is arranged to be in contact with the surface of the lower substrate 300. In this case, the direction in which the green sheet is arranged may be horizontal or vertical to the direction of the address electrode 320, and there is no particular limitation.

Next, the heated roller is moved on the green sheet so as to transfer the first composition layer 220 and the second composition layer 230 onto the lower substrate 300 and thermocompressed.

Then, as shown in Figure 2c, the base film 210 of the green sheet is peeled off. Subsequently, the lower substrate 300 to which the first composition layer 220 and the second composition layer 230 have been transferred is heat-treated at a temperature of 500 ° C. or higher to thereby heat the first composition layer 220 and the second composition layer 230. Fire.

Next, referring to FIG. 2D, after placing a mask on the lower substrate 300 on which the first composition layer 220 and the second composition layer 230 are formed, the upper layer 330 and the lower layer 340 are etched. A partition wall 350 is provided.

In the etching process, the upper layer 330 and the lower layer 340 by adjusting the volume ratio (vol%) of the first filler and the second filler included in the first composition layer 220 and the second composition layer 230, respectively. May have a difference in etching rate.

In more detail, the etching rate of the first composition layer 220 may be lower than the etching rate of the second composition layer 230. That is, while the first composition layer 220 is etched and then the second composition layer 230 is etched, the first composition layer 220 is less susceptible to damage by the etchant and thus is structurally mechanically stable rectangular or trapezoidal. A partition having a cross-sectional shape of can be formed.

To this end, the composition for the plasma display panel partition wall according to an embodiment of the present invention is the volume ratio (vol%) of the first filler to the total volume of the inorganic powder of the first composition and the entire inorganic powder of the second composition A difference of the volume ratio (vol%) occupied by the second filler with respect to the volume may be formed within a range of ± 3 volume ratio (vol%). Hereinafter, the detailed description will be disclosed in the experimental example described later.

Therefore, the partition wall of the plasma display panel according to an embodiment of the present invention can be manufactured.

Hereinafter, an embodiment according to a method of manufacturing a partition of a plasma display panel of the present invention will be described. However, the following embodiments are merely preferred embodiments of the present invention, and the present invention is not limited to the following embodiments.

Experiment 1: Measurement of the etching rate of a partition according to the volume ratio of the filler contained in the composition for plasma display panel partitions.

Experimental Example 1

An inorganic powder, a binder, a plasticizer, a dispersant, and a solvent were mixed to prepare a plasma display panel partition composition. Inorganic powders include zinc oxide (ZnO), boron oxide (B ₂ O ₃ ) and phosphoric acid (P ₂ O ₅ ), with barium oxide (BaO) and calcium oxide (CaO) as major components By mixing the filler consisting of (Al ₂ O ₃ ), zinc oxide (ZnO), titanium oxide (TiO ₂ ) and silicon oxide (SiO ₂ ), the volume ratio of the filler to the volume of the total inorganic powder is 17vol% Formed.

In this case, the volume ratio of each material of the filler was formed of 2vol% aluminum oxide (Al ₂ O ₃ ), 11vol% zinc oxide (ZnO), 2vol% titanium oxide (TiO ₂ ) and 2vol% silicon oxide (SiO ₂ ).

Next, 90 g of the prepared inorganic powder, 3 g of ethyl cellulose as a binder, 2 g of polyisobutylene as a dispersant, 2 g of phthalate as a plasticizer, and 3 g of butylcarbitol acetate (BCA) as a solvent were prepared to prepare a partition composition.

Next, the barrier composition was coated on a glass substrate with a thickness of 200 μm, dried, and then fired at a temperature of 500 ° C. to form a barrier layer.

Then, the prepared barrier layer was etched to measure the etching rate.

Experimental Example 2

Under the same conditions as in Experimental Example 1, the volume ratios of ₂ vol% of aluminum oxide (Al ₂ O ₃ ), 2 vol% of zinc oxide (ZnO), 11 vol% of titanium oxide (TiO ₂ ), and ₂ vol% of silicon oxide (SiO ₂ ) were determined. Filler was used.

