KR100919149B1 - 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법 - Google Patents

포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법

Info

Publication number
KR100919149B1
KR100919149B1 KR1020077027242A KR20077027242A KR100919149B1 KR 100919149 B1 KR100919149 B1 KR 100919149B1 KR 1020077027242 A KR1020077027242 A KR 1020077027242A KR 20077027242 A KR20077027242 A KR 20077027242A KR 100919149 B1 KR100919149 B1 KR 100919149B1
Authority
KR
South Korea
Prior art keywords
group
structural unit
acid
alkyl
acrylic acid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
KR1020077027242A
Other languages
English (en)
Korean (ko)
Other versions
KR20080003923A (ko
Inventor
마사아키 무로이
고타 아츠치
다카히로 나카무라
마사카즈 야마다
겐스케 사이쇼
마사루 다케시타
다카노리 야마기시
도모 오이카와
Original Assignee
도오꾜오까고오교 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 도오꾜오까고오교 가부시끼가이샤 filed Critical 도오꾜오까고오교 가부시끼가이샤
Publication of KR20080003923A publication Critical patent/KR20080003923A/ko
Application granted granted Critical
Publication of KR100919149B1 publication Critical patent/KR100919149B1/ko
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/281Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing only one oxygen, e.g. furfuryl (meth)acrylate or 2-methoxyethyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/26Esters containing oxygen in addition to the carboxy oxygen
    • C08F220/28Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety
    • C08F220/283Esters containing oxygen in addition to the carboxy oxygen containing no aromatic rings in the alcohol moiety and containing one or more carboxylic moiety in the chain, e.g. acetoacetoxyethyl(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/38Esters containing sulfur
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2603/00Systems containing at least three condensed rings
    • C07C2603/56Ring systems containing bridged rings
    • C07C2603/58Ring systems containing bridged rings containing three rings
    • C07C2603/70Ring systems containing bridged rings containing three rings containing only six-membered rings
    • C07C2603/74Adamantanes
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S430/00Radiation imagery chemistry: process, composition, or product thereof
    • Y10S430/1053Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
    • Y10S430/1055Radiation sensitive composition or product or process of making
    • Y10S430/106Binder containing
    • Y10S430/111Polymer of unsaturated acid or ester

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Materials For Photolithography (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020077027242A 2005-05-10 2006-04-26 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법 Expired - Lifetime KR100919149B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005137777A JP4510695B2 (ja) 2005-05-10 2005-05-10 ポジ型レジスト組成物およびレジストパターン形成方法
JPJP-P-2005-00137777 2005-05-10

Publications (2)

Publication Number Publication Date
KR20080003923A KR20080003923A (ko) 2008-01-08
KR100919149B1 true KR100919149B1 (ko) 2009-09-28

Family

ID=37396407

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077027242A Expired - Lifetime KR100919149B1 (ko) 2005-05-10 2006-04-26 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법

Country Status (5)

Country Link
US (1) US7972762B2 (https=)
JP (1) JP4510695B2 (https=)
KR (1) KR100919149B1 (https=)
TW (1) TWI350945B (https=)
WO (1) WO2006120897A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4679990B2 (ja) 2005-07-22 2011-05-11 東京応化工業株式会社 ポジ型レジスト組成物の製造方法、ポジ型レジスト組成物およびレジストパターン形成方法
US7604920B2 (en) 2007-08-07 2009-10-20 Tokyo Ohka Kogyo Co., Ltd. Positive resist composition, method of forming resist pattern, polymeric compound, and compound
JP5308678B2 (ja) 2007-08-07 2013-10-09 東京応化工業株式会社 化合物の製造方法、化合物
JP5337579B2 (ja) * 2008-12-04 2013-11-06 東京応化工業株式会社 ポジ型レジスト組成物、レジストパターン形成方法
JP6002378B2 (ja) 2011-11-24 2016-10-05 東京応化工業株式会社 高分子化合物の製造方法
US8795947B2 (en) 2012-03-22 2014-08-05 Tokyo Ohka Kogyo Co., Ltd. Resist composition and method of forming resist pattern

