JP3092929B2 - Ni, Cu coated stainless steel sheet and method for producing the same - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a Ni, Cu-coated stainless steel sheet and a method for producing the same, and more particularly, to a stainless steel sheet used for a negative electrode plate (sealing plate) of a button battery for a primary battery. Ni direction
In the one coated with Cu on the other side,
In particular, the steel base and Ni and the steel base and Cu are firmly bonded to each other to enhance adhesion, improve corrosion resistance and workability, and reduce the thickness of Ni and Cu, thereby reducing costs. It is intended.

2. Description of the Related Art Conventionally, as a method of coating both sides of a steel base of this kind with Ni and Cu, a roll cladding method is generally used. In the roll cladding method, Ni foil and Cu foil produced in advance are supplied to both sides of a steel substrate, and these are rolled and adhered together. Annealing is repeated many times, and the thickness of the Cu foil is reduced to approximately 40 μm and the thickness of the Ni foil is reduced to approximately 16 μm to obtain the Ni coating layer and the Cu coating layer.

Problems to be Solved by the Invention However, in the rolled cladding method, Ni foil and
There is a disadvantage that the Cu foil needs to be manufactured in advance, and the rolling is repeated many times, thereby lowering the yield and increasing the cost. Also, when manufacturing Ni foil and Cu foil, a certain thickness is required, so that the required amount of Ni and Cu is increased, and from this point, there is a disadvantage that the cost is increased.

Instead of the rolling clad method having the above-mentioned problem, a method of coating both surfaces of a steel substrate with Ni and Cu by a plating method has also been provided. That is, a Ni plating layer is formed on one surface of the steel substrate, and a Cu plating layer is formed on the other surface.However, when manufactured by this method, there is a disadvantage that the adhesion between the stainless steel substrate and the plating layer is not good. ing. If the adhesion is not good, if processing is performed, depending on its shape, for example, if it is bent at 180 degrees, the deformation of the stainless steel sheet will be Ni
The plating layer and the Cu plating layer cannot follow each other, and peeling may occur. In addition, since the Ni plating layer is hard and brittle, cracks are liable to occur even in portions where separation is avoided.
Furthermore, even if the amount of plating is increased, the occurrence of pinholes cannot be avoided.

For the above various reasons, the Ni, Cu coated stainless steel sheet provided with the Ni plating layer and the Cu plating layer directly on the surface of the stainless steel substrate has a problem in workability and corrosion resistance.

The present invention has been made in order to solve the above-described problems, and enhances the adhesion between a stainless steel substrate and a Ni plating layer and a Cu plating layer, thereby improving corrosion resistance and workability, and comparing with the rolling clad method. Required Ni amount and Cu
By reducing the amount and reducing the number of work processes,
The aim is to significantly reduce costs.

Means for Solving the Problems In order to achieve the above object, the present invention is to continuously apply Ni plating on one surface of a stainless steel plate and Cu plating on the other surface, and then perform bright annealing in a non-oxidizing atmosphere gas. After forming a diffusion layer of Ni and a steel base and a diffusion layer of Cu and a steel base, temper rolling is performed, and a metallurgically bonded diffusion layer is formed on the stainless steel base to form a diffusion layer. An object of the present invention is to provide a Ni, Cu-coated stainless steel sheet which has improved adhesion between a plating layer and a Cu plating layer and has excellent corrosion resistance and workability, and a method for producing the same.

Specifically, a stainless steel substrate is provided with a Ni metal plating layer on one side and a Cu metal plating layer on the other side, and a diffusion layer of stainless steel and Ni, a stainless steel substrate, between the stainless steel substrate and the Ni metal plating layer. Between stainless steel and Cu diffusion layer or stainless steel
An object of the present invention is to provide a Ni, Cu-coated stainless steel sheet comprising a diffusion layer of Ni and Cu.

