JP2004035985A - Apparatus for plating surface of metallic foil - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus for plating the surface of a metallic foil, which stably and continuously forms a special metallic film on one side of the metallic foil by electroplating. <P>SOLUTION: This apparatus has a radial cell 10 comprising the main body of a cell 1 for accommodating a plating liquid M, a guide roll 2 partly immersed in the plating liquid M in the main body of the cell 1, the bow-shaped anode 3 arranged around the immersed part of the guide roll 2, and the deflection roll 4 arranged above the front and back of the main body of the cell 1. The guide roll 2 is formed into a roll with a large diameter, of which at least the outer surface layer consists of a non-electroconductive material. The anode 3 is an insoluble anode, and is arranged so as to keep a gap between itself and the guide roll 2. The deflection roll 4 also serves as a conductor roll. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a metal foil surface plating apparatus, and more particularly to a radial cell type metal foil surface plating apparatus that continuously forms a special metal film on the surface (one side) of a metal foil strip by electroplating.
[0002]
[Prior art]
BACKGROUND ART A polyimide film in which a polyimide resin and a copper foil are bonded to each other is used as a printed wiring board (soft board) in IT-related equipment such as a mobile phone, and the demand has been increasing in recent years. Conventionally, these polyimide films have been mainly of a three-layer structure in which a copper foil and a polyimide resin are bonded together with an adhesive, but the bonding is performed by ultra-thin and high integration. There is an increasing demand for a two-layer structure having high adhesive strength without using an agent.
[0003]
On the other hand, in order to form a two-layer structure of the polyimide film, it is necessary to modify one surface of the copper foil to a structure having a high affinity for the polyimide resin. Examples of the method include a method of modifying the surface of the copper foil by sputtering or etching, and a method of forming a thin special metal film on the surface of the copper foil by an electroplating method, an electroless plating method, a laminating method, or the like. As an optimum manufacturing method among them, an electroplating method capable of continuous processing has attracted attention.
[0004]
[Problems to be solved by the invention]
However, although electroplating of copper foil having a thickness of several microns to several tens of microns is performed in a batch process in the form of a sheet, for example, a continuous processing technology such as a continuous process using a coil is still established. There is a need for an early realization of a surface plating apparatus that can form a special metal film on the surface of a copper foil or other metal foil stably and continuously by electroplating.
[0005]
For example, as described in Japanese Patent Publication No. 6-504584, a cell body containing a plating solution, a radial cathode (conductor roll) which is disposed by being partially immersed in the plating solution of the cell body, and An anode disposed around the immersion portion of the radial cathode; and a deflecting roll disposed above the plating solution in the cell body, wherein a guide roll is formed by deflecting the strip (steel strip) by the deflecting roll. A radial cell-type electroplating apparatus is known in which a plating solution in a cell body is moved in a state where the upper surface is closely contacted with a guide roll and the lower surface of the strip is continuously electroplated. In this apparatus, a radial cathode (conductor roll) is used. In addition, a high tension is applied to the strip so that the plating solution does not enter the upper surface of the strip, and a gas is applied to the strip. Are those that need to adhere to Dror, it can not be applied to the metal foil strip inferior in rigidity tens of micron order thickness from a few microns.
[0006]
The present invention has been made in view of the above technical background and problems, and has as its object to provide a metal foil surface plating apparatus capable of forming a special metal film stably and continuously on one side of a metal foil strip by electroplating. And
[0007]
[Means for Solving the Problems]
In order to achieve the above object, a surface plating apparatus for a metal foil according to the present invention includes a cell body containing a plating solution, a guide roll disposed so as to be partially immersed in the plating solution of the cell body, An anode disposed around the dipping portion of the guide roll, and a deflecting roll disposed above the plating solution in the cell body, wherein the strip is deflected by the deflecting roll and fixed to the guide roll. A metal foil surface plating apparatus for moving the plating solution in the cell body in a state in which the upper surface thereof is brought into close contact with the guide roll and continuously electroplating the lower surface of the strip,
The strip is a metal foil strip, the guide roll is formed as a large-diameter roll made of a non-conductive material at least on the outer peripheral surface, and the anode is formed of a material insoluble in the plating solution, and the guide roll is formed of a non-conductive material. And the deflection roll is also configured to also serve as a conductor roll serving as a cathode of the metal foil strip. Here, the cell body may be a single cell or a series of cells, and may be plated with one kind of alloy or plated with plural kinds of alloys. Further, the metal foil strip is not limited to a copper foil strip (copper alloy foil strip), but includes other metal foil strips such as an iron foil strip and an aluminum foil strip.
