KR100819874B1 - stamper and manufacturing method of PCB using it - Google Patents

Abstract

A stamper and a method of manufacturing a printed circuit board using the same are disclosed. An apparatus for use in an imprint process, the stamper comprising an upper frame and a lower frame, wherein the upper frame includes a first plate, a through hole drilled in the first plate, and an upper relief protruding from the first plate. The stamper may include a second plate and a through protrusion formed on the second plate so as to correspond to the through hole, and form a via hole in the insulating layer without leaving residue.

Stamper, Upper Frame, Lower Frame, Residue, Plate

Description

Stamper and manufacturing method of printed circuit board using same

1 is an imprint process diagram according to the prior art.

Figure 2a is a plan view and a cross-sectional view of the upper frame of the stamper according to the first embodiment of the present invention.

Figure 2b is a plan view and a cross-sectional view of the lower frame of the stamper according to the first embodiment of the present invention.

Figure 2c is a cross-sectional view showing the alignment method of the upper frame, the lower frame, the insulating layer according to a first embodiment of the present invention.

Figure 3a is a cross-sectional view of the upper frame of the stamper according to a second preferred embodiment of the present invention.

3B is a cross-sectional view of the undercarriage of a dual stemr according to a second preferred embodiment of the present invention.

Figure 4 is a flow chart of a printed circuit board manufacturing method using a stamper according to a third embodiment of the present invention.

5 is a process diagram for manufacturing a printed circuit board using a stamper according to a third embodiment of the present invention.

6A and 6B are graphs showing control of temperature and pressure in the manufacture of a printed circuit board according to a third preferred embodiment of the present invention. Figure 6c is a graph showing the relationship between the temperature and viscosity of the thermosetting resin according to a third preferred embodiment of the present invention.

7 is a manufacturing process diagram of a printed circuit board using a stamper according to a fourth embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

51: upper frame 51a: through hole

51b: upper embossed 51c: spacer

52: lower frame 52a: through protrusion

52b: second flat plate 54: insulating layer

54a: engraved

The present invention relates to a stamper, and more particularly, to a stamper having a dual structure and an imprint method using the same.

Today, electronic and electric technology is rapidly evolving for more information storage, faster information processing and transmission, and simpler communication network to keep pace with the 21st century's high information and communication society.

In particular, under the condition of the finiteness of a given information transmission rate, as a way of meeting these requirements, a method for implementing the components as small as possible while increasing reliability and providing new functionality has been proposed.

As described above, in accordance with the trend of light and short size of electronic products, fine patterns, miniaturization, and packaging of printed circuit boards are also progressing simultaneously. Accordingly, a circuit having excellent signal processing capability in a smaller area may be implemented. For this purpose, there is a need for manufacturing high density substrates (line / space ≦ 10 μm / 10 μm, Microvia <30 μm).

One of the most widely used microstructure fabrication techniques to date is UV lithography, a method of forming a circuit pattern by injecting ultraviolet rays onto a substrate coated with a photoresist thin film.

However, when manufacturing a substrate using the UV lithography method, there is a limitation that the copper foil used as the circuit has to be thick and the wet etching method is used, so that the reliability of the product when forming a fine line width of 10 μm or less with UV lithography This has the problem of falling.

On the other hand, in recent years, the integration degree of printed circuit boards is increasing, and as a result, research into a method of forming a fine pattern is becoming more active. As an alternative method of the above-described UV lithography, a high density using a stamper for forming a circuit pattern Attempts to manufacture substrates of interest have attracted attention.

1 is an imprint process chart according to the prior art, a substrate having a resin layer 12a formed on an upper surface of a reinforcing plate 12b with a stamper 11 having a multi-stage relief 11a as shown in FIG. Imprint to 12). As a result, the substrate 12 is formed with an intaglio 14 having a multi-stage structure. On the other hand, the reinforcing plate 12b is later removed, at this time, the deep intaglio 14 should be penetrated to form the via hole. However, there is a problem that a residue 13, which remains to be a through hole, remains, and a chemical or mechanical process has to be performed once more to remove it. In particular, the chemical process causes environmental pollution, which is contrary to the current technological trend of pursuing eco-friendly processes.

