KR100877381B1 - 고저항 세라믹 열용사 코팅 소재 및 이를 포함하는정전척의 제조방법 - Google Patents
고저항 세라믹 열용사 코팅 소재 및 이를 포함하는정전척의 제조방법 Download PDFInfo
- Publication number
- KR100877381B1 KR100877381B1 KR1020070015622A KR20070015622A KR100877381B1 KR 100877381 B1 KR100877381 B1 KR 100877381B1 KR 1020070015622 A KR1020070015622 A KR 1020070015622A KR 20070015622 A KR20070015622 A KR 20070015622A KR 100877381 B1 KR100877381 B1 KR 100877381B1
- Authority
- KR
- South Korea
- Prior art keywords
- electrostatic chuck
- yag
- dielectric layer
- layer
- coating layer
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating By Spraying Or Casting (AREA)
Abstract
Description
Claims (5)
- 금속 모재에 하부 유전층, 전도성 전극층 및 상부 유전층을 적층하여 형성하는 정전척 제조방법에 있어서,상기 하부 유전층 또는 상부 유전층 중 1층 이상이 Al2O3 분말과 YAG(Y3Al5O12) 분말의 혼합물을 열처리하여 제조된 Al2O3-YAG 복합산화물 분말을 열용사 코팅하여 형성된 것을 특징으로 하는, Al2O3-YAG 복합산화물계 유전층을 갖는 정전척의 제조방법.
- 제 1 항에 있어서,상기 Al2O3-YAG 복합산화물은 5 내지 95 중량%의 YAG 및 95 내지 5 중량%의 Al2O3로 이루어지는 Al2O3-YAG 복합산화물계 유전층을 갖는 정전척의 제조방법.
- 제 2항에 있어서,상기 상부 유전층 또는 하부 유전층 중 어느 하나 이상의 표면은 액상의 유기계 또는 무기계 실링액에 의해 실링 처리된 것을 특징으로 하는 Al2O3-YAG 복합산화물계 유전층을 갖는 정전척의 제조방법.
- 제 1항에 있어서,상기 Al2O3-YAG 복합산화물 분말은 Al2O3분말 및 YAG분말을 포함하는 슬러리 혼합액을 분무 건조하여 5 내지 100㎛크기로 제조한 후 1000 내지 1600 ℃에서 열처리하여 제조된 것을 특징으로 하는 Al2O3-YAG 복합산화물계 유전층을 갖는 정전척의 제조방법.
- 제 1항 내지 제 4항에서 선택되는 어느 한 항의 제조방법에 의해 제조된 Al2O3-YAG 복합산화물계 유전층을 갖는 정전척.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/KR2007/000855 WO2008010632A1 (en) | 2006-07-20 | 2007-02-16 | Electrostatic chuck with high-resistivity ceramic coating materials |
JP2009520666A JP4975101B2 (ja) | 2006-07-20 | 2007-02-16 | 高抵抗セラミック熱溶射コーティング素材及びこれを含む静電チャックの製造方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060067754 | 2006-07-20 | ||
KR20060067754 | 2006-07-20 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20080008941A KR20080008941A (ko) | 2008-01-24 |
KR100877381B1 true KR100877381B1 (ko) | 2009-01-09 |
Family
ID=39221673
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070015622A KR100877381B1 (ko) | 2006-07-20 | 2007-02-14 | 고저항 세라믹 열용사 코팅 소재 및 이를 포함하는정전척의 제조방법 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP4975101B2 (ko) |
KR (1) | KR100877381B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102123912B1 (ko) * | 2018-11-21 | 2020-06-18 | (주)제니스월드 | 세라믹 코팅층 표면 개질 방법을 이용한 정전척의 제조방법 |
DE102022114212A1 (de) | 2021-06-09 | 2022-12-15 | Electronics And Telecommunications Research Institute | Hochspannungs-Ansteuervorrichtung |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020070340A (ko) * | 2000-01-21 | 2002-09-05 | 도카로 가부시키가이샤 | 정전척 부재 및 그 제조방법 |
KR20060060612A (ko) * | 2004-11-30 | 2006-06-05 | 가부시키가이샤 후지미인코퍼레이티드 | 용사용 분말, 용사 방법 및 용사 피막의 형성방법 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW514996B (en) * | 1999-12-10 | 2002-12-21 | Tokyo Electron Ltd | Processing apparatus with a chamber having therein a high-corrosion-resistant sprayed film |
