KR100834262B1 - Non heating uv resin bonding apparatus and bonding method for flat display - Google Patents

Abstract

A non-heating circuit connection device of a flat panel display using a UV curable conductive adhesive and a connection method thereof are provided to remove deformation of a flexible circuit board caused by heat by bonding a driving chip package only through pressure and light exposure without heating, and reduce a tact time significantly which is required to cure thermosetting or thermoplastic resin. A UV(Ultra Violet) curable conductive adhesive(11) is applied to a connection terminal unit installed in a lower substrate. A driving chip package(12) is disposed on the UV curable conductive adhesive. In the driving chip package, the connection terminal unit of the lower substrate is connected with an electrode unit of the driving package. A pressing head(1) is disposed in an upper part of the lower substrate so as to press the driving chip package. An upper end part of a compressing unit(4) is closely contacted with the bottom of the lower substrate applied with the UV curable conductive adhesive. In a lower end part of the compressing unit, a heat reflecting UV permeable film(7) for reflecting heat and permeating UV rays is installed. A metal halide ultra-high pressure mercury lamp(8) is disposed in a lower side of the compressing unit, and emits UV rays so as to permeate to the lower substrate through the compressing unit.

Description

Non-heating circuit connection device and connection method of flat panel display using ultraviolet curable conductive adhesive {NON HEATING UV RESIN BONDING APPARATUS AND BONDING METHOD FOR FLAT DISPLAY}

1 is a schematic cross-sectional state diagram of a circuit connecting apparatus according to the present invention

2 is an enlarged cross-sectional view of a flexible circuit board and a driving chip bonded with an ultraviolet curable conductive adhesive.

Figure 3 is a perspective view of the pressure crimp used for the OLB of the circuit connection device

Figure 4 is a perspective view of the pressure crimp used for the COG or ILB of the circuit connection device

5 is a schematic cross-sectional view of an apparatus for bonding a driving chip to a flexible circuit board with an ultraviolet curable conductive adhesive.

6 is a plan view and a cross-sectional view of a connection terminal unit provided on a lower plate of a flat panel display;

7 is an enlarged cross-sectional state diagram of the connection terminal unit;

(Description of Drawing Reference)]

1 Pressing head 2 Ultraviolet reflecting mirror surface

4: pressure bonding table 5: slide shutter

6: slide device 7: heat ray reflection ultraviolet transmission film

8: metal halide ultra high pressure mercury lamp

9: top plate 10: bottom plate

11: UV curable conductive adhesive

12: drive chip package 13: drive chip

14 flexible circuit board 15 light shielding film

16,18: roller 17: coating dispenser

19 metal electrode 20 insulating film

21: transparent electrode film 22a, 22b: holes or slits

23: sealant

The present invention relates to an apparatus and a method for bonding and bonding the connecting terminal portion of a flat panel display and the electrode portion of a driving chip package using ultraviolet rays. In detail, an ultraviolet curable conductive adhesive is applied to the connecting terminal portion of a flat panel display, and the driving chip thereon. By irradiating ultraviolet rays with a metal halide ultra-high pressure mercury lamp while aligning the electrode portion of the package and pressing it with a pressurized head, an ultraviolet curable conductive adhesive agent is bonded to a flat panel display while the conductive adhesive is cured by the ultraviolet rays. The present invention relates to a non-heated circuit connecting apparatus and a connecting method of a flat panel display used.

In the flat panel display which consists of the upper plate and the lower plate of a glass substrate, the drive chip package is connected by connecting the connection terminal part of the said flat panel display and the electrode part of the drive chip package, and the function of a display is realized by driving the said drive chip.

As a general method of joining the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package, anisotropic conductive tape is temporarily attached to the connecting terminal portion and press-bonded to a temperature of about 120 degrees, and then the driving chip package is mounted on the conductive tape. The conductive tape is thermally cured at a temperature of about 180 degrees in a state where the electrode portion is aligned, and the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package are finally compressed and connected.

However, the connection by such a joining method causes an increase in manufacturing cost in that the conductive tape is expensive at about 1 million won per 100m and hardens the conductive tape by high temperature heat. There is a problem of short circuit or disconnection due to an increase, and in addition, the curing time of the conductive tape due to heat is required.

