JPH05156485A - Conductor roll for plating extremely thin metallic foil - Google Patents

Conductor roll for plating extremely thin metallic foil

Info

Publication number
JPH05156485A
JPH05156485A JP34789891A JP34789891A JPH05156485A JP H05156485 A JPH05156485 A JP H05156485A JP 34789891 A JP34789891 A JP 34789891A JP 34789891 A JP34789891 A JP 34789891A JP H05156485 A JPH05156485 A JP H05156485A
Authority
JP
Japan
Prior art keywords
conductor roll
plating
roll
conductor
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP34789891A
Other languages
Japanese (ja)
Inventor
Toshio Sugawara
敏夫 菅原
Tatsuo Tomomori
龍夫 友森
Hiroaki Hironaka
宏明 弘中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyo Kohan Co Ltd
Original Assignee
Toyo Kohan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyo Kohan Co Ltd filed Critical Toyo Kohan Co Ltd
Priority to JP34789891A priority Critical patent/JPH05156485A/en
Publication of JPH05156485A publication Critical patent/JPH05156485A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE:To provide the conductor roll for plating extremely thin metallic foil which hardly generates the trace of the pressing by a level difference between an energizing part and an insulating part. CONSTITUTION:This device consists of a means for disposing closed cellular ceramic layers on the front layer of the conductor roll for the purpose of insulating both sides in an axial direction. The ceramic layers of the conductor roll 3 are constituted of thermally sprayed alumina layers 12. The difference in the coeffts. of thermal expansion and difference in hardness between the energizing part and insulating part of the conductor roll are more approximated and, therefore, the level difference is hardly generated in the boundary part between the energizing part and the insulating part.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、鋼帯等のストリップ表
面に亜鉛等の電気めっきを施すラジアル型めっき設備に
用いるコンダクターロールに関し、さらに詳しくは、極
薄金属箔めっき用コンダクターロールに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductor roll used in a radial type plating facility for electroplating zinc or the like on the strip surface of a steel strip or the like, and more particularly to a conductor roll for ultrathin metal foil plating.

【0002】[0002]

【従来の技術】従来から高速電気めっき用の設備として
用いられているラジアル型めっき装置は、図3に示すよ
うな構成となっている。めっき液槽1とめっき液2内に
一部浸漬されたコンダクターロール3とその上部両サイ
ドにデフレクターロール4,4があり、ストリップ5は
デフレクターロール4、コンダクターロール3、デフレ
クターロール4を介し搬送される。このストリップ5の
通液中に電極6(メインアノード)上にセットされた可
溶性アノード7から通電によりめっき金属が溶出し、あ
るいは不溶性アノードの場合は、めっき液中の金属イオ
ンにより、ストリップ5の片面表面にめっきされる。
2. Description of the Related Art A radial type plating apparatus conventionally used as equipment for high speed electroplating has a structure as shown in FIG. There are conductor rolls 3 partially immersed in the plating solution tank 1 and the plating solution 2 and deflector rolls 4 and 4 on both upper sides thereof, and the strip 5 is conveyed through the deflector roll 4, the conductor roll 3 and the deflector roll 4. It The plating metal is eluted from the soluble anode 7 set on the electrode 6 (main anode) during the passage of the strip 5 by energization, or in the case of an insoluble anode, one side of the strip 5 is formed by the metal ions in the plating solution. The surface is plated.

【0003】従来のラジアルセル型めっき装置のコンダ
クターロールには、浸漬中のめっき液の裏回り防止、コ
ンダクターロールへの被めっき物である亜鉛等の析出防
止のために、絶縁材料として軟質のゴムをコンダクター
ロールの一部に使用していた。
A conductor roll of a conventional radial cell type plating apparatus has a soft rubber as an insulating material in order to prevent backing of a plating solution during immersion and to prevent deposition of zinc or the like to be plated on the conductor roll. Was used as part of the conductor roll.

【0004】また、特公平2ー8037号公報には、金
属等から成る通電リングとゴム部材との間に発生する段
差情報を検出してフィードバックし、冷却媒体温度制御
によりこのような段差を調整するという方法が記載され
ている。
Further, in Japanese Patent Publication No. 2-8037, information on a level difference generated between a current-carrying ring made of metal or the like and a rubber member is detected and fed back, and such a level difference is adjusted by controlling a cooling medium temperature. The method of doing is described.

