KR20100056169A - Bonding appartus and bonding methode for flat panel display with anaerobic resin and ultrasonic - Google Patents

Bonding appartus and bonding methode for flat panel display with anaerobic resin and ultrasonic Download PDF

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Publication number
KR20100056169A
KR20100056169A KR1020080115215A KR20080115215A KR20100056169A KR 20100056169 A KR20100056169 A KR 20100056169A KR 1020080115215 A KR1020080115215 A KR 1020080115215A KR 20080115215 A KR20080115215 A KR 20080115215A KR 20100056169 A KR20100056169 A KR 20100056169A
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KR
South Korea
Prior art keywords
lower plate
driving chip
chip package
ultraviolet
flat panel
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Application number
KR1020080115215A
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Korean (ko)
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이한준
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이한준
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Priority to KR1020080115215A priority Critical patent/KR20100056169A/en
Publication of KR20100056169A publication Critical patent/KR20100056169A/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • G02F1/13452—Conductors connecting driver circuitry and terminals of panels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Optics & Photonics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Mathematical Physics (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

PURPOSE: A circuit connecting device of a flat display using ultrasonic of an anaerobic resin and a circuit connecting method are provided to connect electrodes of a circuit of a flat display using ultrasonic bonding. CONSTITUTION: An upper end of a pressurizing board(6) closely contacts a lower surface on which a resin layer is applied. A heat reflection and ultraviolet transmission film is installed in a lower end of the pressurizing board. An ultraviolet ray is reflected from the side of the pressurizing board upward. An ultraviolet applying device(7) is arranged in the lower side of the pressurizing board. The ultraviolet applying device emits an ultraviolet ray.

Description

Bonding Appartus and Bonding Method for Flat Panel Display with Anaerobic Resin and Ultrasonic}

The present invention relates to a circuit connecting device and a circuit connecting method of a flat panel display using an ultraviolet curable resin containing anaerobic, and more particularly, to a flat panel display using an ultraviolet curable resin and an ultrasonic connecting device containing anaerobic. The lower plate and the driving chip package are hardened by ultraviolet rays and fixed to each other, and the electrode and the electrode are fused by ultrasonic waves by fusion of the electrode and the electrode using an ultrasonic metal connecting device between the connecting terminal portion of the lower plate and the electrode portion of the driving chip package. The present invention relates to a circuit connecting device and a circuit connecting method of a flat panel display in which a lower plate and a driving package or a flexible circuit board are connected by anaerobic ultraviolet curing resin.

In the flat panel display which consists of the upper plate and the lower plate of a glass substrate, the drive chip package is connected by connecting the connection terminal part of the said flat panel display and the electrode part of the drive chip package, and the function of a display is realized by driving the said drive chip.

As a general method of joining the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package, anisotropic conductive tape is temporarily attached to the connecting terminal portion and press-bonded to a temperature of about 120 degrees, and then the driving chip package is mounted on the conductive tape. The conductive tape is thermally cured at a temperature of about 180 degrees in a state where the electrode portion is aligned, and the connecting terminal portion of the flat panel display and the electrode portion of the driving chip package are finally compressed and connected.

However, the connection by such a joining method causes an increase in manufacturing cost in that the conductive tape is expensive at about 1 million won per 100m and hardens the conductive tape by high temperature heat. There is a problem of short circuit or disconnection due to an increase, and in addition, the curing time of the conductive tape due to heat is required.

In addition, there is a limit in designing the electrode densely at a narrow pitch because of the problem that the defect rate is increased in the bonding process due to the pitch change of the electrode, which is increased by heat.

The present invention has been made to solve the above-mentioned problems, the main purpose of which is thermocompression bonding

Ultrasonic bonding is used between the electrode and the electrode while curing by bonding with ultraviolet light.

It is an object of the present invention to provide a circuit connection device for connecting a circuit of a flat panel display.