Further, the present invention provides a stainless steel
Ni plating through strike plating and Ni plating through Ni or Cu strike plating on the other side, Ni plating layer on one side of stainless steel base,
Provide a Cu plating layer on the other surface, and then perform bright annealing in a non-oxidizing atmosphere gas,
A diffusion layer of stainless steel and Ni, a diffusion layer of stainless steel and Cu, and a diffusion layer of stainless steel, Ni and Cu are formed when the main nickel plating is performed on the surface of Ni strike plating. It is intended to provide a method for producing a Ni, Cu-coated stainless steel sheet, characterized by performing temper rolling.

In the above-described Ni, Cu-coated stainless steel sheet and the method of manufacturing the same, the Ni provided on one of the front and back surfaces of the stainless steel substrate
The thickness of the metal plating layer is 0.5 to 6.0 μm, and the Cu
The thickness of the metal plating layer is 2 to 20 μm, the overall thickness formed through temper rolling is 0.05 mm to 0.8 mm, and the diffusion layer of stainless steel and Ni, stainless steel and Cu
So that the thickness of each diffusion layer composed of a diffusion layer of stainless steel and Ni and Cu is 0.1 to 5.0 μm, and the annealing conditions are continuous annealing time of 0.5 to 15 minutes and annealing temperature of 600 ° C. to 900 ° C. , H
It is performed an annealing processing in N ₂ 95% to 25% of the gas non-oxidizing atmosphere at a _25% to 75%.

Furthermore, after forming the Ni and Cu plating layers, annealing and temper rolling are performed an arbitrary number of times, and after the final temper rolling, again, the Ni plating layer is subjected to Ni plating and the Cu plating layer is subjected to Cu plating. It is preferable to form a plating layer on the outermost layer in order to embed foreign substances that easily adhere to the surface during temper rolling or the like.

Furthermore, after the above-mentioned plating, the first temper rolling may be performed before annealing, and then the above-mentioned annealing and the second temper rolling may be performed.

The Ni, Cu coated stainless steel sheet according to the present invention is provided with a stainless steel and Ni diffusion layer and a stainless steel and Cu diffusion layer between the stainless steel substrate and the Ni metal plating layer and the Cu metal plating layer, respectively. Because of the diffusion layer, the adhesion between the stainless steel substrate and the Ni metal plating layer and the Cu metal plating layer is increased by the diffusion layer, and peeling of the plating layer during processing that occurs in the case of the coating method of Ni and Cu by the plating method is prevented. It can be prevented reliably. And, in order to form a Ni, Cu coating layer by a plating method, a Ni foil and a Cu foil are provided in advance, compared with the rolling cladding method in which the steel is supplied to both sides of a stainless steel substrate and repeatedly rolled. In addition to greatly shortening the work process, the thickness of the Ni plating layer and Cu plating layer can be reduced to about 1/4 compared with the case of using the rolled cladding method, thereby achieving a significant cost reduction. You can do it.

Hereinafter, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a cross-sectional view of a Ni, Cu-coated stainless steel sheet 1 according to a first embodiment of the present invention, where 2 is a stainless steel base,
Reference numeral 3 denotes a stainless steel and Ni diffusion layer (hereinafter, referred to as A) laminated on one of the front and back surfaces of the stainless steel substrate 2 (hereinafter, referred to as A surface).
4 is a stainless steel laminated on the other surface of the stainless steel substrate 2 (hereinafter referred to as surface B).
A diffusion layer of Ni and Cu (hereinafter, referred to as a SUS-Ni-Cu diffusion layer), 5 is a Ni metal plating layer laminated on the surface of the SUS-Ni diffusion layer 3, and 6 is the SUS-Ni-Cu diffusion layer. 4 is a Cu metal plating layer laminated on the surface of No. 4.

The thickness of the Ni, Cu coated stainless steel sheet 1 having the above configuration is 0.05 to 0.8 mm, the sheet width is 10 mm to 800 mm, the thickness of the Ni metal plating layer 5 is 0.5 to 6.0 μm, and the thickness of the Cu metal plating layer 6. The thickness is 2 to 20 μm, and the thickness of the SUS-Ni diffusion layer 3 and the SUS-Ni-Cu diffusion layer 4 is 0.1 to 5.0 μm.

