KR100907054B1 - 칩 컨베이어 장치 - Google Patents
칩 컨베이어 장치 Download PDFInfo
- Publication number
- KR100907054B1 KR100907054B1 KR1020070109489A KR20070109489A KR100907054B1 KR 100907054 B1 KR100907054 B1 KR 100907054B1 KR 1020070109489 A KR1020070109489 A KR 1020070109489A KR 20070109489 A KR20070109489 A KR 20070109489A KR 100907054 B1 KR100907054 B1 KR 100907054B1
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- cover
- conveyor
- scraper
- belt
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q11/00—Accessories fitted to machine tools for keeping tools or parts of the machine in good working condition or for cooling work; Safety devices specially combined with or arranged in, or specially adapted for use in connection with, machine tools
- B23Q11/0042—Devices for removing chips
- B23Q11/0067—Devices for removing chips chip containers located under a machine or under a chip conveyor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67736—Loading to or unloading from a conveyor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Disintegrating Or Milling (AREA)
Abstract
Description
Claims (5)
- 지하 피트로부터 호퍼로 칩을 이송하기 위한 칩 컨베이어 장치에 있어서,내부에 컨베이어 벨트를 갖는 컨베이어 커버를 지상의 일측으로부터 호퍼까지 연결하여 칩을 호퍼로 공급하는 컨베이어 유닛;내부에 스크래퍼 벨트를 갖는 스크래퍼 커버를 상기 지하 피트와 지상의 상기 컨베이어 커버의 상부까지 연결하여 지하 피트로부터 칩을 지상으로 이송하는 스크래퍼 유닛;상기 스크래퍼 유닛의 스크래퍼 커버 상부 일측에 구성되어 일정크기 이상의 덩어리 칩을 수거통으로 안내하는 슈트;를 포함하는 것을 특징으로 하는 칩 컨베이어 장치.
- 제1항에 있어서,상기 컨베이어 커버와 상기 스크래퍼 커버 사이에는파쇄기 커버가 구성되고, 상기 파쇄기 커버의 외부에는 스크루 모터가 장착되며, 상기 파쇄기 커버의 내부에는 상기 스크루 모터의 회전축에 파쇄 스크루가 장착되어 회전 구동하는 파쇄기가 구성되는 것을 특징으로 하는 칩 컨베이어 장치.
- 제1항에 있어서,상기 컨베이어 유닛은상기 지상의 일측으로부터 상기 호퍼의 상부 일측까지 연결하는 컨베이어 커버;상기 컨베이어 커버의 내부를 따라 배치되어 양측에서 회전축에 감긴 상태로 구동하는 컨베이어 벨트;상기 컨베이어 커버의 상부 일측에 구성되어 상부 회전축과 벨트 연결에 의해 동력을 전달하는 컨베이어 구동모터로 이루어지는 것을 특징으로 하는 칩 컨베이어 장치.
- 제1항에 있어서,상기 스크래퍼 유닛은상기 지하 피드로부터 상기 컨베이어 커버의 상부 일측까지 연결하는 스크래퍼 커버;상기 스크래퍼 커버의 내부를 따라 배치되어 양측에서 회전축에 감긴 상태로 구동하는 스크래퍼 벨트;상기 스크래퍼 커버의 상부 일측에 구성되어 상부 회전축과 벨트 연결에 의해 동력을 전달하는 스크래퍼 구동모터로 이루어지는 것을 특징으로 하는 칩 컨베이어 장치.
