JP2011202219A - Method for electroplating long-sized conductive substrate, and apparatus for the same, metallized polyimide film, and method for producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for forming a metallic layer such as copper which has excellent flexibility compatible with COF (chip-on-film) mounting as a metallized polyimide film when the metallic layer is formed on a long-sized conductive substrate such as a polyimide film with metallic thin film layer.SOLUTION: Every time immersion of the polyimide film F with metallic thin film layer unwound from an unwinding roll 1 into a plating solution 4a is repeated, water of 10-32°C is supplied to feeding rollers 3a, 3b, 3c, 3d from first water supply nozzles 8a, 8b, 8c, 8d, and the water of 10-32°C is supplied from a second water supply nozzle 10 on the plated surface of the metallized polyimide film S after the electroplating is completed and before the metallized polyimide film S is wound by a winding roll 7.

Description

  The present invention relates to an electroplating method and an electroplating apparatus for a long conductive substrate, a method for producing a metallized polyimide film using the electroplating method for a long conductive substrate, and a metallized polyimide film obtained by the method. About.

  A metallized polyimide film is a film in which a metal layer is formed on at least one surface of a polyimide film. In recent years, it has been widely used as a semiconductor mounting substrate for mounting a driving semiconductor for displaying an image on a liquid crystal screen. Yes. A polyimide film as a base material for a metallized polyimide film has excellent heat resistance and is inferior to other plastic materials in mechanical, electrical and chemical characteristics.

  Therefore, the metallized polyimide film is an insulating substrate material for electronic parts such as a printed wiring board (PWB), a flexible printed wiring board (FPC), a tape for automatic tape bonding (TAB), and a chip on film (COF). It is often used as. Among these, COF using a metallized polyimide film has attracted attention as a method for mounting a driver IC chip for displaying a liquid crystal screen.

  The COF can be mounted with a fine pitch as compared with TCP (Tape Carrier Package), which is a conventional mounting method, and is an easy mounting method for reducing the size and cost of the driver IC. As a manufacturing method of this COF, a metallized polyimide film using copper as a metal layer is used, so-called subtractive method, that is, the copper layer is subjected to fine patterning by a photolithography technique, and further, tin plating is applied to a desired portion. In addition, a method obtained by coating a solder resist is common.

  The metallized polyimide film includes a three-layer metallized polyimide film in which a metal foil and a polyimide film are bonded using an adhesive, and a two-layer metal in which a metal film layer is formed directly on the surface of the polyimide film without using an adhesive. There is a polyimide film. The demand for a double-layer metallized polyimide film without an adhesive layer is required because a material that uses the inherent stability of polyimide is obtained without being affected by the adhesive layer, while a substrate capable of drawing fine wiring is required. Is growing.

  When manufacturing a two-layer metallized polyimide film, as a method of forming a metal film layer on the polyimide film surface, for example, a nickel alloy base metal thin film made of a nickel chromium alloy or the like is formed by a dry plating method such as a sputtering method. And in order to give good electroconductivity on it, a copper thin film is formed and it is set as a metal thin film layer. Next, in order to thicken the film for circuit formation, a copper layer is formed on the metal thin film layer by an electroplating method or a method using both electroplating and electroless plating, and consists of a base metal thin film and a copper thin film. Forming a metal film layer in which a copper layer is laminated on a metal thin film layer is performed.

  In addition, as a thickness of the metal thin film layer which consists of a base metal thin film and a copper thin film formed by the said sputtering method, 100-500 nm is common. Moreover, the thickness of the copper layer formed by electroplating or the like is generally 5 to 12 μm when a circuit is formed by, for example, a subtractive method.

  Here, when a copper layer is formed on the metal thin film layer by electroplating, for example, a plurality of plating tanks to which a copper plating solution is supplied are arranged side by side in the transport direction of the film-like substrate, and the cathodes are placed in each plating tank. A continuous plating apparatus is used that has an anode disposed so as to face the plating surface that plays a role, and a power feeding unit that supplies power to each plating tank and a mechanism for continuously transporting the film-like substrate. Yes.

