KR100847277B1 - A read wire product system and method - Google Patents

Abstract

An apparatus and a method for manufacturing ultrafine read wires for electronic components are provided to improve productivity substantially by straightly transferring ultrafine wires, manufacture ultrafine read wires by performing a tin plating operation easily while smoothly transferring strands of the ultrafine wires without cutting, and improve pre-treatment and plating capabilities while circulating a pre-treatment solution and molten tin consistently. An apparatus(1-3) for manufacturing a ultrafine read wire comprises: first and second pre-treatment tanks(10,20) of a pre-treatment unit part(2) for removing alien substances adhered to an outer face of a ultrafine wire(A), and a melting tank(30) of a plating unit part(3) having a heating device(34) mounted on a bottom face thereof, the first and second pre-treatment tanks and the melting tank being successively installed side by side on the same horizontal line; straight circulating sealing ports(40) which are mounted both side faces of the first and second pre-treatment tanks and the melting tank such that heights of the straight circulating sealing ports are lower than those of the melting tank and a pre-treatment solution filled in the first and second pre-treatment tanks, and which pre-treats and coats the ultrafine wire while horizontally supplying or discharging the ultrafine wire through the straight circulating sealing ports of the first and second pre-treatment tanks and the melting tank; and first and second pre-treatment circulation tanks(11,21) installed under the first and second pre-treatment tanks, and a melting circulation tank(31) which is installed under the melting tank and has a heating device mounted on a bottom face thereof such that pre-treatment and plating processes are performed while consistently circulating a pre-treatment solution filled in the first and second pre-treatment tanks and molten tin filled in the melting tank by a circulating unit.

Description

Micro lead wire manufacturing apparatus and manufacturing method for electronic components {A READ WIRE PRODUCT SYSTEM AND METHOD}

1A and 1B are schematic diagrams showing a conventional apparatus for manufacturing a rig wire for an electronic component.

Figure 2 is a schematic diagram showing a micro lead wire manufacturing apparatus for an electronic component according to the present invention.

Figure 3a and Figure 3b is a perspective view and a cross-sectional view showing a straight through sealing hole installed in the ultra-fine lead wire manufacturing apparatus for electronic components according to the present invention.

Explanation of symbols on the main parts of the drawings

1-1.1-2: Lead wire manufacturing device 1-3: Ultra fine wire production device 2: Pretreatment unit

3: Plating apparatus part 5: Pretreatment tank 6.7.30: Melting tank

8.30.35: heating apparatus 10: first pretreatment tank 20: second pretreatment tank

11: first pretreatment circulation tank 21: second pretreatment circulation tank 12.22.32: supply circulation pipe

13.23.33: Outlet circulating pipe 40: Straight line sealing port 41: Sealing port

42: Sealing hole 43.44: Expansion part P1.P2.P3: Circulation pump

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to an apparatus and a manufacturing method for an electronic component READ WIRE having a significantly thin thickness in a lead wire used when connecting elements of various electronic parts to wiring on a printed circuit board.

In more detail, in the plating (film) of molten stone made of tin (Sn) on the outer surface (the outer circumference) of the conductor made of copper (Cu) or copper alloy, a plurality of pretreatment tanks and a separate molten bath are in a horizontal state. Straight distribution balls are installed on each supply side and discharge side of each pretreatment tank and the melting tank on the same horizontal line, and the wires are respectively installed on each supply side and the discharge side of each pretreatment tank and the melting tank. Pretreatment to cleanly remove foreign substances attached to the outer circumference (outer surface) of the conducting wire while passing on the horizontal line, and the pre-processed conducting wire is plated by passing molten stone through a molten bath equipped with a heating device It is to provide a lead wire manufacturing apparatus and a manufacturing method.

READ WIRE for electronic components is used to fix and connect various electronic devices (microcom, transistor, diode, resistor, capacitor, etc.) on the wiring of printed circuit board (PCB) or to conduct soldering. Excellence is inevitably required.

