KR100871980B1 - Wafer flat zone aligner - Google Patents

Wafer flat zone aligner Download PDF

Info

Publication number
KR100871980B1
KR100871980B1 KR1020030102184A KR20030102184A KR100871980B1 KR 100871980 B1 KR100871980 B1 KR 100871980B1 KR 1020030102184 A KR1020030102184 A KR 1020030102184A KR 20030102184 A KR20030102184 A KR 20030102184A KR 100871980 B1 KR100871980 B1 KR 100871980B1
Authority
KR
South Korea
Prior art keywords
wafer
cassette
flat zone
alignment
aligning
Prior art date
Application number
KR1020030102184A
Other languages
Korean (ko)
Other versions
KR20050071205A (en
Inventor
김형원
길풍기
Original Assignee
동부일렉트로닉스 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 동부일렉트로닉스 주식회사 filed Critical 동부일렉트로닉스 주식회사
Priority to KR1020030102184A priority Critical patent/KR100871980B1/en
Publication of KR20050071205A publication Critical patent/KR20050071205A/en
Application granted granted Critical
Publication of KR100871980B1 publication Critical patent/KR100871980B1/en

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls

Abstract

본 발명은 카세트내에 수납된 웨이퍼들의 플랫존을 정렬 시키기 위한 웨이퍼 플랫존 정렬장치에 있어서, 웨이퍼를 적재하는 카세트의 앞쪽과 뒤쪽에 설치되고, 앞쪽의 장치는 두개의 롤러(roller)로 구성되어 있으며 뒤쪽의 장치는 정렬 스틱으로 구성되는 것을 특징으로 한다.The present invention is a wafer flat zone alignment device for aligning the flat zone of the wafers stored in the cassette, which is installed at the front and rear of the cassette for loading the wafer, the front device is composed of two rollers (roller) The device behind is characterized by being composed of alignment sticks.

본 발명에 의해서 웨이퍼가 카세트에 위치한 상태에서 정렬함으로 장비에서 정렬불량에 의한 에러를 줄일 수 있다.
The present invention can reduce errors due to misalignment in the equipment by aligning the wafer with the wafer positioned in the cassette.

웨이퍼, 플랫 존, 정렬Wafer, flat zone, aligned

Description

웨이퍼 플랫존 정렬장치{Wafer flat zone aligner} Wafer flat zone aligner             

도1은 본 발명에 의한 웨이퍼 카세트 로딩 방향 및 정렬장치의 구성.1 is a configuration of a wafer cassette loading direction and alignment device according to the present invention.

도2는 본 발명에 의한 롤러 구조.2 is a roller structure according to the present invention.

도3은 본 발명의 정렬스틱 구조.
Figure 3 is an alignment stick structure of the present invention.

본 발명은 웨이퍼 플랫 존 정렬장치에 관한 것으로서, 특히 반도체 생산공정에서 웨이퍼 플랫존을 일정하게 정렬시킬 수 있도록 정확한 제어가 가능한 웨이퍼 플랫존 정렬장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer flat zone aligning apparatus, and more particularly, to a wafer flat zone aligning apparatus capable of precise control to uniformly align a wafer flat zone in a semiconductor production process.

일반적으로 반도체 장치의 제조시에 웨이퍼는 다수매씩 적재하기 편리하도록 슬롯(slot)을 가지고 있는 카세트(cassette)에 적재되어 현 공정에서 다음 공정으로 이송된다. In general, in the manufacture of a semiconductor device, a wafer is loaded in a cassette having a slot so as to be convenient for stacking a plurality of sheets, and then transferred from the current process to the next process.

또한 반도체 장치의 제조를 위한 단위 공정 수행시에 상기 카세트에 적재된 상기 웨이퍼는 낱장 단위 또는 카세트 단위로 반도체 제조 장비에 적재되어 공정이 수행된다. 상기 카세트에 적재된 상기 웨이퍼는 반도체 단위 공정을 수행하기 이전에 장비내에서 얼라인(align) 불량을 방지하기 위해 상기 카세트 내에 적재된 상기 웨이퍼는 플랫존(Flat Zone)이 정렬되어 있어야 한다. In addition, when the unit process for manufacturing a semiconductor device is performed, the wafer loaded in the cassette is loaded on a semiconductor manufacturing equipment in a sheet unit or a cassette unit to perform a process. The wafers loaded in the cassettes must be aligned with the flat zones in order to prevent misalignment in the equipment prior to performing the semiconductor unit process.