In addition, there is a limit in designing the electrode densely at a narrow pitch because of the problem that the defective rate is increased in the bonding process due to the pitch change of the electrode, which is increased by heat.

The present invention has been made to improve the problems of the conventional bonding method as described above, it is characterized in that the bonding by the light of ultraviolet light, not thermocompression bonding.

That is, the present invention is characterized in that a connection is made using an ultraviolet curable conductive adhesive that is cured by ultraviolet light without using a conductive tape conventionally used for connecting the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package.

Pressurizing the UV curable conductive adhesive applied to the connection terminal of the lower plate of the flat panel display, the driving chip package positioned on the coated surface, and the driving chip package positioned to adhere to the ultraviolet curable conductive adhesive. A head, a pressure bonding table attached to the lower surface of the lower plate of the UV curable conductive adhesive is applied, and a metal halide ultra-high pressure mercury lamp that radiates and irradiates ultraviolet rays passing through the lower plate through the pressure bonding zone. It is an object of the present invention to provide a circuit connecting device and a circuit joining method using the connecting device.

The present invention to achieve the object as described above,

A circuit connecting device for connecting a circuit to a flat panel display consisting of an upper plate and a lower plate of a glass substrate, comprising: an ultraviolet curable conductive adhesive applied to a connecting terminal portion provided on the lower plate, and a connecting terminal portion of the lower plate disposed on the ultraviolet curable conductive adhesive; An upper end portion is in close contact with a driving chip package to which an electrode portion of a driving chip package is connected, a pressurizing head disposed above the lower plate so as to press the driving chip package from above, and a lower surface of the lower plate to which the ultraviolet curable conductive adhesive is applied; It consists of a pressurized pressure zone installed with a heat ray reflection ultraviolet ray transmitting membrane that reflects heat to the lower end and transmits ultraviolet rays, and a metal halide ultrahigh pressure mercury lamp disposed under the pressurized pressure zone to emit ultraviolet rays to transmit to the lower plate through the pressure pressure zone. It is characterized by.

In addition, the driving chip package is configured such that the driving chip is bonded to the flexible circuit board with an ultraviolet curable conductive adhesive. The connection is another feature.

In addition, it is another feature that a moisture absorption amount of 0.1 to 0.5% of a UV-transmitting film is used as the base film of the flexible circuit board.

In addition, the ultraviolet transmission film used as the base film of the flexible circuit board is characterized in that any one of polyethylene telephthalate (PET), polyethylene naphthalate (PEN), polyolefin (POLYOLEFIN) film.

In addition, the pressing crimp is characterized in that the width is narrowed toward the upper portion in close contact with the lower plate of the flat panel display is another feature.

The apparatus may further include an ultraviolet reflecting mirror surface attached to the lower surface of the pressing head to reflect ultraviolet rays.

In addition, the ultraviolet reflecting mirror surface is characterized in that the concave-convex shape is another feature.

The apparatus may further include a black ink or a black tape coated or attached to the driving chip package electrode part connected to the connection terminal part provided on the lower plate of the flat panel display so that the ultraviolet light does not touch.

In addition, it is further characterized in that it further comprises a slide shutter which is installed in the slide device so as to open or shut off between the pressure bonding zone and the metal halide ultra-high pressure mercury lamp, the horizontal slide by the slide device.

In addition, the connecting terminal portion provided on the lower plate of the flat panel display has a multilayer structure of a transparent electrode film, an insulating film and a metal electrode from the top, and a plurality of holes or slits of 1 to 5 μm are formed in the insulating film. I am doing it.

In addition, the ultraviolet curable conductive adhesive is characterized by another thing consisting of ultraviolet curable epoxy resin and conductive balls.

In addition, the ultraviolet curable conductive adhesive is characterized in that the ultraviolet curing shrinkage is 3 to 10%, characterized in another feature.