  For example, as described in Patent Document 1, a plurality of plating tanks having an anode and an electrolytic solution are arranged, and a polyimide film with a metal thin film layer composed of a base metal thin film and a copper thin film is sequentially and continuously added to the plurality of plating tanks. While supplying, a uniform and good copper layer can be continuously formed by controlling the energization amount for each plating tank and sequentially increasing the energization amount in each plating tank in the order in which the films are supplied. .

JP 2009-026990 A

  A two-layer metallized polyimide film in which a metal layer is directly formed on a polyimide film without using an adhesive may be bent and used when a liquid crystal display driver IC chip is mounted by COF. However, the two-layer metallized polyimide film manufactured by the conventional method described above, for example, the method described in Patent Document 1 above, may be inferior in flexibility in a metal layer such as copper formed by electroplating. In some cases, problems such as wire breakage occurred during mounting.

  The present invention has been made in view of such a conventional problem, and is formed when a metal layer such as a copper layer is formed by electroplating on a long conductive substrate such as a polyimide film with a metal thin film layer. There is no problem in the appearance of the surface of the metal layer formed, and a method of forming a metal layer such as copper having excellent flexibility that can be mounted on a COF as a two-layer metallized polyimide film by electroplating. The purpose is to provide.

  In order to achieve the above object, the method of electroplating a long conductive substrate provided by the present invention is to apply a long conductive substrate unwound from an unwinding roll by a roll-to-roll method to a plating solution in a plating tank. In the method of electroplating a long conductive substrate that is repeatedly immersed and in contact with a power supply roll provided outside the plating tank before being immersed, and wound on a winding roll, the long conductive substrate is Each time the immersion in the plating solution is repeated, water at a temperature of 10 ° C. to 32 ° C. is supplied to the surface of the power supply roll that comes into contact, and the electroplating in the plating tank is completed before being wound on the take-up roll Water having a temperature of 10 ° C. to 32 ° C. is supplied to the surface of the conductive substrate that has been electroplated.

  In addition, the electroplating apparatus for a long conductive substrate provided by the present invention repeatedly immerses a long conductive substrate unwound from an unwinding roll by a roll-to-roll method in a plating solution in a plating tank. In the electroplating device for long conductive substrates that are electroplated while being in contact with the power supply roll provided outside the plating tank and wound on the take-up roll, the long conductive substrate is immersed in the plating solution. The first water supply nozzle that supplies water at a temperature of 10 ° C. to 32 ° C. to the surface of the power supply roll that contacts each time is repeated, and the long conductive before the electroplating in the plating tank is completed and wound up on the take-up roll And a second water supply nozzle for supplying water at a temperature of 10 ° C. to 32 ° C. on the surface of the conductive substrate that has been electroplated.

  Furthermore, the present invention provides a method for electroplating a long conductive substrate according to the present invention as described above, wherein a dry thin film layer is formed on the long conductive substrate without using an adhesive on at least one surface of the long polyimide film. Provided is a method for producing a metallized polyimide film characterized by using a polyimide film with a metal thin film layer formed by a plating method and performing copper electroplating on the surface of the metal thin film layer of the polyimide film with a metal thin film. .

  ADVANTAGE OF THE INVENTION According to this invention, metal layers, such as a copper layer excellent in the softness | flexibility, can be formed on the surface of elongate conductive substrates, such as a polyimide film with a metal thin film layer, by the electroplating method. In particular, a metallized polyimide film comprising a copper layer formed according to the present invention is not broken even when bent with a chip-on-film (COF), which is extremely effective for mass production and cost reduction. is there.

It is a schematic sectional drawing which shows one specific example of the continuous electroplating apparatus used with the electroplating method of the elongate conductive substrate by this invention. FIG. 2 is a schematic cross-sectional view showing an enlarged vicinity of a power supply roll in FIG. 1.

  In the method for electroplating a long conductive substrate according to the present invention, the continuous conductive substrate is repeatedly immersed in the plating solution while being transported between the unwinding roll and the winding roll by a roll-to-roll method. When performing plating, each time the long conductive substrate is repeatedly immersed in the plating solution, water is supplied to the surface of the power supply roll which comes into contact with the surface, and the electroplating is completed and the winding roll is supplied. Water having a temperature of 10 ° C. to 32 ° C. is also supplied to the surface of the long conductive substrate that has been electroplated before being wound on the substrate.