The Ni, Cu coated stainless steel plate 1 is manufactured according to the flowchart shown in FIG. 3, and as shown in FIG. 2, the Ni strike plating layer 7 and the B surface After the Ni strike plating layer 8 is formed, the Ni main plating layer 9 is formed by thick plating on the A side, and the Cu main plating layer 10 is formed by thick plating on the B side. After these plating steps are completed, a non-oxidizing atmosphere gas (H ₂
5% to 75%, in N ₂ 95% to 25%), annealing temperature 600 ° C. to 900
℃, continuous annealing time of 0.5 to 15 minutes, SUS-Ni diffusion layer 3 between stainless steel substrate 2 and Ni plating layer,
SUS-Ni-Cu between stainless steel substrate 2 and Cu plating layer
The diffusion layer 4 is formed, and then temper rolling is performed to complete the Ni, Cu-coated stainless steel sheet 1 shown in FIG.

Referring to FIG. 3, the manufacturing method will be described in detail below. First, the stainless steel substrate 2 wound around a coil is unwound from a coil dispenser, subjected to electrolytic degreasing, washed with water, and then activated. Process. The electrolytic degreasing treatment is performed by dipping in a mixed solution of sodium orthosilicate and sodium hydroxide, and the activation treatment is performed by dipping in a 10% hydrochloric acid solution.

After the activation treatment, a water washing treatment is performed, and then one side (A
Is transferred to the Ni strike plating tank, and the A side of the stainless steel base 2 is subjected to Ni strike plating, and then sent to the next Ni strike plating tank, and the B strike of the strike base 2 is subjected to Ni strike plating.

The strike plating method performed on each of the A and B surfaces of the stainless steel substrate 2 one by one and the thick plating method performed on one surface described below are described in May 15, 1990 by the present applicant.
A plating method using a single-sided plating apparatus and the like disclosed in “Ni-plated steel sheet, molded article made of the Ni-plated steel sheet and a method of manufacturing the same” concerning the Japanese Patent Application can be appropriately adopted. still,
Needless to say, strike plating may be performed simultaneously on the A side and the B side.

The Ni strike plating on the A and B surfaces of the stainless steel substrate 2 is 200 g / ~ 300 g / Ni chloride and 70 g / ~ hydrochloric acid.
It is plated by electrolytic plating using a plating solution of 200 g /. The Ni strike plating is 0.05 ~ on both sides A and B
Electrodeposited with a thickness of 0.2 μm. This Ni strike plating removes the passivation film on the surface of the stainless steel substrate 2 and improves the adhesion of the thick plating layer performed in a later step.

After Ni strike plating is applied to the A side and the B side described above, a water washing treatment is performed, then, the A side is subjected to the Ni main plating, and subsequently, the B side is subjected to the Cu main plating.

The above Ni plating (Ni thick plating) is Ni sulfate 200g / ~ 3
Electrodeposit a plating solution of 00g /, Ni chloride 40g / ~ 60g /, boric acid 35g / ~ 55g / by electroplating method, 0.5μm ~ 6.0μm
Ni metal plating layer is provided. The Ni electrolytic plating is a matte plating method and uses a normal plating bath such as a Watts bath and a sulfamic acid bath. As a plating method, an electroless chemical plating method may be used, but electrolytic plating has an advantage of being inexpensive because a predetermined plating thickness can be reliably obtained in a short time.

The above-mentioned Cu main plating (Cu thick plating) is copper sulfate 200g / ~ 2
Electrodepositing a plating solution of 50 g /, sulfuric acid 45 g / ~ 60 g / by the electrolytic plating method in the same manner as the above Ni main plating, and 2 μm to 20 μm
A Cu metal plating layer is provided.

After the above-described Ni main plating and Cu main plating are successively and sequentially performed, a water washing process and a drying process are performed, and the coil is wound into a coil by a coil winder.

