CN114672867A - Coating film conductive device - Google Patents

Abstract

The invention discloses a coated conductive device which comprises a head end acid liquor spraying assembly, a liquid squeezing roller assembly, a diamond conductive roller assembly, a liquid receiving tank and a tail end acid liquor spraying assembly, wherein pure water is stored in the liquid receiving tank, the diamond conductive roller assembly is soaked in the pure water, and an electroplated copper film sequentially passes through the head end acid liquor spraying assembly, the liquid squeezing roller assembly, the diamond conductive roller assembly and the tail end acid liquor spraying assembly. The coating conductive device provided by the invention solves the problems that the conductive roller of the traditional copper electroplating film equipment is plated with copper and the copper electroplating film is easy to generate heat to cause film ablation perforation.

Description

Coating film conductive device

Technical Field

The invention relates to the technical field of copper film electroplating equipment, in particular to a film-coating conductive device.

Background

Electroplating is a process of plating a thin layer of metal or alloy on the surface of metal by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis so as to play a role in preventing metal oxidation (such as corrosion), improving wear resistance, conductivity and light reflection, enhancing the appearance and the like. With the development of modern industrial technologies, the demand for film coating on the surface of a film substrate is increasing, and the film substrate is widely applied to the fields of new energy materials, high-performance automobile films, plasma television flat panel displays, touch screens, solar cells, flexible printed circuit boards (FPCs), Chip On Films (COFs) and the like.

In the existing copper film electroplating equipment, the structure of a film plating conductive device is complex, the volume is large, the occupied area is large, and the production cost is high; in addition, during work, the conductive roller is easy to be plated with copper, and an electroplated copper film is easy to generate heat, so that the film is easy to be ablated and perforated.

The above drawbacks are to be improved.

Disclosure of Invention

In order to overcome the defects of the prior art, the invention provides a coated conductive device.

The technical scheme of the invention is as follows:

a coated conductive device comprises a head end acid liquor spraying assembly, a liquid squeezing roller assembly, a diamond-shaped conductive roller assembly, a liquid receiving tank and a tail end acid liquor spraying assembly, wherein pure water is stored in the liquid receiving tank, the diamond-shaped conductive roller assembly is soaked in the pure water, and an electroplated copper film sequentially passes through the head end acid liquor spraying assembly, the liquid squeezing roller assembly, the diamond-shaped conductive roller assembly and the tail end acid liquor spraying assembly.

According to the invention of the scheme, the head end acid liquid spraying assembly comprises a first front side acid liquid spraying pipe and a first back side acid liquid spraying pipe, the first front side acid liquid spraying pipe is positioned on the upper side of the film running path of the electroplated copper film, and the first back side acid liquid spraying pipe is positioned on the lower side of the film running path of the electroplated copper film;

the tail end acid liquor spraying assembly comprises a second front acid liquor spraying pipe and a second back acid liquor spraying pipe, the second front acid liquor spraying pipe is located on the upper side of a film running path of the electroplated copper film, and the second back acid liquor spraying pipe is located on the lower side of the film running path of the electroplated copper film.

According to the invention of the scheme, the liquid squeezing roller assembly comprises a first liquid squeezing roller and a second liquid squeezing roller, the second liquid squeezing roller is positioned above the first liquid squeezing roller, the second liquid squeezing roller is closer to the liquid receiving tank than the first liquid squeezing roller, the electroplated copper films sequentially cross the first liquid squeezing roller and the second liquid squeezing roller, and wrap angles of the electroplated copper films passing through the first liquid squeezing roller and the second liquid squeezing roller are both larger than 90 degrees.

Furthermore, the first liquid squeezing roller is positioned on the outer side of the left side wall of the liquid receiving tank, and the film outlet end of the second liquid squeezing roller is positioned on the inner side of the left side wall of the liquid receiving tank.

Furthermore, a roller for assisting in squeezing liquid is arranged between the head-end acid liquor spraying assembly and the first liquid squeezing roller.

Further, the passing roll was an SUS304 steel roll.