In other words, it is characterized in that the connection of the flat terminal display and the electrode of the driving chip package is made by connecting light by ultraviolet light and ultrasonic waves without using a conductive tape conventionally used.

It is an object of the present invention to provide a circuit connecting method for connecting a connection terminal portion of a flat panel display and an electrode portion of a driving chip package to each other by using a circuit connecting apparatus using an anaerobic ultraviolet curable resin and ultrasonic waves.

The circuit connecting apparatus of a flat panel display using anaerobic ultraviolet curable resin and ultrasonic waves according to the present invention for achieving the above object is a circuit connecting apparatus for connecting a circuit of a drive chip package to a flat panel display consisting of a top plate and a bottom plate of a glass substrate. In the lower plate is coated with an anaerobic ultraviolet curable resin, and the driving chip package is disposed on the connecting terminal portion of the lower plate and between the lower plate and the driving chip package facing each other and in contact with each other. A resin layer positioned between the connection terminal portion of the lower plate and the electrode portion of the driving chip package; An ultrasonic pressure head disposed on an upper portion of the driving chip package to press the driving chip package from above, such that the connection terminal portion of the lower plate and the electrode portion of the driving chip package are in contact with each other; An upper end portion in close contact with a lower surface of the lower plate on which the resin layer is applied, a pressure crimping stand provided with a heat ray reflection ultraviolet ray transmitting membrane for reflecting heat and transmitting ultraviolet rays to the lower end portion; And an ultraviolet irradiation device disposed below the pressure crimping table and emitting ultraviolet light by the ultraviolet light emitting mechanism so as to transmit to the lower plate through the pressure crimping table.

In addition, it is preferable that the ultraviolet dissipation mechanism of the ultraviolet irradiation device emits ultraviolet rays by using any one of an LED, a lamp, and a flash.

In addition, the drive chip package includes an anaerobic character, characterized in that the drive chip is installed on the flexible circuit board, a UV-transmitting film having a moisture absorption of 0.1 to 0.5% as a base film of the flexible circuit board, The UV-transmitting film used as the base film of the flexible circuit board is preferably any one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyolefin (POLYOLEFIN) film.

Further, in a circuit connecting method for connecting a circuit to a flat panel display consisting of a top plate and a bottom plate of a glass substrate, a resin layer is formed by applying anaerobic ultraviolet curable resin to the connection terminal portion provided on the bottom plate of the flat panel display and the lower plate around the bottom plate. Making; Positioning the electrode part of the driving chip package on the connection terminal part of the lower plate formed on the upper surface of the resin layer; Pressing the pressure bonding stand against the lower surface of the lower plate is aligned with the driving chip package, and pressing down the driving chip package with an ultrasonic pressure head disposed on the upper, the connection terminal portion of the lower plate and the electrode portion of the driving chip package The projections formed in the fusion welded to each other by friction to electrically connect the connection terminal portion of the lower plate and the electrode portion of the driving chip package; By radiating ultraviolet rays with an ultraviolet irradiation device disposed under the pressure bonding zone to irradiate the ultraviolet rays to penetrate the lower plate through the pressure bonding zone, the resin layer between the lower plate and the driving chip package is cured by the ultraviolet rays to mutually It is characterized by consisting of the step of fixing.

According to the circuit connection apparatus and circuit connection method of the flat panel display using the ultraviolet curable resin containing the anaerobic of this invention, the following various effects are exhibited.

1. The driving chip package can be bonded only by pressurization, exposure and ultrasonic waves without heating, thereby eliminating the deformation of the flexible circuit board due to heat, and greatly reducing the processing time due to thermal curing or curing of the plastic resin.

2. The reliability of connection between electrode and electrode can be greatly increased.

3. Multi-irradiation processing that can adjust cycle of irradiation with slide shutter is possible.

4. It is possible to increase the connection accuracy because it does not heat the driving chip package.

5. It is possible to reduce material cost by using anaerobic UV curable resin and ultrasonic wave only in effective area without using expensive anisotropic conductive tape.