In addition, the Cu main plating 10 on the B side and the stainless steel substrate 2
As the strike plating provided between the first and second steps, a Cu strike plating layer 21 may be provided as shown in the second embodiment of FIG. 7 instead of the above-mentioned Ni strike plating. The Cu strike plating is performed with a mixed plating solution of copper pyrophosphate 40 g / 〜50 g /, potassium pyrophosphate 150 g / 〜200 g /, ammonia 1 g /, and potassium oxalate 5 g / 〜10 g /.

As described above, the Ni strike plating layer 7 and the main Ni plating layer 9 are provided on the side A of the stainless steel substrate 2, and the Ni strike plating layer 8 and the main Cu plating layer 10 are provided on the side B.
Example 1), or the A side is the same as the first embodiment, and the Cu strike plating layer 21 and the Cu main plating layer 10 are formed on the B side.
(Second embodiment shown in FIG. 7) is formed, and the plating step is completed.

After finishing the above plating process, the coil-shaped product was supplied to a continuous annealing furnace while being unwound from a coil unloader, and H ₂ 5%
75%, in a non-oxidizing atmosphere N ₂ 95% to 25% of the gas mixture, _{preferably, H 2 75%, N 2} 25%, in a non-oxidizing atmosphere having a dew point of -50 ° C. or less, the heating temperature The temperature rises from 600 ° C to 900 ° C,
Continuous bright annealing is performed for soaking time of 0.5 to 15 minutes.

As shown in FIG. 4, the continuous annealing furnace 11 has a heating furnace 12,
It has a configuration in which a soaking furnace 13, a primary cooling furnace 14, a pre-aging furnace 15, and a secondary cooling furnace 16 are continuously arranged. After being unwound from the coil unwinder 17 and continuously passed through the continuous annealing furnace 11, it is passed through a temper rolling mill 18, subjected to temper rolling, and then wound up by a coil winder 19. .

By the annealing treatment, the SUS-Ni diffusion layer 3 is formed between the stainless steel substrate 2 and the Ni main plating layer 9 with the Ni strike plating layer 7 interposed therebetween on the A side. On the B side, the stainless steel substrate 2 is sandwiched with the Ni strike plating layer 8 interposed.
The SUS-Ni-Cu diffusion layer 4 is formed between the Cu and the main plating layer 10. The SUS-Ni diffusion layer 3 and the SUS-Ni-Cu diffusion layer 4 are annealed so as to have a thickness of 0.1 μm to 5.0 μm.

Incidentally, in the second embodiment in which the Cu strike plating layer 21 was formed as the strike plating on the side B, as shown in FIGS. 6 and 7, the stainless steel was sandwiched by the Cu strike plating layer 21 by annealing. The SUS-Cu diffusion layer 22 is formed between the substrate 2 and the main Cu plating layer 10. The SUS-
The thickness of the Cu diffusion layer 22 is also 0.1 μm to 5.0 μm.

In the annealing process performed to form the diffusion layers 3 and 4 (or the diffusion layer 22), important factors for quickly forming the diffusion layer to a required thickness include an atmosphere, a heating temperature, and the like.
This is a correlation between the heating time and the plating thickness. In the annealing treatment step, in the austenitic and ferritic stainless steels, as shown in FIG. 5, when the annealing time is prolonged, a sensitization phenomenon of precipitation of grain boundary carbide occurs, and the temperature range is 900 ° C. to 600 ° C. There is a problem that spreads in the range of ° C. When the sensitization phenomenon occurs, the material becomes brittle and the elasticity is reduced, which causes cracking during processing. Therefore, it is necessary to set a temperature and a heating time at which the sensitization phenomenon does not occur. On the other hand, a high annealing temperature of 1120 ° C. is possible with ordinary stainless steel, but Cu plating is performed and the melting point of Cu is 1083 ° C. Therefore, when the temperature is increased, Cu is dissolved. Therefore, the maximum limit of the annealing temperature is about 900 ° C., and the annealing temperature needs to be about 600 ° C. or more in order to diffuse the stainless steel base and Ni. Therefore, the annealing temperature is limited to the range of 900 ℃ ~ 600 ℃,
Since the temperature range is a temperature range in which the sensitization phenomenon shown in FIG. 5 is likely to occur, it is necessary to limit the heating time to a time in which the sensitization phenomenon does not occur. As shown in FIG. 5, when the heating temperature is the highest temperature of 900 ° C., the sensitization phenomenon does not occur when the annealing time is 30 seconds, and when the minimum temperature is 600 ° C., the annealing time is 120 minutes. In this case, no sensitization phenomenon occurs. Therefore, the annealing condition is performed in a temperature range of 600 ° C. to 900 ° C., and the annealing time is selected in a range of 30 seconds to 120 minutes according to the temperature condition.