[0008]
According to the metal foil surface plating apparatus according to claim 1, for example, a metal foil strip fed from a metal foil coil is deflected by a deflecting roll and wound around a guide roll with a constant tension. Is brought into close contact with the guide roll. The metal foil strip is moved through the plating solution in the cell body with its upper surface in close contact with the guide roll. At the same time, a plating current is supplied from the power supply source to the anode. Since the deflection roll serving also as a conductor roll is connected to the power supply source, the plating film thickness is controlled by controlling the supply amount of the plating current.
[0009]
At this time, since the metal foil strip is made into a cathode by contacting with a deflection roll as a conductor roll, its lower surface is electroplated by a metal component in the ionized plating solution.
[0010]
On the other hand, since the guide roll immersed in the plating solution has at least its outer peripheral surface layer made of a non-conductive material, it is not electroplated even if immersed in the plating solution, and the deflecting roll as a conductor roll is Since it is located above the plating solution (liquid level), it is difficult to electroplate. In addition, for example, foreign matter caused by electroplating can be prevented from adhering to the roll surface by a polisher installed above the guide roll and below the deflection roll, and the roll surfaces are kept clean.
[0011]
Therefore, it is possible to avoid troubles such as generating wrinkles and scratches on the metal foil strip and causing local discharge (arc spots) due to foreign substances (attachment due to electroplating) on the roll surface, and thereby stably. Thus, the electroplating can be performed continuously, and the maintenance load of the roll can be reduced.
[0012]
In addition, since the guide roll employs a large-diameter roll having a smooth surface, a strong tension can be applied to the wound metal foil strip without forming a stress concentration portion, and thus the metal foil strip can be applied. And the occurrence of wrinkles and apertures (vertical wrinkles) can be prevented. At the same time, the degree of adhesion to the guide roll can be increased to prevent the plating solution from flowing to the upper surface of the metal foil strip, that is, the non-plated surface. In addition, by making the diameter larger, the plating surface can be kept almost flat, and stable continuous plating can be performed by these combined effects.
[0013]
Since the anode is disposed with a narrow and uniform gap between the anode and the guide roll, the electric resistance between the electrodes can be suppressed low, the plating current efficiency can be increased, and the power consumption can be reduced. In addition, since the anode employs a material insoluble in the plating solution, the gap between the anode and the guide roll can be stably and uniformly maintained.
[0014]
3. A pure water spray nozzle for spraying pure water on an upper surface of the metal foil strip before being wound on the guide roll, between the deflection roll and the guide roll, as described in claim 2. Can be.
[0015]
According to the metal foil surface plating apparatus of the second aspect, the pure water spray nozzle sprays pure water onto the upper surface of the metal foil strip before being wound around the guide roll, thereby allowing the guide roll and the metal foil strip to adhere to each other. As a result, the plating solution is reliably prevented from flowing to the upper surface (non-plated surface) side of the metal foil strip. Further, since a water film is formed between the metal foil strip and the guide roll, when a slight synchronization shift occurs between the two, the water film functions as a lubricating film, and a non-plated surface of the metal foil strip is formed. The effect of preventing the generation of scratches can also be obtained.
[0016]
As described in claim 3, the cell body is connected to a plating solution circulating supply system having a function of adjusting the temperature and concentration of the plating solution and a function of evaporating and removing moisture mixed in the plating solution. be able to.
[0017]
According to the metal foil surface plating apparatus of the third aspect, the temperature / concentration of the plating solution is adjusted by the temperature / concentration adjusting function of the plating solution circulating supply system. In addition, due to the function of evaporating and removing water of the plating solution circulating supply system, pure water added to the plating solution in the cell body is removed by evaporation, so that a plating solution having an optimum temperature and concentration is constantly circulated and supplied to the cell body. . Therefore, uniform and stable continuous plating is continuously performed.
[0018]
As described in claim 4, the anode is disposed symmetrically with respect to the center of the cell as an axis, while plating is formed in the cell body from between the two anodes to a gap between the anode and the guide roll. A pump nozzle for injecting the liquid at a high pressure may be provided.
[0019]
According to the metal foil surface plating apparatus of the fourth aspect, the plating solution is injected at a high pressure from between the two anodes into the gap between the anode and the guide roll via the pressure feeding nozzle and exists in the gap. The old plating solution is extruded to distribute the new plating solution. Accordingly, a fresh and ion-rich plating solution can be supplied to the lower surface (surface) of the metal foil strip wound around the guide roll to form a uniform and fine plating film.
[0020]
According to a fifth aspect of the present invention, the anode can be formed by screwing a titanium electrode in which iridium oxide is coated on a titanium base.
[0021]
According to the apparatus for plating a surface of a metal foil according to the fifth aspect, the wear of the anode due to the influence of the electric current and the plating solution is suppressed, and stable electroplating can be performed for a long time. When the metal foil strip comes into contact with the anode due to breakage of the metal foil strip and the anode is damaged, only the screwed electrode can be replaced.
