CN102011162B - Method and device for electroplating sheets - Google Patents
Method and device for electroplating sheets Download PDFInfo
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- CN102011162B CN102011162B CN 201010295935 CN201010295935A CN102011162B CN 102011162 B CN102011162 B CN 102011162B CN 201010295935 CN201010295935 CN 201010295935 CN 201010295935 A CN201010295935 A CN 201010295935A CN 102011162 B CN102011162 B CN 102011162B
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- plating tank
- shoves
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Abstract
The invention discloses a method and a device for electroplating sheets. The method comprises the steps of: adopting an electroplating bath with an inner width between 1 and 2cm; arranging surge flow devices and anode devices at two opposite sides in the electroplating bath; and providing suction force on the bottom surface of the electroplating bath, wherein the suction force is used for causing the electroplating liquid in the electroplating bath to flow downwards so as to discharge the electroplating liquid; the electroplating liquid flows out from the surge flow devices and the anode devices and then enters the electroplating bath; included angles are formed between the surge flow outlets of the surge flow devices and the horizontal plane; the flow rate of the electroplating liquid flowing out from the surge flow devices is greater than that of the electroplating liquid flowing out from the anode devices; and sheets are vertically conveyed in the electroplating liquid in the electroplating bath so that the electroplating operation is carried out. The surge flow devices are surge flow pipes. The anode device comprises an anode net and a baffler having a plurality of tilting slots. In the invention, the sheets are prevented from deforming or swaying in the conveying process in the electroplating bath, and sheet blocking caused by the deflection of the ultrathin sheets and the interference of the separation sheets of the anode devices is prevented, and the product yield is greatly enhanced.
Description
Technical field
The present invention be more particularly directed to a kind of avoiding at the method and apparatus that ultra thin plate is carried out touching in the electroplating processes process plate face.Background technology
Printed circuit board (PCB) or other plate processing procedure that is laid with circuit must pass through the electroplating processes program.Early stage
Therefore plate all adopts the horizontal feed mode to carry in the electroplating processes processing procedure because thickness is larger.With
The continuous evolution of technology and the requirement of electronic product slimming and light and handyization, some printed circuit board (PCB)s or phase
Close the thickness more and more thin (approximately 25 μ m～75 μ m) of plate, so that plate has become ultra-thin soft board,
Therefore, if adopt traditional horizontal feed mode to carry soft board, sheet material will because of self flexibility with
Action of gravity causes the plate distortion, easily causes clamp at course of conveying, and plate is damage therefore, even makes
Become to shut down, the product fraction defective is quite high.
Summary of the invention
The object of the invention is to propose a kind of method and apparatus of electroplating thin plate; when adopting the horizontal feed mode to carry out the electroplating processes processing procedure to solve ultra-thin soft board, easily cause clamp at course of conveying, the plate damage; even cause shutdown, the problem that the product fraction defective is high.
For reaching the foregoing invention purpose, the present invention has adopted following technical scheme:
A kind of method of electroplating thin plate is: adopting an inner width is the plating tank of 1～2cm, and the relative both sides in this plating tank all arrange shove device and anode assembly, be provided as simultaneously the suction of discharging electroplate liquid and making the past current downflow of electroplate liquid in the plating tank in the bottom surface of plating tank, electroplate liquid flows out in the plating tank from shove device and anode assembly respectively, the shoving of device of shoving has an angle between outlet and the horizontal plane, the electroplate liquid flow velocity that shoves from the device that shoves is greater than the electroplate liquid flow velocity that flows out from anode assembly, one plate carries out electroplating activity to be transferred in the electroplate liquid of upright state in plating tank, by the described electroplate liquid that shoves plate is supported, avoid plate to contact with anode assembly;
The described device that shoves is the pipe that shoves, described angle be shove pipe axially and the angle between the horizontal plane, and described angle is 70 °～80 °, the plate that the upper end of the described pipe that shoves is come than approaching being transferred in lower end, the plural number that axially is arranged in a row of managing along shoving that the described outlet of shoving on one side is provided with for the pipe that the shoves hole of shoving;
Described anode assembly is located at two of the relative both sides of plating tank and is shoved between the device, and described anode assembly comprises the baffler that an anode network and has plural inclination slotted eye, and the vergence direction of this slotted eye is that a high end is met to described plate and carried and the direction come.
