KR20060115536A - Continuous horizontal plating line with roller type cathodes - Google Patents

Continuous horizontal plating line with roller type cathodes Download PDF

Info

Publication number
KR20060115536A
KR20060115536A KR1020050038035A KR20050038035A KR20060115536A KR 20060115536 A KR20060115536 A KR 20060115536A KR 1020050038035 A KR1020050038035 A KR 1020050038035A KR 20050038035 A KR20050038035 A KR 20050038035A KR 20060115536 A KR20060115536 A KR 20060115536A
Authority
KR
South Korea
Prior art keywords
plating
roller
cathode
negative electrode
rollers
Prior art date
Application number
KR1020050038035A
Other languages
Korean (ko)
Other versions
KR100647805B1 (en
Inventor
이수재
Original Assignee
(주) 에스엠씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주) 에스엠씨 filed Critical (주) 에스엠씨
Priority to KR1020050038035A priority Critical patent/KR100647805B1/en
Publication of KR20060115536A publication Critical patent/KR20060115536A/en
Application granted granted Critical
Publication of KR100647805B1 publication Critical patent/KR100647805B1/en

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/007—Current directing devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/02—Tanks; Installations therefor

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

A simply structured horizontal continuous plating equipment using cathode rollers is provided to remove plating generated on the cathode rollers easily and effectively and improve mechanical delamination effect of plating generated on the cathode rollers by improving surface roughness of the cathode rollers. A horizontal continuous plating equipment using cathode rollers comprises: a plating tank in which a plating solution is stored, and which has an inlet(12) and an outlet(14) oppositely formed on both sides thereof; a plurality of transfer rollers(20) installed in front and rear of the plating tank such that a plating object(2) is horizontally transferred through the plating tank; insoluble anodes(30) installed within the plating tank; cathode rollers(40) installed in front of the plating tank to charge the plating object with negative electricity; and cleaning means(50) comprising nonconductive frames in which a plurality of through holes are formed, and which are installed near the cathode rollers, porous absorption members adhered onto faces of the nonconductive frames directed to the cathode rollers, and plating solution supply pipes for supplying a plating solution into the through holes of the nonconductive frames.

Description

음극롤러를 이용한 수평식 연속도금장치{Continuous horizontal plating line with roller type cathodes} Continuous horizontal plating line with roller type cathodes

도 1은 본 발명의 일 실시예를 보인 개략도       1 is a schematic view showing an embodiment of the present invention

도 2와 도 3은 상기 실시예의 요부를 보인 확대단면도      2 and 3 is an enlarged cross-sectional view showing the main portion of the embodiment.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

10. 도금조 20. 이송롤러 10. Plating bath 20. Feed roller

30. 불용성 양극 40. 음극롤러 30. Insoluble Anode 40. Cathode Roller

50. 세척수단 52. 비전도성 프레임50. Cleaning means 52. Non-conductive frame

54. 다공성 흡수부재 56. 도금액공급관54. Porous Absorbing Member 56. Plating Solution Supply Pipe

본 발명은 음극롤러를 이용한 수평식 연속도금장치에 관한 것으로서, 보다 상세하게는 도금과정에서 음극롤러에 불가피하게 발생된 도금을 용이하고 효과적으로 제거할 수 있으며, 구성도 간단한 새로운 구조의 음극롤러를 이용한 수평식 연속도금장치에 관한 것이다.The present invention relates to a horizontal continuous plating apparatus using a negative electrode roller, and more particularly, it is possible to easily and effectively remove the plating inevitably generated in the negative electrode roller during the plating process, using a new structure of the negative electrode roller simple structure It relates to a horizontal continuous plating apparatus.