Furthermore, the wrap angle of the electroplated copper film passing through the second liquid squeezing roller is larger than that of the electroplated copper film passing through the first liquid squeezing roller. The wrap angle of the electroplated copper film passing through the first liquid squeezing roller is 160-170 degrees, and the wrap angle of the electroplated copper film passing through the second liquid squeezing roller is 215-225 degrees.

Furthermore, the radiuses of the first liquid squeezing roller, the second liquid squeezing roller and the roller passing roller are all A, the distance between the first liquid squeezing roller and the second liquid squeezing roller is B, the distance between the roller passing roller and the first liquid squeezing roller is C, and the ratio of A to B to C is 7:1: 1.

According to the invention of the scheme, the rhombic conductive roller assembly comprises a first conductive roller, a second conductive roller, a third conductive roller and a fourth conductive roller, the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are respectively connected with anodes of four direct current power supplies, central axes of the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are respectively positioned on four vertexes of the same rhombus, an electroplated copper film sequentially crosses the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller, and wrap angles of the electroplated copper film passing through the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are all larger than 90 degrees.

Furthermore, the wrap angle of the electroplated copper film passing through the first conductive roller is 190-200 degrees, the wrap angle of the electroplated copper film passing through the second conductive roller is 215-225 degrees, the wrap angle of the electroplated copper film passing through the third conductive roller is 215-225 degrees, and the wrap angle of the electroplated copper film passing through the fourth conductive roller is 190-200 degrees.

Further, the radiuses of the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are all C, and the distance between the first conductive roller and the second conductive roller, the distance between the first conductive roller and the third conductive roller, the distance between the fourth conductive roller and the second conductive roller and the distance between the fourth conductive roller and the third conductive roller are all smaller than C.

Further, the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are divided into an upper row and a lower row, the first conductive roller is located on the left side of the lower row, the second conductive roller is located on the left side of the upper row, the third conductive roller is located on the right side of the lower row, the fourth conductive roller is located on the right side of the upper row, the first conductive roller and the third conductive roller are soaked in the pure water, and the lower end of the second conductive roller and the lower end of the fourth conductive roller are soaked in the pure water.

Furthermore, the film outlet end of the fourth conductive roller is positioned outside the right side wall of the liquid receiving groove.

Furthermore, the first conductive roller is closer to the left groove wall of the liquid receiving groove than the second conductive roller, and the fourth conductive roller is closer to the right groove wall of the liquid receiving groove than the third conductive roller.

Furthermore, the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are internally provided with a circulating cooling pipe.

Further, the first conductive roller, the second conductive roller, the third conductive roller, and the fourth conductive roller are SUS304 steel rollers.

Furthermore, the electroplating copper film electroplating device further comprises a first pure water spraying assembly, wherein the first pure water spraying assembly is arranged above the second conductive roller and is used for carrying out pure water spraying on the electroplating copper film passing through the upper end of the second conductive roller.

Furthermore, the first pure water spray assembly comprises a left pure water spray pipe and a right pure water spray pipe, the left pure water spray pipe is positioned at the upper left of the second conductive roller, and the right pure water spray pipe is positioned at the upper right of the second conductive roller.

Furthermore, the electroplating device further comprises a second pure water spraying assembly, wherein the second pure water spraying assembly is arranged between the liquid squeezing roller assembly and the rhombic conductive roller assembly, and is used for spraying pure water on the electroplated copper film after liquid squeezing.

Furthermore, the second pure water spray assembly comprises a front pure water spray pipe and a back pure water spray pipe, the front pure water spray pipe is located on the upper side of the film walking path of the electroplated copper film, and the back pure water spray pipe is located on the lower side of the film walking path of the electroplated copper film.

Furthermore, a water outlet is formed in the bottom of the liquid receiving tank, and the flow rate of pure water discharged from the water outlet is equal to the sum of the flow rates of pure water sprayed into the liquid receiving tank by the first pure water spraying component and the second pure water spraying component.

Compared with the prior art, the invention has the beneficial effects that:

the coating conductive device provided by the invention solves the problems that the conductive roller of the traditional copper electroplating film equipment is plated with copper and the copper electroplating film is easy to generate heat to cause film ablation perforation; the number of parts is less while certain process requirements are met, the structure is simpler and more compact, the size is smaller, the occupied area is small, and the production cost is low; the resistivity of the unit area of the electroplated copper film is more uniform, the film is not easy to break by equipment, and the process performance is more excellent.