  As a typical long conductive substrate, a polyimide film with a metal thin film layer before forming a copper layer to obtain a metallized polyimide film, that is, Ni, Cr without using an adhesive on the surface of the polyimide film There is a polyimide film with a metal thin film layer in which a metal thin film layer made of a metal such as Cu or an alloy thereof is formed by a dry plating method. In addition, a metal strip such as a copper foil can be used.

  Regarding the electroplating method and apparatus for a long conductive substrate of the present invention, a case where a polyimide film with a metal thin film layer is used as a long conductive substrate and a copper layer is electroplated as a metal thin film layer on the surface is taken as an example. explain in detail.

  FIG. 1 is a specific example of a continuous electroplating apparatus used in the electroplating method for a long conductive substrate according to the present invention. The polyimide film F with a metal thin film layer is unwound from the unwinding roll 1 and is immersed in the plating solution 4a in the plating tank 4 through the guide roll 2a and the power supply roll 3a. The polyimide film F with a metal thin film layer that has entered the plating tank 4 goes out of the plating tank 4 by the guide roll 2b through the reverse roll 5a. Thus, the polyimide film F with a metal thin film layer repeats the immersion to a plating solution several times (in FIG. 1 4 times), and a copper layer is formed on the surface in the meantime.

  An electroplating circuit (plating cell) is constituted by each power supply roll and a corresponding pair of anodes. Specifically, the power supply roll 3a and the pair of anodes 6a and 6a constitute a plating cell, and similarly, the power supply roll 3b and the anodes 6b and 6b, the power supply roll 3c and the anodes 6c and 6c, and the power supply roll 3d and the anode. 6d and 6d constitute an electroplating circuit (plating cell). As the anode, a known oxygen-free phosphorous copper or insoluble anode can be used, and a plating solution corresponding to the anode may be used as the plating solution.

  Each of the power supply rolls 3a, 3b, 3c, and 3d is connected to an individual power supply device (not shown), and contacts the metal thin film layer of the polyimide film F with the metal thin film layer to supply electric power necessary for electroplating. . The amount of current supplied to each of the power supply rolls 3a, 3b, 3c, 3d and each of the anodes 6a, 6a, 6b, 6b, 6c, 6c, 6d, 6d is along the path along which the polyimide film F with a metal thin film layer is conveyed. By sequentially increasing the thickness, a uniform and good electroplating layer such as a copper layer can be formed.

  As described above, the polyimide film F with a metal thin film layer is repeatedly immersed in the plating solution 4a while being transported at a transport speed of several meters to several tens of meters / minute, so that the final film thickness is several on the surface. A copper layer of μm to 12 μm is formed. The metal thin film layer-attached polyimide film F on which the copper layer is formed is wound around the take-up roll 7 as a metallized polyimide film S.

  In this invention, 1st water supply nozzle 8a, 8b, 8c, 8d for supplying water with a temperature of 10 to 32 degreeC to each feed roll 3a, 3b, 3c, 3d is provided. The polyimide film F with a metal thin film layer can be cooled by supplying water having a temperature of 10 ° C. to 32 ° C. from the first water supply nozzles 8a, 8b, 8c, and 8d. The supply of water from the first water supply nozzle 8a mainly has a cleaning action rather than a cooling action of the polyimide film F with a metal thin film layer.

  It is preferable to provide water receiving tanks 9a, 9b, 9c and 9d below the first water supply nozzles 8a, 8b, 8c and 8d, respectively. By receiving the supplied water in the water receiving tanks 9a, 9b, 9c, 9d, it is possible to eliminate the mixing of water into the plating solution 4. If the plating solution is supplied from each of the first water supply nozzles, it is not necessary to provide a water receiving tank. However, if the plating solution is supplied from the first water supply nozzle, there is a concern that the power supply roll is contaminated, which is not preferable.

