KR100957816B1 - 웨이퍼 버퍼를 반전시키는 장치 - Google Patents
웨이퍼 버퍼를 반전시키는 장치 Download PDFInfo
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- KR100957816B1 KR100957816B1 KR1020080015429A KR20080015429A KR100957816B1 KR 100957816 B1 KR100957816 B1 KR 100957816B1 KR 1020080015429 A KR1020080015429 A KR 1020080015429A KR 20080015429 A KR20080015429 A KR 20080015429A KR 100957816 B1 KR100957816 B1 KR 100957816B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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Abstract
Description
Claims (6)
- 복수의 웨이퍼를 다단으로 쌓아 저장하는 웨이퍼 버퍼; 및상기 웨이퍼 버퍼를 회전시켜 상기 웨이퍼 버퍼를 반전시키는 버퍼 반전부를 포함하며,상기 웨이퍼 버퍼는상기 복수의 웨이퍼가 다단으로 쌓이는 버퍼 몸체;상기 버퍼 몸체의 옆면에 상기 복수의 웨이퍼를 한 장씩 소정의 간격을 두고 각 웨이퍼가 배치되도록 하는 복수의 걸림부; 및상기 복수의 걸림부 각각에 놓여져 있는 상기 각 웨이퍼를 고정시키는 고정부를 포함하며,상기 복수의 걸림부의 각 걸림부는 유동이 통과할 수 있는 흡입관로를 포함하며,상기 고정부는 상기 흡입관로를 통하여 흡입을 수행하여 상기 각 웨이퍼를 상기 각 걸림부에 고정시키는, 웨이퍼 버퍼를 반전시키는 장치.
- 제 1항에 있어서, 상기 버퍼 반전부는상기 웨이퍼 버퍼의 옆면에 연결되는 회전 축; 및상기 회전 축을 회전시켜 상기 웨이퍼 버퍼를 반전시키는 구동부를 포함하는, 웨이퍼 버퍼를 반전시키는 장치.
- 삭제
- 제 1항에 있어서,상기 복수의 걸림부의 각 걸림부는 소정의 간격을 두고 벌어진 두 개의 판을 포함하며,상기 고정부는 상기 각 걸림부의 상기 두 개의 판의 간격을 좁혀 상기 두 개의 판 사이에 상기 각 웨이퍼를 고정시키는, 웨이퍼 버퍼를 반전시키는 장치.
- 제 1항에 있어서,상기 고정부는 기계적 클램핑 또는 전자기력에 의하여 상기 각 웨이퍼를 상기 각 걸림부에 고정시키는, 웨이퍼 버퍼를 반전시키는 장치.
- 복수의 웨이퍼를 다단으로 쌓아 임시로 저장하는 웨이퍼 버퍼;상기 웨이퍼 버퍼에 상기 복수의 웨이퍼를 이송시키는 제1 이송 로봇;상기 웨이퍼 버퍼를 소정의 축을 기준으로 회전시켜 상기 웨이퍼 버퍼를 반전시키는 버퍼 반전부; 및상기 웨이퍼 버퍼의 반전에 의하여 반전된 복수의 웨이퍼를 공정 챔버로 이송시키는 제2 이송 로봇을 포함하며,상기 웨이퍼 버퍼는상기 복수의 웨이퍼가 다단으로 쌓이는 버퍼 몸체;상기 버퍼 몸체의 옆면에 상기 복수의 웨이퍼를 한 장씩 소정의 간격을 두고 각 웨이퍼가 배치되도록 하는 복수의 걸림부; 및상기 복수의 걸림부 각각에 놓여져 있는 상기 각 웨이퍼를 고정시키는 고정부를 포함하며,상기 복수의 걸림부의 각 걸림부는 유동이 통과할 수 있는 흡입관로를 포함하며,상기 고정부는 상기 흡입관로를 통하여 흡입을 수행하여 상기 각 웨이퍼를 상기 각 걸림부에 고정시키는, 웨이퍼 버퍼를 반전시켜 처리하는 시스템.
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KR1020080015429A KR100957816B1 (ko) | 2008-02-20 | 2008-02-20 | 웨이퍼 버퍼를 반전시키는 장치 |
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KR1020080015429A KR100957816B1 (ko) | 2008-02-20 | 2008-02-20 | 웨이퍼 버퍼를 반전시키는 장치 |
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KR100957816B1 true KR100957816B1 (ko) | 2010-05-13 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100267183B1 (ko) * | 1995-05-11 | 2000-10-16 | 프란세스코 피콘 | 상호연결가능한 폼워크 엘리먼트 |
KR101291397B1 (ko) | 2010-07-14 | 2013-07-30 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판반송방법 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7377659B2 (ja) * | 2019-09-27 | 2023-11-10 | 株式会社Screenホールディングス | 基板処理装置 |
CN111261560A (zh) * | 2020-03-20 | 2020-06-09 | 无锡电基集成科技有限公司 | 等离子清洗设备用翻转装置 |
Citations (4)
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JP2000036527A (ja) * | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 基板搬送処理装置及び基板搬送処理方法 |
JP2001044270A (ja) | 1999-07-26 | 2001-02-16 | Nec Kyushu Ltd | 半導体製造装置及びその半導体基板搬送方法 |
KR20070120373A (ko) * | 2006-06-19 | 2007-12-24 | 삼성전자주식회사 | 웨이퍼 버퍼 스테이션 및 이를 구비한 반도체 제조 장치 |
JP2008010606A (ja) | 2006-06-29 | 2008-01-17 | Nec Lcd Technologies Ltd | 基板用カセット保持装置、その保持方法およびその保管方法 |
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- 2008-02-20 KR KR1020080015429A patent/KR100957816B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2000036527A (ja) * | 1998-07-17 | 2000-02-02 | Tokyo Electron Ltd | 基板搬送処理装置及び基板搬送処理方法 |
JP2001044270A (ja) | 1999-07-26 | 2001-02-16 | Nec Kyushu Ltd | 半導体製造装置及びその半導体基板搬送方法 |
KR20070120373A (ko) * | 2006-06-19 | 2007-12-24 | 삼성전자주식회사 | 웨이퍼 버퍼 스테이션 및 이를 구비한 반도체 제조 장치 |
JP2008010606A (ja) | 2006-06-29 | 2008-01-17 | Nec Lcd Technologies Ltd | 基板用カセット保持装置、その保持方法およびその保管方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100267183B1 (ko) * | 1995-05-11 | 2000-10-16 | 프란세스코 피콘 | 상호연결가능한 폼워크 엘리먼트 |
KR101291397B1 (ko) | 2010-07-14 | 2013-07-30 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 기판반송방법 |
US8744614B2 (en) | 2010-07-14 | 2014-06-03 | Dainippon Screen Mfg. Co., Ltd. | Substrate processing apparatus, and substrate transport method |
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