【0005】又、アイアン アンド スチール エンジニ
ア(Iron and Steel Engineer)の1971年10月
号、54〜58頁には、片面めっき前の処理方法として
ゴム製絶縁部のシール効果により非めっき面とコンダク
ターロールの間へのめっき液浸入防止を図り、更に非め
っき面とコンダクターロールの間に電解液( Protectiv
eFluid Rinse )を点滴する技術が記載されている。
Further, Iron and Steel Engineer, October 1971 issue, p. 54-58, describes a non-plated surface and a conductor roll by a sealing effect of a rubber insulating part as a treatment method before single-sided plating. Between the non-plated surface and the conductor roll (Protectiv
eFluid Rinse) is described.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、浸漬中
のめっき液の裏回り防止、コンダクターロールへの亜鉛
等の析出防止のために、絶縁材料として軟質のゴムを使
用しているコンダクターロールでは、中央の金属製通電
部材とゴム部材の硬度差が大きいため、コンダクターロ
ール仕上げ工程での表面研磨時にゴム部材と金属製通電
部材を同一レベルに仕上げることが困難であった。さら
に、ラインテンションを張った時のゴムの変形、ストリ
ップ通板によるゴムの磨耗、温度変化に対する熱膨張率
の違いのために、金属製通電部材とゴム部材との間に発
生する段差の発生を押さえることも困難であった。しか
も、この状態でコンダクターロールとストリップ間のシ
ールを完全にしようとすれば、極薄金属箔のストリップ
の場合、段差近傍における抗力の影響により筋状の疵
(押さえ跡)が入ったり、不必要に耳伸びしてしまう問
題があった。
However, in the conductor roll using a soft rubber as an insulating material in order to prevent the backing of the plating solution during immersion and the deposition of zinc etc. on the conductor roll, Because of the large hardness difference between the metal conductive member and the rubber member, it was difficult to finish the rubber member and the metal conductive member at the same level during surface polishing in the conductor roll finishing step. In addition, due to the deformation of the rubber when the line tension is increased, the abrasion of the rubber due to the strip passing plate, and the difference in the coefficient of thermal expansion with respect to temperature changes, the occurrence of a step between the metal current-carrying member and the rubber member is prevented. It was also difficult to hold down. Moreover, if it is attempted to completely seal the conductor roll and the strip in this state, in the case of the strip of ultra-thin metal foil, streak-like flaws (holding marks) may be generated or unnecessary due to the influence of the drag force near the step. I had a problem with my ear growing.

【0007】また、金属製通電部材とゴム部材との間に
発生する段差情報を検出してフィードバックし、冷却媒
体温度制御により段差を調整する特公平2ー8037号
公報記載の発明の適用では、段差は通常の板厚のめっき
には支障は少ないが、極薄金属箔のめっきにとっては、
板厚が薄いゆえにラインテンションを張ると極薄金属箔
に容易に押さえ跡が発生してしまう問題があった。さら
に、片面めっき前の処理方法としてゴム製絶縁部のシー
ル効果により非めっき面とコンダクターロールの間への
めっき液浸入防止を図り、更に非めっき面とコンダクタ
ーロールの間に電解液を点滴している前記アイアン ア
ンド スチール エンジニア(Iron and Steel Enginee
r)の記載では、極薄箔ラジアルセルめっきを達成する
手段が開示されていない。
Further, in the application of the invention described in Japanese Patent Publication No. 2-8037, which detects and feeds back the step information generated between the metal energization member and the rubber member, and adjusts the step by controlling the cooling medium temperature, Although the step is not a problem for the plating of normal plate thickness, for plating of ultra-thin metal foil,
Since the plate thickness is thin, there is a problem that when a line tension is applied, pressing marks are easily generated on the ultrathin metal foil. Furthermore, as a treatment method before single-sided plating, the sealing effect of the rubber insulation part prevents the infiltration of the plating solution between the non-plated surface and the conductor roll, and further drip electrolytic solution between the non-plated surface and the conductor roll. The Iron and Steel Enginee
The description of r) does not disclose means for achieving ultrathin foil radial cell plating.