[0022]
As set forth in claim 6, a plating solution discharge nozzle for discharging a plating solution to a lower surface of the metal foil strip before being wound on the guide roll is provided in the cell body. it can.
[0023]
According to the metal foil surface plating apparatus of the sixth aspect, the plating liquid is discharged to the lower surface of the metal foil strip before plating through the plating liquid discharge nozzle, and the plating adheres during the subsequent electroplating in the cell body. Can be enhanced.
[0024]
As described in claim 7, the guide roll is formed as a hollow roll, and the roll body can be made of a light metal such as a lightweight synthetic resin or a titanium / aluminum alloy.
[0025]
According to the metal foil surface plating apparatus of the present invention, the guide roll to be formed in a large size is made relatively light in weight so as to suppress the rotational inertia moment low, thereby increasing the responsiveness during acceleration and deceleration, and increasing the rotational speed. And the transfer speed of the metal foil strip can be easily synchronized. Therefore, it is possible to prevent the metal foil strip from being broken or the surface from being damaged due to the synchronization deviation, and to perform stable continuous plating.
[0026]
Further, as described in claim 8, the guide roll may be formed by spraying and laminating non-conductive ceramics having plating liquid resistance on the outer peripheral surface of a roll body made of FRP.
[0027]
According to the metal foil surface plating apparatus of the eighth aspect, the guide roll is formed by spraying and laminating non-conductive ceramics having plating solution resistance on the outer peripheral surface portion of the roll body made of FRP. It is excellent in corrosion resistance, prevents ion precipitation on the roll surface, and can continue stable continuous plating for a long time.
[0028]
According to a ninth aspect, the gap between the anode and the guide roll can be set to 15 mm or less.
[0029]
According to the metal foil surface plating apparatus of the ninth aspect, the gap between the anode and the guide roll is reduced to 15 mm or less, so that the resistance between the anode and the guide roll is suppressed low, and the plating current efficiency is increased. Power consumption can be reduced. Further, since the gap between the anode and the guide roll is reduced to 15 mm or less, a useless portion of the liquid pool in the cell body is reduced, and a quick circulation of the plating solution in the narrow gap is realized. Therefore, a fresh and normal plating solution is always supplied.
[0030]
A plurality of deflector rolls for adjusting a tension applied to a metal foil strip to be transferred are arranged upstream and downstream of the cell body, and the deflector roll, the deflection roll, and the guide roll are arranged as described in claim 10. May be arranged such that the free span of the metal foil strip is 300 mm or less.
[0031]
According to the apparatus for plating a surface of a metal foil according to claim 10, the interval between the rolls for transferring the metal foil strip is reduced so that the free span of the metal foil strip is 300 mm or less. Wrinkles and iris can be prevented from occurring.
[0032]
According to an eleventh aspect, a rectifier capable of supplying a DC current or a pulse current having a polarity conversion can be used for supplying the current as the metal foil plating means.
[0033]
According to the metal foil surface plating apparatus of the eleventh aspect, the plating roughness can be controlled by arbitrarily setting the use of the supplied current.
[0034]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0035]
1 to 4 show an embodiment of a copper foil (metal foil) surface plating apparatus according to the present invention, FIG. 1 is a longitudinal sectional view showing a schematic configuration of the apparatus, and FIG. FIG. 3 is a sectional view taken along line AA of FIG. 2, and FIG. 4 is a view showing a schematic configuration of a plating solution circulation system.
[0036]
As shown in FIG. 1, the copper foil surface plating apparatus according to the present invention has a radial cell 10 provided on a support base 9.
[0037]
Each radial cell 10 includes a cell body 1 containing a plating solution M, a guide roll 2 partially immersed in the plating solution M of the cell body 1, and a immersion portion of the guide roll 2. It comprises an arcuate anode 3 arranged around the periphery, and a deflecting roll 4 arranged above both left and right portions of the cell body 1 in FIG. The cell body 1 is made of a metal material lined with rubber or FRP in consideration of corrosion resistance due to a plating solution and electrostatic corrosion.
[0038]
The copper foil strip S (metal foil strip) fed from a copper foil coil (not shown) is deflected by the deflecting roll 4 and wound around the outer peripheral surface of the guide roll 2 with a constant tension. By moving the plating solution M in the cell body 1 while keeping the upper surface of the S in close contact with the outer peripheral surface of the guide roll 2, one side (lower surface) of the copper foil strip S is continuously electroplated. Have been.