  The electroplating of the polyimide film F with the metal thin film layer in the plating tank 4 is completed, and the metallized polyimide film S on which the copper layer is formed has a temperature of 10 ° C. from the second water supply nozzle 10 provided near the outlet of the plating tank 4. By supplying water at ˜32 ° C. to the surface on which electroplating has been performed, the surface is cooled before being wound on the winding roll 7. The metalized polyimide film S that has received water from the second water supply nozzle 10 is preferably sandwiched between nip rolls (not shown) to remove water. Further, a water receiving tank 9e that receives water supplied from the second water supply nozzle 10 may be provided.

  The supply of water from the water supply nozzle to the power supply roll is preferably performed via another roll or brush. For example, as shown in FIG. 2 in which the vicinity of the power supply roll 3b of the continuous plating apparatus of FIG. 1 is enlarged, a power supply roll brush 11b is provided in contact with the surface of the power supply roll 3b, and the power supply roll brush 11b is provided from the first water supply nozzle 8b. The supplied water having a temperature of 10 ° C. to 32 ° C. can be further supplied to the power supply roll 3b. In addition, you may supply water directly to a feed roll from a water supply nozzle, without passing a roll and a brush.

  For example, as shown in FIG. 2, the polyimide film with a metal thin film layer that has been supplied with water from the first cooling water nozzle is sandwiched between the power supply roll 3b and the nip roll 12b to remove water. Further, by providing a brush such as a power supply roll brush or another roll, the effect of cleaning the power supply roll can be obtained.

  Further, in the present invention, every time the long conductive substrate is repeatedly immersed in the plating solution, the long conductive substrate is electroplated on the transport path of the long conductive substrate before reaching the power supply roll. It is preferable to supply water having a temperature of 10 ° C. to 32 ° C. to the surface.

  For example, as shown in FIG. 2, the 3rd water supply nozzle 13b is installed separately from the 1st water supply nozzle 8b, and the water of temperature 10 to 32 degreeC is directly supplied to the metal thin film layer of the polyimide film F with a metal thin film layer. To do. Water is supplied from the third water supply nozzle 13b to the metal thin film layer of the polyimide film F with the metal thin film layer before the polyimide film F with the metal thin film layer contacts the power supply roll 3b.

  By supplying water from the third water supply nozzle, the cooling effect of the polyimide film with a metal thin film layer can be further enhanced. If the plating solution is supplied from the third water supply nozzle, it is not necessary to provide a water receiving tank. However, it is not preferable to supply the plating solution from the third water supply nozzle because there is a concern of contamination of the power supply roll.

  The first water supply nozzle, the second water supply nozzle, and the third water supply nozzle described above need only be able to supply water generally in the axial direction of the power supply roll, the width direction of the polyimide film with the metal thin film layer, and the metallized polyimide film. The shape and arrangement can be selected as appropriate. For example, the shape of the nozzle can be elongated or a plurality of nozzles can be arranged in a straight line so that water can be supplied in the axial direction of the power supply roll or in the width direction of the film.

  Since the water supplied from the first water supply nozzle, the second water supply nozzle, and the third water supply nozzle may be mixed into the plating solution, attention must be paid to purity. Therefore, the supplied water is preferably pure water from which ions and the like that are not preferable in the plating solution are removed. The pure water to be used can be produced by a pure water production apparatus equipped with a known pure water cooling mechanism. The pure water cooling mechanism only needs to be able to control the temperature of water at 10 ° C. to 32 ° C. by performing cooling using industrial water, watering, etc., or performing heat exchange using a known chiller. The amount of water to be supplied can be appropriately selected from the water temperature and the appearance of electroplating. However, it must be avoided that the metal thin film layer of the polyimide film with the metal thin film layer is deformed by the pressure of water sprayed from a nozzle or the like.

  With a metal thin film layer outside the electroplating tank by energization of electroplating by supplying water at a temperature of 10 ° C. to 32 ° C. to the power supply roll and the metalized polyimide film from the first water supply nozzle and the second water supply nozzle, respectively. The temperature rise of a polyimide film and a metallized polyimide film can be suppressed. By receiving these water supplies, the polyimide film with a metal thin film layer and the metallized polyimide film outside the plating tank have substantially the same temperature as the supplied water.