Drawings

FIG. 1 is a schematic structural diagram of one embodiment of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of the present invention;

in the context of the figures, it is,

1. a head end acid liquor spray assembly; 101. a first front acid spray pipe; 102. a first reverse side acid liquor spray pipe; 2. a squeeze roll assembly; 210. a first wringing roller; 202. a second wringing roller; 3. a diamond-shaped conductive roller assembly; 301. a first conductive roller; 302. a second conductive roller; 303. a third conductive roller; 304. a fourth conductive roller; 3041. a circulating cooling pipe; 4. a liquid receiving tank; 401. pure water; 402. a water outlet; 5. a tail end acid liquor spraying assembly; 501. a second front acid liquor spray pipe; 502. a second reverse side acid liquor spray pipe; 6. electroplating a copper film; 7. passing through a roller; 8. a first pure water spray assembly; 801. a left pure water spray pipe; 802. a right pure water spray pipe; 9. a second pure water spray assembly; 901. a pure water spray pipe on the front; 902. a reverse pure water spray pipe.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.

It is to be understood that the terms "comprises" and "comprising," and any variations thereof, in the description and claims of this invention are intended to cover non-exclusive inclusions. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. The terms "disposed" and "connected" should be interpreted broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The terms "upper", "lower", "left", "right", "top", "bottom", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are only for convenience of description and should not be construed as limiting the technical solution. The terms "first", "second", "third" and "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features.

Referring to fig. 1, an embodiment of the present invention provides a coating conductive device, including a head end acid liquid spraying assembly 1, a liquid squeezing roller assembly 2, a diamond-shaped conductive roller assembly 3, a liquid receiving tank 4, and a tail end acid liquid spraying assembly 5, where pure water 401 is stored in the liquid receiving tank 4, the diamond-shaped conductive roller assembly 3 is soaked in the pure water 401, and an electroplated copper film 6 sequentially passes through the head end acid liquid spraying assembly 1, the liquid squeezing roller assembly 2, the diamond-shaped conductive roller assembly 3, and the tail end acid liquid spraying assembly 5. The head end acid liquor spraying assembly 1 and the tail end acid liquor spraying assembly 5 are used for enabling the electroplated copper film 6 to be exposed in the air without liquid as little as possible, preventing the electroplated copper film 6 from being exposed in the air for a long time to cause acid liquor crystallization to scratch the film surface, cooling the film surface and shunting the current of the electroplated copper film 6 at the section, and reducing the heating of the electroplated copper film 6. The liquid squeezing roller assembly 2 is used for squeezing off acid liquor on the electroplated copper film 6. The diamond-shaped conductive roller assembly 3 is used for electrifying the front and back surfaces of the electroplated copper film 6. The liquid receiving tank 4 is used for storing pure water 401, and then the diamond-shaped conductive roller assembly 3 is soaked by the pure water 401, so that the effects of cooling the diamond-shaped conductive roller assembly 3, maximally diluting copper ions, preventing the conductive roller from being plated with copper, filling and lubricating the contact surface of the conductive roller and the electroplated copper film 6 and preventing the electroplated copper film 6 from being scratched and ablated through a perforation can be achieved. Meanwhile, the liquid receiving tank 4 also plays a role in guiding the acid liquid of the liquid squeezing roller assembly 2 to the plating solution tank.

Referring to fig. 1, in the present embodiment, the head end acid solution spraying assembly 1 includes a first front side acid solution spraying pipe 101 and a first back side acid solution spraying pipe 102, the first front side acid solution spraying pipe 101 is located on the upper side of the film running path of the electroplated copper film 6, the first back side acid solution spraying pipe 102 is located on the lower side of the film running path of the electroplated copper film 6, the first front side acid solution spraying pipe 101 is used for spraying acid solution on the front side of the section of the electroplated copper film 6 before entering the pure water 401, and the first back side acid solution spraying pipe 102 is used for spraying acid solution on the back side of the section of the electroplated copper film 6 before entering the pure water 401, so as to prevent the section of the electroplated copper film 6 before entering the pure water 401 from being exposed to air for a long time to cause acid solution crystallization and scratch the film surface, cool the film surface and shunt current of the section of the electroplated copper film 6, thereby reducing heating of the electroplated copper film 6.