I have read the READ WIRE for electronic parts having the above characteristics. Patent Publication No. 10-1980-520 (Application No. 10-1979-474) and Patent Publication No. 10-1986-476 (Application No. 10-1984-802) and Patent Registration No. 10-405350.

This is a tin (Sn) plated on the outer circumference (outer surface) of a conductor made of copper (Cu) or a copper alloy.

1A and 1B show a conventional lead wire manufacturing apparatus 1-1 (1-2) in which tin (Sn) is plated on the outer circumference (outer surface) of a conductive wire when the lead wire for a electronic component (READ WIRE) is manufactured as described above. Will be shown.

In the conventional lead wire manufacturing apparatus 1-1 illustrated in FIG. 1A, the pretreatment leaving unit 2 and the plating apparatus unit 3 are provided horizontally.

The pretreatment unit 2 and the melter unit 3 are provided with a row side by side in the pretreatment tank 5 and the plurality of melting tanks 6, the heating device 8 is mounted on the bottom, each pretreatment tank (5) And induction rollers 5-1, 6-1 and discharge induction rollers 5-2 and 6-2, respectively, on both sides (inlet side and outlet side) of the upper part of the melting tank 6, Inside the pretreatment tank 5 and the melting tank 6, a pair of idle rollers are provided below the induction rollers 5-1, 6-1 and the discharge induction rollers 5-2, 6-2. 5-3) and 6-3, respectively, and the induction roller 7-1 is mounted on the upper inlet side of the final melting tank 7 and the discharge induction roller 7-2 is installed inside.

Induction rollers 5-1, 6-1, 7-1 and discharge induction rollers 5-2, 6-2 and 7 of the respective pretreatment tanks 5 and the melting tank 6 formed as described above. -2), the conducting wires A are sequentially applied to each other, plating is performed while the pretreatment liquid and the molten tin are filled in each pretreatment tank 5 and the plating tank 6, and the molten molten lead wire A-1 ) Is inclined at an angle of about 45 degrees to be transferred to the next process (winding process).

The lead wire manufacturing apparatus 1-2 illustrated in FIG. 1B shows a patent registration No. 10-41955, "Lead wire plating method for an electronic component using a multi-stage plating apparatus," developed and registered by the person.

The electroplating method is characterized in that the pretreatment unit 2 and the plating unit 3 are installed in the longitudinal direction, and a plurality of plating tanks in which the pretreatment tank 5 and the heating device 8 are mounted on the bottom ( 6) Install a line in longitudinal line, each of the pretreatment tank (5) and the upper side of the plating tank (6) (inlet side and outlet side), the induction roller (5-1) (6-1) and the discharge induction roller ( 5-2) and 6-2, respectively, and inside the pretreatment tank 5 and the plating tank 6, the induction rollers 5-1, 6-1 and the discharge induction roller 5-2. A pair of idle rollers (5-3) (6-3) are mounted to the lower side of (6-2), respectively, between the pretreatment tank (5) and the plating tank (6), and the plating tank (6). A pair of guide rollers 9 are repeatedly provided left and right on the outer side between the jaws 6.

 The induction rollers 5-1, 6-1, 7-1 and the discharge induction rollers 5-2, 6-2 and 7 of each of the pretreatment tanks 5 and the plating tanks 6 formed as described above. -2) to the wire (A) in sequence, and sequentially walked through the guide roller (9) which is installed left and right repeatedly, pretreatment liquid and molten tin in each pretreatment tank (5) and plating tank (6) Plating is carried out in a filled state, and the plated plating lead wire A-1 is discharged from the final plating bath 6 located at the top thereof and transferred to the next step (winding step).

However, this is a stack of conventional pre-treatment tanks and plating baths arranged in a straight line in a vertical state, the problem that the entire length of the plating is long (about 300m) when plating after pre-processing the wires Since the wire simply passes through each plating bath, the adhesion ability of the tin (Sn) is reduced, and the plating time is long because the plating bath must be repeatedly passed through the plating bath to eliminate the adhesion ability of the tin (Sn). There is a problem in that the production time is reduced due to the long plating time.