[0039]
The guide roll 2 of the radial cell 10 has a configuration (that is, an insulating configuration) in which a non-conductive ceramic having plating solution resistance is thermally sprayed and laminated on the outer peripheral surface of a roll body made of FRP (fiber reinforced plastic). It is a large-diameter roll (in this example, an outer diameter of 1000 mm).
[0040]
The anode 3 is configured as an insoluble anode in which a titanium electrode having a base made of titanium coated with iridium oxide is screwed. As shown in FIGS. 1 and 2, the anode 3 is disposed symmetrically with respect to the center of the cell as an axis, and keeps a uniform gap of 15 mm or less (10 mm in this example) between the anode roll 3 and the guide roll 2. Is arranged. At the same time, it is connected to a power supply device (not shown, for example, a rectifier) via a bus bar (not shown) disposed through the wall of the cell body 1 through the liquid seal.
[0041]
The deflecting roll 4 has a roll body made of a conductive material having excellent corrosion resistance and is connected to the power supply device. Thereby, the deflecting roll 4 is configured to also function as a conductor roll for transmitting a current to the copper foil strip S to be deflected.
[0042]
The deflection roll 4 has an outer diameter of about 300 mm (350 mm in this example) in order to ensure a sufficient contact area with the copper foil strip S. Then, as shown in FIG. 2, the deflecting roll 4 is used to deflect the copper foil strip S to deflect the guide roll 2 in order to secure a sufficient winding angle (wrap angle) of the copper foil strip S with respect to the guide roll 2. They are arranged in a positional relationship such that the winding angle with respect to the outer peripheral surface (circumferential surface) is approximately 180 degrees. In addition, a polisher 4a for removing dirt on the roll surface due to an adhering liquid or the like is disposed immediately below each deflection roll 4 (see FIG. 2).
[0043]
On the other hand, as shown in FIG. 2, an overflow nozzle 1a for keeping the level of the plating solution M constant is provided at the upper part of the cell body 1. At the bottom of the cell body 1, a liquid discharge port 1b for discharging the retained liquid is provided. Further, the plating solution M supplied from a plating solution circulating supply device 30 (plating solution circulating supply system) described later is supplied to the cell body 1 in a gap between the anode 3 and the guide roll 2 (circumferential surface). A pressure feeding nozzle 5 for pressure feeding is provided. The pressure feeding nozzle 5 is formed as a flat nozzle having a width smaller than the width of the guide roll 2, and is disposed between the bottom of the tank and the two anodes 3.
[0044]
Further, in the cell body 1, as shown in FIG. 2, the copper foil strip S before being wound around the guide roll 2 (that is, before plating) is provided inside the front side wall located on the level of the plating solution S. A plating solution discharge nozzle 6 for discharging the plating solution M is provided on the lower surface (plating surface) of the substrate. Then, between the deflecting roll 4 and the guide roll 2 disposed on the upstream side, the circumferential surface of the guide roll 2 and the upper surface (non-plated surface) of the copper foil strip S before being wound around the guide roll 2 And a pure water spray nozzle 7 for spraying pure water. A pure water supply device (not shown) is connected to the pure water spray nozzle 7. Further, a plating solution circulating supply device 30 described below is connected to the overflow nozzle 1a, the solution discharge port 1b, the pressure feeding nozzle 5, and the plating solution discharge nozzle 6 of the cell body 1.
[0045]
As shown in FIG. 4, the plating solution circulating supply device 30 is provided with a circulation tank 31 having a heater 31a and containing a plating solution M. In the circulation tank 31, an additive is supplied from an additive supply tank 32. The plating solution is supplied from the plating solution supply tank 33. Further, a water evaporator 34 for evaporating and removing water mixed in the plating solution M and a filtration for filtering impurities are provided to two reflux pipes (closed circuit) for circulating the plating solution M in the circulation tank 31. Each device 35 is provided. A cooler 36 for adjusting the temperature of the plating solution M to be fed is provided in a feed pipe line to the cell body 1. Under this configuration, the plating solution M whose temperature and concentration have been adjusted is circulated and supplied to the cell body 1. The supply pressure of the plating solution M to the cell body 1 is set to a relatively high pressure (0.25 MPa in this example).
[0046]
The plating solution M supplied to the cell body 1 at a high pressure is applied between the anode 3 and the circumferential surface (outer peripheral surface) of the guide roll 2 via the pressure-feeding nozzle 5 as shown by an arrow in FIG. To the gap. Then, the plating solution M rises through the gap, and mostly returns to the plating solution circulation supply device 30 through the overflow nozzle 1a. A part is fed to the plating solution discharge nozzle 6 and discharged to the lower surface of the copper foil strip S. The plating solution M retained at the bottom of the cell body 1 is appropriately returned to the plating solution circulating supply device 30 via the solution discharge port 1b.