  Thus, the copper layer of the metallized polyimide film obtained by the present invention is regulated by JPCA BM03-2006-6.2 by keeping the temperature of the polyimide film with metal thin film layer and the metallized polyimide film low by supplying water. When measured by the method for measuring the elongation of the copper foil (JIS C 1998 appendix A.2.3), the elongation is excellent at a rate of 3.5% or more.

  If it is a metallized polyimide film with an elongation percentage of the copper layer of 3.5% or more, when it is processed into a wiring pattern by a known subtractive method or the like to form a COF substrate, it is bent and attached to a liquid crystal display or the like. Even if the wiring pattern is broken, disconnection and damage of the wiring pattern can be eliminated.

  When the temperature of the water to be supplied exceeds 32 ° C., the elongation rate decreases, and the surface appearance of the copper layer of the resulting metallized polyimide film is deteriorated, and a defect portion is likely to be generated. It becomes easy to crack. On the other hand, when the water temperature falls below 10 ° C., the surface appearance of the copper layer is not affected, but the productivity is lowered due to a decrease in the plating temperature caused by the temperature drop of the polyimide film with the metal thin film layer. This is not preferable because of fear.

  In order to measure the elongation of the copper layer of the metallized polyimide film by the above method, it is necessary to remove the polyimide film. For the removal of the polyimide film, a known polyimide etching method may be used, and the polyimide film can be dissolved and removed using a commercially available polyimide etching solution. For example, if a metallized polyimide film is cut into the shape of a test piece, and the polyimide film is dissolved and removed with a commercially available polyimide etching solution, a foil-like metal is obtained.

  The polyimide film with a metal thin film layer used in the electroplating method of the present invention is a base metal thin film made of a metal such as Ni or Cr or an alloy thereof by a dry plating method without using an adhesive on the surface of the polyimide film. And a copper thin film laminated on the underlying metal thin film. These base metal thin film and copper thin film are formed by using a dry plating method such as a Kochi vapor deposition method or a sputtering method.

  The thickness of the base metal thin film is preferably 3 to 50 nm. If the film thickness is less than 3 nm, when the metal layer of the obtained metalized polyimide film is etched to form a wiring, the etching solution erodes the metal thin film and penetrates between the polyimide film and the metal thin film, and the wiring floats. May be undesirable. On the other hand, if the thickness exceeds 50 nm, the metal layer may not be completely removed when the wiring is formed by etching, and the remaining residue may cause an insulation failure between the wirings.

  The reason why the copper thin film is provided on the base metal thin film is that when the copper layer is directly provided on the base metal thin film by electroplating, the current resistance is high and the current density of electroplating becomes unstable. By providing a copper thin film, the current resistance can be lowered and the current density during electroplating can be stabilized. The thickness of the copper thin film is 10 nm to 1 μm, and preferably in the range of 20 nm to 0.8 μm. If the thickness is less than 10 nm, the energization resistance at the time of electroplating cannot be lowered sufficiently, and if it exceeds 1 μm, it takes too much time to form a film, which deteriorates productivity and impairs economy.

  The electroplating method for a long conductive substrate according to the present invention described above is a metal in which a metal thin film layer is formed by a dry plating method without using an adhesive on at least one surface of a long polyimide film as a long conductive substrate. By using a polyimide film with a thin film layer, it can be used as a method for producing a metallized polyimide film. The continuous plating apparatus described above can also be used as a metallized polyimide film manufacturing apparatus. Further, when a long copper foil is used as the long conductive substrate and electrolytic copper plating is performed, the copper can be thickened by copper plating on the copper foil. The electroplating method of the present invention can also be applied to pattern plating of a known semi-additive method.

  Incidentally, the subtractive method is a method for producing a wiring pattern of a flexible wiring board. A resist layer is provided on the metal film layer surface of the metallized polyimide film, a mask having a predetermined wiring pattern is provided on the resist layer, exposure is performed by irradiating ultraviolet rays from the resist layer, and development is performed to etch the metal. After obtaining the etching mask, the exposed metal is removed by etching, and then the remaining resist layer is removed and washed with water to obtain a wiring pattern.