In particular, the conventional lead wire manufacturing apparatuses 1-1 (1-2) lead wires A to the induction rollers 5-1, 6-1, 7-1 and the discharge induction roller 5-2. (6-2) (7-2) and the guide rollers 9 are zigzag and transported, so that the transfer capacity is remarkably poor (about 350M / min), which leads to a problem of low productivity.

In addition, the ultra fine wire strands (10 to 12 lines) having a thickness of 0.03 to 0.10 mm are drawn in the induction rollers (5-1) (6-1) (7-1) and the discharge induction rollers (5-2) (6-2). (7-2) and guide rollers (9) are transported on the micro fine strands induction roller (5-1) (6-1) (7-1) and discharge guide roller (5-2) (6 -2) (7-2) and the guide rollers (9) are frequently in contact with the friction and bending is made repeatedly, and the ultra-fine wires (fine wire strands) of very thin thickness are friction and bending during transfer As this is repeatedly carried out, there is a problem that is easily broken during the transfer.

Therefore, in the conventional lead wire manufacturing apparatus 1-1 (1-2), not only tin (Sn) can be plated on the fine wire strands (10 to 12 lines) having a thickness of 0.03 to 0.10 mm, but also the fine wire leads There is a problem that cannot be produced (manufactured).

The present invention relates to an ultra-thin lead wire (READ WIRE) manufacturing apparatus and a manufacturing method for an electronic component that can solve the above problems to manufacture a ultra-fine lead wire.

In the present invention, in plating a molten solution made of tin (Sn) on the outer surface (outer periphery) of a conductor made of copper (Cu) or a copper alloy, a plurality of pretreatment tanks and separate melt baths are provided in a straight line in a horizontal state. Each supply side and the discharge side of each pretreatment tank and the melting tank are equipped with a straight flow ball bundle on the same horizontal line, and the lead wires are passed through the horizontal line through the straight flow sealing ports respectively provided on each supply side and the discharge side of each pretreatment tank and the melting tank. It provides pretreatment to remove foreign matters attached to the outer circumference (outer surface) cleanly, and passes the pretreated lead through molten tin through a melting tank equipped with a heating device, and provides an READ WIRE manufacturing device and manufacturing method for electronic parts. There is a purpose.

Another object of the present invention is to significantly improve the transfer capacity, that is, productivity by transferring the wire in a straight line without turning or bending the wire, and eliminating the turning and bending and the generation of contact resistance. It is possible to manufacture (produce) ultra fine wire by easily performing plating (tin) while smoothly transferring strands (10 to 12 lines) of ultra fine wires (0.03 to 0.10 mm) that are extremely thin. It is to provide an apparatus and a manufacturing method for a READ WIRE for parts.

Still another object of the present invention is to provide a pretreatment circulation tank and a melt circulation tank under the pretreatment tank and the melting tank where pretreatment and plating are performed, respectively, and pretreatment and plating by continuously circulating the pretreatment liquid and the melt, and pretreatment and plating. The present invention aims to provide an READ WIRE manufacturing apparatus and a manufacturing method for an electronic component that can efficiently perform and improve pretreatment and plating ability.