일반적으로 PCB기판과 같은 박판형상의 제품을 도금하는 경우에는 피도금체를 연속적으로 도금시키는 수평식 도금방식을 사용한다. 이러한 도금은 도금액이 저장되며 피도금체가 투입, 배출되는 투입구 및 배출구가 형성된 도금조와, 불용성 양극와, 피도금체가 상기 도금조를 관통하여 수평방향으로 이송되도록 하는 이송롤러와, 도금조의 전방으로 위치되어 피도금체를 (-)전기로 대전시키는 음극롤러를 포함하는 도금장치에 의해 이루어지며, 상기 도금조의 투입구와 배출구에는 피도금체가 원활하게 이송되도록 가이드하는 가이드롤러가 구비된다.        In general, when plating a thin plate-like product, such as a PCB substrate, a horizontal plating method for continuously plating the plated body is used. The plating is a plating bath in which the plating liquid is stored and the inlet and outlet of the plated body are inserted and discharged, an insoluble anode, a transfer roller for transferring the plated body horizontally through the plating bath, and positioned in front of the plating bath. It is made by a plating apparatus including a negative electrode roller to charge the plated body with (-) electricity, the inlet and outlet of the plating bath is provided with a guide roller for guiding the plated body to be transferred smoothly.

한편, 상기 도금조는 투입구와 배출구를 통해 도금액이 불가피하게 외부로 유출되며, 유출된 도금액이 음극롤러에 묻으면 음극롤러가 불필요하게 도금된다. 그리고 이와 같이 음극롤러가 도금되면 음극롤러의 도면에 요철이 발생되어, 피도금체의 표면에는 스크래치 등의 흠이 발생되는데, 이는 제품불량의 원인이 된다.       On the other hand, the plating bath is inevitably leaked out through the inlet and outlet, the plating liquid is unnecessarily plated when the spilled plating liquid is buried in the negative electrode roller. When the cathode roller is plated in this way, irregularities are generated in the drawing of the anode roller, and scratches such as scratches are generated on the surface of the plated body, which causes product defects.

이와 같은 문제점에 대해 종래에는 음극롤러에 (-)전기와 (+)전기를 교번적 으로 부여하는 전기장치를 추가로 설치하여 음극롤러가 (+)전기를 띤 상태에서 음극롤러의 도금이 박리되도록 하기도 한다. 그러나 음극롤러에 (-)전기와 (+)전기를 교번적으로 부여하는 전기장치가 상당히 고가이므로 설비비가 상승되어 제품의 코스트가 상승된다.       In order to solve such a problem, conventionally, an additional electric device that alternately supplies (-) electricity and (+) electricity to the cathode roller is additionally installed so that the plating of the cathode roller is peeled off while the cathode roller is (+) electricity. Sometimes. However, since the electric equipment that alternately supplies negative and negative electricity to the cathode roller is very expensive, the cost of the product increases due to the increase in equipment cost.

경우에 따라서는 음극롤러에 발생된 도금을 기계적인 방법으로 제거하기도 한다. 이 경우에는 도금라인을 중지시키고 음극롤러는 도금장치에서 분리시킨 다음, 연마기 등으로 음극롤러의 표면을 연마하여 도금을 제거한다. 그러나 이 방법은 도금을 중단하고 작업을 하여야 하므로 생산성이 저하되며, 또한 음극롤러를 도금장치에서 분해하여 도금제거작업을 한 다음, 재조립하여야 하므로 작업도 번거롭다.       In some cases, plating generated on the cathode roller may be removed by a mechanical method. In this case, the plating line is stopped and the negative electrode roller is separated from the plating apparatus, and then the surface of the negative electrode roller is polished with a grinding machine to remove the plating. However, this method reduces productivity because the plating must be stopped and the work is performed. Also, the anode roller is disassembled from the plating apparatus to remove the plating and then reassembled.

또, 음극롤러에 도금용액을 스프레이하여 도금을 용해시켜 제거하는 방법이 사용되기도 하는데, 이 방법은 음극롤러에 도금액을 스프레이할 때 도금액이 주변으로 비산되며, 비산된 도금이 농축되면 도금액에서 구리가 석출되기도 한다. 그리고 이와 같이 석출된 구리가 떨어져서 음극롤러와 기타 이송롤러에 붙으면 피도금체에 스크래치가 발생되는 상술한 바와 같은 문제점이 여전히 발생된다.        In addition, a method of spraying a plating solution on a cathode roller to dissolve and remove the plating is used. In this method, the plating liquid is scattered to the surroundings when the plating liquid is sprayed on the cathode roller. It may also precipitate. In addition, if the copper thus deposited is attached to the cathode roller and other feed rollers, the problem as described above is still generated.