The flow velocity of the described electroplate liquid that shoves is 0.3～1m/sec.
Described plate is in plating tank the time, and the optimum distance between the outermost surfaces of this plate surface and this anode assembly is 6～15mm.
A kind of device of electroplating thin plate comprises:
One plating tank, having inner width is the district of immersing of 1～2cm, the bottom surface of this plating tank is provided with the return port that plural number distributes along its length direction;
The plural number device that shoves is located at the relative both sides in the plating tank, provides the electroplate liquid that shoves to enter in the plating tank, and shoving of the device that shoves has an angle between outlet and the horizontal plane, and the device that shoves of the relative both sides of plating tank staggers mutually in asymmetric position;
The plural number anode assembly is located at the relative both sides in the plating tank, and each anode assembly is located at two and is shoved between the device, and this anode assembly provides electroplate liquid to pass through and flows in the plating tank;
One traversing transfer roller is in order to carry a plate to move towards horizontal direction in the electroplate liquid of upright state in plating tank;
The described device that shoves is the pipe that shoves, described angle be shove pipe axially and the angle between the horizontal plane, and described angle is 70 °～80 °, the plate that the upper end of the described pipe that shoves is come than approaching being transferred in lower end, the plural number that axially is arranged in a row of managing along shoving that the described outlet of shoving on one side is provided with for the pipe that the shoves hole of shoving;
Described anode assembly is located at two of the relative both sides of plating tank and is shoved between the device, and described anode assembly comprises the baffler that an anode network and has plural inclination slotted eye, and the vergence direction of this slotted eye is that a high end is met to described plate and carried and the direction come.
Particularly, two lateral walls in the described plating tank is respectively equipped with the first chute of plural number inclination one aforementioned angle, the relative both sides of the described device that shoves are respectively equipped with one first slide rail and one second slide rail, the relative both sides of described baffler are respectively equipped with one second chute, by the cooperate interior sidewall surface that for shove device be combined in plating tank of this first slide rail with the first chute, make anode assembly be combined in two by this second slide rail and cooperating of the second chute and shove between the device.
Below principle of the present invention is done to discuss in detail:
The present invention system utilizes traversing transfer roller with thin plate clamping and conveying, makes thin plate maintain in the plating tank of splendid attire electroplate liquid horizontal direction with upright state and carries; When thin plate moves horizontally in plating tank, provide the electroplate liquid that shoves to flow at the inner surface of plating tank, and both sides arrange plural anode assembly in plating tank, the metal ion that electroplate liquid contains positively charged after by anode assembly forms coating to be attached on the plate that is electrically connected negative electrode, utilize simultaneously the electroplate liquid that shoves as the spacer medium between thin plate and anode assembly, avoid plate to contact with anode assembly and may cause abrading or scrape the broken string road, even cause the problem of clamp.
Moreover, the relative both sides that the present invention ties up in the plating tank provide the from top to bottom electroplate liquid of gradual reactive force to plate, and the generation of the bottom in plating tank suction down, the sheet member that makes the top be held in traversing transfer roller is maintained stable upright state conveying and advances in plating tank.
Postscript, the present invention ties up to the plating tank both sides and provides toward asymmetric direction and spray respectively the electroplate liquid of punching, makes the electroplate liquid can be with high exchange rate by the through hole of plate or enter blind hole.
In addition, the present invention system provides modular shove device and anode assembly can be assembled in rapidly the design of plating tank both sides.