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020639A (ja) * 2000-02-10 2002-01-23 Shipley Co Llc ポジ型フォトレジスト組成物
JP2002348328A (ja) * 2001-05-23 2002-12-04 Nippon Soda Co Ltd アルケニルフェノール系共重合体及びこれらの製造方法
JP2003140351A (ja) * 2001-11-07 2003-05-14 Fuji Photo Film Co Ltd ポジ型レジスト組成物
JP2003167347A (ja) * 2001-12-03 2003-06-13 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びレジストパターンの形成方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3694976B2 (ja) * 1996-05-02 2005-09-14 Jsr株式会社 感放射線性樹脂組成物
TW482946B (en) 1997-01-29 2002-04-11 Sumitomo Chemical Co Chemical amplification type positive photoresist composition
JP3873261B2 (ja) * 1997-09-04 2007-01-24 Jsr株式会社 感放射線性樹脂組成物、保護膜、層間絶縁膜およびこれらの膜の形成法
EP1143299B1 (en) * 2000-04-04 2003-07-16 Sumitomo Chemical Company, Limited Chemically amplified positive resist composition
US7005230B2 (en) * 2003-01-16 2006-02-28 Jsr Corporation Radiation-sensitive resin composition
JP4088784B2 (ja) * 2003-06-19 2008-05-21 信越化学工業株式会社 高分子化合物の製造方法及びレジスト材料
JP4398783B2 (ja) 2003-09-03 2010-01-13 信越化学工業株式会社 高分子化合物、レジスト材料及びパターン形成方法
JP4714488B2 (ja) * 2004-08-26 2011-06-29 富士フイルム株式会社 ポジ型レジスト組成物及びそれを用いたパターン形成方法
JP4731200B2 (ja) * 2005-05-10 2011-07-20 丸善石油化学株式会社 半導体リソグラフィー用共重合体の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002020639A (ja) * 2000-02-10 2002-01-23 Shipley Co Llc ポジ型フォトレジスト組成物
JP2002348328A (ja) * 2001-05-23 2002-12-04 Nippon Soda Co Ltd アルケニルフェノール系共重合体及びこれらの製造方法
JP2003140351A (ja) * 2001-11-07 2003-05-14 Fuji Photo Film Co Ltd ポジ型レジスト組成物
JP2003167347A (ja) * 2001-12-03 2003-06-13 Tokyo Ohka Kogyo Co Ltd ポジ型レジスト組成物及びレジストパターンの形成方法

Also Published As

Publication number Publication date
US7972762B2 (en) 2011-07-05
TW200705105A (en) 2007-02-01
KR20080003923A (ko) 2008-01-08
JP2006317553A (ja) 2006-11-24
JP4510695B2 (ja) 2010-07-28
US20090233220A1 (en) 2009-09-17
TWI350945B (en) 2011-10-21
WO2006120897A1 (ja) 2006-11-16

Similar Documents

Publication Publication Date Title
KR100965445B1 (ko) 액침 노광용 레지스트 조성물 및 레지스트 패턴 형성 방법
KR100915567B1 (ko) 고분자 화합물, 산 발생제, 포지티브형 레지스트 조성물,및 레지스트 패턴 형성 방법
KR100998463B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
KR20090091022A (ko) 포지티브형 레지스트 조성물, 레지스트 패턴 형성 방법 및 고분자 화합물
KR101057603B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
JP4828204B2 (ja) ポジ型レジスト組成物およびレジストパターン形成方法、並びに高分子化合物
KR100891888B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
KR100875871B1 (ko) 액침 노광용 레지스트 조성물 및 레지스트 패턴 형성 방법
JP5129988B2 (ja) 高分子化合物、ポジ型レジスト組成物およびレジストパターン形成方法
JP5114286B2 (ja) ポジ型レジスト組成物、レジストパターン形成方法および高分子化合物
KR100919149B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
KR100998464B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
JP5349765B2 (ja) 高分子化合物、ポジ型レジスト組成物およびレジストパターン形成方法
JP5308877B2 (ja) ポジ型レジスト組成物、レジストパターン形成方法
KR20090018717A (ko) 화합물, 산발생제, 레지스트 조성물 및 레지스트 패턴 형성방법
JP4633655B2 (ja) ポジ型レジスト組成物およびレジストパターン形成方法
KR100888570B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
JP2008026838A (ja) ポジ型レジスト組成物およびレジストパターン形成方法
KR101034164B1 (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
KR20090016486A (ko) 포지티브형 레지스트 조성물 및 레지스트 패턴 형성 방법
JP4762821B2 (ja) ポジ型レジスト組成物およびレジストパターン形成方法
JP4472586B2 (ja) ポジ型レジスト組成物およびレジストパターン形成方法
JP4663456B2 (ja) ポジ型レジスト組成物およびレジストパターン形成方法
JP2008242011A (ja) ポジ型レジスト組成物およびレジストパターン形成方法

Legal Events

Date Code Title Description
A201 Request for examination
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

FPAY Annual fee payment

Payment date: 20120907

Year of fee payment: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

FPAY Annual fee payment

Payment date: 20130903

Year of fee payment: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

FPAY Annual fee payment

Payment date: 20140901

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

FPAY Annual fee payment

Payment date: 20150819

Year of fee payment: 7

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

FPAY Annual fee payment

Payment date: 20160818

Year of fee payment: 8

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

FPAY Annual fee payment

Payment date: 20170818

Year of fee payment: 9

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 9

FPAY Annual fee payment

Payment date: 20180816

Year of fee payment: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 10

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 11

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 12

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 13

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 14

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 15

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 16

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000