본 발명은 전술한 바와 같은 문제점을 해결하기 위한 것으로서, 본 발명의 목적은 음극롤러에 발생된 도금을 용이하고 효과적으로 제거할 수 있으며, 동시에 음극롤러의 표면조도가 상승되어 음극롤러에 발생된 도금의 기계적인 박리효과도 상승되며, 구성도 간단한 새로운 구조의 음극롤러를 이용한 수평식 연속도금장치를 제공하고자 하는 것이다.The present invention is to solve the problems as described above, an object of the present invention can easily and effectively remove the plating generated on the negative electrode roller, and at the same time the surface roughness of the negative electrode roller is raised to the The mechanical peeling effect is also increased, and it is intended to provide a horizontal continuous plating apparatus using a cathode roller having a new structure with a simple structure.

본 발명에 따르면, 판상의 피도금체(2)를 연속적으로 도금시키는 수평식 연속도금장치에 있어서, 도금액이 저장되며 서로 대향되는 양측면에는 상기 피도금체(2)가 투입, 배출되는 투입구(12) 및 배출구(14)가 형성된 도금조(10)와, 상기 피도금체(2)가 상기 도금조(10)를 통과하여 수평으로 이송되도록 상기 도금조(10)의 전방 및 후방에 위치되는 다수개의 이송롤러(20)와, 상기 도금조(10) 내에 설치되는 불용성 양극(30)과, 상기 도금조(10)의 전방에 위치되어 상기 피도금체(2)에 (-)전기를 대전시키는 음극롤러(40)를 포함하며, 다수개의 통공(51)이 형성되어 상기 음극롤러(40)에 근접되게 설치되는 비전도성 프레임(52)과, 상기 비전도성 프레임(52)의 음극롤러(10)를 향하는 면에 부착되는 다공성 흡수부재(54)와, 상기 비전도성 프레임(52)의 통공(51)에 도금액을 공급하는 도금액공급관(56)으로 이루어진 세척수단(50)이 구비된 것을 특징으로 하는 음극롤러를 이용한 수평식 연속도금장치가 제공된다. According to the present invention, in the horizontal continuous plating apparatus for continuously plating the plate-like plated body (2), the plating solution is stored and the inlet 12 through which the plated body (2) is introduced and discharged on both sides facing each other ) And a plurality of plating tanks 10 having discharge ports 14 formed therein, and the plated body 2 positioned at the front and rear of the plating tank 10 so that the plated body 2 may be horizontally transferred through the plating tank 10. Two feeding rollers 20, an insoluble anode 30 installed in the plating bath 10, and a front of the plating bath 10 to charge (-) electricity to the plated body 2 A non-conductive frame 52 including a negative electrode roller 40, a plurality of through-holes 51 are formed in close proximity to the negative electrode roller 40, and the negative electrode roller 10 of the non-conductive frame 52 Supply a plating liquid to the porous absorbing member 54 attached to the surface facing the through hole, and the through hole 51 of the non-conductive frame 52. Is a horizontal type continuous plating apparatus is provided with a cathode provided with a roller, it characterized in that the cleaning means (50) consisting of a plating liquid supply pipe (56).