An object of the present invention is to provide a method of manufacturing a printed circuit board without leaving residue when forming through holes in a resin layer in an imprint process.

According to one aspect of the invention, in the stamper consisting of the upper frame and the lower frame as an apparatus used in the imprint process, the upper frame, the first plate, the through-hole perforated in the first plate, the first plate It includes an upper embossed protruding in the, the lower frame is provided with a stamper comprising a second plate and a through protrusion formed to protrude from the second plate to correspond to the through hole. Such a stamper may form via holes in the insulating layer without leaving residue.

The upper relief is preferably formed adjacent to the through hole, in which case the upper relief serves as a guide of the through projection.

In addition, at the edge of any one of the upper frame or the lower frame it is preferable that a spacer protruding more than the upper relief. The spacer serves to maintain the upper frame and the lower frame at a constant separation distance.

A lower relief may be further formed on the second flat plate. When the imprint process is performed using the lower relief, there is an advantage in that circuit patterns may be formed on both surfaces of the insulating layer.

On the other hand, if the end of the through protrusion is formed to be pointed more easily can penetrate the insulating layer.

Another aspect of the present invention, (a) a step of interposing an insulating layer between the through-hole and the embossed upper frame, and the lower frame including a through projection formed at a position corresponding to the through hole, (b) the upper frame and A method of manufacturing a printed circuit board using a stamper is provided, the method including imprinting an embossment on an insulating layer by closely contacting a lower frame, and (c) separating the upper frame and the lower frame from the insulating layer.

Before the step (b), it is preferable to further include the step of applying a release material on the upper frame and the lower frame surface. The release member serves to easily separate the upper frame and the lower frame.

In addition, in the step (b), it is preferable to imprint such that the through protrusion penetrates the insulating layer to protrude out of the through hole. As a result of this drilling, a via hole is formed, and no residue remains around the via hole.

The insulating layer may be a thermosetting resin, in which step (b) increases the temperature of the insulating layer (b1) to maintain the lowest viscosity, and (b2) compresses the upper frame and the lower frame at the lowest viscosity to insulate the insulating layer. The method may further include imprinting and (b3) increasing the temperature of the insulating layer to cure the insulating layer. Imprinting at a temperature corresponding to the lowest viscosity of the thermosetting resin may facilitate the process.

After the step (c), (d) it may further comprise a step of manufacturing a unit printed circuit board by filling the intaglio inside formed in the insulating layer with a conductive layer. When the conductive layer is filled in the intaglio, a circuit pattern or via hole is completed.

After the step (d), (e) may further comprise the step of laminating a plurality of the unit printed circuit board. This is a process for manufacturing a multilayer printed circuit board.

Hereinafter, a preferred embodiment of a stamper according to the present invention and a circuit pattern forming method using the same will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same components will be denoted by the same reference numerals regardless of the reference numerals and redundant description thereof will be omitted.

Figure 2 (a) is a plan view and a cross-sectional view of the upper frame of the stamper according to a first embodiment of the present invention, Figure 2b is a plan view and a cross-sectional view of the lower frame of the stamper according to a first embodiment of the present invention . 2A and 2B, the upper frame 21, the through hole 21a, the upper relief 21b, the spacer 21c, the first flat plate 21d, the lower frame 22, and the through protrusions 22a), a second plate 22b is shown.

As shown in FIG. 1, the conventional stamper 11 is composed of one member. However, in the present embodiment, the upper mold 21 and the lower mold 22 are set so that one stamper is provided. do.

The upper frame 21 shown in FIG. 2A includes a through hole 21a perforated in the first plate 21d and the first plate 21d, and an upper relief 21b protruding adjacent to the through hole 21a. The spacer 21c protrudes at the edge of the first flat plate 21d and protrudes more than the upper relief 21b.

The first flat plate 21d is a portion corresponding to the body of the upper frame 21, and it is preferable to use a material having excellent hardness. In general, a metal is used, and in some cases, a polymer polymer may be used.