A circuit connection method for connecting a circuit to a flat panel display consisting of a top plate and a bottom plate of a glass substrate, the method comprising: applying an ultraviolet curable conductive adhesive to a connection terminal of a bottom plate of a flat panel display, and positioning an electrode portion of a driving chip package at the connection terminal portion Fitting, pressing the driving chip package against the lower surface of the lower plate on which the driving chip package is positioned, pressing the driving chip package with the pressing head disposed above, and pressing the driving chip package downward; And dissipating ultraviolet rays with the disposed metal halide ultra-high pressure mercury lamp, and irradiating the ultraviolet rays to transmit the lower plate through the pressure bonding zone.

The method may further include transmitting or blocking ultraviolet rays emitted from the mercury lamp by a slide shutter of the slide device disposed between the pressure bonding zone and the metal halide ultrahigh pressure mercury lamp. have.

In addition, the ultraviolet curable conductive adhesive agent applied to the connection terminal part of the lower plate of the said flat panel display is further characterized by applying by the dispenser method or the printing method.

The ultraviolet light irradiation intensity is 3 to 30 J / cm 2 per second, and the pressurization time of the pressure head is 1 to 7 seconds.

In addition, the strength of the ultraviolet irradiation and the bonding strength by pressurization of the pressure head is characterized by being divided into two or more steps.

Hereinafter, an embodiment of a non-heated circuit connecting apparatus and a connecting method of a flat panel display using the ultraviolet curable conductive adhesive of the present invention will be described in detail with reference to the accompanying drawings.

First of all, the same components or parts in the drawings are denoted by the same reference numerals as much as possible. In describing the present invention, detailed descriptions of related well-known technologies or configurations are omitted in order not to obscure the subject matter of the present invention.

1 shows a schematic cross-sectional state diagram of a circuit connecting apparatus according to the present invention.

As shown, the circuit connecting apparatus of the present invention comprises an ultraviolet curable conductive adhesive agent 11 applied to the connecting terminal portion of the lower plate of a flat panel display composed of an upper plate 9 and a lower plate 10 of a glass substrate, and the conductive adhesive agent A driving chip package 12 in which an electrode portion is positioned on the coated terminal portion, a pressing head 1 disposed on the driving chip package to press down on the driving chip package, and a lower plate provided with the connecting terminal portion ( 10) is pressed while the upper part is in close contact, the bottom surface is made of a multi-layered film made of a multi-layered membrane, the pressure crimping table (4) attached with a heat ray reflection ultraviolet transmission membrane (7) to transmit heat and transmit ultraviolet rays, The metal halide ultra-high pressure mercury lamp 8 which is arrange | positioned under this pressurizing stand and radiates the ultraviolet-ray which permeate | transmits a lower board through the said pressurizing stand is made into a basic structure.

At this time, since the ultraviolet light emitted by the operation of the metal halide ultrahigh pressure mercury lamp 8 is made after a predetermined time passes through preheating after operation, it is always necessary to keep the mercury lamp in operation during the use of the circuit connection device of the present invention. It is effective in shortening the process time. Therefore, as shown in Fig. 1, the slide shutter 5 is disposed between the pressure bonding zone 4 and the metal halide ultra-high pressure mercury lamp 8, and the slide shutter is moved by the slide device 6. By allowing horizontal movement, it is preferable to block ultraviolet rays emitted from the mercury lamp as necessary.

In addition, the ultraviolet curable conductive adhesive is a mixture of ultraviolet curable epoxy resin (PARQIT, Japan Otex Co., Ltd.) and the conductive ball, the conductive ball is the connection terminal portion of the lower plate of the flat panel display and the drive chip package or flexible When the electrode portion of the circuit board is joined by the conductive adhesive, it is added for electrical connection, and when it is cured by irradiation of ultraviolet rays, it is possible to achieve a desirable bonding so that the curing shrinkage ratio is in the range of 3 to 10%.

In addition, by attaching an ultraviolet reflecting mirror surface 2 having an uneven shape to the lower surface of the pressurizing head 1, ultraviolet rays transmitted through the lower plate 10 of the flat panel display and irradiated to the pressurizing head are reflected to form an ultraviolet curable conductive adhesive. When irradiated back to the junction of the lower terminal connecting terminal portion and the electrode portion of the driving chip package coated with the UV rays, the irradiation of ultraviolet rays is more efficiently performed, and the uneven shape 3 of the ultraviolet reflecting mirror surface is specifically a ∧ shape and a ∨. By forming a shape in which the shape is in a half-speed or a shape in which the X shape and the X shape are repeated, the ultraviolet ray can be smoothly scattered and reflected.