Experimental Example 3

Under the same conditions as in Experimental Example 1, the volume ratio of 4 vol% aluminum oxide (Al ₂ O ₃ ), 4 vol% zinc oxide (ZnO), 4 vol% titanium oxide (TiO ₂ ), and 3 vol% silicon oxide (SiO ₂ ) A filler having was used.

Experimental Example 4

Under the same conditions as in Experimental Example 1, 11 vol% of aluminum oxide (Al ₂ O ₃ ), 2 vol% of zinc oxide (ZnO), 2 vol% of titanium oxide (TiO ₂ ), and ₂ vol% of silicon oxide (SiO ₂ ) were used. Filler was used.

The etching rate of the barrier rib layer prepared according to Experimental Examples 1 to 4 was measured and shown in Table 1 below.

Volume ratio of each filler (vol%) to total filler volume ratio 17 vol% Etch rate of the barrier layer (㎛) Aluminum oxide zinc oxide Titanium oxide Silicon oxide Experimental Example 1 2 11 2 2 102.9 Experimental Example 2 2 2 11 2 102.7 Experimental Example 3 4 4 4 5 96.6 Experimental Example 4 11 2 2 2 101.8

As shown in Table 1, looking at the etching rate of the barrier rib layer prepared by Experimental Examples 1 to 4, the etching rate of the barrier rib layer prepared by Experimental Example 1 is the highest, the barrier rib layer manufactured by Experimental Example 3 It turns out that the etching rate of is the lowest.

Therefore, it can be seen that in Example 1, the lower barrier rib was formed by the composition of Experimental Example 1 having the highest etching rate, and the upper barrier rib was formed by the composition of Experimental Example 3 having the lowest etching rate.

Therefore, the partition wall of the plasma display panel according to an embodiment of the present invention has a difference in the etching rate between the upper layer and the lower layer, and thus, a structurally stable trapezoidal or rectangular partition wall shape may be manufactured during the etching process for fabricating the partition wall. .

Experiment 2: Determination of partition wall removal according to the volume ratio of the filler contained in the upper and lower partition walls.

An inorganic powder, a binder, a plasticizer, a dispersant, and a solvent were mixed to prepare a first composition and a second composition, which are compositions for plasma display panel partitions. Inorganic powders include zinc oxide (ZnO), boron oxide (B ₂ O ₃ ) and phosphoric acid (P ₂ O ₅ ), with barium oxide (BaO) and calcium oxide (CaO) as major components Fillers composed of (Al ₂ O ₃ ), zinc oxide (ZnO), titanium oxide (TiO ₂ ) and silicon oxide (SiO ₂ ) were mixed.

In this case, the first composition forming the upper layer of the partition wall has a volume ratio (vol%) of the first filler to 10, 13, 15, 18, and 20 vol% with respect to the volume of the entire inorganic powder.

The second composition forming the lower layer of the partition wall was formed by adjusting the volume ratio (vol%) of the second filler to 10, 13, 15, 18, and 20 vol% with respect to the volume of the entire inorganic powder.

Next, both the first composition and the second composition were similarly mixed with 90 g of inorganic powder, 3 g of ethyl cellulose as a binder, 2 g of polyisobutylene as a dispersant, 2 g of phthalate as a plasticizer, and 3 g of butylcarbitol acetate (BCA) as a solvent.

Next, the first composition and the second composition were sequentially applied onto the base film to form a green sheet, the green sheet was transferred onto a glass substrate, and then fired and etched to form a partition including an upper layer and a lower layer. .

Measurement of the degree of no film removal of the partition walls prepared according to the Experiment 2 is shown in Table 2 below.