The through hole 21a is a portion through which the through protrusion 22a of the lower frame 22 to be described with reference to FIG. 2B passes. Therefore, the diameter must be slightly larger than the through protrusion 22a. The via hole of the printed circuit board is formed by the through hole 21a and the through protrusion 22a. At this time, since the size of the via hole is determined by the through protrusion 22a, it is preferable to select the diameter of the through protrusion 22a according to the via hole having a desired size.

The upper relief 21b is formed on the first flat plate 21d, and when the imprint is performed later, an intaglio is formed in the insulating layer 24 shown in FIG. 2C. The upper relief 21b may be formed in various ways to fit the desired circuit pattern. On the other hand, when the upper embossed 21b is formed adjacent to the through hole 21a, the upper embossed 21b may also serve as a guide of the through protrusion 22a at the same time. Here, the meaning of 'adjacent' means that the upper embossed portion 21b has the first flat plate 21d such that the diameter of the through hole 21a and the inner hole of the upper embossed portion 21b surrounding the through hole 21a are the same as shown in FIG. 2A. ) Is formed.

The spacer 21c is formed to protrude at the edge of the first flat plate 21d and protrudes more than the upper relief 21b. This allows the lower frame 22 and the upper frame 51 to be maintained at a predetermined distance when the imprint process is performed through the insulating layer 24 between the lower frame 22 and the upper frame 21. That is, when pressure is applied from the upper and lower parts, the upper frame 21 and the lower frame 22 are maintained at a constant separation distance by the protruding spacer 21c. This makes it possible to form a reliable intaglio in the insulating layer 24.

The lower frame 22 shown in FIG. 2B includes a second flat plate 22b and a through protrusion 22a. The second flat plate 22b is made of the same material as the first flat plate 21d. The through plate 22a is formed in the second flat plate 22b so as to correspond to the through hole 21a shown in FIG. 2A. The end of the through protrusion 22a is preferably formed sharply. This is to allow the through protrusion 22a to easily penetrate the insulating layer 24.

The upper frame 21 and the lower frame 22 imprint the upper relief 21b of the upper frame 21 with the insulating layer 24 therebetween as shown in FIG. 2C. A detailed imprint process will be described in detail with reference to FIG. 5.

3A is a cross-sectional view of the upper frame of the stamper according to the second preferred embodiment of the present invention, and FIG. 3B is a cross-sectional view of the lower frame of the stamper according to the second preferred embodiment of the present invention. This embodiment is generally the same configuration as the first embodiment described in Figures 2a, 2b, 2c, it is characterized in that the lower relief 32c is additionally formed in the lower frame (32). When the upper embossing 31b is formed on the upper frame 31 and the lower embossing 32c is formed on the lower frame 32, intaglio may be formed on both surfaces of the insulating layer by one imprint process. In the subsequent process, the intaglio portion corresponds to the portion of the circuit pattern, which is a method of forming a double-sided circuit pattern on the insulating layer.

4 is a flowchart of a method of manufacturing a printed circuit board using a stamper according to a third exemplary embodiment of the present invention, and FIG. 5 is a process diagram of a printed circuit board manufacturing using a stamper according to a third exemplary embodiment of the present invention. Referring to FIG. 5, the upper frame 51, the through hole 51a, the upper relief 51b, the spacer 51c, the lower frame 52, the through protrusion 52a, the second flat plate 52b, Insulating layer 54, intaglio 54a is shown.

S41 of FIG. 4 is a step of interposing the insulating layer 54 between the upper mold 51 and the lower mold 22, and FIG. 5A shows a corresponding process. In particular, it is important that the upper frame 51 and the lower frame 52 are positioned so that the through hole 51a and the through protrusion 52a correspond to each other.

On the other hand, it is preferable to apply a release material on the upper frame 51 and the lower frame 52 at this step. The release member serves to allow the upper mold 51 and the lower mold 52 to be easily separated from the insulating layer 54 after the imprint process is finished. Release treatment methods include plasma polymerization, SAM (Self Assembly Monolayer) coating, and DLC (Diamond Like Carbon) coating.