It only is the plating tank of 1～2cm that mat of the present invention provides an inner width, relative both sides in the plating tank arrange respectively plural number shove device and anode assembly, the device that shoves has the pipe that shoves, shove pipe axially and the angle that tilts between the horizontal plane, the upper end that makes the pipe that shoves than approaching being transferred in lower end and plate; One anode assembly of each side of plating tank is located at two and is shoved between the device.Plate is transferred towards horizontal direction in plating tank with upright state, the electroplate liquid that flows out by anode assembly except provide band just with metal ion form the coating to be attached to the plate surface that is electrically connected negative electrode, the electroplate liquid that shoves also is provided as the spacer medium between plate and the anode assembly; In addition, plate is transferred when shoving device and anode assembly, the different positions of plate both sides bears the electroplate liquid that shoves from top to bottom gradually, disperse to shove by this reactive force of electroplate liquid to plate, avoid plate to be subject to the reactive force of concentrations and be out of shape or rock, cooperate again the plural return port of being located at the plating tank bottom surface to discharge the down suction that electroplate liquid produces, be maintained ultra-thin plate and carry stably.
As a kind of selection, the pipe that shoves that the present invention is obliquely installed, its axially and the optimum angle between the horizontal plane be 70 °～80 °.
As another better selection, the flow rate of liquid that the present invention is shoved from the device that shoves is 0.3～1m/s.
The present invention's anode assembly includes an anode network, and a baffler with plural inclination slotted eye, and this anode network is located at the one side of this resistance pole plate, the baffler both sides can with the two device combinations of shoving, use that anode assembly is shoved between the device two; The vergence direction of described slotted eye is that a high end is met to described plate and carried and the direction come, uses and reduces in the plate course of conveying, and plate angle end snaps in slotted eye and causes clamp.
By aforementioned method and apparatus of the present invention, for thin plate with upright state in plating tank during horizontal feed, the utilization electroplate liquid that shoves flows as the spacer medium between thin plate and the anode assembly at the inner surface of plating tank, can avoid thin plate to contact with anode assembly, and the electroplate liquid that utilizes an angle to shove, avoided ultra-thin plate both sides to be subject to the electroplate liquid reactive force that shoves of concentrations, thereby avoid plate in plating tank course of conveying distortion or rock, prevent that ultra-thin plate from because the baffler interference of deflection and anode assembly causes clamp, significantly improving product yield.
Description of drawings
Fig. 1 is the front view of electroplating thin plate device of the present invention;
Fig. 2 is the side-view of electroplating thin plate device of the present invention;
Fig. 2 A is the partial enlarged drawing in the 2A zone of Fig. 2;
Fig. 3 is the partial elevation view of electroplating thin plate device of the present invention;
Fig. 4 is the partial top view of electroplating thin plate device of the present invention;
Fig. 5 A is one of the present invention's partial elevation view of anode assembly being installed on plating tank;
Fig. 5 B is two of the present invention's partial elevation view of anode assembly being installed on plating tank;
Fig. 5 C is three of the present invention's partial elevation view of anode assembly being installed on plating tank;
Fig. 6 A is one of structural representation of anode assembly of the present invention;
Fig. 6 B be anode assembly of the present invention structural representation two;
Fig. 6 C be anode assembly of the present invention structural representation three;
Fig. 6 D be anode assembly of the present invention structural representation four;
Assembly and symbol thereof are respectively shown in above each figure:
1 ... plating tank, 10 ... immerse the district, 11 ... the first chute, 12 ... return port, 2 ... device shoves, 20 ... pipe shoves, 21 ... the hole of shoving, 22 ... the first slide rail, 23 ... the second slide rail, 3 ... anode assembly, 31 ... baffler, 311 ... the second chute, 312 ... slotted eye, 32 ... anode network, 33 ... the titanium frame, 34 ... PP cloth, 4 ... traversing transfer roller, 41 ... clamper, 5 ... plate, W ... the plating tank width, θ ... angle.
Embodiment
Below cooperate accompanying drawing that embodiments of the present invention are done more detailed description, in order to do those skilled in the art can be implemented after studying this specification sheets carefully according to this.