이하, 본 발명의 바람직한 실시예를 첨부한 도면에 의거하여 설명하면 다음과 같다. 도 1은 본 발명의 일 실시예를 보인 개략도이며 도 2와 3은 요부확대도이다. 본 발명은 일반적인 수평식 구리도금장치와 같이, 도금액으로 황산구리가 저장 되는 도금조(10)와, 상기 피도금체(2)가 상기 도금조(10)를 통과하여 수평으로 이송되도록 상기 도금조(10)의 전후방으로 위치되는 다수개의 이송롤러(20)와, 상기 도금조(10) 내에 설치되는 불용성 양극(30)과, 상기 도금조(10)의 전방에 위치되어 상기 피도금체(2)에 (-)전기를 대전시키는 음극롤러(40)를 포함하여 이루어진다. 상기 음극롤러(40)는 피도금체(2)와 접촉되거나 이격가능하도록 설치되는데, 제어부(미도시)에 의해 음극롤러(40)와 피도금체(2)의 접촉여부가 제어된다. Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. 1 is a schematic view showing an embodiment of the present invention, and FIGS. 2 and 3 are enlarged views of main parts. The present invention provides a plating bath 10 in which copper sulfate is stored as a plating solution, and the plated body 2 is horizontally transferred through the plating bath 10, as in a general horizontal copper plating device. 10, a plurality of feed rollers 20 located in front and rear, the insoluble anode 30 installed in the plating bath 10, and the plated body 2 located in front of the plating bath 10 It comprises a negative electrode roller 40 for charging the (-) electricity. The negative electrode roller 40 is installed to be in contact with or to be spaced apart from the plated body 2, the contact of the negative electrode roller 40 and the plated body 2 is controlled by a controller (not shown).

한편, 상기 음극롤러(40)를 중심으로 피도금체(2)의 이송경로와 대향되는 위치에는 음극롤러(40)와 다소 이격되도록 세척수단(50)이 구비된다. 이 세척수단(50)은 다수개의 통공(51)이 형성된 비전도성 프레임(52)과, 이 비전도성 프레임(52)의 내측면에 구비되는 다공성 흡수부재(54)와, 상기 통공(51)에 연결되어 다공성 흡수부재(54)에 도금액을 공급하는 도금액공급관(56)으로 이루어진다. 이 도금액공급관(56)에는 도금액의 공급을 제어하는 밸브가 구비된다. On the other hand, the cleaning means 50 is provided at a position opposite to the transport path of the plated body 2 around the cathode roller 40 so as to be somewhat spaced apart from the cathode roller 40. The washing means 50 includes a non-conductive frame 52 in which a plurality of through holes 51 are formed, a porous absorbing member 54 provided on the inner surface of the non-conductive frame 52, and the through holes 51. Is connected is made of a plating liquid supply pipe 56 for supplying a plating liquid to the porous absorbing member (54). The plating liquid supply pipe 56 is provided with a valve for controlling the supply of the plating liquid.

상기 비전도성 프레임(52)은 음극롤러(40)에 대응되는 길이를 갖는 바아형태를 갖도록 경질 플라스틱으로 성형되는데, 바람직하게는 단면이 V형상을 갖도록 성형되어 외측면 양단부에 연결된 연결부재(58)에 의해 피도금체(2)의 이송경로와 대향되는 위치에서 음극롤러(40)에 근접되게 설치된다. 그리고 상기 다공성 흡수부재(54)는 스폰지와 같이 액체를 흡수한 후 서서히 배출시키는 소재로 이루어진다. 이 다공성 흡수부재(54)는 비전도성 프레임(52)의 음극롤러(40)와 면하는 내면에 부착된다. 따라서 상기 도금액공급관(56)을 통해 비전도성 프레임(52)의 통공(51)으로 도금액이 공급되면 도금액은 다공성 흡수부재(54)에 흡수되는데, 음극롤러(40)가 피도금체(2)에서 이격된 상태에서만 다공성 흡수부재(54)에 도금액이 공급되도록 도금액공급관(56)에 구비된 밸브는 상기 제어부에 의해 그 작동이 제어된다. The non-conductive frame 52 is formed of hard plastic to have a bar shape having a length corresponding to that of the negative electrode roller 40. Preferably, the connecting member 58 is formed to have a V shape and connected to both ends of the outer surface. It is installed close to the negative electrode roller 40 at a position opposite to the transfer path of the plated body (2) by. And the porous absorbing member 54 is made of a material that is slowly discharged after absorbing the liquid, such as a sponge. The porous absorbing member 54 is attached to the inner surface facing the negative roller 40 of the non-conductive frame 52. Therefore, when the plating liquid is supplied to the through hole 51 of the non-conductive frame 52 through the plating liquid supply pipe 56, the plating liquid is absorbed by the porous absorbing member 54, and the negative electrode roller 40 is separated from the plated body 2. The operation of the valve provided in the plating liquid supply pipe 56 is controlled by the control unit so that the plating liquid is supplied to the porous absorbing member 54 only in the spaced state.