[0047]
Therefore, the required amount of the plating solution M can be supplied to the copper foil strip S while keeping the amount of the plating solution M in the cell body 1 low.
[0048]
As shown in FIG. 3, the guide roll 2 is rotatably supported by a support column 8 erected on a support base 9, and is driven by a motor 11 arranged on the side of the cell body 1. Has become. Although not shown here, the front and rear deflecting rolls 4 are also driven under the same configuration.
[0049]
Then, as shown in FIG. 2, the guide roll 2 is arranged such that a portion lower than the height position of the contact point P of the wound copper foil strip S is immersed in the plating solution in the cell body 1. Is established. As a result, the plating solution M in the cell body 1 goes around between the copper foil strip S, which is above the contact point P and is not yet in close contact, and the circumferential surface of the guide roll 2, that is, on the non-plating surface. It is configured to avoid going around a certain upper surface side. In addition, a polisher 13 and a cleaning liquid injection nozzle 14 are disposed above the polisher so that the outer peripheral surface of the roll can be cleaned at an appropriate time.
[0050]
On the other hand, a pair of edge masks (not shown) that move according to the width of the copper foil strip S are provided on the anode 3 in order to prevent edge overcoating due to current concentration on both side end surfaces of the copper foil strip S. Is provided.
[0051]
The deflector rolls 20 arranged on the upstream and downstream sides of the radial cell 10 adjust the tension applied to the copper foil strip S, and wind the copper foil strip S around the guide roll 2 with a constant tension. The deflector roll 20, the deflecting roll 4 and the guide roll 2 are spaced apart from each other so that the copper foil strip S to be transferred is prevented from wrinkling or squeezing. It is arranged so that it becomes. Further, cleaning liquid jet nozzles 21 for jetting the cleaning liquid toward the upper and lower surfaces of the copper foil strip S to be transferred are disposed above and below between the deflector rolls 20.
[0052]
In the apparatus having the above-described configuration, a copper foil strip S, which is fed from a copper foil coil (not shown) after being subjected to pretreatment such as cleaning and surface treatment, is fed by the deflection rolls 4 at the front and rear portions of the radial cell 10. It is deflected and wound around the guide roll 2, and is passed through the plating solution M in the cell body 1 in a state where the upper surface thereof is in close contact with the guide roll 2. At this time, a plating current is supplied to the anode 3 of the cell body 1 from a power supply device (not shown). Further, the plating solution M is circulated and supplied from the plating solution circulating supply device 30 to the cell body 1, and the copper foil strip wound around the guide roll 2 and the surface (circumferential surface) of the guide roll 2 from the pure water spray nozzle 7. Pure water is sprayed on the upper surface of S.
[0053]
Since the copper foil strip S is in contact with the deflecting roll 4 as a conductor roll to form a cathode, the current applied to the anode 3 flows through the plating solution M to the copper foil strip S. The metal component in the ionized plating solution M is electroplated on the lower surface of the copper foil strip S. Then, the current after plating flows from the copper foil strip S to the power supply device via the deflection roll 4.
[0054]
Here, since the deflection roll 4 (conductor roll) is a roll having an outer diameter of about 300 mm and is designed to ensure a sufficient contact area with the copper foil strip S, it does not cause local discharge or the like. In addition, a large-capacity current can be evenly transmitted to the copper foil strip S, and uniform and efficient plating can be performed.
[0055]
The plating solution M fed from the plating solution circulating / supplying device 30 at a high pressure is fed into the gap between the anode 3 and the circumferential surface of the guide roll 2 via the pressure feeding nozzle 5 and exists in the gap. The plating solution is extruded and distributed. Thereby, the ion-rich fresh plating solution M is constantly supplied to the surface (lower surface) of the copper foil strip S wound around the guide roll 2, and a uniform and fine plating film can be formed.
[0056]
In addition, since the plating liquid M is discharged to the lower surface of the copper foil strip S before plating by the plating liquid discharge nozzle 6, the plating adhesion at the time of electroplating can be improved.
[0057]
On the other hand, since the guide roll 2 is configured as an insulating roll having a nonconductive ceramic layer on the outer peripheral surface layer, the guide roll 2 is not plated even if immersed in the plating solution M. Further, since the deflecting roll 4 as a conductor roll is disposed above the level of the plating solution M, it is hardly affected by the plating action, and is caused by the plating action by the polisher 4a provided below the deflecting roll 4. Foreign matter can be prevented from adhering to the roll surface, and each roll surface can be kept clean.
[0058]
Therefore, it is possible to avoid troubles such as generation of wrinkles and scratches on the copper foil strip S and occurrence of local discharge, and the like, and stable plating can be performed. realizable. Further, the maintenance load of the roll can be reduced.