<< Experimental Example 1 >> An experiment was conducted by changing the temperature condition and time of the inking treatment to determine whether or not the above-described sensitization phenomenon occurred, that is, whether or not the sensitization phenomenon occurred and a crack was generated during processing.

(I) Using SUS304 and 0.25BA material, a plating layer of Ni strike plating 0.2 μm and Ni main plating 3.0 μm was formed on side A, Ni strike plating 0.2 μm and Cu main plating 6.0 μm was formed on side B.

(II) Using SUS304 and 0.25BA material, a plating layer of Ni strike plating 0.2 μm and Ni main plating 3.0 μm was formed on the A side, and a Cu strike plating 0.2 μm and Cu main plating 6.0 μm was formed on the B side.

Using the plating materials (I) and (II) above, H ₂ 75%
Bright annealing was performed in a mixed gas atmosphere of N ₂ 25% and a dew point of −40 ° C. at a heating temperature and a heating time shown in the following table. With respect to the five types of (I) and (II) materials having different heating temperatures and heating times, the Cu metal plating layer 6 is used as an outer surface as shown in FIG. 8 (a), and as shown in FIG. 8 (b). As described above, the Ni metal plating layer 5 was bent 180 degrees with the outer surface, and the presence or absence of cracks was inspected with a microscope 400 times larger than the observation side P. The results are as shown in the table below. In the table, △ indicates that a small amount of cracks were generated by bending 180 degrees, and ○ indicates that no cracks were generated even when bent 180 degrees and the ductility was good. ing.

As is clear from the results of the experiments shown in the table above, 70
When heated at 0 ° C. or 750 ° C. for 90 seconds, there was almost no sensitization, which proved to be the best from the viewpoint of workability and the like.

In both the first and second embodiments described above,
After the plating step, an annealing treatment is performed.
It is manufactured by performing temper rolling several times. That is, a temper-rolled stainless steel material is used as the stainless steel base, and the above-described plating and annealing are performed on the stainless steel base, and then temper rolling is performed at a rolling reduction of 0.5% to 10%.

However, the manufacturing method is not limited to the above-described embodiment, and the following third, fourth, and fifth embodiments can be used as the temper rolling method from the relationship with the material of the stainless steel base.

First, in the third embodiment, when a stainless cold rolled material is used as the stainless steel base, plating and annealing are performed under the same conditions as in the first and second embodiments, and then the first steel is used.
The second temper rolling is performed at a rolling rate of 10% to 50%. (Note that when the rolling ratio exceeds 50%, the stainless steel itself hardens.)
Next, after the second annealing is performed in a non-oxidizing atmosphere gas, the second temper rolling is performed at a rolling rate of 0.5% to 10%.

In the fourth embodiment, a temper-rolled stainless steel material is used as a stainless base material, and plating and annealing are performed under the same conditions as in the first and second embodiments, and then the first tempering is performed at a rolling reduction of 2% to 10%. Perform quality rolling. Thereafter, the second annealing treatment is performed in a non-oxidizing atmosphere gas, and then the second temper rolling is performed at a rolling rate of 0.5% to 3%.

In the above third and fourth embodiments, annealing and temper rolling are repeated twice, so that the thickness of the diffusion layer is increased, the adhesion is improved, and even if the bending process is performed at 180 degrees, cracks are not formed. Generation can be reliably prevented.