S42 of FIG. 4 is a step of imprinting the upper relief 51b on the insulating layer 54 by pressing the upper frame 51 and the lower frame 52, and FIG. 5B shows a corresponding process. As shown in (b) of FIG. 5, the through protrusion 52a is positioned at a position corresponding to the through hole 51a, and has a sharp tip, and thus easily penetrates through the insulating layer 54 to protrude into the first flat plate 51d. In addition, since the upper relief 51b formed adjacent to the through hole 51a serves as a guide through which the through protrusion 52a moves, an imprint process is more easily performed.

Meanwhile, the insulating layer 54 may use a thermosetting resin, and in this case, it is important to control the temperature and the imprint pressure accordingly in order to proceed the imprint process more easily.

6A is a graph relating to the temperature during the imprint process according to the present embodiment, FIG. 6B is a graph relating to the pressure during the imprint process according to the present embodiment, and FIG. 6C is a graph relating to the temperature and viscosity of the thermosetting resin. As shown in FIG. 6C, the thermosetting resin reaches the lowest viscosity at some point as the temperature increases, and then increases again. Therefore, it is preferable to advance an imprint process at the time when it becomes a minimum viscosity.

Such minimum viscosity differs depending on the type of thermosetting resin. The thermosetting resin of this embodiment maintains the lowest viscosity at about 65 to 75 degrees. Therefore, after maintaining about 70 degrees as shown in FIG. 6a and after about 2 minutes, pressure is applied to the upper mold 51 and the lower mold 52 as shown in FIG. 6b. In this case, the through protrusion 52a easily penetrates the insulating layer 54. Methods of controlling temperature and pressure can vary. However, the common part is that these various control methods also use the lowest viscosity of the thermosetting resin.

In addition, the insulating layer 54 can use not only a thermosetting resin but a thermoplastic resin. Since the thermoplastic resin has a low viscosity as the temperature increases, it is preferable to proceed with the imprint process at a point where the thermoplastic resin becomes a suitable viscosity for the process. If the viscosity is too low and the thermoplastic resin flows down between the upper mold 51 and the lower mold 52, it will be difficult to proceed with the imprint process.

S43 of FIG. 4 is a step of separating the upper mold 51 and the lower mold 52 from the insulating layer 54. The upper mold 51 and the lower mold 52 can be easily separated because the release material is coated. When separated, as shown in (c) of FIG. 5, an intaglio 54a is formed in the insulating layer 54 at a point corresponding to the upper relief 51b of the upper frame 51, and the through protrusion 52a. The via hole 54b is formed at a point corresponding to.

S44 of FIG. 4 is a step of manufacturing a unit printed circuit board by filling the conductive layer 54c in the via hole 54b and the intaglio 54a, and FIG. 5 (d) shows a corresponding process. The conductive layer 554c is generally formed by plating. As a typical plating process, the seed layer is laminated on the surface of the insulating layer 54 by (a) electroless plating, and then (b) the intaglio 54a and the via hole 54b are filled with electroplating. (C) The plating layer of the part to be shorted is then removed by grinding. Through this process, the unit printed circuit board 56 is completed.

S45 of FIG. 4 is a process of manufacturing a multilayer printed circuit board by laminating unit printed circuit boards 56. In general, the printed circuit board is made of a multilayer, so that the lamination process is performed as shown in the drawing. At this time, the via hole 54b serves to connect the circuit patterns of the upper and lower layers. The lamination method is performed by pressing the unit printed circuit board 56 under the condition of high temperature and high pressure. Through this process, the multilayered printed circuit board 57 is completed as shown in FIG.

7 is a manufacturing process diagram of a printed circuit board using a stamper according to a fourth embodiment of the present invention. This embodiment proceeds in the same manner as in the third embodiment of FIG. 5, but a lower relief 72c is formed in the lower frame 72. As a result, the first embossment 74a and the second embossment are formed on the insulating layer 74 by the upper embossed 71b of the upper mold 71 and the lower embossed 72c of the upper mold 72 as shown in FIG. When the intaglio 74c is formed and the plating process is performed on this portion, the unit printed circuit board 76 having the circuit patterns 77a and 77b formed on both surfaces of the insulating layer 74 is formed as shown in FIG. . The unit printed circuit board 76 may be laminated to manufacture a multilayer printed circuit board.