6. The electrode can be prevented from being corroded by acid.

7. It is possible to connect positioning accuracy and low connection resistance because it combines multiple irradiation which can control light quantity and pressure control.

8. After UV curing, epoxy resin keeps compressive stress due to hardening shrinkage and prevents connection resistance change.

9. It is possible to increase the utilization efficiency of ultraviolet rays.

10. Accuracy is increased because base film with small change of size due to humidity is used as flexible circuit board.

11. It is possible to reduce the cost of substrate and to shorten the manufacturing time due to UV curing.

12, can prevent the malfunction of the driving chip.

13. By making the area affected by ultraviolet rays as small as possible, UV bonding is possible even with a wide electrode.

14. If only non-transparent parts of ultraviolet rays are blocked by air, the anaerobic characteristics of the UV-curable resin can be naturally cured without being irradiated with ultraviolet rays, so that the unirradiated portions of ultraviolet rays can be connected.

Hereinafter, a circuit connection apparatus and a circuit connection method of a flat panel display using an ultraviolet curable resin including anaerobic according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

1 is a schematic cross-sectional state diagram of a circuit connecting apparatus of a flat panel display using an ultraviolet curable resin containing anaerobic according to the present invention, Figure 2 is a circuit connection of a flat panel display using an ultraviolet curable resin containing anaerobic according to the present invention An enlarged cross-sectional view of a lower plate and a driving chip package of a flat panel display connected by using the apparatus is shown.

As shown in FIG. 1, the circuit connecting apparatus of the flat panel display according to the present invention connects the lower plate 1 and the driving chip package 3 of the flat panel display made of a glass substrate of the upper plate 1 and the lower plate 2 to each other. To this end, the resin layer 4, the ultrasonic pressure head 5, the pressure crimp 6, and the ultraviolet irradiation device 7 formed by coating with an anaerobic ultraviolet curing resin are formed as basic constructions.

As shown in Fig. 1 and Fig. 2, the resin layer 4 is formed by applying an anaerobic ultraviolet curable resin to the connecting terminal portion 2a of the lower plate 2 of the flat panel display and the lower plate around it. On the connection terminal portion 2a of the lower plate 2 to which the ground layer 4 is applied, the electrode portions 3a of the driving chip package 3 are positioned to be aligned so that the lower plate 2 and the driving chip package 3 The resin layer 4 is positioned between the connection terminal portion 2a of the lower plate 2 and the electrode portion 3a of the driving chip package 3.

The ultrasonic pressure head 5 is disposed on the driving chip package 3 to press the driving chip package 3 downward to press the connecting terminal portion 2a of the lower plate 2 facing each other by ultrasonic welding. ) And the electrode portion 3a of the driving chip package 3 are electrically connected.

The pressure crimp (6) is arranged while the upper part is in close contact with the lower surface of the lower plate (2) on which the connection terminal portion (2a) is installed, the bottom surface is made of a multi-layered film reflects heat and transmits ultraviolet rays The permeable membrane 23 is attached.

The ultraviolet irradiator 7 is disposed below the pressure crimp 6 and transmits ultraviolet rays by passing through the lower plate 2 including the connection terminal portion 2a through the pressure crimp 6. The anaerobic ultraviolet curable resin of the layer 4 is cured.

At this time, since the ultraviolet radiation due to the operation of the ultraviolet irradiation device 7 is made after a predetermined time passes through preheating after operation, the ultraviolet irradiation device 7 is always operated while the circuit connection device of the present invention is in use. This is effective in terms of shortening the process time. Therefore, as shown in FIG. 1, the slide shutter 8 is arrange | positioned between the said press bonding stand 6 and the ultraviolet irradiation device 7, and this slide shutter 8 is made | formed by the slide apparatus 9 By allowing horizontal movement, it is preferable to block ultraviolet rays emitted from the ultraviolet irradiation device 7 as necessary.