The above and other objects of the present invention,

Pass the copper (Cu) or copper alloy wire through the pretreatment tank to remove foreign substances adhering to the outer surface, and through the pretreatment tank, the conducting wire from which the foreign matter is removed is filled with a melt of tin (Sn) and the heating device ( In plating while passing through the molten bath 30 provided with 34),

The first pretreatment tank 10 and the second pretreatment tank 20 of the pretreatment unit 2 for removing the foreign matter attached to the outer surface of the ultra fine wire A, and the plating apparatus unit on which the heating device 34 is mounted. (3) that the molten bath 30 is continuously installed side by side on the same horizontal line;

Pretreatment liquid filled with a linear distribution ball 40 on both sides of the inlet and discharge of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 which are continuously installed side by side on the same horizontal line. And lower than the height of the melting tank 30, respectively;

While supplying / discharging the ultra-fine conductive wires A horizontally through the linear distribution sealing holes 40 of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 mounted on the same horizontal line. Pretreatment and plating;

Under the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30, a first pretreatment circulation tank 11, a second pretreatment circulation tank 21, and a heating device 35 on the bottom thereof. Respectively equipped with a melt circulation tank 31, and continuously circulates the pretreatment liquid and the melt liquid filled in the first pretreatment tank 10, the second pretreatment tank 20, and the molten bath 30 by a circulation device. It is achieved by the ultra-fine lead wire manufacturing apparatus (1-3) characterized in that the;

Other above and other objects of the present invention,

Pre-treatment process that removes foreign substances adhering to the outer surface by passing the copper (Cu) or copper alloy wire through the pretreatment tank, molten stone made of tin (Sn) is filled and heated to the bottom In carrying out the plating step of plating while passing through the molten bath 30 provided with the apparatus 34,

In the pretreatment step of removing foreign matter adhering to the outer surface of the ultrafine wire A, the first pretreatment tank 10 and the second pretreatment tank 20 and the melting tank 30 where plating is performed are installed side by side. ) And discharging the plated ultra fine lead A-1 by plating the double pretreatment while penetrating and moving through the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30;

The first pretreatment circulation tank 11, the second pretreatment circulation tank 21, and the melt circulation tank 31 are disposed below the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30. Respectively installed, the step of continuously circulating the pretreatment liquid and the molten liquid filled in the first pretreatment tank 10, the second pretreatment tank 20 and the molten bath 30 by the circulation device; It is achieved by a micro lead wire manufacturing method.

The above and other objects and features of the present invention will be more clearly understood by the following detailed description based on the accompanying drawings.

2 to 3b are views showing specific implementation examples of the ultra fine lead wire manufacturing apparatus 1-3 according to the present invention, and FIG. 2 is a schematic diagram showing the ultra lead wire manufacturing apparatus 1-3 according to the present invention. 3A and 3B are a perspective view and a cross-sectional view showing a straight flow sealing hole 40 installed in the present invention.

The ultra fine lead wire manufacturing apparatus 1-3 according to the present invention was also formed of the pretreatment unit 2 and the plating treatment unit 3 as illustrated in FIG. 2.

The pretreatment unit 2 and the plating treatment unit 3 were formed as follows.

The first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 were installed side by side on the same line, and the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 were installed side by side. Each side surface (inlet side and outlet side) of the) is installed (installed), respectively, the linear distribution sealing sphere 40 which will be described in detail later, each of the linear distribution sealing sphere 40 is installed by filling the upper side of the middle It was set under the pretreatment liquid or melt liquid.

3A and FIG. 3 are straight line sealing ports 40 which are installed (mounted) on both side surfaces (inlet side and outlet side) of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30, respectively. As illustrated in 3b, at the center of the distribution sealing opening 41, a minute size distribution hole 42 was opened and opened to the front and rear of the distribution hole 42 so as to allow the ultra fine lead to pass therethrough. In the outside of the distribution hole 42, trumpet-shaped extensions 43 and 44 were formed, respectively, so that the micro-conductors and the micro-lead wires could easily pass (intake and discharge).

In particular, the linear distribution sealing sphere 40 is formed of metal or synthetic resin, etc. so as not to damage the ultra-fine wire and the ultra-lead wire passing through (inlet and discharge).

Further, the first pretreatment circulation tank 11, the second pretreatment circulation tank 21, and the melt circulation tank 31 are disposed below the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30. Are installed side by side, respectively, between the first pretreatment tank 10 and the first pretreatment circulation tank 11, and between the second pretreatment tank 20 and the second pretreatment circulation tank 21 and the melting tank 30. And a circulation device are installed between the melt circulation tank 31 and each to circulate the pretreatment solution or the melt.