상기 플랫존이 정렬되어 있지 않을 경우 장비 얼라인 불량은 물론 단위 공정을 진행하는데 심각한 장애요소로 작용한다.If the flat zone is not aligned, it is a serious obstacle to progress of the unit process as well as the equipment alignment failure.

상기 카세트에 적재된 웨이퍼의 플랫존 정렬은 롤러(roller)를 이용하여 상기 웨이퍼를 회전하여 정렬한다. 종래에는 에어 실런더를 이용한 롤러의 상하 동작을 제어할 수 있는 시스템이 구축되어 있지 않아, 스톱퍼를 이용하여 강제로 멈추는 제어방식을 사용하고 있다. 따라서 실린더에 연결된 롤러가 2kgf/㎠ 압력의 힘으로 웨어퍼의 취약부분인 에지에 직접적으로 가함으로써 웨이퍼 에지의 브로큰(broken)이 유발된다. Flat zone alignment of the wafers loaded in the cassette is performed by rotating the wafers using a roller. Conventionally, there is no system that can control the vertical movement of the roller using an air cylinder, and a control method of forcibly stopping using a stopper is used. Therefore, a roller connected to the cylinder is applied directly to the edge, which is a weak part of the wafer, by a force of 2 kgf / cm 2, causing a crack of the wafer edge.

이처럼, 종래에는 에어 실린더를 이용하여 롤러를 상하 동작시킴에 있어 거리 이동을 정밀하게 제어할 수 없었고, 따라서 롤러와 웨이퍼 에지와의 충돌로 인한 문제가 발생되어도 제어기능이 없어서 공정사고 위험성이 매우 높다.
As such, in the related art, it is not possible to precisely control the distance movement in operating the roller up and down by using an air cylinder. Therefore, even if a problem caused by the collision between the roller and the wafer edge occurs, there is no control function so the risk of process accident is very high. .

따라서, 본 발명이 이루고자 하는 기술적 과제는 반도체 생산공정에서 웨이퍼 플랫존을 일정하게 정렬시킬 수 있도록 정확한 제어가 가능한 웨이퍼 플랫존 정렬장치를 제공하는 데 있다.
Accordingly, the technical problem to be achieved by the present invention is to provide a wafer flat zone alignment apparatus capable of precise control so as to align the wafer flat zone uniformly in the semiconductor production process.

상기한 기술적 과제를 달성하기 위하여, 본 발명은 카세트내에 수납된 웨이퍼들의 플랫존을 정렬 시키기 위한 웨이퍼 플랫존 정렬장치에 있어서, 웨이퍼를 적재하는 카세트의 앞쪽과 뒤쪽에 설치되고, 앞쪽의 장치는 두개의 롤러로 구성되어있으며 뒤쪽의 장치는 정렬 스틱으로 구성되는 것을 특징으로 하며, 상기 카세트 로딩 로더 밑부분에서 두개의 롤러와 1개의 정렬스틱이 올라오는 것을 특징으로 한다.In order to achieve the above technical problem, the present invention is a wafer flat zone aligning device for aligning the flat zone of the wafers stored in the cassette, it is provided in the front and rear of the cassette for loading the wafer, the front device is two It consists of a roller of the rear device is characterized in that consisting of the alignment stick, characterized in that the two rollers and one alignment stick is raised from the bottom of the cassette loading loader.

삭제delete

본 발명의 상기 목적과 기술적 구성 및 그에 따른 작용효과에 관한 자세한 사항은 본 발명의 바람직한 실시예를 도시하고 있는 도면을 참조한 이하 상세한 설명에 의해 보다 명확하게 이해될 것이다.Details of the above object and technical configuration of the present invention and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention.

종래에는 웨이퍼 카세트의 밑에 정렬 롤러가 있었지만 본 발명에서는 웨이퍼를 로더(loader)에 올린 상태에서 도1과 같이 수평상태에서 웨이퍼의 플랫존을 정렬하게 된다.Conventionally, there was an alignment roller under the wafer cassette, but in the present invention, the flat zone of the wafer is aligned in a horizontal state as shown in FIG. 1 while the wafer is placed on a loader.