KR100682740B1 (ko) * | 2004-01-15 | 2007-02-15 | 주식회사 솔믹스 | 반도체 제조설비의 코팅층 형성방법 |
JP4467453B2 (ja) * | 2004-09-30 | 2010-05-26 | 日本碍子株式会社 | セラミックス部材及びその製造方法 |
-
2007
- 2007-02-14 KR KR1020070015622A patent/KR100877381B1/ko active IP Right Grant
- 2007-02-16 JP JP2009520666A patent/JP4975101B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20020070340A (ko) * | 2000-01-21 | 2002-09-05 | 도카로 가부시키가이샤 | 정전척 부재 및 그 제조방법 |
KR20060060612A (ko) * | 2004-11-30 | 2006-06-05 | 가부시키가이샤 후지미인코퍼레이티드 | 용사용 분말, 용사 방법 및 용사 피막의 형성방법 |
Also Published As
Publication number | Publication date |
---|---|
KR20080008941A (ko) | 2008-01-24 |
JP2010515237A (ja) | 2010-05-06 |
JP4975101B2 (ja) | 2012-07-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4272786B2 (ja) | 静電チャック部材およびその製造方法 | |
KR100268052B1 (ko) | 정전 척부재 및 그 제조방법 | |
TWI427188B (zh) | 熱噴塗粉末、形成熱噴塗塗層之方法、以及耐電漿侵蝕之構件 | |
JP2009081223A (ja) | 静電チャック部材 | |
KR20100101641A (ko) | 정전 척 및 형성 방법 | |
KR101593078B1 (ko) | Esd 보호 디바이스 및 그 제조방법 | |
TWI728327B (zh) | 複合燒結體、半導體製造裝置構件及複合燒結體之製造方法 | |
KR20170141340A (ko) | 정전척용 세라믹 소결체 및 그 제조방법 | |
US20070065678A1 (en) | Electro-static chuck with non-sintered aln and a method of preparing the same | |
EP3792964B1 (en) | Electrostatic chuck and manufacturing method therefor | |
KR100877381B1 (ko) | 고저항 세라믹 열용사 코팅 소재 및 이를 포함하는정전척의 제조방법 | |
US5864459A (en) | Process for providing a glass dielectric layer on an electrically conductive substrate and electrostatic chucks made by the process | |
KR102266658B1 (ko) | 용사용 이트륨계 과립 분말 및 이를 이용한 용사 피막 | |
CN111081626A (zh) | 一种包含高电阻陶瓷热熔射材料的静电卡盘 | |
GB2583911A (en) | High density corrosion resistant layer arrangement for electrostatic chucks | |
US7525409B2 (en) | Method of manufacturing a varistor | |
JP4043219B2 (ja) | 静電チャック | |
WO2008010632A1 (en) | Electrostatic chuck with high-resistivity ceramic coating materials | |
JP4510358B2 (ja) | 静電チャックおよびその製造方法 | |
KR100432639B1 (ko) | 유전층 직접부착형 정전 척의 제조방법 | |
RU2454841C2 (ru) | Схемная подложка | |
KR102356172B1 (ko) | 내플라즈마성 코팅막의 제조방법 | |
JP4585129B2 (ja) | 静電チャック | |
Kim et al. | Microstructure evolution and dielectric properties of plasma sprayed BaTiO3 coatings | |
JP6491875B2 (ja) | 電気絶縁膜の形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20121129 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20131227 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20141201 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20151201 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20161125 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20171122 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20191202 Year of fee payment: 12 |