[0059]
Moreover, since the guide roll 2 is formed as a large-diameter roll having a smooth surface, it is possible to apply a strong tension to the wound copper foil strip S without forming a stress concentration portion, and thus wrinkles. And aperture can be prevented. In addition, by increasing the diameter, the degree of adhesion to the guide roll 2 can be increased, and the plating solution M can be prevented from flowing around to the upper surface (non-plated surface) of the copper foil strip S. Further, the copper foil strip S has a large winding angle (wrap angle) (approximately 180 degrees) as well as a large diameter, so that the plating surface can be kept flat and stable and uniform on the copper foil strip S. Power can be supplied, and by these combined effects, stable and efficient continuous plating can be performed.
[0060]
In addition, since the guide roll 2 has a configuration in which the roll body is made of FRP, it is relatively lightweight, has a small rotational moment of inertia, and has high reactivity during acceleration / deceleration. Synchronization with the transfer speed is easy. In addition, since the surface of the guide roll 2 is made of non-conductive ceramics, it has excellent resistance to the action of the plating solution M, and can perform stable continuous plating for a long time.
[0061]
In addition, since the gap between the anode 3 and the guide roll 2 is a small gap of 15 mm or less, the inter-electrode resistance between the anode 3 and the guide roll 2 is suppressed low, thereby increasing the plating current efficiency and reducing power consumption. Can be done. Further, the anode 3 is made of an insoluble material formed by screwing a titanium electrode coated with iridium oxide on its surface. Is maintained stably, and stable plating can be performed for a long period of time.
[0062]
Since pure water is sprayed from the pure water spray nozzle 7 onto the outer peripheral surface of the guide roll 2 and the upper surface of the copper foil strip S, the sprayed pure water is wound with the copper foil strip S wound around the guide roll 2. Extrude on both sides to discharge. The discharge prevents the plating solution M from flowing to the upper surface side of the copper foil strip S from both sides. Further, a water film is formed between the copper foil strip S and the guide roll 2 so as to serve as a lubricating film when a slight synchronization shift occurs between the two, and an effect of preventing scratches on the non-plated surface can be obtained. . By these combined effects, stable one-side plating can be performed without impairing the surface properties of the non-plated surface.
[0063]
On the other hand, since the plating solution circulating supply device 30 has an evaporation removal function (water evaporator 34) in addition to the temperature / concentration adjustment function of the plating solution M, it is also used in the cell body 1 and is mixed into the plating solution M. The purified water (moisture) thus evaporated is removed by evaporation, so that the plating solution M having the optimum temperature and concentration can be constantly circulated and supplied to the cell body 1, so that uniform and stable continuous plating can be continued.
[0064]
As described above, according to the present example, one side of the ultra-thin copper foil strip S continuously fed without causing wrinkles, squeezing, and damage due to local discharge is generated. Can be electroplated. Therefore, it is possible to obtain a single-side plated copper foil having a uniform and fine special metal film and having no scratches on the non-plated surface and no spillage of the plating solution.
[0065]
In addition, the maintenance load on the guide rolls 2 and the deflecting rolls 4 can be reduced, the power consumption and the amount of plating solution used can be reduced, so that efficient and stable continuous plating can be performed and the product cost can be reduced.
[0066]
In addition to the above, the metal foil surface plating apparatus according to the present invention can also be configured as follows.
(1) In the above embodiment, a guide roll in which a non-conductive ceramic layer is laminated on the outer peripheral surface of a roll main body made of FRP is employed, but this has a hard and excellent insulating layer. This is because it is preferable to obtain a guide roll that is lightweight and has a small rotational moment of inertia. As long as such requirements are satisfied, for example, a guide roll made entirely of a non-conductive material may be used.For example, another type of non-conductive material may be used as the surface layer, and the roll body may be made of a lightweight composite. A hollow roll made of a resin or a light metal such as a titanium-aluminum alloy may be used.
(2) In order to keep the plating surface of the copper foil strip substantially flat, it is desirable to use a roll having a larger diameter so that a large contact area can be obtained. And the length of the path in the plating solution, and it is necessary to suppress it to around 1000 mm due to restrictions such as rotational torque and the size of the cell body. Therefore, when a longer path length in the plating solution is required, it is necessary to increase the number of cells.
(3) The anode 3 employs a titanium electrode having a base made of titanium coated with iridium oxide, and is screw-fixed. However, it is possible to reduce abrasion due to the influence of electricity and the plating solution. This is because the gap with the guide roll 2 can be stably maintained, but an insoluble anode made of another kind of material can also be used.