이러한 구성을 갖는 본 고안은 다음과 같이 작동된다, 도금 중에 음극롤러(40)에 불필요한 도금이 이루어지면, 사용자는 제어부에 신호를 입력하여 음극롤러(40)를 피도금체(2)에서 이격시킨다. 이에 따라 음극롤러(40)가 피도금체(2)에서 이격되면 상대적으로 상기 세척수단(50)의 다공성 흡수부재(54)에 급접되어 음극롤러(40)가 다공성 흡수부재(54)에 접하게 된다. 이와 동시에 제어부에 의해 도금액공급관(56)의 밸브가 열려서 공급액공급관(56)을 통해 다공성 흡수부재(54)에 도금액이 공급되고, 음극롤러(40)가 다공성 흡수부재(54)에 접한 상태에서 회동되면 음극롤러(40)의 표면이 도금액이 흡수된 다공성 흡수부재(54)에 의해 닦이게 되는데, 이때 음극롤러(40)의 표면에 발생된 도금, 구리는 도금액, 즉 황산구리용액에 의해 부식되어 제거 및 박리된다. The present invention having such a configuration works as follows. If unnecessary plating is performed on the negative electrode roller 40 during plating, the user inputs a signal to the control unit to separate the negative electrode roller 40 from the plated body 2. . Accordingly, when the negative electrode roller 40 is spaced apart from the plated body 2, the negative roller 40 is relatively rapidly contacted with the porous absorbing member 54 of the cleaning means 50, so that the negative roller 40 is in contact with the porous absorbing member 54. . At the same time, the valve of the plating liquid supply pipe 56 is opened by the controller so that the plating liquid is supplied to the porous absorbing member 54 through the supply liquid supply pipe 56, and the cathode roller 40 is rotated in contact with the porous absorbing member 54. Then, the surface of the negative electrode roller 40 is wiped by the porous absorbing member 54 in which the plating liquid is absorbed. At this time, the plating and copper generated on the surface of the negative electrode roller 40 are corroded and removed by the plating solution, that is, copper sulfate solution. And peel off.

또한, 다공성 흡수부재(54)가 음극롤러(40)의 표면에 마찰됨에 따라 음극롤러(40)의 표면은 연마되어 표면 조도가 상승된다. 그리고 이와 같이 음극롤러(40)의 표면조도가 상승되면, 음극롤러(40)에 발생된 도금이 기계적 마찰에 의해 한층 더 쉽게 박리된다. In addition, as the porous absorbing member 54 rubs against the surface of the negative electrode roller 40, the surface of the negative electrode roller 40 is polished to increase the surface roughness. When the surface roughness of the negative electrode roller 40 is raised in this manner, the plating generated on the negative electrode roller 40 is more easily peeled off by mechanical friction.

미설명 부호 13,15는 각각 도금조의 투입구(12)와 배출구(14)에 설치되어 피도금체의 이송을 가이드하는 가이드롤러이다. Reference numerals 13 and 15 are guide rollers installed at the inlet 12 and the outlet 14 of the plating bath, respectively, to guide the transfer of the plated body.