  The semi-additive method is another method for forming a wiring pattern of a flexible wiring board. A resist layer is provided on the surface of the metal film layer of the metallized polyimide film, a mask having a predetermined wiring pattern is provided on the resist layer, exposed to ultraviolet rays from the resist layer, developed, and developed on the surface of the metal film layer. After obtaining a plating mask for electrodepositing copper, the metal film layer exposed in the opening is electroplated as a cathode to form a wiring portion, and then the resist layer is removed and wiring is performed by soft etching. The wiring pattern is obtained by removing the metal other than the portion to complete the wiring pattern and washing with water.

  Copper electroplating was performed on the polyimide film F with a metal thin film layer so as to have a film thickness of 8 μm using the roll-to-roll continuous electroplating apparatus shown in FIGS. 1 and 2. In addition, the polyimide film F with a metal thin film layer is immersed in the deepest depth of 1 m from the liquid level of a plating solution. A soluble anode (phosphorus deoxygenated copper) was used as the anode. The plating solution has a sulfuric acid concentration of 180 g / l, a copper sulfate concentration of 23 g / l, and a chlorine concentration of 50 mg / l, and a predetermined amount of a commercially available organic additive is added for the purpose of ensuring the smoothness of the copper plating layer. did. The temperature of the plating solution was 27 ° C.

Also, current density, power feed roller 3a and the anode 6a, during 6a is 0.01 A / cm ^2, feed roll 3b and the anode 6b, during 6b is 0.02 A / cm ^2, feed roll 3c and the anode 6c, 6c The gap was set to 0.03 A / cm ² , and the gap between the feeding roll 3 d and the anodes 6 d and 6 d was set to 0.04 A / cm ² .

  A polyimide film F with a metal thin film layer is a 20% Cr-Ni alloy base metal thin film having a thickness of 7 nm on the surface of a polyimide film (registered trademark “Kapton”, manufactured by Toray DuPont) having a width of 50 cm and a thickness of 38 μm by sputtering. And a copper thin film having a thickness of 100 nm were laminated.

  The elongation percentage of the copper layer was measured based on the standard regarding the measurement of the elongation percentage of the copper foil defined in JPCA BM03-2006-6.2. As a test piece for measuring elongation, a foil-like copper layer obtained by cutting a metallized polyimide film according to the above-mentioned JPCA standard and removing the polyimide film portion using a commercially available polyimide etching solution was used.

[Example 1]
Copper electroplating was performed while supplying pure water at a temperature of 29 ° C. from all of the first water supply nozzle, the second water supply nozzle, and the third water supply nozzle of the continuous plating apparatus to obtain a metallized polyimide film.

  When the appearance of the obtained metallized polyimide film was visually observed, there was no problem with the copper color. Moreover, as a result of measuring the elongation rate of the copper foil produced from the obtained metallized polyimide film, the number of measurement samples was 500 and the average value of the elongation rate was 6.47%.

[Example 2]
Copper electroplating was performed in the same manner as in Example 1 except that the temperature of the pure water supplied was 17 ° C. to obtain a metallized polyimide film.

  When the appearance of the obtained metallized polyimide film was visually observed, there was no problem with the copper color. Moreover, as a result of measuring the elongation rate of the copper foil produced from the obtained metallized polyimide film, the number of measurement samples was 500 and the average value of the elongation rate was 8.14%.

[Comparative Example 1]
In the same manner as in Example 1 except that water was not supplied from all of the first water supply nozzle, the second water supply nozzle, and the third water supply nozzle of the continuous plating apparatus, the polyimide film with the metal thin film layer was applied to the copper electric machine. Plating was performed. However, the electroplating was stopped because the surface of the copper plating was discolored.

[Comparative Example 2]
Copper electroplating was performed in the same manner as in Example 1 except that the temperature of the pure water supplied was changed to 33 ° C. to obtain a metallized polyimide film.

  When the appearance of the obtained metallized polyimide film was visually observed, there was no problem with the copper color. Moreover, as a result of measuring the elongation rate of the copper foil produced from the obtained metallized polyimide film, the number of measurement samples was 500 and the average value of the elongation rate was 3.04%.