2 is an enlarged cross-sectional state diagram of a flexible circuit board and a driving chip bonded with an ultraviolet curable conductive adhesive.

As shown in the drawing, the driving chip package 12 has a shape in which the driving chips 13 covered with the sealant 23 on both sides are bonded to the flexible circuit board 14 by the UV curable conductive adhesive 11. The flexible circuit board may include an electrode part provided on the flexible circuit board and a connection terminal part provided on the lower plate 10 of the flat panel display to be joined to each other. The flexible circuit board may have a moisture absorption amount of 1 to 5%. The film is used as the base film, and as a specific material, any one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyolefin (POLYOLEFIN) -based film is used.

In addition, when ultraviolet rays emitted from the mercury lamp 8 come into contact with the driving chip 13 of the driving chip package 12 or the flexible circuit board 14, there is a risk of malfunction, so that the lower plate 10 of the flat panel display When the connection terminal portion and the driving chip package 12 are bonded and connected by curing the ultraviolet curable conductive adhesive 11 by ultraviolet rays emitted and irradiated from the mercury lamp, blocking the ultraviolet rays from contacting the driving chip 13. To this end, it is preferable to attach a black ink or black tape, which acts as the light shielding film 15 of ultraviolet rays, to a lower surface of the driving chip package or the flexible circuit board on which the driving chip is located.

FIG. 3 is a perspective view of the presser used in the OLB of the circuit connecting apparatus, and FIG. 4 is a perspective view of the presser used in the COG or ILB of the circuit connecting apparatus.

As shown, the pressure-adhesive stand 4 has a hollow shape to allow ultraviolet rays emitted by the mercury lamp 8 to pass through, and concentrates on the connection terminal portion of the lower plate of the flat panel display coated with the ultraviolet curable conductive adhesive. In order to focus the ultraviolet rays to be irradiated, it is preferable to have a form that becomes narrower toward the top or above a certain height.

FIG. 5 shows a schematic cross-sectional state diagram of an apparatus for bonding a driving chip to a flexible circuit board with an ultraviolet curable conductive adhesive.

As shown in the drawing, the UV curable conductive adhesive 11 is applied to the flexible circuit board 14 continuously unwound by one roller 16 by the application dispenser 17, and the driving chip 13 is applied thereon. The ultraviolet curable conductive adhesive agent by ultraviolet rays using a pressure head 1, a pressure crimping stand 4, a metal halide ultra-high pressure mercury lamp 8, and the like, which are the circuit connection devices of the present invention as described above. After bonding the drive chip to the flexible circuit board by hardening, and winding the flexible circuit board bonded with the driving chip on the other roller 18 continuously, the driving chip is bonded to the flexible circuit board at regular intervals. The completed driving chip package can be completed.

6 is a plan view and a cross-sectional state diagram of a connection terminal portion provided on a lower plate of the flat panel display, and FIG. 7 is an enlarged cross-sectional state diagram of the connection terminal portion.

As shown in the drawing, the connection terminal portion provided in the lower plate 10 is formed in such a manner that the metal electrode 19, the insulating film 20, and the transparent electrode film 21 are stacked in this order from the bottom up. A plurality of holes 22a or slits 22b each having a thickness of 1 to 5 µm are formed at regular intervals in all directions so that ultraviolet rays 24 irradiated through the lower plate can pass smoothly.

Next, the circuit connection method which uses the circuit connection apparatus of this invention as mentioned above in detail is demonstrated.

First, the ultraviolet curable electrically conductive adhesive is suitably apply | coated to the connection terminal of the lower board of a flat panel display by a dispenser method or the printing method.

Next, the electrode portion of the driving chip package is placed on the connecting terminal portion coated with the conductive adhesive.

Next, in the state where the driving chip package is aligned, the pressure crimp is brought into close contact with the bottom surface of the flat panel display, and the driving chip package is pressed down by pressing the driving chip package for 1 to 7 seconds with the pressure head disposed above. do.