【0008】[0008]

【課題を解決するための手段】本発明は前記課題を達成
するために、ラジアルセルを使用し、ストリップ等の表
面にめっきする電気めっき装置のコンダクターロールに
おいて、電気的絶縁のための無連通孔状態のセラミック
層をコンダクターロール軸方向両サイド表層に配設する
ことを特徴とする手段によってなる。また、本発明は、
コンダクターロールのセラミック層がアルミナ溶射層で
あることを特徴とする。
In order to achieve the above-mentioned object, the present invention uses a radial cell and in a conductor roll of an electroplating apparatus for plating the surface of a strip or the like, a continuous hole for electrical insulation. The ceramic layers in the state are arranged on the surface layers on both sides in the axial direction of the conductor roll. Further, the present invention is
The ceramic layer of the conductor roll is an alumina sprayed layer.

【0009】[0009]

【実施例】以下添付図面に従って、本発明に係る極薄金
属箔電気めっき装置のコンダクターロールの一実施例に
ついて説明する。図1は、本発明実施例の概要を示す線
図である。図2は、本発明実施例のコンダクターロール
の拡大断面図である。図1、2において、コンダクター
ロール3は、中空の金属ロール10の外周中央に通電リ
ング11、その両端にアルミナ溶射部12を有し、内部
の中空部13には、めっき電流によるジュール熱を吸収
するため、中心軸14の一方から供給される冷却水が充
填される。コンダクターロール3は、軸方向両サイドの
絶縁のための無連通孔状態のアルミナ溶射セラミック部
12をコンダクターロール3の表層に配設する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a conductor roll of an ultrathin metal foil electroplating apparatus according to the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a diagram showing an outline of an embodiment of the present invention. FIG. 2 is an enlarged sectional view of the conductor roll according to the embodiment of the present invention. In FIGS. 1 and 2, the conductor roll 3 has a current-carrying ring 11 at the center of the outer circumference of a hollow metal roll 10 and alumina sprayed parts 12 at both ends thereof, and an internal hollow part 13 absorbs Joule heat due to a plating current. Therefore, the cooling water supplied from one of the central shafts 14 is filled. The conductor roll 3 is provided with the alumina sprayed ceramic parts 12 in the state of no communication holes for insulation on both sides in the axial direction on the surface layer of the conductor roll 3.

【0010】通電リング11は、耐食・耐磨耗の面から
ステンレスあるいはハステロイ等の合金鋼が用いられ、
例えば、ハステロイの線膨張率は1.2×10-5/℃で
ある。またコンダクターロール両サイドの絶縁のため従
来用いられていた合成ゴム、例えばウレタンゴムの線膨
張率は17.1×10-5/℃である。これに対し、本発
明で使用するアルミナセラミックでは0.8×10-5
℃でウレタンゴムの値に比べ鉄系材料の値に近いため、
温度変化に対し通電部と絶縁部の段差が生じにくい。そ
して通電リング11のコンダクターロール軸方向幅は、
極薄金属箔ストリップ5の幅より狭く設定し、通電リン
グに余分なめっき付着が生じないようにする。
The current-carrying ring 11 is made of stainless steel or alloy steel such as Hastelloy from the viewpoint of corrosion resistance and wear resistance.
For example, the coefficient of linear expansion of Hastelloy is 1.2 × 10 -5 / ° C. Further, the linear expansion coefficient of synthetic rubber conventionally used for insulating both sides of the conductor roll, such as urethane rubber, is 17.1 × 10 -5 / ° C. On the other hand, in the alumina ceramic used in the present invention, 0.8 × 10 −5 /
Since it is closer to the value of iron-based materials than the value of urethane rubber at ℃,
A difference between the current-carrying part and the insulating part is unlikely to occur due to temperature changes. The conductor roll axial width of the energizing ring 11 is
The width is set to be narrower than the width of the ultra-thin metal foil strip 5 so that extra plating does not adhere to the current-carrying ring.

【0011】また、コンダクターロール3のエンドディ
スク(側部円板)は、従来コンダクターロール3の円筒
絶縁部と同じ軟質ゴムあるいは硬質ゴムなどでライニン
グされていたが、めっき液との電荷の授受を防止し、不
必要なめっき付着を回避するため、FRP(繊維強化プ
ラスチック)を表層にライニングすることが好ましい。
Further, the end disk (side disc) of the conductor roll 3 is conventionally lined with the same soft rubber or hard rubber as that of the cylindrical insulating portion of the conductor roll 3, but the transfer of electric charge with the plating solution is performed. In order to prevent and avoid unnecessary plating adhesion, it is preferable to line FRP (fiber reinforced plastic) on the surface layer.