Between the first pretreatment tank 10, the first pretreatment circulation tank 11, the second pretreatment tank 20, the second pretreatment circulation tank 21, and the melting tank 30 and the melt circulation tank 31. Each of the circulation devices for circulating the pretreatment liquid or the melt is provided with supply circulation pipes 12, 22, 32 at the bottom of each of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30. ) And discharge circulation tubes 13, 23, 33 are installed side by side, respectively, but the lower ends of each supply circulation tube 12, 22, 32 and discharge circulation tubes 13, 23, 33 The first pretreatment circulation tank 11, the second pretreatment circulation tank 21, and the melt circulation tank 31 were introduced to the inside, and each of the supply circulation pipes 12, 22, and 32 had a pump P1 (P2). (P3) are respectively mounted to free fall into the first pretreatment circulation tank 11 or the second pretreatment circulation tank 21 or the melt circulation tank 31 through the discharge circulation pipes (13) (23) and (33). The pretreatment liquid or the melt is pumped and supplied to the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30, respectively. It was to be able to ring.

Hereinafter, a method (process) of manufacturing the ultra fine lead wire A-1 by the ultra fine lead wire manufacturing apparatus 1-3 according to the present invention configured as described above will be described.

Distribution holes 42 of the respective linear flow ports 40 mounted on both sides (inflow and discharge) of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 so as to maintain the same horizontal line. In the preliminary process, the wires are installed by passing the fresh and softened ultra fine lead wires A, and the ultra fine lead wires A discharged from the distribution hole 42 of the straight flow port 40 on the discharge side of the melting tank 30 are next installed. Winding) walk on the process.

As described above, the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 are filled with the pretreatment solution and the melt solution in the state where the ultra fine lead wire A is applied. Filled to be sufficiently submerged, and the first pretreatment circulation tank 11, the second pretreatment circulation tank 21 and the melt circulation tank 31 is also filled with the pretreatment liquid and molten tin, each supply circulation pipe (12) (22) ( 32) and the bottom of the discharge circulation tube 13, 23, 33 is sufficiently filled to lock.

In this way, the ultra fine lead wire A is applied and the main switch (not specifically shown) is operated while the pretreatment liquid and the molten stone are filled, respectively, to supply and pull the ultra fine lead wire A, and each pump P1 (P2) (P3) is operated and plating is performed while circulating the pretreatment liquid and the molten liquid.

In particular, the ultra-fine conductive wires A, which are horizontally applied to the straight flow ports 40 in the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30, respectively, move at a speed of about 3500 M / min. Pretreatment and plating are performed.

When the pumps P1 and P2 installed in each of the first pretreatment tank 10 and the second pretreatment tank 20 of the pretreatment unit 2 operate, the first pretreatment circulation tank 11 and the second pretreatment circulation tank The pretreatment liquid filled in each of the 21 is pumped and supplied to the first pretreatment tank 10 and the second pretreatment tank 20 through each of the circulation supply pipes 12 and 22, and the first pretreatment tank 10 and The pretreatment liquid already filled in the second pretreatment tank 20 is dropped through the discharge circulation 13, 23 and is supplied to the first pretreatment circulation tank 11 and the second pretreatment circulation tank 21, and thus The pretreatment liquid filled in the first pretreatment tank 11, the second pretreatment tank 22, and the first pretreatment circulation tank 11 and the second pretreatment circulation tank 21 is circulated by the operation of the pumps P1 and P2. Done.