In addition, the ultraviolet irradiation device 7 is any one of the LED (LED), Lamp (Lamp), Flash (Flash) as an ultraviolet light emitting device for emitting ultraviolet light, by the irradiation of ultraviolet light anaerobic ultraviolet curing resin When the resin layer coated with the resin is cured, it is possible to achieve a desirable bonding so that the curing shrinkage ratio is in the range of 3 to 10%.

In addition, as shown in FIG. 1, the bottom surface of the pressurizing head 5 is attached with an ultraviolet reflecting mirror surface 10 having a concave-convex surface, thereby penetrating the lower plate 2 of the flat panel display so that the pressurizing head 5 Ultraviolet rays irradiated to the surface is reflected and an anaerobic ultraviolet curable resin is applied to the junction between the connecting terminal portion 2a of the lower plate 2 with the resin layer 4 interposed therebetween and the electrode portion 3a of the driving chip package 3. When irradiated again, the irradiation of ultraviolet rays is made more efficiently, and the uneven shape of the ultraviolet reflecting mirror surface 10 is specifically a shape in which the shape and shape of the shape are repeated or the shape of the shape and the shape of the shape is repeated. By doing so, the ultraviolet rays can be scattered and reflected smoothly.

When the driving chip package 3 is attached and fixed to the lower plate 2 by the circuit connecting device using the ultraviolet curable resin including the anaerobic of the present invention, as shown in FIG. Since the surface of the connection terminal portion 2a of the lower plate 2 and the surface of the electrode portion 3a of the driving chip package 3 are not smooth and fine irregularities are repeated, the ultrasonic pressure welding of the ultrasonic pressure head 5 as described above is performed. The large uneven protrusions contact each other to electrically connect the lower plate 2 and the driving chip package 3 to each other.

Subsequently, ultraviolet rays are irradiated to the connection terminal portion 2a of the lower plate 2 and the electrode portion 3a portion of the driving chip package 3 with the ultraviolet dissipation mechanism of the ultraviolet irradiation device 7, but the connection facing each other is performed. The anaerobic ultraviolet curable resin located between the uneven portions which do not contact each other between the terminal portion 2a and the electrode portion 3a does not receive ultraviolet rays and air is blocked. Therefore, due to the anaerobic nature, If air is not supplied, it hardens naturally depending on the property of hardening, thereby fixing the driving chip package 3 to the lower plate 2, but with this alone, the coupling force to fix the driving chip package 3 to the lower plate 2 is somewhat different. Since it may be regarded as weak, the anaerobic ultraviolet curable resin around the connecting terminal portion 2a of the lower plate 2 and the electrode portion 3a of the driving chip package 3 is cured by irradiation of the ultraviolet ray, so that the lower plate 2 Drive chip package (3) More securely combined and fixed.

3 is an enlarged cross-sectional state diagram of a flexible circuit board and a driving chip bonded with an anaerobic ultraviolet curable resin.

As shown in FIG. 3, the driving chip package 3 includes a flexible printed circuit board 14 formed of an anaerobic ultraviolet curable resin 13 in which a driving chip 12 covered with a sealant 11 is formed on both sides thereof. The electrode portion 3a provided on the flexible circuit board 14 and the connection terminal portion 2a provided on the lower plate 2 of the flat panel display may be bonded to each other. The flexible printed circuit board 14 uses a UV-transmissive film having a moisture absorption of 1 to 5% as a base film, and specific materials thereof include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyolefin (POLYOLEFIN) based film. You will use either.