- 제1항에 있어서,상기 슈트는상기 스크래퍼 커버의 상부 전측에 일정규격의 칩 배출구를 형성하여 하향 경사지게 장착되는 것을 특징으로 하는 칩 컨베이어 장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070109489A KR100907054B1 (ko) | 2007-10-30 | 2007-10-30 | 칩 컨베이어 장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070109489A KR100907054B1 (ko) | 2007-10-30 | 2007-10-30 | 칩 컨베이어 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090043757A KR20090043757A (ko) | 2009-05-07 |
KR100907054B1 true KR100907054B1 (ko) | 2009-07-09 |
Family
ID=40854428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070109489A KR100907054B1 (ko) | 2007-10-30 | 2007-10-30 | 칩 컨베이어 장치 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100907054B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101443871B1 (ko) | 2013-08-29 | 2014-09-30 | (주)케이에스텍 | 가공칩 집하처리 시스템 |
US9415475B2 (en) | 2014-07-18 | 2016-08-16 | O-SUNG MECHATRONICS CO., Ltd | Conveyer apparatus for discharging chips |
KR20160122947A (ko) | 2015-04-14 | 2016-10-25 | (주) 덕은 | 압축식 칩컨베이어 장치 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108058062A (zh) * | 2018-02-02 | 2018-05-22 | 孙培宗 | 一种铣床废料收集器 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1058275A (ja) | 1996-08-23 | 1998-03-03 | Tsubakimoto Meifuran Kk | 切削液と切削屑の分離装置 |
JP2002331435A (ja) | 2001-05-07 | 2002-11-19 | Honda Motor Co Ltd | 切屑分別装置 |
KR200347000Y1 (ko) | 2004-01-07 | 2004-04-06 | (주)성우기전 | 칩반출 컨베이어의 배출칩 분쇄장치 |
KR100716782B1 (ko) | 2006-03-24 | 2007-05-14 | 창덕환경산업(주) | 목재칩 이송장치 |
-
2007
- 2007-10-30 KR KR1020070109489A patent/KR100907054B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH1058275A (ja) | 1996-08-23 | 1998-03-03 | Tsubakimoto Meifuran Kk | 切削液と切削屑の分離装置 |
JP2002331435A (ja) | 2001-05-07 | 2002-11-19 | Honda Motor Co Ltd | 切屑分別装置 |
KR200347000Y1 (ko) | 2004-01-07 | 2004-04-06 | (주)성우기전 | 칩반출 컨베이어의 배출칩 분쇄장치 |
KR100716782B1 (ko) | 2006-03-24 | 2007-05-14 | 창덕환경산업(주) | 목재칩 이송장치 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101443871B1 (ko) | 2013-08-29 | 2014-09-30 | (주)케이에스텍 | 가공칩 집하처리 시스템 |
US9415475B2 (en) | 2014-07-18 | 2016-08-16 | O-SUNG MECHATRONICS CO., Ltd | Conveyer apparatus for discharging chips |
KR20160122947A (ko) | 2015-04-14 | 2016-10-25 | (주) 덕은 | 압축식 칩컨베이어 장치 |
Also Published As
Publication number | Publication date |
---|---|
KR20090043757A (ko) | 2009-05-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100907054B1 (ko) | 칩 컨베이어 장치 | |
US20050155845A1 (en) | Particulate matter conveyor | |
CN110420680A (zh) | 一种石膏粉用高效复合破碎筛选一体化设备 | |
CN109540625A (zh) | 一种自动化煤样制粉系统 | |
JP5124120B2 (ja) | ロール粉砕機及びロール粉砕システム | |
CN207563024U (zh) | 一种肥料粉碎装置 | |
CN205995493U (zh) | 玉米深加工系统 | |
KR101876270B1 (ko) | 곡물분쇄혼합기 | |
CN206935532U (zh) | 一种肉苁蓉研磨装置 | |
CN113145279A (zh) | 一种可自动上料的石英砂破碎装置的工作方法 | |
KR100890617B1 (ko) | 폐코팅종이 처리장치 | |
CN206631738U (zh) | 一种磨机防卡死的石粉生产系统 | |
KR101732265B1 (ko) | 조사료용 haccp 제조 장치 | |
CN210022322U (zh) | 一种矿粉立磨机的回料系统 | |
KR200470384Y1 (ko) | 패각 분쇄기 | |
KR100855881B1 (ko) | 정량공급기가 구비된 고추분쇄기 | |
CN112473982A (zh) | 一种水泥生产用超细粉磨系统 | |
KR200440009Y1 (ko) | 사료분쇄기용 피더의 금속이물질 제거장치 | |
CN201823586U (zh) | 一种物料打散机 | |
CN210022264U (zh) | 一种矿用自动给料对辊破碎机 | |
CN220787111U (zh) | 一种磷矿开采用快速运输装置 | |
KR20060097090A (ko) | 에어이송장치가 구비된 고추분쇄기 | |
CN205995588U (zh) | 一种石粉生产存储装置 | |
CN221772355U (zh) | 一种具有防噪功能的矿石粉碎设备 | |
CN221680180U (zh) | 一种可调节矿山物料输送设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20130627 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20140630 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20150630 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20160630 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20180628 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20190627 Year of fee payment: 11 |