이와 같은 구성을 갖는 본 발명은 도금액이 다공성 흡수부재(54)를 통해 음극롤러(40)의 표면에 공급되므로 종래와 같이 도금액이 음극롤러(40) 주변으로 비 산되어 다른 부품에 구리가 석출되는 문제점이 해결된다. 이상에서는 도금액으로 황산구리용액을 사용하는 구리도금을 예로 들어 설명하였으나, 이에 국한되지 않으며, 도금액이 음극롤러(40)에 발생된 도금을 부식시킬 수 있는 경우에는 모두 적용이 가능하다. 또한, 이상에서는 음극롤러(40)가 이동되어 세척수단(50)에 접하게 되는 것으로 설명하였으나, 필요에 따라서는 세척수단(50)이 이동되어 음극롤러(40)에 접하게 될 수도 있다. In the present invention having such a configuration, since the plating liquid is supplied to the surface of the negative electrode roller 40 through the porous absorbing member 54, the plating liquid is scattered around the negative electrode roller 40 as in the prior art, and copper is deposited on other components. The problem is solved. In the above, the copper plating using the copper sulfate solution as the plating solution has been described as an example. However, the present invention is not limited thereto, and the plating solution can be used in the case where the plating solution can corrode the plating generated on the negative electrode roller 40. In addition, the cathode roller 40 is moved above to be in contact with the cleaning means 50, but if necessary, the cleaning means 50 may be moved to be in contact with the cathode roller 40.

이상에서와 같은 본 발명은, 다공성 흡수부재(54)에 의해 음극롤러(40)의 표면에 도금액이 비산되지 않도록 공급되므로 도금액이 비산되어 발생되는 종래의 문제점이 해결되며, 도금작업을 중단하지 않고도 음극롤러(40)의 표면에 발생된 도금을 제거할 수 있으므로 생산성이 저하되지 않으며, 음극롤러(40)의 표면이 다공성 흡수부재에 의해 연마되어 음극롤러의 표면조도도 상승되어 도금의 기계적인 박리효과도 상승된다. In the present invention as described above, since the plating solution is supplied to the surface of the negative electrode roller 40 by the porous absorbing member 54, the conventional problem caused by the plating solution is solved, without interrupting the plating operation. Since the plating generated on the surface of the negative electrode roller 40 can be removed, productivity does not decrease, and the surface of the negative electrode roller 40 is polished by the porous absorbing member, so that the surface roughness of the negative electrode roller is also increased, thereby causing mechanical peeling of the plating. The effect is also raised.

Claims (1)

판상의 피도금체(2)를 연속적으로 도금시키는 수평식 연속도금장치에 있어서, 도금액이 저장되며 서로 대향되는 양측면에는 상기 피도금체(2)가 투입, 배출되는 투입구(12) 및 배출구(14)가 형성된 도금조(10)와, 상기 피도금체(2)가 상기 도금조(10)를 통과하여 수평으로 이송되도록 상기 도금조(10)의 전방 및 후방에 위치되는 다수개의 이송롤러(20)와, 상기 도금조(10) 내에 설치되는 불용성 양극(30)과, 상기 도금조(10)의 전방에 위치되어 상기 피도금체(2)에 (-)전기를 대전시키는 음극롤러(40)를 포함하며, 다수개의 통공(51)이 형성되어 상기 음극롤러(40)에 근접되게 설치되는 비전도성 프레임(52)과, 상기 비전도성 프레임(52)의 음극롤러(10)를 향하는 면에 부착되는 다공성 흡수부재(54)와, 상기 비전도성 프레임(52)의 통공(51)에 도금액을 공급하는 도금액공급관(56)으로 이루어진 세척수단(50)이 구비된 것을 특징으로 하는 음극롤러를 이용한 수평식 연속도금장치.In a horizontal continuous plating apparatus for continuously plating a plate-like plated body (2), an inlet (12) and an outlet (14) into which the plated body (2) is introduced and discharged, on both sides of which plating solutions are stored and opposed to each other. ) A plurality of transfer rollers 20 formed at the front and rear of the plating tank 10 so that the plating tank 10 and the plated body 2 are horizontally transported through the plating tank 10. ), An insoluble anode 30 installed in the plating bath 10, and a cathode roller 40 positioned in front of the plating bath 10 to charge (-) electricity to the plated body 2. It includes, a plurality of through-hole 51 is formed is attached to the non-conductive frame 52 which is installed in close proximity to the negative electrode roller 40, the surface facing the negative roller 10 of the non-conductive frame 52 A plating liquid supply pipe for supplying a plating liquid to the porous absorbing member 54 and the through hole 51 of the non-conductive frame 52. Horizontal continuous plating apparatus using a cathode roller, characterized in that provided with a cleaning means (50) consisting of 56).
KR1020050038035A 2005-05-06 2005-05-06 Continuous horizontal plating line with roller type cathodes KR100647805B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020050038035A KR100647805B1 (en) 2005-05-06 2005-05-06 Continuous horizontal plating line with roller type cathodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050038035A KR100647805B1 (en) 2005-05-06 2005-05-06 Continuous horizontal plating line with roller type cathodes