The pretreatment liquids respectively filled in the first pretreatment circulation tank 11 and the second pretreatment circulation tank 21 by the operation of the pumps P1 and P2 are each of the first pretreatment tank 10 and the second pretreatment tank ( 20, the pretreatment liquid supplied to the first pretreatment tank 10 and the second pretreatment tank 20 through the circulation supply pipes 12 and 22 is the first pretreatment tank 11 and the second pretreatment tank. Since it swings while circulating inside (22), even if the ultrafine lead wire A passes quickly, foreign matters attached to the outer surface of the ultrafine lead wire A can be easily separated (dropped off).

In addition, when the pump P3 installed in the molten stone tank 30 of the melter unit 3 is operated, the molten stone filled in the molten circulating tank 31, that is, tin (Sn) solution is pumped to circulate the supply pipe 32. The molten stone which is supplied to the molten bath 30 through the melted tank 30 is dropped through the discharge circulation 33 and circulated while being supplied to the molten circulation tank 31.

When the molten stone filled in the molten bath 30 is supplied to the plating circulation tank 32 by the operation of the pump P3, the molten stone supplied to the molten bath 30 through the circulation supply pipe 32 is a molten bath ( Since it swings while circulating in the inside of 30), molten stone, that is, tin (Sn) solution is plated easily, quickly and uniformly on the outer surface of the ultra fine lead wire A which passes quickly.

Each of the straight line sealing holes 40 mounted on the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 is provided with the ultra fine lead wire A or the plated ultra fine lead wire A-1 having completed plating. When passing (distributing) each of the distribution holes 42, the extension portions 43 and 44 are formed on the inlet (supply) side and the discharge side of the distribution hole 42, respectively. The ultrafine lead wire A-1 is easily moved.

In particular, the first pretreatment tank 10 when the ultra fine lead wire A or the plated ultra fine lead wire A-1 of which plating is completed passes through (distributes) the distribution holes 42 of the linear flow distribution sealing holes 40, respectively. And the pretreatment liquid and the molten stone respectively filled in the second pretreatment tank 20 or the plating tank 30 are first pretreatment tank 10 and the second pretreatment tank 20 or the plating tank 30 by the phenomenon of surface tension. It will not be discharged to the outside of the state.

Plating is completed while passing through the plating bath 30 and the plated ultra fine lead wire A-1 discharged through the final straight flow sealing port 40 is transferred to the next step (winding step).

As described above, the ultra-fine lead wire manufacturing apparatus 1-3 according to the present invention transfers the ultra-fine wire A supplied from the first pretreatment tank 10, the second pretreatment tank 20, and the plating apparatus part of the pretreatment unit 2. When pretreatment and plating are carried out while passing through the molten bath 30 of (3), the plating is carried out while transferring extremely thin wires having a very thin thickness at a high speed by transferring them in a straight line without changing contact or bending. You can do it.

Although the above has been described and illustrated only with respect to specific embodiments of the present invention, various modifications can be made by those skilled in the art, and the embodiments which can be modified as described above are not to be individually understood from the spirit or technical configuration of the present invention. Will be belong to the claims of the present invention.

An apparatus and a manufacturing method for an READ WIRE for an electronic component according to the present invention are to plate (film) molten stone made of tin (Sn) on an outer surface (outer periphery) of a conductor made of copper (Cu) or a copper alloy. In this case, a plurality of pretreatment tanks and separate melting tanks are installed in a straight line in a horizontal state, and a linear flow ball is mounted on the same horizontal line on each supply side and discharge side of each pretreatment tank and the melting tank, respectively, and the wires are Pretreatment to cleanly remove foreign substances attached to the outer circumference (outer surface) of the conducting wire while passing through the horizontal straight sealing seals installed on each supply side and the discharge side, respectively, and melt the molten bath equipped with the heating device. It is to be plated through tin,

By transferring the wire in a straight line without turning or bending the wire, it is possible to greatly improve the transfer capacity, that is, the productivity, and to make it extremely thin by excluding the bending and bending and the generation of contact resistance. It is possible to manufacture (produce) ultra fine lead wire by easily tin plating while transferring strands (10 ~ 12 lines) of wire (0.03 ~ 0.10mm) without cutting. The pretreatment circulation tank and the melt circulation tank are installed at the lower side, and the pretreatment and plating are carried out while continuously circulating the pretreatment liquid and the molten stone, so that the pretreatment and plating can be efficiently performed and the pretreatment and plating ability can be improved.