도 2 및 도 3을 참조하여 구체적으로 설명하면, 웨이퍼 로더에 웨이퍼 카세트를 로드하게 되면 로더 아래에 설치된 2개의 롤러를 이용하여 웨이퍼를 회전시킨다.2 and 3, when the wafer cassette is loaded into the wafer loader, the wafer is rotated using two rollers installed below the loader.

이후 웨이퍼 카세트의 뒷쪽에 설치된 정렬스틱이 웨이퍼 카세트 로딩 아랫부분에서 웨이퍼 카세트 높이까지 상승하게 되며, 2개의 롤러와 정렬 스틱이 웨이퍼 안쪽으로 서로 이동하여 웨이퍼에 접촉하게 되며, 이때 정렬막대는 웨이퍼의 플랫존이 걸릴 수 있도록 적당한 힘으로 밀어주게 되고, 회전 중인 웨이퍼의 플랫존의 위치가 정렬된 웨이퍼는 웨이퍼 회전 멈춤장치에 의하여 회전을 멈추고 정렬되지 않은 웨이퍼는 계속하여 회전하면서 정렬 위치를 찾게된다.The alignment stick installed at the back of the wafer cassette then rises from the bottom of the wafer cassette loading to the wafer cassette height, and the two rollers and the alignment stick move into each other to contact the wafer, where the alignment bar is flat on the wafer. The zone is pushed with a suitable force so that the zone can be caught, the wafer in which the position of the flat zone of the rotating wafer is aligned is stopped by the wafer rotation stopper, and the unaligned wafer is continuously rotated to find the alignment position.

여기에서 웨이퍼 카세트 앞쪽에 설치된 2개의 롤러가 웨이퍼를 미는 힘은 뒤쪽에 설치된 정렬스틱의 힘보다는 약하게 구성하는 것이 바람직하다.Here, it is preferable that the force of pushing the wafer by the two rollers installed at the front of the wafer cassette is weaker than the force of the alignment stick installed at the rear.

상세히 설명된 본 발명에 의하여 본 발명의 특징부를 포함하는 변화들 및 변형들이 당해 기술 분야에서 숙련된 보통의 사람들에게 명백히 쉬워질 것임이 자명하다. 본 발명의 그러한 변형들의 범위는 본 발명의 특징부를 포함하는 당해 기술 분야에 숙련된 통상의 지식을 가진 자들의 범위 내에 있으며, 그러한 변형들은 본 발명의 청구항의 범위 내에 있는 것으로 간주된다.
It will be apparent that changes and modifications incorporating features of the invention will be readily apparent to those skilled in the art by the invention described in detail. It is intended that the scope of such modifications of the invention be within the scope of those of ordinary skill in the art including the features of the invention, and such modifications are considered to be within the scope of the claims of the invention.

상술한 바와 같이 본 발명의 웨이퍼 플랫 존 정렬장치에 의해서, 웨이퍼가 카세트에 위치한 상태에서 정렬함으로 장비에서 정렬불량에 의한 에러를 줄일 수 있다.As described above, the wafer flat zone aligning apparatus of the present invention can reduce the error due to misalignment in the equipment by aligning the wafer while the wafer is placed in the cassette.

Claims (4)

카세트 내에 수납된 웨이퍼들의 플랫존을 정렬시키기 위한 웨이퍼 플랫존 정렬장치에 있어서,In the wafer flat zone aligning apparatus for aligning the flat zone of the wafers stored in the cassette, 상기 카세트의 앞쪽과 뒤쪽에 설치되고, 앞쪽의 장치는 두개의 롤러로 구성되고, 뒤쪽의 장치는 정렬 스틱으로 구성되며,Installed at the front and rear of the cassette, the device of the front consists of two rollers, the device of the rear consists of alignment sticks, 카세트 로더에 의하여 상기 카세트가 로딩되면 상기 롤러 및 상기 정렬 스틱은 상기 카세트 로더 밑부분으로부터 상기 카세트 높이까지 상승되고, 내측으로 상기 웨이퍼를 밀어서 정렬시키는 것을 특징으로 하는 웨이퍼 플랫 존 정렬장치.And the roller and the alignment stick are raised from the bottom of the cassette loader to the cassette height when the cassette is loaded by the cassette loader, and the wafer flat zone alignment device is aligned by pushing the wafer inwardly. 삭제delete 제1항에 있어서,The method of claim 1, 상기 정렬스틱은 웨이퍼 카세트의 높이와 동일한 길이를 가지며, 웨이퍼 회전 멈춤장치가 형성되는 것을 특징으로 하는 웨이퍼 플랫 존 정렬장치.The alignment stick has a length equal to the height of the wafer cassette, the wafer flat zone alignment device, characterized in that the wafer rotation stopper is formed. 제1항에 있어서,The method of claim 1, 상기 두개의 롤러가 웨이퍼를 미는 힘은 상기 정렬 스틱의 힘보다 약한 것을 특징으로 하는 웨이퍼 플랫 존 정렬장치.And the force by which the two rollers push the wafer is weaker than the force of the alignment stick.
KR1020030102184A 2003-12-31 2003-12-31 Wafer flat zone aligner KR100871980B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020030102184A KR100871980B1 (en) 2003-12-31 2003-12-31 Wafer flat zone aligner