The tail end acid liquor spraying assembly 5 comprises a second front side acid liquor spraying pipe 501 and a second back side acid liquor spraying pipe 502, the second front side acid liquor spraying pipe 501 is located on the upper side of a film running path of the electroplated copper film 6, the second back side acid liquor spraying pipe 502 is located on the lower side of the film running path of the electroplated copper film 6, the second front side acid liquor spraying pipe 501 is used for spraying acid liquor on the front side of the section of the electroplated copper film 6 after the electroplated copper film comes out from the pure water 401, the first back side acid liquor spraying pipe 102 is used for spraying acid liquor on the back side of the section of the electroplated copper film 6 after the electroplated copper film comes out from the pure water 401, and therefore the situation that the acid liquor crystals scratch the film surface due to the fact that the air is exposed on the film surface of the section of the electroplated copper film 6 after the electroplated copper film comes out from the pure water 401 for a long time is avoided, the current of the electroplated copper film 6 is shunted by the cooling film surface, and the heating of the electroplated copper film 6 is reduced.

Referring to fig. 1, in the present embodiment, the squeeze roller assembly 2 includes a first squeeze roller 201 and a second squeeze roller 202, the second squeeze roller 202 is located above the first squeeze roller 201, the second squeeze roller 202 is closer to the liquid receiving tank 4 than the first squeeze roller 201, the electroplated copper film 6 sequentially crosses the first squeeze roller 201 and the second squeeze roller 202, and the wrap angle of the electroplated copper film 6 passing through the first squeeze roller 201 and the second squeeze roller 202 is greater than 90 °, so as to ensure the squeezing effect. Because the liquid squeezing effect is in direct proportion to the liquid squeezing stress and the liquid squeezing area, the liquid squeezing roller assembly 2 increases the liquid squeezing area as much as possible only under the tension of the membrane and increases the liquid squeezing path in a winding mode, and simultaneously utilizes the gravity of the acid liquid to achieve the best liquid squeezing effect; the structure is simple, adjustment is not needed, the film surface of the electroplated copper film 6 is not damaged, the film surface of the electroplated copper film 6 is not separated, and the liquid squeezing effect is better.

Referring to fig. 1, further, the first squeeze roller 201 is located outside the left sidewall of the liquid receiving tank 4, and the film outlet end of the second squeeze roller 202 is located inside the left sidewall of the liquid receiving tank 4, so that the second squeeze roller 202 is as close to the diamond-shaped conductive roller assembly 3 as possible, and the wrap angle of the electroplated copper film 6 passing through the second squeeze roller 202 is as large as possible, thereby improving the squeezing effect.

Referring to fig. 1, further, a roller 7 for assisting in squeezing is disposed between the first-end acid liquid spraying assembly 1 and the first squeezing roller 201, the roller 7 is an SUS304 steel roller, and a film passing path of the electroplated copper film 6 can be changed by the roller 7, so that a wrap angle of the electroplated copper film 6 passing through the first squeezing roller 201 is as large as possible, and a squeezing effect is improved.

Preferably, the wrap angle of the electroplated copper film 6 passing through the second squeeze roller 202 is larger than the wrap angle of the electroplated copper film 6 passing through the first squeeze roller 201, the wrap angle of the electroplated copper film 6 passing through the first squeeze roller 201 is 160-170 degrees, and the wrap angle of the electroplated copper film 6 passing through the second squeeze roller 202 is 215-225 degrees. By adopting the arrangement, the device can be ensured to run smoothly, and the optimal liquid squeezing effect can be achieved.