Fig. 1 is extremely shown in Figure 4 to be the device of electroplating thin plate of the present invention, it includes a plating tank 1, be configured to immersing of splendid attire electroplate liquid between plating tank 1 two lateral walls and distinguish 10, the optimum width W scope of immersing between the district 10 is 1～2cm, the top of plating tank 1 arranges the traversing transfer roller 4 that comprises the lifting plate fetching machine, and the clamper 41 that can move along traversing transfer roller 4, clamper 41 is clamping thin plate 5, carries plates 5 to move horizontally in immersing district 10 by traversing transfer roller 4 again; Plate 5 is immersing 10 top, district when terminal, then carries by the lifting plate fetching machine and respectively plate is immersed or take out and immerse the district.
Relative both sides in the plating tank 1 arrange respectively plural number shove device 2 and anode assembly 3 obliquely; Its set-up mode, relative two inner-wall surfaces that tie up to plating tank 1 arrange respectively first chute 11 (consulting shown in Fig. 5 A) of plural number inclination one angle.The device 2 that shoves is a kind of pipes 20 that shove at embodiments of the invention, on one side it is provided with along the plural number of axially the lining up at least one row hole 21 of shoving of the pipe that shoves; Pipe 20 the relative both sides, rear end of shoving are provided with the first symmetrical slide rail 22, pipe 20 the relative both sides of front end of shoving are provided with the second symmetrical slide rail 23, the first slide rail 22 is slipped into the first chute 11 (consulting shown in Fig. 5 B), and the pipe 20 that can will shove is combined in the interior wall of plating tank one by one; After the pipe 20 that respectively shoves was finished and is combined in plating tank, it is symmetrical that adjacent two the second slide rails 23 that shove pipe are, by the second slide rail 23 recombinant anode assemblies 3 (consulting shown in Fig. 5 C).The bottom surface of plating tank 1 is provided with a plurality of return ports 12 that distribute along its length direction, and return port 12 is connected to the filter plant (not shown) with pipeline, and the electroplate liquid after will being filtered by pumping again is delivered to plating tank and recycles.
Consult shown in Fig. 6 A to Fig. 6 D, the present invention's anode assembly 3 includes an iridium oxide anode network 32 (consulting Fig. 6 A), that is located on the titanium frame 33 and covers in the baffler 31 (consulting Fig. 6 C and Fig. 6 D) that the PP of anode network 32 cloth 34 (consulting Fig. 6 B) and one is used for and anode network 32 makes up, baffler 31 is provided with the slotted eye 312 of plural number inclination one angle, and be provided with the second chute 311 in the relative both sides of baffler 31, the inclination mode of this slotted eye 312 is the high end of slotted eye to be met to plate carry and next direction; After the anode network 32 that is provided with PP cloth 34 is combined in baffler 31 rears, again the second chute 311 of baffler 31 both sides the second slide rail 23 with pipe 20 both sides of shoving is slidingly matched, shoves between the device 2 so that whole anode assembly 3 is located at two; Structure design by this, no matter be to shove device or anode assembly maintenance or eliminate and change renewal, all very convenient.In addition, anode assembly 3 of the present invention is combined in plating tank two rear flank, the plate of in immersing the district, advancing, and its plate surface and the optimum distance between the anode network 32 of anode assembly 3 outermost are 6～15mm.
To shove pipe 20 of the present invention system is connected to the pumping (not shown) via pipeline, pumping with electroplate liquid via Pipeline transport to the pipe 20 that shoves, and then shoved by the hole 21 of shoving; The optimum flow rate that electroplate liquid shoves from the hole 21 of shoving is 0.3～1m/sec, to avoid ultra-thin plate is caused too high reactive force and be out of shape or rock.The angle of inclination that the pipe 20 that shoves is located at plating tank, be its axially and angle 0 optimum range between the horizontal plane be 70 °～80 °, and the pipe 20 that shoves that tilts, its upper end approaches the plate 5 that is transferred and comes than the lower end.The device 2 that shoves of plating tank 1 relative both sides is not to be located at symmetric position, but the suitable distance (consulting shown in Figure 4) that mutually staggers, in order to do the electroplate liquid that the pipe that shoves from both sides is flowed out can high exchange rate through hole or blind hole by plate.
Utilize aforesaid carrying method and device, the present invention uses when carrying out the electroplating thin plate processing procedure, tie up to thin plate be erected to enter in the plating tank 1 before, namely enter plating tank from the pipe 20 that shoves of plating tank 1 both sides hole 21 electroplate liquid that continues to gush out that respectively shoves, and return port 12 also continues that the electroplate liquid in the plating tank is expelled to filter plant and finishes and be transmitted back to the pipe 20 that shoves after the filtration again and flow into plating tanks; Electroplate liquid forms one deck medium flowing of plating tank 1 relative two inner surfaces by shoving, then enter plating tank 1 and in the horizontal direction conveying by clamper 41 gripping panels 5 on the traversing transfer roller 4, in course of conveying, plate 5 relative both sides are subject to shoving the supporting of electroplate liquid and effect and produce buffer actions with anode assembly 3, avoid the baffler 31 of ultra-thin plate 5 and rigidity to contact, cooperate the design of the tilting slotted eye 312 on the baffler 31, can prevent the clamp problem that may cause.In addition, the present invention utilizes the device 2 that shoves that tilts an angle and arrange, can be in plate 5 horizontal feed when shoving hole 21, allow the both sides different positions of plate 5 from top to bottom bear progressively the reactive force of the electroplate liquid that shoves, produce plate toward drop-down suction when cooperating again return port 12 to discharge electroplate liquid, can avoid ultra-thin plate 5 to be subject to the reactive force of concentrations and be out of shape or rock, cause the plate deflection and interfere with anode assembly and to cause clamp.
The above person only is in order to explain the present invention's preferred embodiment; be not that the attempt tool is to do any formal restriction to the present invention; be with, all have in lower any modification or change of doing relevant the present invention of identical invention spirit, all must be included in the category that the invention is intended to protection.
Claims (5)
1. the method for an electroplating thin plate, it is characterized in that, the method is: adopting an inner width is the plating tank of 1～2cm, and the relative both sides in this plating tank all arrange shove device and anode assembly, be provided as simultaneously the suction of discharging electroplate liquid and making the past current downflow of electroplate liquid in the plating tank in the bottom surface of plating tank, electroplate liquid flows out in the plating tank from shove device and anode assembly respectively, the shoving of device of shoving has an angle between outlet and the horizontal plane, the electroplate liquid flow velocity that shoves from the device that shoves is greater than the electroplate liquid flow velocity that flows out from anode assembly, one plate carries out electroplating activity to be transferred in the electroplate liquid of upright state in plating tank, by the described electroplate liquid that shoves plate is supported, avoid plate to contact with anode assembly;
The described device that shoves is the pipe that shoves, described angle be shove pipe axially and the angle between the horizontal plane, and described angle is 70 °～80 °, the plate that the upper end of the described pipe that shoves is come than approaching being transferred in lower end, the plural number that axially is arranged in a row of managing along shoving that the described outlet of shoving on one side is provided with for the pipe that the shoves hole of shoving;
Described anode assembly is located at adjacent two the shoving between the device of each side of the relative both sides of plating tank, and described anode assembly comprises the baffler that an anode network and has plural inclination slotted eye, and the vergence direction of this slotted eye is that a high end is met to described plate conveying and next direction.
2. the method for electroplating thin plate according to claim 1 is characterized in that, the flow velocity of the described electroplate liquid that shoves is 0.3～1m/sec.
3. the method for electroplating thin plate according to claim 1 is characterized in that, described plate is in plating tank the time, and the optimum distance between the outermost surfaces of this plate surface and this anode assembly is 6～15mm.