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020030102184A KR100871980B1 (en) 2003-12-31 2003-12-31 Wafer flat zone aligner

Publications (2)

Publication Number Publication Date
KR20050071205A KR20050071205A (en) 2005-07-07
KR100871980B1 true KR100871980B1 (en) 2008-12-08

Family

ID=37261180

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030102184A KR100871980B1 (en) 2003-12-31 2003-12-31 Wafer flat zone aligner

Country Status (1)

Country Link
KR (1) KR100871980B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110265342A (en) * 2019-07-02 2019-09-20 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Wafer locating device and chip processing system

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177229A (en) * 1992-08-28 1994-06-24 Hughes Aircraft Co Method and apparatus for coincident and jamless alignment of semiconductor wafer
JPH09290890A (en) * 1996-04-25 1997-11-11 Nikon Corp Wafer carrier
KR20000010502U (en) * 1998-11-23 2000-06-15 김규현 Transfer stage of diffusion apparatus with wafer protrusion error prevention means

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06177229A (en) * 1992-08-28 1994-06-24 Hughes Aircraft Co Method and apparatus for coincident and jamless alignment of semiconductor wafer
JPH09290890A (en) * 1996-04-25 1997-11-11 Nikon Corp Wafer carrier
KR20000010502U (en) * 1998-11-23 2000-06-15 김규현 Transfer stage of diffusion apparatus with wafer protrusion error prevention means

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110265342A (en) * 2019-07-02 2019-09-20 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Wafer locating device and chip processing system
CN110265342B (en) * 2019-07-02 2021-07-02 北京半导体专用设备研究所（中国电子科技集团公司第四十五研究所） Wafer positioning device and wafer processing system

Also Published As

Publication number Publication date
KR20050071205A (en) 2005-07-07

Similar Documents

Publication Publication Date Title
JP6352376B2 (en) Substrate processing system and substrate processing method
KR100380623B1 (en) Semiconductor manufacturing method and semiconductor manufacturing apparatus
KR20080039195A (en) Workpiece rotation apparatus for a plasma reactor system
KR100871980B1 (en) Wafer flat zone aligner
KR100587781B1 (en) Methods and apparatus for positioning a substrate relative to a support stage
JP2004031799A (en) Temporarily positioning mechanism of work and method for temporarily positioning work
JP2018069536A (en) Scribe device and scribe method
JP3904843B2 (en) Substrate detection apparatus, substrate processing apparatus, and substrate detection method
KR100763251B1 (en) Apparatus for moving wafer
KR100229073B1 (en) Automatic glass-transferring system
KR101580554B1 (en) The apparatus for changing the pitch between the wafers
WO2020114010A1 (en) Conveyor
CN213546271U (en) Integrated circuit device
KR20020084475A (en) Wafer aligner and method for aligning wafer
KR101496444B1 (en) Transportation Method of Glass Substrate and Heat Treatment Apparatus using the Same
JP2503732Y2 (en) Semiconductor manufacturing equipment
KR20030043220A (en) Apparatus for sensing breakage in base glass plate of LCD
JP2000021953A (en) Method for semiconductor treatment
KR101316893B1 (en) Tray Aligner
KR20080036272A (en) Pivot with wafer protection device
JPH0755533Y2 (en) Distortion correction device for substrate storage cassette
KR20140073170A (en) Wafer Flat Zone Aligner
JPH0333066Y2 (en)
JPH0310672Y2 (en)
JP2002289674A (en) Apparatus and method for aligning notched part of substrate

Legal Events

Date Code Title Description
N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee