KR100861604B1 - 가변 각도 설계를 이용하는 광학 검사 방법 및 장치 - Google Patents

가변 각도 설계를 이용하는 광학 검사 방법 및 장치 Download PDF

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KR100861604B1
KR100861604B1 KR1020017015891A KR20017015891A KR100861604B1 KR 100861604 B1 KR100861604 B1 KR 100861604B1 KR 1020017015891 A KR1020017015891 A KR 1020017015891A KR 20017015891 A KR20017015891 A KR 20017015891A KR 100861604 B1 KR100861604 B1 KR 100861604B1
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South Korea
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light
article
detection device
optical detection
image
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KR20020019073A (ko
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보리스 골버그
아미르 코멤
론 나프탈리
길라드 알모지
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어플라이드 머티어리얼스, 인코포레이티드
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/94—Investigating contamination, e.g. dust

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020017015891A 1999-06-10 2000-06-09 가변 각도 설계를 이용하는 광학 검사 방법 및 장치 Expired - Lifetime KR100861604B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/330,249 US6366352B1 (en) 1999-06-10 1999-06-10 Optical inspection method and apparatus utilizing a variable angle design
US09/330,249 1999-06-10

Publications (2)

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KR20020019073A KR20020019073A (ko) 2002-03-09
KR100861604B1 true KR100861604B1 (ko) 2008-10-07

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KR1020017015891A Expired - Lifetime KR100861604B1 (ko) 1999-06-10 2000-06-09 가변 각도 설계를 이용하는 광학 검사 방법 및 장치

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US (2) US6366352B1 (https=)
EP (1) EP1185855A1 (https=)
JP (1) JP2003502634A (https=)
KR (1) KR100861604B1 (https=)
WO (1) WO2000077500A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190090874A (ko) * 2011-07-28 2019-08-02 케이엘에이-텐코 코포레이션 웨이퍼 상의 결함 검출
US10605744B2 (en) 2009-01-26 2020-03-31 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996039619A1 (en) 1995-06-06 1996-12-12 Kla Instruments Corporation Optical inspection of a specimen using multi-channel responses from the specimen
US6288780B1 (en) 1995-06-06 2001-09-11 Kla-Tencor Technologies Corp. High throughput brightfield/darkfield wafer inspection system using advanced optical techniques
US6774991B1 (en) * 1999-05-27 2004-08-10 Inspex Incorporated Method and apparatus for inspecting a patterned semiconductor wafer
US6369888B1 (en) * 1999-11-17 2002-04-09 Applied Materials, Inc. Method and apparatus for article inspection including speckle reduction
JP3996728B2 (ja) * 2000-03-08 2007-10-24 株式会社日立製作所 表面検査装置およびその方法
US7130029B2 (en) 2000-09-20 2006-10-31 Kla-Tencor Technologies Corp. Methods and systems for determining an adhesion characteristic and a thickness of a specimen
US6891627B1 (en) 2000-09-20 2005-05-10 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension and overlay of a specimen
US7106425B1 (en) 2000-09-20 2006-09-12 Kla-Tencor Technologies Corp. Methods and systems for determining a presence of defects and a thin film characteristic of a specimen
US6946394B2 (en) 2000-09-20 2005-09-20 Kla-Tencor Technologies Methods and systems for determining a characteristic of a layer formed on a specimen by a deposition process
US7349090B2 (en) 2000-09-20 2008-03-25 Kla-Tencor Technologies Corp. Methods and systems for determining a property of a specimen prior to, during, or subsequent to lithography
US6919957B2 (en) 2000-09-20 2005-07-19 Kla-Tencor Technologies Corp. Methods and systems for determining a critical dimension, a presence of defects, and a thin film characteristic of a specimen
DE10115578A1 (de) * 2001-03-29 2002-10-10 Leica Microsystems Verfahren und Anordnung zum Ausgleichen von Abbildungsfehlern
US6538730B2 (en) * 2001-04-06 2003-03-25 Kla-Tencor Technologies Corporation Defect detection system
US6657714B2 (en) * 2001-09-24 2003-12-02 Applied Materials, Inc. Defect detection with enhanced dynamic range
US6906305B2 (en) * 2002-01-08 2005-06-14 Brion Technologies, Inc. System and method for aerial image sensing
US6828542B2 (en) * 2002-06-07 2004-12-07 Brion Technologies, Inc. System and method for lithography process monitoring and control
US6861660B2 (en) * 2002-07-29 2005-03-01 Applied Materials, Inc. Process and assembly for non-destructive surface inspection
US7433053B2 (en) * 2002-08-08 2008-10-07 Applied Materials, Israel, Ltd. Laser inspection using diffractive elements for enhancement and suppression of surface features
US6807503B2 (en) * 2002-11-04 2004-10-19 Brion Technologies, Inc. Method and apparatus for monitoring integrated circuit fabrication
AU2003290785A1 (en) * 2003-02-11 2004-09-06 Applied Materials Israel, Ltd. System and method for inspection of a substrate that has a refractive index
US7030978B2 (en) 2003-04-25 2006-04-18 Applied Materials, Israel, Ltd System and method for inspection of a substrate that has a refractive index
US7180658B2 (en) 2003-02-21 2007-02-20 Kla-Tencor Technologies Corporation High performance catadioptric imaging system
US7053355B2 (en) 2003-03-18 2006-05-30 Brion Technologies, Inc. System and method for lithography process monitoring and control
US7002677B2 (en) * 2003-07-23 2006-02-21 Kla-Tencor Technologies Corporation Darkfield inspection system having a programmable light selection array
US20050122508A1 (en) * 2003-10-31 2005-06-09 Sachio Uto Method and apparatus for reviewing defects
JP4996856B2 (ja) * 2006-01-23 2012-08-08 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
JP4876019B2 (ja) * 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
JP5687014B2 (ja) * 2010-09-24 2015-03-18 株式会社日立ハイテクノロジーズ 光学式表面欠陥検査装置及び光学式表面欠陥検査方法
JP5593213B2 (ja) * 2010-12-24 2014-09-17 株式会社日立ハイテクノロジーズ 検査装置
US10156527B2 (en) * 2014-04-24 2018-12-18 Asml Holding N.V. Compact two-sided reticle inspection system
US10887580B2 (en) * 2016-10-07 2021-01-05 Kla-Tencor Corporation Three-dimensional imaging for semiconductor wafer inspection
NL2023884A (en) * 2018-10-12 2020-05-07 Asml Netherlands Bv Detection system for an alignment sensor
US11536792B2 (en) 2020-04-30 2022-12-27 Applied Materials Israel Ltd. Test of an examination tool

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813172A (en) * 1972-01-03 1974-05-28 Kollmorgen Corp Photometric device with a plurality of measuring fields
US4902131A (en) * 1985-03-28 1990-02-20 Kabushiki Kaisha Toshiba Surface inspection method and apparatus therefor
US5276498A (en) * 1992-05-12 1994-01-04 Tencor Instruments Adaptive spatial filter for surface inspection
US5604585A (en) * 1995-03-31 1997-02-18 Tencor Instruments Particle detection system employing a subsystem for collecting scattered light from the particles

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5324301B2 (https=) * 1974-09-09 1978-07-20
US4669875A (en) * 1982-11-04 1987-06-02 Hitachi, Ltd. Foreign particle detecting method and apparatus
JPS603457U (ja) * 1983-06-21 1985-01-11 株式会社安川電機 欠点検出装置
USRE33956F1 (en) 1987-06-08 1994-06-07 Optical Specialties Inc Inspection system for array of microcircuit dies having redundant circuit patterns
US4898471A (en) * 1987-06-18 1990-02-06 Tencor Instruments Particle detection on patterned wafers and the like
US5046847A (en) * 1987-10-30 1991-09-10 Hitachi Ltd. Method for detecting foreign matter and device for realizing same
US5172000A (en) 1990-11-02 1992-12-15 Insystems, Inc. Spatial filter for optically based defect inspection system
US5177559A (en) * 1991-05-17 1993-01-05 International Business Machines Corporation Dark field imaging defect inspection system for repetitive pattern integrated circuits
JP3314440B2 (ja) * 1993-02-26 2002-08-12 株式会社日立製作所 欠陥検査装置およびその方法
JP3319790B2 (ja) * 1992-11-30 2002-09-03 株式会社日立製作所 異物検査方法及びその装置
US5479252A (en) * 1993-06-17 1995-12-26 Ultrapointe Corporation Laser imaging system for inspection and analysis of sub-micron particles
US5471066A (en) * 1993-08-26 1995-11-28 Nikon Corporation Defect inspection apparatus of rotary type
JPH07229844A (ja) * 1994-02-22 1995-08-29 Nikon Corp 異物検査装置
US5712701A (en) * 1995-03-06 1998-01-27 Ade Optical Systems Corporation Surface inspection system and method of inspecting surface of workpiece
JPH09178563A (ja) 1995-12-21 1997-07-11 Shimadzu Corp 分光測定装置
JPH102864A (ja) * 1996-06-13 1998-01-06 Nikon Corp 異物検査装置
US6034776A (en) * 1997-04-16 2000-03-07 The United States Of America As Represented By The Secretary Of Commerce Microroughness-blind optical scattering instrument

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3813172A (en) * 1972-01-03 1974-05-28 Kollmorgen Corp Photometric device with a plurality of measuring fields
US4902131A (en) * 1985-03-28 1990-02-20 Kabushiki Kaisha Toshiba Surface inspection method and apparatus therefor
US5276498A (en) * 1992-05-12 1994-01-04 Tencor Instruments Adaptive spatial filter for surface inspection
US5604585A (en) * 1995-03-31 1997-02-18 Tencor Instruments Particle detection system employing a subsystem for collecting scattered light from the particles

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10605744B2 (en) 2009-01-26 2020-03-31 Kla-Tencor Corp. Systems and methods for detecting defects on a wafer
KR20190090874A (ko) * 2011-07-28 2019-08-02 케이엘에이-텐코 코포레이션 웨이퍼 상의 결함 검출
KR20210034699A (ko) * 2011-07-28 2021-03-30 케이엘에이 코포레이션 웨이퍼 상의 결함 검출
KR102232913B1 (ko) 2011-07-28 2021-03-30 케이엘에이 코포레이션 웨이퍼 상의 결함 검출
KR20220014340A (ko) * 2011-07-28 2022-02-04 케이엘에이 코포레이션 웨이퍼 상의 결함 검출
KR102356941B1 (ko) 2011-07-28 2022-02-08 케이엘에이 코포레이션 웨이퍼 상의 결함 검출
KR102407075B1 (ko) 2011-07-28 2022-06-08 케이엘에이 코포레이션 웨이퍼 상의 결함 검출

Also Published As

Publication number Publication date
US6366352B1 (en) 2002-04-02
US6469784B2 (en) 2002-10-22
EP1185855A1 (en) 2002-03-13
WO2000077500A1 (en) 2000-12-21
KR20020019073A (ko) 2002-03-09
JP2003502634A (ja) 2003-01-21
US20020005947A1 (en) 2002-01-17

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