In addition, when the ultraviolet rays emitted from the ultraviolet irradiation device 7 come into contact with the driving chip 12 of the driving chip package 3 or the flexible circuit board 14, there is a risk of malfunction, so the lower plate 2 of the flat panel display Between and around the connecting terminal portion 2a of the electrode and the electrode portion 3a of the driving chip package 3 is coated with anaerobic ultraviolet curable resin by ultraviolet rays emitted and irradiated from the ultraviolet dissipation mechanism of the ultraviolet irradiation device 7. When the resin layer 4 is hardened by being bonded and fixed, the driving chip 12 of the driving chip package 3 or the flexible printed circuit board 14 is positioned to block ultraviolet rays from contacting the driving chip 12. It is preferable to attach black ink or black tape which acts as the light shielding film 15 of ultraviolet rays to the lower surface of the part to be made.

Figure 4 shows a schematic cross-sectional state diagram of the device for bonding the driving chip to the flexible circuit board with an anaerobic ultraviolet curable resin.

As shown in Fig. 4, the anaerobic ultraviolet curable resin 4a is applied to the flexible circuit board 14 that is continuously released by one roller 16 by the application dispenser 17, and the driving chip thereon. The anaerobic ultraviolet rays are exposed to ultraviolet rays by using the pressure head 5, the pressure crimping stand 6, the ultraviolet irradiation device 7, and the like, which are the circuit connection devices of the present invention as described above in the position where the position is aligned. After hardening the cured resin, the driving chip 12 is bonded to the flexible circuit board 14, and then the flexible circuit board 14 to which the driving chip 12 is bonded is continuously wound on the other roller 18. As a result, the driving chip package 3 bonded to the flexible circuit board 14 at regular intervals may be completed.

5 is a plan view and a cross-sectional state diagram of a connection terminal unit provided on a lower plate of the flat panel display, and FIG. 6 is an enlarged cross-sectional state diagram of the connection terminal unit of FIG. 5.

5 and 6, the connection terminal portion 2a provided on the lower plate 2 has a shape in which a metal electrode 19, an insulating film 20, and a transparent electrode film 21 are sequentially stacked from the bottom up. In the insulating film 20, holes 22a or slits 22 to 1 µm having a thickness of 1 to 5 µm are spaced at regular intervals so that ultraviolet rays 24 transmitted through the lower plate 2 can pass smoothly. A plurality is formed.

Accordingly, the resin layer 4 coated with the anaerobic ultraviolet curable resin on the connection terminal portion 2a is cured by the ultraviolet rays irradiated through the hole 22a or the slit 22b to be anaerobic. Along with the natural hardening by the hardening is made more active.

Next, the circuit connection method which uses the circuit connection apparatus of this invention as mentioned above in detail is demonstrated.

7 is an enlarged flowchart illustrating a circuit connection method of a flat panel display using an ultraviolet curable resin including anaerobic according to the present invention.

Referring to FIGS. 1, 2, and 7, a dispenser method or a printing method is used on the upper surface of the connection terminal portion 2a of the lower plate 2 of the flat panel display and the lower plate around the lower plate. The anaerobic ultraviolet curable resin is appropriately applied to form the resin layer 4.

Next, the anaerobic ultraviolet curable resin is applied to place the electrode portion 3a of the drive chip package 3 on the upper surface of the connection terminal portion 2a on which the resin layer 4 is formed.

Next, in the state in which the driving chip package 3 is aligned, the pressure crimp 6 is brought into close contact with the lower surface of the lower plate 2 of the flat panel display, and the ultrasonic pressure is placed on the driving chip package 3. Since the surface of the connection terminal portion 2a of the lower plate 2 and the electrode portion 3a of the driving chip package 3 are respectively uneven in the form of pressing the head 5 downward for 1 to 2 seconds, The large protrusions of the concave-convex shape on the surface of the connecting terminal portion 2a and the electrode portion 3a facing each other by the pressing of the pressurizing head 5 are fused to each other to electrically connect the lower plate 2 and the driving chip package 3. The connection is made.