[0067]
【The invention's effect】
As described above, the metal foil surface plating apparatus according to the present invention includes a cell body, a guide roll partially immersed in a plating solution, and an insulating configuration in which at least the outer peripheral surface layer is made of a non-conductive material. While a large-diameter roll is formed, the deflection roll for deflecting the metal foil strip fed from the coil and winding it around the guide roll is configured so that the metal foil strip also serves as a conductor roll serving as a cathode, so the plating solution is used. It is possible to avoid the formation of deposits due to the plating action on the surface of the guide roll immersed therein, and keep the roll surface clean. Therefore, it is possible to avoid troubles such as generation of wrinkles and scratches on the metal foil strip due to the deposits on the metal foil and occurrence of local discharge. Accordingly, stable continuous plating can be performed, and the maintenance load of the roll can be reduced.
[0068]
In addition, since the guide roll is formed as a large-diameter roll having a smooth surface, it has an advantageous structure for applying a strong tension to the wound metal foil strip without forming a stress concentrated portion. Therefore, wrinkles and squeezing can be prevented, and the degree of adhesion to the guide roll can be increased, thereby preventing the plating solution from flowing to the upper surface (that is, the non-plating surface) of the metal foil strip. In addition, by making the diameter large, the plating surface can be kept almost flat, and by these combined effects, stable and continuous electroplating is performed to form a stable special metal film on one side of the metal foil strip. be able to.
[0069]
In addition, the anode disposed around the immersion portion of the guide roll is formed as an insoluble anode, and is disposed while maintaining a uniform gap between the guide roll and the anode. Thus, the power consumption can be reduced by increasing the plating current efficiency, so that efficient continuous plating can be performed.
[0070]
Therefore, the ultra-thin copper foil strip fed from the coil can be continuously and efficiently electroplated on one side without causing wrinkles, squeezing, and damage due to local discharge, and the like. It is possible to obtain a metal foil of good single-sided plating having a stable special metal film and having no scratches on the non-plated surface and no spillage of the plating solution.
[0071]
If pure water is sprayed from the pure water spray nozzle onto the upper surface of the metal foil strip wound around the guide roll as in the metal foil surface plating apparatus according to claim 2, the sprayed pure water can be applied to the metal foil strip. By extruding and discharging to both sides along with the winding around the guide roll, it is possible to prevent the plating solution from flowing from both sides to the upper surface side of the metal foil strip. In addition, a water film is formed between the metal foil strip and the guide roll to provide a lubricating film when a slight synchronization shift occurs between the two, and the effect of preventing the occurrence of scratches on the non-plated surface can be obtained.
[0072]
As in the metal foil surface plating apparatus according to the third aspect, the plating solution circulating supply means adjusts the temperature and concentration of the plating solution and evaporates and removes water used in the cell body and mixed in the plating solution. However, if the plating solution having the optimum temperature and concentration can be constantly circulated and supplied to the cell body, it is possible to continuously perform uniform and stable electroplating.
[0073]
If the plating solution is pressure-fed to the gap between the anode and the guide roll by the pressure-feeding nozzle as in the metal foil surface plating apparatus according to claim 4, a new plating solution is circulated and the metal foil strip is circulated. An ion-rich fresh plating solution is supplied to the lower surface of the substrate to form a uniform and fine plating film.
[0074]
As in the apparatus for plating a surface of a metal foil according to claim 5, if the anode is formed by screwing a titanium electrode having a base made of titanium coated with iridium oxide with screws, the anode is affected by an electric current and a plating solution. Wear can be suppressed to a low level and stable plating can be performed for a long time.
[0075]
If the plating liquid is discharged to the lower surface of the metal foil strip before plating by the plating liquid discharge nozzle as in the metal foil surface plating apparatus according to the sixth aspect, the adhesion of plating during subsequent electroplating is enhanced. be able to.
[0076]
A large-sized guide roll is formed as a hollow roll, and the roll main body is made of a light metal such as a lightweight synthetic resin or a titanium-aluminum alloy as in the metal foil surface plating apparatus according to claim 7. If so, it is possible to make the rotation speed and the transfer speed of the metal foil strip easy to synchronize with each other, which is relatively lightweight and has a small rotational moment of inertia. Therefore, it is possible to prevent the metal foil strip from being broken or the surface from being damaged due to the synchronization deviation, and to perform stable continuous plating.
[0077]
As in the apparatus for plating a surface of a metal foil according to claim 8, if the guide roll is formed by spraying and laminating non-conductive ceramics having plating liquid resistance on the outer peripheral surface of a roll body made of FRP, the weight is light. The rotational moment of inertia is small, the rigidity is excellent and the insulation is excellent, the resistance to the plating solution is excellent, and the rotation speed and the transfer speed of the metal foil strip can be easily synchronized.
[0078]
If the gap between the anode and the guide roll is reduced to 15 mm or less as in the metal foil surface plating apparatus according to claim 9, the interelectrode resistance between the anode and the guide roll is suppressed, and the plating current efficiency is reduced. The power consumption can be increased to reduce power consumption.