Meanwhile, in order to enable the wrap angle of the electroplated copper film 6 passing through the first liquid squeezing roller 201 to reach 160-170 degrees, the wrap angle of the electroplated copper film 6 passing through the second liquid squeezing roller 202 to reach 215-225 degrees, the radiuses of the first liquid squeezing roller 201, the second liquid squeezing roller 202 and the roll passing roller 7 are all A, the distance between the first liquid squeezing roller 201 and the second liquid squeezing roller 202 is B, the distance between the roll passing roller 7 and the first liquid squeezing roller 201 is C, and the ratio of A to B to C is equal to or equal to 7:1: 1.

Referring to fig. 1, in the embodiment, the rhombic conductive roller assembly 3 includes a first conductive roller 301, a second conductive roller 302, a third conductive roller 303 and a fourth conductive roller 304, the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304 are respectively connected to positive electrodes of four dc power supplies, central axes of the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304 are respectively located at four vertices of the same rhombus, the copper-plated film 6 sequentially crosses the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304, and wrap angles of the copper-plated film 6 passing through the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304 are all greater than 90 °. The four conductive rollers of the rhombic conductive roller assembly 3 are arranged in a rhombic shape to generate a large wrap angle, so that the electroplated copper film 6 is fully contacted with the conductive rollers, the current density of the contact surface of the electroplated copper film 6 and the conductive rollers is greatly reduced, the heating rate is reduced, and the electroplated copper film 6 is prevented from being ablated and perforated due to heating; the structure is simple and compact, the tension is not isolated, and the control of the film tension is more facilitated so as to better walk the film.

Preferably, the wrap angle of the electroplated copper film 6 passing through the first conductive roller 301 is 190 ° to 200 °, the wrap angle of the electroplated copper film 6 passing through the second conductive roller 302 is 215 ° to 225 °, the wrap angle of the electroplated copper film 6 passing through the third conductive roller 303 is 215 ° to 225 °, and the wrap angle of the electroplated copper film 6 passing through the fourth conductive roller 304 is 190 ° to 200 °. By adopting the arrangement, the device can be ensured to smoothly operate, the electroplated copper film 6 can be fully contacted with the conductive roller, the current density of the contact surface of the electroplated copper film 6 and the conductive roller is greatly reduced, the heating rate is reduced, and the electroplated copper film 6 is prevented from being ablated and perforated due to heating.

Meanwhile, in order to enable the wrap angle of the electroplated copper film 6 passing through the first conductive roller 301 to reach 190-200 degrees, the wrap angle of the electroplated copper film 6 passing through the second conductive roller 302 to reach 215-225 degrees, the wrap angle of the electroplated copper film 6 passing through the third conductive roller 303 to reach 215-225 degrees, the wrap angle of the electroplated copper film 6 passing through the fourth conductive roller 304 to reach 190-200 degrees, the radii of the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304 are all set to be C, and the spacing between the first conductive roller 301 and the second conductive roller 302, the spacing between the first conductive roller 301 and the third conductive roller 303, the spacing between the fourth conductive roller 304 and the second conductive roller 302 and the spacing between the fourth conductive roller 304 and the third conductive roller 303 are all set to be smaller than C.

Referring to fig. 1, further, the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304 are divided into two upper rows and two lower rows, the first conductive roller 301 is located on the left side of the lower row, the second conductive roller 302 is located on the left side of the upper row, the third conductive roller 303 is located on the right side of the lower row, the fourth conductive roller 304 is located on the right side of the upper row, the first conductive roller 301 and the third conductive roller 303 are soaked in pure water 401, and the lower end of the second conductive roller 302 and the lower end of the fourth conductive roller 304 are soaked in pure water 401. By immersing the first conductive roller 301 and the third conductive roller 303 in pure water 401 and the lower end of the second conductive roller 302 and the lower end of the fourth conductive roller 304 in pure water 401, the first conductive roller 301, the second conductive roller 302, the third conductive roller 303, and the fourth conductive roller 304 can be cooled, copper ions can be diluted maximally, copper plating of the first conductive roller 301, the second conductive roller 302, the third conductive roller 303, and the fourth conductive roller 304 can be prevented, the contact surfaces of the first conductive roller 301, the second conductive roller 302, the third conductive roller 303, the fourth conductive roller 304, and the electroplated copper film 6 can be filled and lubricated, and scratching and perforation ablation of the film surface of the electroplated copper film 6 can be prevented. Meanwhile, the film outlet end of the fourth conductive roller 304 is positioned outside the right side wall of the liquid receiving tank 4, so that the large wrap angle is maintained when the electroplated copper film 6 passes through the fourth conductive roller 304.