【0012】本実施例では、アルミナセラミックを絶縁
部に使用する場合は、例えば、プラズマ溶射を用いるこ
とが好ましい。熟練度によって多少の差はあるが、一般
にアルミナ溶射層厚を0.5mm以上、特に好ましくは
0.7mm以上にすると、アルミナ溶射層バルク内のポ
ア(孔)の連通性は失われ、無連通孔のアルミナ溶射部
12となる。
In this embodiment, when alumina ceramic is used for the insulating portion, it is preferable to use plasma spraying, for example. Although there is some difference depending on the skill level, generally, when the alumina sprayed layer thickness is 0.5 mm or more, particularly preferably 0.7 mm or more, the pores in the alumina sprayed layer bulk lose their communication and no communication It becomes the alumina sprayed portion 12 of the hole.

【0013】このように、アルミナセラミック層を無連
通孔の層にすることで、アルミナバルクの絶縁性を完全
にすると共に、通電部からのめっき電流を分流すること
なく、より確実に極薄金属箔ストリップ5に通電せし
め、アルミナ溶射部12にめっきされにくく、効率よく
良好なめっき膜を形成することが出来る。
As described above, by forming the alumina ceramic layer as a layer having no communication hole, the insulation property of the alumina bulk is perfected, and the plating current from the current-carrying portion is not shunted, so that the ultrathin metal can be more reliably formed. By energizing the foil strip 5, the alumina sprayed portion 12 is less likely to be plated, and a good plated film can be efficiently formed.

【0014】また図2において、12Aは、アルミナセ
ラミック溶射層、5は例えば20μm〜100μm程度
の厚さを有するストリップ、11は通電リング、12B
はアルミナセラミック12Aを溶射する基部である。
In FIG. 2, reference numeral 12A is an alumina ceramic sprayed layer, 5 is a strip having a thickness of, for example, about 20 μm to 100 μm, 11 is an energizing ring, and 12B.
Is a base for spraying the alumina ceramic 12A.

【0015】本発明によれば、ラジアルセルめっき装置
のコンダクターロールの両サイドの絶縁のために設けら
れる無連通孔状態のセラミック層の熱膨張率や硬度を中
央部の通電部の熱膨張率や硬度の値に従来技術の場合よ
りも近づけることができる。したがって、温度変化のい
かんにかかわらず、コンダクターロールの通電部と絶縁
部の境界が連続し、表面層をよりシリンドリカルなコン
ダクターロールにすることができる。そして、通電によ
るジュール熱を良好に吸収し、デフレクターロールから
搬送されてきた極薄金属箔と良好にマッチングさせるこ
とが出来る。
According to the present invention, the coefficient of thermal expansion and hardness of the ceramic layer in the state of no-communication holes provided for the insulation of both sides of the conductor roll of the radial cell plating apparatus are determined by The hardness value can be brought closer than in the case of the prior art. Therefore, the boundary between the conducting portion and the insulating portion of the conductor roll is continuous regardless of the temperature change, and the surface layer can be a more cylindrical conductor roll. Then, Joule heat due to energization can be absorbed well, and can be matched well with the ultrathin metal foil conveyed from the deflector roll.

【0016】[0016]