Next, while pressing the pressing head with the driving chip package, ultraviolet rays are emitted by a metal halide ultra-high pressure mercury lamp disposed under the pressing plate, so that the ultraviolet rays penetrate the lower plate through the pressing plate. It is irradiated with an irradiation intensity of 3 ~ 30J / ㎠, heat is also emitted along with the ultraviolet light, but the heat reflection ultraviolet transmission membrane is attached to the lower surface of the pressure bonding zone, the heat is reflected and irradiated through only the ultraviolet light. .

In this manner, the ultraviolet curable conductive adhesive is cured by irradiation of ultraviolet rays, whereby the connecting terminal portion of the lower plate of the flat panel display and the electrode portion of the driving chip package are joined to each other, and the circuit is connected only with the ultraviolet light without heating.

In addition, the irradiation of ultraviolet rays is such that the slide shutter of the slide device disposed between the pressure bonding zone and the metal halide ultrahigh pressure mercury lamp is moved horizontally, so as to transmit or block the ultraviolet rays emitted from the mercury lamp as necessary. In this case, even when the mercury lamp is always turned on, irradiation of ultraviolet rays can be appropriately performed.

In addition, the irradiation strength of the ultraviolet rays and the bonding strength due to the pressurization of the pressure head may be divided into two or more steps as necessary.

According to the non-heated circuit connecting apparatus and connection method of a flat panel display using the ultraviolet curable electrically conductive adhesive agent of this invention which consists of the above objects and structures, the following various effects are exhibited.

1. Since the driving chip package can be bonded by pressing and exposure without heating, the deformation of the flexible printed circuit board due to heat can be eliminated, and the processing time due to heat curing or curing of the hydrophobic resin can be greatly shortened.

2. The effective utilization rate of ultraviolet rays can be improved.

3. Multi-irradiation processing that can adjust between irradiation with slide shutter is possible.

4. It is possible to increase the connection accuracy because it does not heat the driving chip package.

5. It is possible to reduce the material cost by applying an ultraviolet curable conductive adhesive only on the effective area without using expensive anisotropic conductive tape.

6. The electrode can be prevented from being corroded by acid.

7. It is possible to adjust the positioning accuracy and connection resistance because it combines multiple irradiation with adjustable light pressure and pressure adjustment.

8. After UV curing, epoxy resin keeps compressive stress due to hardening shrinkage and prevents connection resistance change.

9. It is possible to increase the utilization efficiency of ultraviolet rays.

10. Accuracy is increased because base film with small change of size due to humidity is used as flexible circuit board.

11. It is possible to reduce the cost of substrate and to shorten the manufacturing time due to UV curing.

12, can prevent the malfunction of the driving chip.

13. By making the area affected by ultraviolet rays as small as possible, UV bonding is possible even with a wide electrode.

Claims (17)