Referring to fig. 1, further, the first conductive roller 301 is closer to the left wall of the liquid receiving tank 4 than the second conductive roller 302, and the fourth conductive roller 304 is closer to the right wall of the liquid receiving tank 4 than the third conductive roller 303, so that the copper electroplating film 6 keeps a large wrap angle when passing through the first conductive roller 301.

Referring to fig. 1, further, a circulation cooling pipe 3041 is disposed inside the first conductive roller 301, the second conductive roller 302, the third conductive roller 303 and the fourth conductive roller 304, and the circulation cooling pipe 3041 is used for circulating cooling water for cooling the conductive rollers and the electroplated copper film 6 passing through the conductive rollers. The circulation cooling pipe 3041 is a reserve function and can be selectively used.

Preferably, the first conductive roller 301, the second conductive roller 302, the third conductive roller 303, and the fourth conductive roller 304 are SUS304 steel rollers.

Referring to fig. 2, in the embodiment, the first pure water spray assembly 8 is further included, the first pure water spray assembly 8 is disposed above the second conductive roller 302, and since the upper end of the second conductive roller 302 is located in the air, pure water spraying can be performed on the electroplated copper film 6 passing through the upper end of the second conductive roller 302 by the first pure water spray assembly 8, so that the concentration of copper ions on the second conductive roller 302 is greatly reduced, and copper plating on the second conductive roller 302 is hardly performed; the auxiliary cooling section passes through the copper plating film 6 on the upper end of the second conductive roller 302, shunts the current, fills the gap between the copper plating film 6 and the second conductive roller 302 and eliminates the potential difference therebetween to prevent the ablation of the plated copper film 6 through the hole.

Referring to fig. 2, specifically, the first pure water spray assembly 8 includes a left pure water spray pipe 801 and a right pure water spray pipe 802, the left pure water spray pipe 801 is located above the left side of the second conductive roller 302, the right pure water spray pipe 802 is located above the right side of the second conductive roller 302, the left pure water spray pipe 801 is used for spraying pure water to the electroplated copper film 6 passing through the left side of the upper end of the second conductive roller 302, and the right pure water spray pipe 802 is used for spraying pure water to the electroplated copper film 6 passing through the right side of the upper end of the second conductive roller 302.

Referring to fig. 2, in the present embodiment, in addition to the first pure water spray assembly 8, the second pure water spray assembly 9 is further included, the second pure water spray assembly 9 is disposed between the liquid squeezing roller assembly 2 and the diamond-shaped conductive roller assembly 3, and the second pure water spray assembly 9 sprays pure water on the squeezed electroplated copper film 6, so as to greatly reduce the concentration of copper ions on the conductive roller, make the conductive roller hardly plated with copper, and assist in cooling the film at this stage and shunt current.

Referring to fig. 2, specifically, the second pure water spray assembly 9 includes a front pure water spray pipe 901 and a back pure water spray pipe 902, the front pure water spray pipe 901 is located on the upper side of the film running path of the electroplated copper film 6, the back pure water spray pipe 902 is located on the lower side of the film running path of the electroplated copper film 6, the front pure water spray pipe 901 is used for spraying pure water on the front side of the electroplated copper film 6 after liquid squeezing, and the back pure water spray pipe 902 is used for spraying pure water on the back side of the electroplated copper film 6 after liquid squeezing.

Referring to fig. 2, a water outlet 402 is disposed at the bottom of the liquid receiving tank 4, and the flow rate of pure water discharged from the water outlet 402 is the same as the sum of the flow rates of pure water sprayed into the liquid receiving tank 4 by the first pure water spraying component 8 and the second pure water spraying component 9, so that the concentration of copper ions in the liquid receiving tank 4 is always at a low level, thereby preventing the conductive roller from being plated with copper.

It will be understood that modifications and variations can be made by persons skilled in the art in light of the above teachings and all such modifications and variations are intended to be included within the scope of the invention as defined in the appended claims.