In the fifth embodiment, a stainless steel temper rolled material is used as a stainless steel substrate, and plating is performed under the same conditions as those of the first and second embodiments, and before the first annealing, the first tempering is performed. The quality rolling is performed at a rolling rate of 2% to 10%. After the temper rolling, an annealing treatment was performed under the same conditions as in the first and second embodiments.
Going between 5% and 3%.

In the case of the fifth embodiment, even if a pin ball or the like occurs in the Cu plating layer in the plating step, the Cu film is embedded by performing the first temper rolling after plating, and the pin ball is removed. Can be eliminated. Further, the adhesion between the stainless steel substrate and Cu is improved, and thereafter, the adhesion can be further increased by performing annealing and temper rolling.

<< Experimental Example 2 >> The thickness of the diffusion layer formed was compared by changing the number of times of annealing and temper rolling.

Ni strike plating 0.2μm and Ni main plating 0.3μm are applied to surface A of stainless steel substrate made of temper rolled BA material, and to surface B
After Ni strike plating 0.2 μm and Cu main plating 6.0 μm, the first temper rolling at a rolling ratio of 4% was performed. afterwards,
_{H 2 25%, N 2 75} %, subjected to bright annealing in the annealing time of 90 seconds at a heating temperature of 750 ° C. in a mixed gas atmosphere of dew point of -40 ° C., then,
The second temper rolling was performed again at a rolling ratio of 1.4%.

After plating the A and B surfaces under the same conditions as above, bright annealing was performed under the same conditions as above, and then temper rolling at a rolling reduction of 5% was performed.

After the above temper rolling, the second bright annealing was performed again under the same conditions, and then the rolling reduction was 0.75%.
For the second temper rolling.

Above, and when the thickness of the diffusion layer formed in was measured, and SUS-Ni diffusion layer is 2.4μ
m, the SUS-Ni-Cu diffusion layer is 2.5 μm, and annealing is performed twice, so that the SUS-Ni diffusion layer is 4.0 μm and the SUS-N
The i-Cu diffusion layer was 4.25 μm, and was about 1.7 times as thick as compared to. For mechanical properties,
, And did not change much. Further, in the surface observation test after bending at 180 degrees similar to that shown in FIGS. 8 (a) and 8 (b), no crack was found in any case.

Further, the manufacturing method according to the present invention employs a sixth embodiment in which, after the final temper rolling, the surface of the Ni metal plating layer 5 is plated with Ni and the surface of the Cu metal plating layer 6 is plated with Cu. You can also. In this way, when the final surface plating is performed, after annealing and temper rolling, Ni
When the gloss of the metal plating surface is insufficient, the gloss can be obtained by applying bright Ni plating again. In addition, when the corrosion resistance is insufficient on the Cu metal plating surface, the corrosion resistance can be covered by performing Cu plating again. Further, if foreign matter adheres to the surface during the temper rolling, the foreign matter can be buried by plating again to prevent the foreign matter from being surfaced.

Effect of the Invention As is clear from the above description, Ni, C according to the present invention
In the case of u-coated stainless steel sheet, the Ni plating layer and Cu plating layer applied to both sides of the stainless steel substrate are annealed to diffuse part of the Ni-plated and Cu-plated structure with the stainless steel to provide a diffusion layer. Therefore, the adhesion between the stainless steel substrate, the Ni plating layer, and the Cu plating layer can be improved. In addition, the surface portion of the diffusion layer can be maintained in a state of a Ni metal layer and a CU metal layer having a metal structure, and both surfaces of the stainless steel base can be covered with the Ni metal layer and the Cu metal layer. Moreover, depending on the plating method, Ni plating and Cu
To apply plating to form Ni metal layer and Cu metal,
Compared to the case of providing a coating layer of about 16 μm Ni and about 40 μm Cu by the conventional roll cladding method, the amount of Ni and Cu can be reduced to about 1/4, resulting in significant cost reduction and low cost. Ni, Cu coated stainless steel can be provided. And, in the case of using the rolling clad method, since the rolling step is required many times, it takes a lot of labor and work time, but in this regard, the plating method of the present invention also
Forming a Ni, Cu coating layer is advantageous simply and in a short time.