In a circuit connecting device for connecting a circuit to a flat panel display consisting of a top plate and a bottom plate of a glass substrate, An ultraviolet curable conductive adhesive applied to a connection terminal provided on the lower plate; A driving chip package disposed on the ultraviolet curable conductive adhesive and connected to the connection terminal portion of the lower plate and the electrode portion of the driving chip package; A pressurizing head disposed above the lower plate to press the driving chip package from above; An upper end portion in close contact with a lower surface of the lower plate on which the ultraviolet curable conductive adhesive is applied, a pressure crimping stand provided with a heat ray reflection ultraviolet ray transmitting membrane that reflects heat and transmits ultraviolet rays to the lower end; A metal halide ultra-high pressure mercury lamp disposed under the pressure crimping table and emitting ultraviolet rays to transmit to the lower plate through the pressure crimping board; An unheated circuit connecting device for a flat panel display using an ultraviolet curable conductive adhesive, characterized in that consisting of. The driving chip package of claim 1, wherein the driving chip package is formed by bonding a driving chip to a flexible printed circuit board using an ultraviolet curable conductive adhesive, and wherein an electrode portion of the flexible printed circuit board is provided on a lower plate of the flat panel display. A non-heated circuit connecting device for flat panel displays using an ultraviolet curable conductive adhesive, which is bonded and bonded with an adhesive. 3. A non-heated circuit connecting device for flat panel displays using an ultraviolet curable conductive adhesive according to claim 2, wherein a moisture-absorption amount of 0.1 to 0.5% of a UV transmissive film is used as a base film of the flexible circuit board. The ultraviolet ray transmitting film of claim 3, wherein the ultraviolet ray transmitting film used as the base film of the flexible circuit board is any one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyolefin (POLYOLEFIN) film. A non-heated circuit connecting device for flat panel displays using a conductive adhesive. 2. The apparatus of claim 1, wherein the pressure welding zone is configured to be narrower toward an upper portion in close contact with the lower plate of the flat panel display. 2. The apparatus of claim 1, further comprising an ultraviolet reflecting mirror surface attached to a lower surface of the pressurizing head to reflect ultraviolet rays. 7. The apparatus of claim 6, wherein the ultraviolet reflecting mirror surface has a concave-convex shape. 8. The method of any one of claims 1 to 7, further comprising a black ink or black tape applied or adhered to the driving chip package electrode portion to be connected to the connection terminal portion provided on the lower plate of the flat panel display so as not to reach the ultraviolet rays. A non-heated circuit connecting device for flat panel displays using an ultraviolet curable conductive adhesive. 8. The slide shutter according to any one of claims 1 to 7, which is provided in a slide device so as to be opened or shut off between the presser zone and the metal halide ultrahigh pressure mercury lamp, and is moved horizontally by the slide device. The non-heated circuit connection device of a flat panel display using an ultraviolet curable conductive adhesive, characterized in that it further comprises. The connecting terminal portion provided in the lower plate of the flat panel display has a multilayer structure of a transparent electrode film, an insulating film and a metal electrode from the top, and has a hole of 1 to 5 탆 in the insulating film. A non-heated circuit connecting device for a flat panel display using an ultraviolet curable conductive adhesive, characterized in that a plurality of slits are formed. 8. The unheated circuit connecting device for flat panel display according to any one of claims 1 to 7, wherein the ultraviolet curable conductive adhesive is composed of an ultraviolet curable epoxy resin and a conductive ball. 12. The unheated circuit connecting device of a flat panel display using the ultraviolet curable conductive adhesive according to claim 11, wherein the ultraviolet curable conductive adhesive has an ultraviolet curing shrinkage of 3 to 10%. In a circuit connection method for connecting a circuit to a flat panel display consisting of a top plate and a bottom plate of a glass substrate, Applying an ultraviolet curable conductive adhesive to the connection terminal of the lower plate of the flat panel display; Positioning the electrode part of the driving chip package on the connection terminal part; Pressing a presser bar against the lower surface of the lower plate on which the driving chip package is positioned, pressing the driving chip package with a pressing head disposed above, and pressing down; Radiating ultraviolet rays with a metal halide ultra-high pressure mercury lamp disposed under the pressure bonding zone, and irradiating the ultraviolet rays to penetrate the lower plate through the pressure bonding zone; A non-heated circuit connection method of a flat panel display using an ultraviolet curable conductive adhesive, characterized in that consisting of. 15. The method of claim 13, further comprising the step of transmitting or blocking ultraviolet rays emitted from the mercury lamp by a slide shutter of the slide device disposed between the pressure bonding zone and the metal halide ultrahigh pressure mercury lamp. A method of connecting a non-heated circuit to a flat panel display using an ultraviolet curable conductive adhesive. 15. The unheated circuit of a flat panel display using the ultraviolet curable conductive adhesive according to claim 13 or 14, wherein the ultraviolet curable conductive adhesive applied to the connection terminal of the lower plate of the flat panel display is applied by a dispenser method or a printing method. How to connect. 15. The non-heating flat panel display using the ultraviolet curable conductive adhesive according to claim 13 or 14, wherein the irradiation intensity of the ultraviolet ray is 3 to 30 J / cm 2 per second and the pressing time of the pressing head is 1 to 7 seconds. Circuit connection method. 15. The method for connecting a non-heated circuit of a flat panel display using an ultraviolet curable conductive adhesive according to claim 13 or 14, wherein the ultraviolet irradiation intensity and the bonding strength by pressurizing the pressing head are divided into two or more steps.

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