【発明の効果】以上説明したように本発明による極薄箔
ラジアルセルめっき装置のコンダクターロールによれ
ば、コンダクターロール通電部と絶縁部の熱膨張率差・
硬度差を従来より近接させたので、通電部と絶縁部の境
界部分に段差が生じにくく、極薄箔も押さえ跡の発生を
なくし、良好にめっきできる効果がある。そして、極薄
金属箔ストリップの場合でも、シールを完全にするため
印加されるテンションによって耳延びすることなくめっ
きすることが出来る。またセラミック層が、従来の軟質
ゴムに比べて本来的に経時変化しにくいため、これを逐
次更新する手間が省けメンテナンスフリーなコンダクタ
ーロールを提供することが出来る。
As described above, according to the conductor roll of the ultra-thin foil radial cell plating apparatus according to the present invention, the difference in the coefficient of thermal expansion between the conductor roll energizing part and the insulating part
Since the difference in hardness is made closer than in the conventional case, a step is unlikely to occur at the boundary between the current-carrying part and the insulating part, and even an ultrathin foil has the effect of suppressing the generation of pressing marks and being able to perform good plating. And, even in the case of an ultra-thin metal foil strip, it is possible to plate without tension by the tension applied to complete the seal. Further, since the ceramic layer is inherently less likely to change with time as compared with the conventional soft rubber, it is possible to provide a maintenance-free conductor roll that saves the trouble of sequentially renewing it.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す概略図。FIG. 1 is a schematic diagram showing an embodiment of the present invention.

【図2】本発明の実施例におけるコンダクターロールの
拡大断面図。
FIG. 2 is an enlarged sectional view of a conductor roll according to an embodiment of the present invention.

【図3】従来例のラジアルめっき設備を説明する概要
図。
FIG. 3 is a schematic diagram illustrating a conventional radial plating facility.

【符号の説明】[Explanation of symbols]

3…コンダクターロール 5…ストリップ(極薄金属箔ストリップ) 12…アルミナ溶射部 12A…アルミナ溶射層 3 ... Conductor roll 5 ... Strip (ultra-thin metal foil strip) 12 ... Alumina sprayed portion 12A ... Alumina sprayed layer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 ラジアルセルを使用し、ストリップの表
面にめっきをする電気めっき装置のコンダクターロール
において、電気的絶縁のための無連通孔状態のセラミッ
ク層を、前記コンダクターロール軸方向両サイド表層に
配設することを特徴とする極薄金属箔めっき用コンダク
ターロール。
1. In a conductor roll of an electroplating apparatus for plating the surface of a strip using a radial cell, a ceramic layer in a state of no communication holes for electrical insulation is provided on both side surface layers in the axial direction of the conductor roll. A conductor roll for plating an ultra-thin metal foil, which is characterized by being arranged.
【請求項2】 前記コンダクターロールのセラミック層
がアルミナ溶射層であることを特徴とする請求項1の極
薄金属箔めっき用コンダクターロール。
2. The conductor roll for ultrathin metal foil plating according to claim 1, wherein the ceramic layer of the conductor roll is an alumina sprayed layer.
JP34789891A 1991-12-02 1991-12-02 Conductor roll for plating extremely thin metallic foil Pending JPH05156485A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34789891A JPH05156485A (en) 1991-12-02 1991-12-02 Conductor roll for plating extremely thin metallic foil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34789891A JPH05156485A (en) 1991-12-02 1991-12-02 Conductor roll for plating extremely thin metallic foil

Publications (1)

Publication Number Publication Date
JPH05156485A true JPH05156485A (en) 1993-06-22

Family

ID=18393353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34789891A Pending JPH05156485A (en) 1991-12-02 1991-12-02 Conductor roll for plating extremely thin metallic foil

Country Status (1)

Country Link
JP (1) JPH05156485A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20020001079A (en) * 2000-06-24 2002-01-09 이구택 Device for preventing conductor roll band mark
JP2004035985A (en) * 2002-07-08 2004-02-05 Kawasaki Heavy Ind Ltd Apparatus for plating surface of metallic foil
KR100426861B1 (en) * 1999-06-16 2004-04-13 주식회사 포스코 Mitigation of band mark of conductor roll for electrogilding
KR100758438B1 (en) * 2001-05-10 2007-09-14 주식회사 포스코 Apparatus for removing step from rolls in electric plating cell by using rubber tubes

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100426861B1 (en) * 1999-06-16 2004-04-13 주식회사 포스코 Mitigation of band mark of conductor roll for electrogilding
KR20020001079A (en) * 2000-06-24 2002-01-09 이구택 Device for preventing conductor roll band mark
KR100758438B1 (en) * 2001-05-10 2007-09-14 주식회사 포스코 Apparatus for removing step from rolls in electric plating cell by using rubber tubes
JP2004035985A (en) * 2002-07-08 2004-02-05 Kawasaki Heavy Ind Ltd Apparatus for plating surface of metallic foil

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