[0079]
As in the metal foil surface plating apparatus according to claim 10, the distance between the rolls for transporting the metal foil strip is reduced so that the free span of the metal foil strip is 300 mm or less. Wrinkles and squeezing can be prevented from occurring, and stable continuous plating can be performed.
[0080]
As described in claim 11, if a rectifier capable of supplying a pulse current having a DC or polarity conversion can be supplied to the current supply as the metal foil plating means, the use of the supplied current can be arbitrarily set, The plating roughness can be controlled.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing a schematic configuration of a copper foil (metal foil) surface plating apparatus according to the present invention.
FIG. 2 is an enlarged sectional view showing a main part of the device.
FIG. 3 is a sectional view taken along line AA of FIG. 2;
FIG. 4 is a diagram showing a schematic configuration of a plating solution circulation system of the above apparatus.
[Explanation of symbols]
1 Cell body
1a Overflow nozzle
1b Liquid discharge port
2 Guide roll
3 Anode
4 deflection roll
4a Roll polisher
5 Pressure feeding nozzle
6 Plating solution discharge nozzle
7 Pure water spray nozzle
8 props
9 Support base
10 radial cells
11 Motor
13 Roll polisher
14 Cleaning liquid injection nozzle
20 Deflector roll
21 Cleaning liquid injection nozzle
30 Plating solution circulation supply device (Plating solution circulation supply system)
31 Circulation tank
31a heater
32 Additive supply tank
33 plating solution supply tank
34 Moisture evaporator
35 Filter
36 cooler
M plating solution
S Copper foil strip (metal foil strip)
P tangent

Claims (11)

A cell body containing a plating solution, a guide roll disposed so as to be partially immersed in the plating solution of the cell body, an anode disposed around a dipping portion of the guide roll, and It has a deflecting roll disposed above the plating solution, deflects the strip by the deflecting roll, winds the strip with a constant tension on the guide roll, and closes the upper surface of the strip to the guide roll inside the cell body. A metal foil surface plating apparatus that moves in a plating solution and continuously electroplates the lower surface of the strip,
The strip is a metal foil strip, the guide roll is formed as a large-diameter roll made of a non-conductive material at least on the outer peripheral surface, and the anode is formed of a material insoluble in the plating solution, and the guide roll is formed of a non-conductive material. A metal foil surface plating apparatus, wherein the deflecting roll also serves as a conductor roll serving as a cathode of the metal foil strip. The metal foil strip according to claim 1, further comprising a pure water spray nozzle for spraying pure water on an upper surface of the metal foil strip before being wound around the guide roll, between the deflection roll and the guide roll. Surface plating equipment. 3. The metal foil surface plating apparatus according to claim 2, wherein the cell body is connected to a plating solution circulating supply system having a function of adjusting the temperature and concentration of the plating solution and a function of evaporating and removing moisture mixed in the plating solution. The anode is disposed symmetrically with respect to the center of the cell as an axis, while a pressure feeding nozzle for injecting a plating solution at a high pressure into the gap between the anode and the guide roll from between the two anodes is provided in the cell body. The metal foil surface plating apparatus according to claim 1, 2 or 3, which is provided. 5. The metal foil surface plating apparatus according to claim 1, wherein the anode is formed by screwing a titanium electrode in which iridium oxide is coated on a titanium base. The metal foil according to any one of claims 1 to 5, wherein a plating solution discharge nozzle that discharges a plating solution on a lower surface of the metal foil strip is provided in the cell body before being wound around the guide roll. Surface plating equipment. The surface plating of a metal foil according to any one of claims 1 to 6, wherein the guide roll is formed as a hollow roll, and the roll body is made of a light metal such as a lightweight synthetic resin or a titanium / aluminum alloy. apparatus. The metal foil according to any one of claims 1 to 6, wherein the guide roll has a configuration in which a non-conductive ceramic having plating solution resistance is spray-coated on an outer peripheral surface of a roll body made of FRP. Surface plating equipment. 9. The metal foil surface plating apparatus according to claim 1, wherein a gap between the anode and the guide roll is 15 mm or less. On the upstream and downstream sides of the cell body, a plurality of deflector rolls for adjusting the tension applied to the transferred metal foil strip are arranged,
The metal foil according to any one of claims 1 to 9, wherein the deflector roll, the deflecting roll, and the guide roll are arranged such that a free span of the metal foil strip is 300 mm or less. Surface plating equipment. The metal foil surface plating apparatus according to any one of claims 1 to 10, wherein a rectifier capable of supplying a direct current or a pulse current having polarity conversion is used as a metal foil plating means.

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