 Although the technical spirit of the present invention has been described in detail according to the above-described embodiments, the above-described embodiments are for the purpose of description and not of limitation, and a person of ordinary skill in the art will appreciate It will be understood that various embodiments are possible within the scope.

According to the present invention having the above-described configuration, not only the via hole can be drilled through the insulating layer by leaving the residue of the stamper, but also the spacer is used to maintain a constant distance between the upper frame and the lower frame. In this state, the imprint process can be performed. On the other hand, when the embossed on both the upper frame and the lower frame it is possible to manufacture a unit printed circuit board having a double-sided circuit pattern.

Claims (11)

delete delete In the stamper consisting of the upper frame and the lower frame as an apparatus used in the imprint process, The upper frame, A first flat plate; A through hole drilled in the first plate; An upper relief protruding from the first plate, The lower frame, A second plate; It includes a through protrusion protruding from the second plate to correspond to the through hole, A stamper, characterized in that a spacer protruding more than the upper embossment is formed at the edge of either the upper frame or the lower frame. In the stamper consisting of the upper frame and the lower frame as an apparatus used in the imprint process, The upper frame, A first flat plate; A through hole drilled in the first plate; An upper relief protruding from the first plate, The lower frame, A second plate; It includes a through protrusion protruding from the second plate to correspond to the through hole, Stamper, characterized in that the lower embossed on the second flat plate. In the stamper consisting of the upper frame and the lower frame as an apparatus used in the imprint process, The upper frame, A first flat plate; A through hole drilled in the first plate; An upper relief protruding from the first plate, The lower frame, A second plate; It includes a through protrusion protruding from the second plate to correspond to the through hole, The through protrusion is a stamper, characterized in that the pointed end. delete (a) interposing an insulating layer between an upper frame having an embossed through hole and a lower frame including a through protrusion formed at a position corresponding to the through hole; (b) imprinting the relief on the insulating layer by bringing the upper frame into close contact with the lower frame; And (c) a method of manufacturing a printed circuit board using a stamper comprising separating the upper frame and the lower frame from the insulating layer, Before step (b), Printed circuit board manufacturing method using a stamper further comprising the step of applying a release material on the upper frame and the lower frame surface (a) interposing an insulating layer between an upper frame having an embossed through hole and a lower frame including a through protrusion formed at a position corresponding to the through hole; (b) imprinting the relief on the insulating layer by bringing the upper frame into close contact with the lower frame; And (c) a method of manufacturing a printed circuit board using a stamper comprising separating the upper frame and the lower frame from the insulating layer, The step (b) is a method for manufacturing a printed circuit board using a stamper, characterized in that the through projections puncture the insulating layer so as to protrude out of the through hole. (a) interposing an insulating layer between an upper frame having an embossed through hole and a lower frame including a through protrusion formed at a position corresponding to the through hole; (b) imprinting the relief on the insulating layer by bringing the upper frame into close contact with the lower frame; And (c) a method of manufacturing a printed circuit board using a stamper comprising separating the upper frame and the lower frame from the insulating layer, The insulating layer is a thermosetting resin, Step (b) is, (b1) increasing the temperature of the insulating layer to maintain the lowest viscosity; (b2) imprinting the insulating layer by pressing the upper frame and the lower frame at the lowest viscosity; (b3) a method of manufacturing a printed circuit board using a stamper further comprising curing the insulating layer. delete (a) interposing an insulating layer between an upper frame having an embossed through hole and a lower frame including a through protrusion formed at a position corresponding to the through hole; (b) imprinting the relief on the insulating layer by bringing the upper frame into close contact with the lower frame; (c) separating the upper frame and the lower frame from the insulating layer; (d) manufacturing a unit printed circuit board by filling the intaglio inside of the insulating layer with a conductive layer; And (e) a method of manufacturing a printed circuit board using a stamper, further comprising stacking a plurality of unit printed circuit boards.

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