Publications (2)

Publication Number Publication Date
KR20060115536A true KR20060115536A (en) 2006-11-09
KR100647805B1 KR100647805B1 (en) 2006-11-23

Family

ID=37652924

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050038035A KR100647805B1 (en) 2005-05-06 2005-05-06 Continuous horizontal plating line with roller type cathodes

Country Status (1)

Country Link
KR (1) KR100647805B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104271814A (en) * 2012-05-10 2015-01-07 印可得株式会社 Continuous plating apparatus
KR20160030492A (en) 2016-02-25 2016-03-18 주식회사 잉크테크 Continuous plating apparatus and continuous plating method
CN113737256A (en) * 2021-09-06 2021-12-03 重庆金美新材料科技有限公司 Production device and production method for electroplating conductive film

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109385661B (en) * 2018-12-06 2020-03-17 四川金湾电子有限责任公司 Water absorption device for electroplating strip

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100435476B1 (en) * 1999-12-27 2004-06-10 주식회사 포스코 Method for removing chip on deflector roll by using HCl soultion and apparaturs used therein

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104271814A (en) * 2012-05-10 2015-01-07 印可得株式会社 Continuous plating apparatus
CN104271814B (en) * 2012-05-10 2016-12-14 印可得株式会社 Continuous electroplating apparatus
KR20160030492A (en) 2016-02-25 2016-03-18 주식회사 잉크테크 Continuous plating apparatus and continuous plating method
CN113737256A (en) * 2021-09-06 2021-12-03 重庆金美新材料科技有限公司 Production device and production method for electroplating conductive film

Also Published As

Publication number Publication date
KR100647805B1 (en) 2006-11-23

Similar Documents

Publication Publication Date Title
CN1319130C (en) Apparatus for plating semiconductor substrate, method for plating semiconductor substrate
TW564265B (en) Plating device and method
JP3357032B2 (en) Plating apparatus and plating method
JPH0571665B2 (en)
EP1793017B1 (en) Plating apparatus and plating liquid removing method
KR100661456B1 (en) Apparatus and method for manufacturing flexible copper clad laminate film
KR100647805B1 (en) Continuous horizontal plating line with roller type cathodes
TW201827644A (en) Surface treating apparatus
JP2005519200A (en) Horizontal processing line and method by conveyor for wet processing of workpieces
KR20050058423A (en) Device and method for electrolytically treating an at least superficially electrically conducting work piece
KR101886782B1 (en) Apparatus for plating with horizontal cell and apparatus for processing
CN1969065B (en) Device and method for electrolytically treating flat work pieces
KR101434995B1 (en) Copper plating electrode roller apparatus for film
CN201381279Y (en) Etching equipment
KR20100063248A (en) Wafer plating apparatus and method for the same
CN109023458B (en) A kind of electroplanting device and method of PCB circuit board
JP2008115457A (en) Plating device and plating method
CN206624936U (en) A kind of electroplating bath based on FPC plating
JPWO2019078063A1 (en) Surface treatment equipment
CN108179459A (en) Copper bar electrolytic tinning slot and the tin plating production equipment of full-automatic copper bar
JP2004035985A (en) Apparatus for plating surface of metallic foil
KR100823583B1 (en) Wet process apparatus
CN219876325U (en) Micro-etching device for circuit board
CN220788850U (en) Horizontal electroplating equipment
KR20130131924A (en) A display circuit board cleaning equipment

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20111111

Year of fee payment: 6

LAPS Lapse due to unpaid annual fee