4. the device of an electroplating thin plate is characterized in that, this device comprises:
One plating tank, having inner width is the district of immersing of 1～2cm, the bottom surface of this plating tank is provided with the return port that plural number distributes along its length direction;
The plural number device that shoves is located at the relative both sides in the plating tank, provides the electroplate liquid that shoves to enter in the plating tank, and shoving of the device that shoves has an angle between outlet and the horizontal plane, and the device that shoves of the relative both sides of plating tank staggers mutually in asymmetric position;
The plural number anode assembly is located at the relative both sides in the plating tank, and each anode assembly is located at two and is shoved between the device, and this anode assembly provides electroplate liquid to pass through and flows in the plating tank;
One traversing transfer roller is in order to carry a plate to move towards horizontal direction in the electroplate liquid of upright state in plating tank;
The described device that shoves is the pipe that shoves, described angle be this pipe that shoves axially and the angle between the horizontal plane, this angle is 70 °～80 °, and the plate that the upper end of the pipe that shoves is come than approaching being transferred in lower end, the plural number that axially is arranged in a row of managing along shoving that the described outlet of shoving on one side is provided with for the pipe that the shoves hole of shoving;
Described anode assembly is located at adjacent two the shoving between the device of each side of the relative both sides of plating tank, and described anode assembly comprises the baffler that an anode network and has plural inclination slotted eye, and the vergence direction of this slotted eye is that a high end is met to described plate conveying and next direction.
5. the device of electroplating thin plate according to claim 4, it is characterized in that, two lateral walls in the described plating tank is respectively equipped with the first chute of plural number inclination one aforementioned angle, the relative both sides of the described device that shoves are respectively equipped with one first slide rail and one second slide rail, the relative both sides of described baffler are respectively equipped with one second chute, by the cooperate interior sidewall surface that for shove device be combined in plating tank of this first slide rail with the first chute, make anode assembly be combined in two by this second slide rail and cooperating of the second chute and shove between the device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010295935 CN102011162B (en) | 2010-09-29 | 2010-09-29 | Method and device for electroplating sheets |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010295935 CN102011162B (en) | 2010-09-29 | 2010-09-29 | Method and device for electroplating sheets |
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| Publication Number | Publication Date |
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| CN102011162A CN102011162A (en) | 2011-04-13 |
| CN102011162B true CN102011162B (en) | 2013-04-03 |
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| CN 201010295935 Active CN102011162B (en) | 2010-09-29 | 2010-09-29 | Method and device for electroplating sheets |
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Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103993339B (en) * | 2014-05-16 | 2017-03-01 | 昆山东威电镀设备技术有限公司 | A kind of apparatus and system of electroplating thin plate |
| CN105063709B (en) * | 2015-09-18 | 2018-02-23 | 安捷利电子科技（苏州）有限公司 | Use in printed circuit board electroplanting device |
| CN107313085B (en) * | 2016-04-26 | 2019-10-22 | 中国科学院金属研究所 | The copper electroplating filling method of fine blind hole in a kind of high density circuit board |
| CN109972188A (en) * | 2017-12-28 | 2019-07-05 | 亚硕企业股份有限公司 | The movable protective mechanism of electroplating device |
| CN114686955B (en) * | 2020-12-29 | 2024-02-27 | 矽磐微电子(重庆)有限公司 | Anode assembly, electroplating device and manufacturing method of anode assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2839303Y (en) * | 2005-07-19 | 2006-11-22 | 官锦堃 | Jet-flow floaing electroplating tank |
| JP2008297574A (en) * | 2007-05-29 | 2008-12-11 | Nitto Denko Corp | Method of manufacturing electroplated film on fine material and apparatus used for the same |
| CN101815407B (en) * | 2010-05-10 | 2011-06-29 | 苏州创峰光电科技有限公司 | Sheet immersing treatment method and device |
| CN201801621U (en) * | 2010-09-29 | 2011-04-20 | 苏州创峰光电科技有限公司 | Device for electroplating thin plate |
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