Next, while the driving chip package 3 is pressed by the ultrasonic pressure head 5, ultraviolet rays are emitted by the ultraviolet dissipation mechanism of the ultraviolet irradiation device 7 disposed under the pressure bonding stand 6. The ultraviolet rays are irradiated with an irradiation intensity of 3 to 30 J / cm 2 per second so that the ultraviolet rays penetrate the lower plate 2 through the pressing plate 6, and heat is also emitted along with the ultraviolet rays, but the pressing plate 6 Since the heat ray reflection ultraviolet ray transmitting film 23 is attached to the lower surface of the), heat is reflected and irradiated through only ultraviolet rays.

As described above, the resin layer 4 coated with the anaerobic ultraviolet curable resin between the lower plate 2 and the driving chip package 3 is cured by ultraviolet rays, but the connection terminal portion 2a of the lower plate 2 is hardened. Since the anaerobic ultraviolet curable resin (resin layer) located between the electrode portions 3a of the driving chip package 3 is air-blocked, the bottom plate of the flat panel display is naturally cured by the anaerobic characteristics. The connection terminal portion 2a of the and the electrode portion 3a of the driving chip package 3 are joined to each other, so that the connection of the circuit and the coupling of the lower plate 2 and the driving chip package 3 can be performed using only ultraviolet light without heating. Will be done.

The ultraviolet irradiation is performed by moving the slide shutter 9 of the slide device 8 disposed between the pressure bonding zone 6 and the ultraviolet irradiation device 7 horizontally, whereby the ultraviolet irradiation device as necessary. By transmitting or blocking the ultraviolet rays emitted by the ultraviolet emitting device of (7), the ultraviolet rays can be properly irradiated even when the ultraviolet irradiation device 7 is always turned on.

Although the present invention has been described with reference to the embodiments shown in the accompanying drawings, this may be regarded as exemplary, and a person of ordinary skill in the art may conceive various modifications and equivalent embodiments therefrom. It should be understood that such equivalent embodiments are also included within the claims of the present invention. Therefore, the true scope of protection of the present invention should be determined only by the appended claims.

1 is a schematic cross-sectional state diagram of a circuit connection device of a flat panel display using an ultraviolet curable resin containing anaerobic according to the present invention

2 is an enlarged cross-sectional view of a lower plate and a driving chip package of a flat panel display connected using a circuit connection device of a flat panel display using an ultraviolet curable resin including anaerobic according to the present invention;

3 is an enlarged cross-sectional view of a flexible circuit board and a driving chip bonded with anaerobic ultraviolet curable resin

Figure 4 is a schematic cross-sectional state diagram of the device for bonding the driving chip with an anaerobic ultraviolet curable resin to the flexible circuit board

5 is a plan view and a cross-sectional view of a connection terminal unit provided on a lower plate of a flat panel display;

6 is an enlarged cross-sectional state diagram of the connection terminal unit of FIG.

7 is an enlarged flowchart of a circuit connection method of a flat panel display using an ultraviolet curable resin including anaerobic according to the present invention;

Description of the Related Art

1: top plate 2: bottom plate

2a: connection terminal 3: drive chip package

3a: electrode portion 4: resin layer

5: ultrasonic pressure head 6: pressure crimp

7: ultraviolet irradiation device 8: slide shutter

9: slide device 10: ultraviolet reflection mirror surface

11 sealant 12 driving chip

13: Anaerobic UV Curing Resin 14: Flexible Circuit Board

15: light shielding film 16, 18: roller

17 dispensing dispenser 19 metal electrode

20: insulating film 21: transparent electrode film

22a: Hole 22b: Slit

23: heat reflection ultraviolet transmission film 24: ultraviolet

Claims (5)