Claims (4)

Pass the copper (Cu) or copper alloy wire through the pretreatment tank to remove foreign substances adhering to the outer surface, and through the pretreatment tank, the lead wire with the foreign matter removed is filled with molten stone made of tin (Sn), and the heating device ( In plating while passing through the molten bath 30 provided with 34), The first pretreatment tank 10 and the second pretreatment tank 20 of the pretreatment unit 2 for removing the foreign matter attached to the outer surface of the ultra fine wire A, and the plating apparatus unit on which the heating device 34 is mounted. (3) that the molten bath 30 is continuously installed side by side on the same horizontal line; Pretreatment liquid filled with a linear distribution ball 40 on both sides of the inlet and discharge of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 which are continuously installed side by side on the same horizontal line. And lower than the height of the melting tank 30, respectively; While supplying / discharging the ultra-fine conductive wires A horizontally through the linear distribution sealing holes 40 of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 mounted on the same horizontal line. Pretreatment and plating; Under the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30, a first pretreatment circulation tank 11, a second pretreatment circulation tank 21, and a heating device 35 on the bottom thereof. The molten circulating tank 31 equipped with each other and continuously circulating the pretreatment liquid and the molten stone filled in the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 by a circulating device. The pre-treatment and plating to be performed while circulating; Ultra-fine lead wire manufacturing apparatus comprising a. The method according to claim 1, The first pre-treatment tank 10, the second pre-treatment tank 20 and the straight flow sealing sphere 40 is provided on each side of each of the melting tank 30;  In the center of the distribution sealing port 41 is formed so that the distribution hole 42 is opened to the front and rear to allow the ultra fine lead wire to pass through; And an extension portion (43) (44) formed on the outer side of the distribution hole (42) on both front and rear surfaces of the distribution hole (42), respectively. The first pretreatment tank 10, the first pretreatment circulation tank 11, the second pretreatment tank 20, the second pretreatment circulation tank 21, the melting tank 30, and the melt circulation tank 31. Circulator installed between each) Supply circulation tubes 12, 22, 32 and discharges are provided on the bottom of each of the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30 so as to freely drop the pretreatment liquid or molten stone. The circulation pipes 13, 23, 33 are respectively installed side by side; Each of the supply circulation pipes 12, 22 and 32 is pumped with pretreatment liquid or molten stone falling freely into the first pretreatment circulation tank 11, the second pretreatment circulation tank 21, or the melt circulation tank 31. And pumps P1, P2, and P3, respectively, for supplying and circulating the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30, respectively. Ultra-fine lead wire manufacturing equipment for parts. Pre-treatment process that removes foreign substances adhering to the outer surface by passing the copper (Cu) or copper alloy lead through the pretreatment tank, and melts the tin liquid (Sn) filled with the lead through the pretreatment tank and heats the bottom In carrying out the plating step of plating while passing through the molten bath 30 provided with the apparatus 34, In the pretreatment step of removing foreign matter adhering to the outer surface of the ultrafine wire A, the first pretreatment tank 10 and the second pretreatment tank 20 and the melting tank 30 where plating is performed are installed side by side. ) And discharging the plated ultra fine lead A-1 by plating the double pretreatment while penetrating and moving through the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30; The first pretreatment circulation tank 11, the second pretreatment circulation tank 21, and the melt circulation tank 31 are disposed below the first pretreatment tank 10, the second pretreatment tank 20, and the melting tank 30. Installed respectively, the step of continuously circulating the pretreatment liquid and the molten stone filled in the first pretreatment tank 10, the second pretreatment tank 20 and the molten bath 30 by a circulation device; Ultra-fine lead wire manufacturing method.

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