In addition, Ni plating and
Since the Cu plating is performed separately, the thicknesses of these plating layers can be controlled separately and arbitrarily, and there are various advantages such as easy difference in thickness.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of the present invention, FIG. 2 is a sectional view showing a state after plating and before annealing in the first embodiment, and FIG.
FIG. 4 is a flowchart showing the manufacturing process of the first embodiment, and FIG.
The figure is a schematic configuration diagram of a continuous annealing furnace used in the annealing step.
FIG. 6 is a diagram showing a sensitization phenomenon, FIG. 6 is a cross-sectional diagram showing a second embodiment, FIG. 7 is a cross-sectional diagram showing a state after plating and before annealing in the second embodiment, and FIGS. (B) is a drawing showing a 180-degree bending test. 1 ... Ni, Cu coated stainless steel sheet, 2 ... Stainless steel base, 3 ... SUS-Ni diffusion layer, 4 ... SUS-Ni-Cu diffusion layer, 5 ... Ni metal plating layer, 6 ... Cu metal Plating layer, 22 ... SUS-Cu diffusion layer.

Claims (7)

(57) [Claims] A stainless steel substrate is provided with a Ni metal plating layer on one surface and a Cu metal plating layer on the other surface, and a diffusion layer of stainless steel and Ni between the stainless steel substrate and the Ni metal plating layer. Stainless steel and Cu diffusion layer or stainless steel between steel base and Cu metal plating layer
A Ni, Cu coated stainless steel sheet comprising a diffusion layer of Ni and Cu. 2. The thickness of a Ni metal plating layer provided on one surface of the front and back of the stainless steel substrate is 0.5 to 6.0 μm, and the thickness of a Cu metal plating layer provided on the other surface is 2 to 20 μm. .
The thickness of each diffusion layer consisting of a diffusion layer of stainless steel and Ni, a diffusion layer of stainless steel and Cu, and a diffusion layer of stainless steel and Ni and Cu is 0.1 to 5.0 mm.
The Ni, Cu-coated stainless steel sheet according to claim 1, which has a thickness of μm. 3. The stainless steel substrate is plated with Ni on one surface and the other is plated with Cu on the other surface, and then subjected to bright annealing in a non-oxidizing atmosphere gas to form the stainless steel and Ni plating. After forming a diffusion layer of stainless steel and Ni between the layer and a diffusion layer of stainless steel and Cu between the stainless steel and the main plating, Ni, Cu characterized by performing temper rolling Manufacturing method of coated stainless steel sheet. 4. Applying to one surface of the front and back of the stainless steel base
Ni strike plating is applied before Ni plating, and Cu
Apply Ni or Cu strike plating before main plating,
4. The method according to claim 3, wherein when Ni strike plating is performed before Cu main plating, a diffusion layer of stainless steel, Ni and Cu is formed between the stainless steel base and Cu by the annealing. Production method. 5. The thickness of the Ni plating provided on one surface of the front and back surfaces of the stainless steel substrate is 0.5 to 6.0 μm, and the thickness of Cu provided on the other surface is
The thickness of this plating is 2 to 20 μm, and the overall thickness of the sheet formed by temper rolling is 0.05 mm to 0.8 mm, and
The continuous annealing time is 0.5 to 15 so that the thickness of each of the diffusion layers of stainless steel and Ni, the diffusion layer of stainless steel and Cu or the diffusion layer of stainless steel and Ni and Cu is 0.1 to 5.0 μm. min, annealing temperature _{600 ℃ ~900 ℃, H 2 5} % ~75%, N 2
The method according to claim 3, wherein the annealing is performed in a 95% to 25% non-oxidizing atmosphere gas. 6. After forming the Ni and Cu plating layers, annealing and temper rolling are performed an arbitrary number of times, and after the final temper rolling,
The method according to any one of claims 3 to 5, wherein Ni plating is performed on the Ni metal plating layer and Cu plating is performed on the Cu metal plating layer. 7. The Ni, Cu-coated stainless steel which has been continuously subjected to the final temper rolling or plating is wound up in a coil shape. The production method described in 1.