In the circuit connection device for connecting the circuit of the drive chip package to the flat panel display consisting of the upper plate and the lower plate of the glass substrate, The lower plate and the driving chip which are coated with an anaerobic ultraviolet curable resin (main component: urethane methacrylate) on the connecting terminal portion provided on the lower plate and the lower plate around the lower plate, and the driving chip package is disposed on the connecting terminal portion of the lower plate to face each other. A resin layer positioned between the package and between the connection terminal portion of the lower plate and the electrode portion of the driving chip package in contact with each other; An ultrasonic pressure head disposed on an upper portion of the driving chip package to press the driving chip package from above, such that the connection terminal portion of the lower plate and the electrode portion of the driving chip package are in contact with each other; An upper surface of the lower plate to which the resin layer is applied, the upper end is in close contact with the bottom portion, and a heat ray reflection ultraviolet ray transmitting film is installed to reflect heat and transmits ultraviolet rays, and a reflection-coated pressure welding zone for reflecting ultraviolet rays on the side to face upwards; And An ultraviolet irradiation device which is disposed below the pressure crimping table and emits ultraviolet rays by an ultraviolet light emitting mechanism so as to transmit to the lower plate through the pressure crimping table; Circuit connection device for a flat panel display using an ultraviolet curable resin comprising anaerobic, characterized in that consisting of. The ultraviolet curing apparatus of claim 1, wherein the ultraviolet emitting device of the ultraviolet irradiation device emits ultraviolet rays using any one of an LED, a lamp, and a flash. Circuit connection device for flat panel display using resin. The flat panel display of claim 1, wherein the driving chip package comprises an ultraviolet curable resin including anaerobic and an ultrasonic pressure head having a welded amplitude of 25 or less, characterized in that the driving chip is installed on a flexible circuit board. Circuit connection device. The anaerobic film according to claim 4, wherein the UV-transmitting film used as the base film of the flexible circuit board is any one of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polyolefin (POLYOLEFIN) film. Including In a circuit connection method for connecting a circuit to a flat panel display consisting of a top plate and a bottom plate of a glass substrate, Forming a resin layer by applying an anaerobic ultraviolet curable resin to the connection terminal portion provided on the lower plate of the flat panel display and the lower plate around the flat panel display; Positioning the electrode part of the driving chip package on the connection terminal part of the lower plate formed on the upper surface of the resin layer; Pressing the pressure bonding stand against the lower surface of the lower plate is aligned with the driving chip package, and pressing down the driving chip package with the ultrasonic pressure head disposed on the upper portion, the connection terminal portion of the lower plate and the electrode portion of the driving chip package The protrusions formed to be fused to each other to electrically connect the connection terminal portion of the lower plate and the electrode portion of the driving chip package; By radiating ultraviolet rays with an ultraviolet irradiation device disposed under the pressure bonding zone to irradiate the ultraviolet rays to penetrate the lower plate through the pressure bonding zone, the resin layer between the lower plate and the driving chip package is cured by the ultraviolet rays to mutually Fixing the resin layer between the connection terminal portion of the lower plate through which the ultraviolet rays are not transmitted and the electrode portion of the driving chip package to be naturally cured; A circuit connection method of a flat panel display using an ultraviolet curable resin comprising anaerobic, characterized in that consisting of.
KR1020080115215A 2008-11-19 2008-11-19 Bonding appartus and bonding methode for flat panel display with anaerobic resin and ultrasonic KR20100056169A (en)

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Application Number Priority Date Filing Date Title
KR1020080115215A KR20100056169A (en) 2008-11-19 2008-11-19 Bonding appartus and bonding methode for flat panel display with anaerobic resin and ultrasonic

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KR1020080115215A KR20100056169A (en) 2008-11-19 2008-11-19 Bonding appartus and bonding methode for flat panel display with anaerobic resin and ultrasonic

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021535436A (en) * 2018-08-27 2021-12-16 三星ディスプレイ株式會社Samsung Display Co., Ltd. Display panel and display device including it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021535436A (en) * 2018-08-27 2021-12-16 三星ディスプレイ株式會社Samsung Display Co., Ltd. Display panel and display device including it
US11917760B2 (en) 2018-08-27 2024-02-27 Samsung Display Co., Ltd. Display panel and display device comprising same

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