[Characteristic evaluation of metallized polyimide film]
As can be seen from the results of Examples 1 and 2 and Comparative Examples 1 and 2 described above, in Examples 1 and 2 according to the present invention, there was no discoloration of the electroplated surface of the obtained metalized polyimide film, and the copper layer The average elongation of the steel sheet was 3.5% or more, which cleared the standard for property inspection.

  On the other hand, in the case of Comparative Examples 1 and 2 that are not based on the present invention, Comparative Example 1 in which cooling is not performed by supplying water cannot achieve good copper electroplating, and Comparative Example 2 in which the temperature of supplied water is high is not obtained. The average elongation of the obtained metallized polyimide film did not reach 3.5%, and the standard for property inspection could not be cleared.

F Polyimide film with metal thin film layer S Metalized polyimide film 1 Unwinding roll 2a, 2b, 2c, 2d, 2e Guide roll 3a, 3b, 3c, 3d Feeding roll 4 Plating tank 4a Plating solution 5a, 5b, 5c, 5d Inversion Roll 6a, 6b, 6c, 6d Anode 7 Winding roll 8a, 8b, 8c, 8d 1st water supply nozzle 9a, 9b, 9c, 9d, 9e Water receiving tank 10 2nd water supply nozzle 11b Feed roll brush 12b Nip roll 13b 3rd water supply nozzle

Claims (7)

The long conductive substrate unwound from the unwinding roll by the roll-to-roll method is repeatedly immersed in the plating solution in the plating tank and is in contact with the power supply roll provided outside the plating tank before being immersed. In the method of electroplating a long conductive substrate that is plated and wound on a winding roll,
Each time the long conductive substrate is repeatedly immersed in the plating solution, water at a temperature of 10 ° C. to 32 ° C. is supplied to the surface of the power supply roll that comes into contact with it. A method of electroplating a long conductive substrate, comprising supplying water having a temperature of 10 ° C to 32 ° C to a surface of the long conductive substrate before being taken.   Each time the long conductive substrate is repeatedly immersed in the plating solution, the surface of the long conductive substrate subjected to electroplating on the transport path of the long conductive substrate before reaching the power supply roll has a temperature of 10. The method for electroplating a long conductive substrate according to claim 1, wherein water at a temperature of from 32 ° C. to 32 ° C. is supplied.   The method for electroplating a long conductive substrate according to claim 1 or 2, wherein water is supplied to the power supply roll through a roll or a brush that contacts the surface of the power supply roll.   The said electroplating is copper electroplating, The electroplating method of the elongate conductive substrate in any one of Claims 1-3 characterized by the above-mentioned. The long conductive substrate unwound from the unwinding roll by the roll-to-roll method is repeatedly immersed in the plating solution in the plating tank and is in contact with the power supply roll provided outside the plating tank before being immersed. In electroplating equipment for long conductive substrates that are plated and wound on a winding roll,
A first water supply nozzle that supplies water at a temperature of 10 ° C. to 32 ° C. to the surface of the power supply roll that comes into contact with the long conductive substrate every time it is repeatedly immersed in the plating solution, and the electroplating in the plating tank is completed and wound. A long conductive substrate comprising a second water supply nozzle for supplying water at a temperature of 10 ° C to 32 ° C on the surface of the long conductive substrate before being wound around the take-up roll. Electroplating equipment.   The metal thin film layer which formed the metal thin film layer with the method in any one of Claims 1-4 by the dry-type plating method on the at least one surface of the long polyimide film as an elongate conductive substrate without using an adhesive agent A method for producing a metallized polyimide film, comprising: using a coated polyimide film, and performing copper electroplating on the surface of the metal thin film layer of the polyimide film with a metal thin film.   It is the metallized polyimide film manufactured by the method of Claim 6, Comprising: When the foil-like copper layer obtained by melt | dissolving and removing a polyimide is measured by the method prescribed | regulated to JPCA BM03-2006-6.2 The metallized polyimide film is characterized in that the elongation percentage of the copper layer is 3.5% or more.

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