Volume ratio of the second filler below the bulkhead (vol%)  Volume ratio of the first filler above the bulkhead (vol%) 10 13 15 18 20 10 ◎ ○ Ｘ Ｘ Ｘ 13 Ｘ ◎ ○ Ｘ Ｘ 15 Ｘ ○ ◎ ○ Ｘ 18 Ｘ Ｘ Ｘ ◎ Ｘ 20 Ｘ Ｘ Ｘ ○ ◎

                                 (Very good: ◎, good: ○, bad: Ｘ)

As shown in Table 1, looking at the partitions according to the experiment 2, the volume ratio (vol%) occupied by the first filler to the total volume of the upper layer of the partition and the second filler occupies the total volume of the lower layer of the partition. When the difference of the volume ratio (vol%) is within the range of ± 3 volume ratio (vol%), it can be seen that no film removal phenomenon occurs between the upper layer and the lower layer of the partition wall.

Accordingly, the composition for plasma display panel partition wall according to the embodiment of the present invention has a volume ratio (vol%) occupied by the first filler with respect to the total volume of the upper layer of the partition and the second volume with respect to the total volume of the lower layer of the partition. By forming the difference of the volume ratio (vol%) occupied by the filler to fall within the range of ± 3 volume ratio (vol%), there is an advantage that the film deposition phenomenon between the upper and lower partition walls can be prevented to improve the reliability of the plasma display panel.

In addition, since it does not contain lead oxide harmful to the environment, it is possible to provide a plasma display panel including an environmentally friendly partition.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings, the technical configuration of the present invention described above may be modified in other specific forms by those skilled in the art to which the present invention pertains without changing its technical spirit or essential features. It will be appreciated that it may be practiced. Therefore, the embodiments described above are to be understood as illustrative and not restrictive in all aspects. In addition, the scope of the present invention is shown by the claims below, rather than the above detailed description. Also, it is to be construed that all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are included in the scope of the present invention.

1 illustrates a plasma display panel according to an exemplary embodiment of the present invention.

2A to 2D are diagrams illustrating processes of manufacturing barrier ribs of a plasma display panel according to an exemplary embodiment of the present invention.

Claims (8)

In the composition for a plasma display panel partition wall comprising a partition wall consisting of an upper layer and a lower layer, The first composition constituting the upper layer of the partition and the second composition constituting the lower layer of the partition each include an inorganic powder, Inorganic powder of the first composition comprises a first filler, The inorganic powder of the second composition includes a second filler, The difference between the volume ratio (vol%) of the first filler to the total volume of the inorganic powder of the first composition and the volume ratio (vol%) of the second filler to the total volume of the inorganic powder of the second composition are ± Composition for a plasma display panel partition wall within the range of 3 volume ratio (vol%). The method of claim 1, And the first filler and the second filler are ceramic fillers. The method of claim 2, The ceramic filler is aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite (3Al ₂₎ A composition for partitioning a plasma display panel including at least one selected from the group consisting of O ₃ 2SiO ₂ ), magnesia, and cordierite. The method of claim 1, The composition of claim 1, wherein the materials included in the first filler and the second filler are included in the same volume ratio (vol%) or different volume ratio (vol%). Front substrate; A rear substrate facing the front substrate; And A partition wall formed between the front substrate and the rear substrate, The barrier rib is composed of an upper layer and a lower layer, wherein the upper layer includes a first filler, and the lower layer includes a second filler, The difference between the volume ratio (vol%) occupied by the first filler with respect to the total volume of the upper layer of the partition and the volume ratio (vol%) occupied by the second filler with respect to the total volume of the lower layer of the partition is ± 3 volume ratio (vol% A) plasma display panel. The method of claim 5, And the first filler and the second filler are ceramic fillers. The method of claim 6, The ceramic filler is aluminum oxide (Al ₂ O ₃ ), titanium oxide (TiO ₂ ), chromium oxide (CrO), zinc oxide (ZnO), copper oxide (CuO), silicon oxide (SiO ₂ ), mullite (3Al ₂₎ A plasma display panel comprising at least one selected from the group consisting of O ₃ 2SiO ₂ ), magnesia, and cordierite. The method of claim 5, The materials included in the first filler and the second filler are included in the same volume ratio (vol%) or different volume ratio (vol%).

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