The invention is described above with reference to the accompanying drawings, which are illustrative, and it is obvious that the implementation of the invention is not limited in the above manner, and it is within the scope of the invention to adopt various modifications of the inventive method concept and technical solution, or to apply the inventive concept and technical solution to other fields without modification.

Claims (10)

1. The plated film conducting device is characterized by comprising a head end acid liquor spraying assembly, a liquid squeezing roller assembly, a diamond-shaped conducting roller assembly, a liquid receiving tank and a tail end acid liquor spraying assembly, pure water is stored in the liquid receiving tank, the diamond-shaped conducting roller assembly is soaked in the pure water, and an electroplated copper film sequentially passes through the head end acid liquor spraying assembly, the liquid squeezing roller assembly, the diamond-shaped conducting roller assembly and the tail end acid liquor spraying assembly.

2. The plated conductive device of claim 1, wherein the head end acid spray assembly comprises a first front side acid spray pipe and a first back side acid spray pipe, the first front side acid spray pipe is located on the upper side of the plated copper film running path, and the first back side acid spray pipe is located on the lower side of the plated copper film running path;

the tail end acid liquor spraying assembly comprises a second front side acid liquor spraying pipe and a second back side acid liquor spraying pipe, the second front side acid liquor spraying pipe is located on the upper side of a film travelling path of the electroplated copper film, and the second back side acid liquor spraying pipe is located on the lower side of the film travelling path of the electroplated copper film.

3. The plated conductive device according to claim 1, wherein the squeeze roller assembly comprises a first squeeze roller and a second squeeze roller, the second squeeze roller is located above the first squeeze roller, the second squeeze roller is closer to the liquid receiving tank than the first squeeze roller, the electroplated copper film sequentially crosses the first squeeze roller and the second squeeze roller, and the wrap angles of the electroplated copper film passing through the first squeeze roller and the second squeeze roller are both greater than 90 °.

4. The plated conductive device according to claim 1, wherein the diamond-shaped conductive roller assembly comprises a first conductive roller, a second conductive roller, a third conductive roller and a fourth conductive roller, central axes of the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are respectively located at four vertexes of a same diamond, the electroplated copper film sequentially crosses the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller, and wrap angles of the electroplated copper film passing through the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are all greater than 90 °.

5. The coated conductive device according to claim 4, wherein the radii of the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller are all C, and the distance between the first conductive roller and the second conductive roller, the distance between the first conductive roller and the third conductive roller, the distance between the fourth conductive roller and the second conductive roller and the distance between the fourth conductive roller and the third conductive roller are all less than C.

6. The coated conducting device according to claim 4, wherein the first conducting roller, the second conducting roller, the third conducting roller and the fourth conducting roller are divided into two rows, the first conducting roller is located at the left side of the lower row, the second conducting roller is located at the left side of the upper row, the third conducting roller is located at the right side of the lower row, the fourth conducting roller is located at the right side of the upper row, the first conducting roller and the third conducting roller are soaked in the pure water, and the lower end of the second conducting roller and the lower end of the fourth conducting roller are soaked in the pure water.

7. The plating conductive apparatus according to claim 6, further comprising a first pure water spray unit disposed above the second conductive roller, the first pure water spray unit spraying pure water to the electroplated copper film passing through the upper end of the second conductive roller.

8. The coated conducting device according to claim 7, further comprising a second pure water spray assembly, wherein the second pure water spray assembly is arranged between the liquid squeezing roller assembly and the diamond-shaped conducting roller assembly, and the second pure water spray assembly sprays pure water on the electroplated copper film after liquid squeezing.

9. The coated conducting device according to claim 8, wherein a drain outlet is arranged at the bottom of the liquid receiving tank, and the flow rate of pure water discharged from the drain outlet is equal to the sum of the flow rates of pure water sprayed into the liquid receiving tank by the first pure water spraying component and the second pure water spraying component.

10. The coated conductive device according to claim 4, wherein a circulation cooling pipe is provided inside the first conductive roller, the second conductive roller, the third conductive roller and the fourth conductive roller.

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