JPH04148594A - Device and method for forming multipin through hole formation - Google Patents
Device and method for forming multipin through hole formationInfo
- Publication number
- JPH04148594A JPH04148594A JP27365390A JP27365390A JPH04148594A JP H04148594 A JPH04148594 A JP H04148594A JP 27365390 A JP27365390 A JP 27365390A JP 27365390 A JP27365390 A JP 27365390A JP H04148594 A JPH04148594 A JP H04148594A
- Authority
- JP
- Japan
- Prior art keywords
- green sheet
- pins
- pin
- forming
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 14
- 230000015572 biosynthetic process Effects 0.000 title abstract description 4
- 239000011159 matrix material Substances 0.000 claims abstract description 8
- 239000000919 ceramic Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims 1
- 239000011295 pitch Substances 0.000 abstract description 10
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はグリーンシート法によるセラミック多層配線基
板の製造装置に関し、特にグリーンシートへのマルチピ
ンスルーホール形成装置とそれを用いたマルチピンスル
ーホール形成法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an apparatus for manufacturing a ceramic multilayer wiring board using a green sheet method, and in particular, an apparatus for forming multi-pin through holes in a green sheet and a multi-pin through hole using the same. Regarding the formation method.
従来、この種のスルーホール形成装置及び形成方法は、
複数のスルーホール形成用のパンチを有していても同時
に2つのスルーホール形成用のパンチを動作させること
はなく、1回の動作で1つのパンチにグリーンシートの
所望の位置を順次位置合わせする事により、グリーンシ
ートに順次に任意のスルーホールパターンを形成してい
た。Conventionally, this type of through hole forming apparatus and forming method are as follows:
Even if there are multiple punches for forming through-holes, two punches for forming through-holes are not operated at the same time, and the desired position of the green sheet is sequentially aligned with one punch in one operation. As a result, arbitrary through-hole patterns were sequentially formed on the green sheet.
上述した従来のスルーホール形成装置及びそれを用いた
スルーホール形成方法は、1つのパンチで順次スルーホ
ールを形成してゆくので、グリーンシートに多数個のス
ルーホールを形成する必要があるときは、形成のための
作業時間がかかるという欠点がある。The conventional through-hole forming apparatus and the through-hole forming method using the same described above sequentially form through-holes with one punch, so when it is necessary to form a large number of through-holes in a green sheet, The drawback is that it takes a lot of time to form.
本発明のマルチピンスルーホール形成装置は、グリーン
シート法によるセラミック多層配線基板製造装置におけ
るスルーホール形成装置であって、上部金型に一定のピ
ッチで配置された複数個のスルーホール形成用のピンと
、前記ピンを少なくとも2個同時に駆動させるためのア
クチュエータ部と、下部金型に設けられグリーンシート
の位置決めをするX−Y駆動機構とを備えてなり、さら
に前記複数個のスルーホール形成用のピンがマトリクス
状に配置されている。The multi-pin through-hole forming device of the present invention is a through-hole forming device for a ceramic multilayer wiring board manufacturing device using the green sheet method, and includes a plurality of through-hole forming pins arranged at a constant pitch in an upper mold. , an actuator section for simultaneously driving at least two of the pins, and an X-Y drive mechanism provided in the lower mold for positioning the green sheet, further comprising: an actuator section for simultaneously driving at least two of the pins; are arranged in a matrix.
また本発明のマルチピンスルーホール形成法は、グリー
ンシート法によるセラミック多層配線基板製造装置にお
けるスルーホール形成法であって、グリーンシートをX
−Y駆動機構によって下部金型上に位置決めする工程と
、上部金型に一定のピッチでマトリクス状に配置された
複数個のスルーホール形成用のピンを用い、アクチュエ
ータ部によって前記ピンの少なくとも2個を同時に駆動
させる工程とを有し、前記グリーンシートに複数個のス
ルーホールを同時に打ち抜くようになっている。Further, the multi-pin through hole forming method of the present invention is a through hole forming method in a ceramic multilayer wiring board manufacturing apparatus using a green sheet method, in which a green sheet is
- A process of positioning on the lower mold by a Y drive mechanism, and using a plurality of pins for forming through holes arranged in a matrix at a constant pitch on the upper mold, at least two of the pins are positioned by an actuator section. The green sheet is simultaneously driven to punch a plurality of through holes in the green sheet at the same time.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第1図は本発明の一実施例の縦断面図、第2図ないし第
5図は本実施例の動作を順次に示す断面図、第6図は本
実施例のピン配置を示す斜視図である。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention, FIGS. 2 to 5 are sectional views sequentially showing the operation of this embodiment, and FIG. 6 is a perspective view showing the pin arrangement of this embodiment. be.
本実施例において、複数のスルーホール形成用のピン1
は超硬合金鋼で作られており、この時のピン本体の直径
は1.5mmであり、先端1aは切削加工が施されて細
くなっている。ピン先端1aの直径は0.2mmである
。これは通常グリーンシートに形成するスルーホールの
直径と同じにする。ピン1は滑り軸受け2によって運動
方向を上下方向に決められた状態で保持されている。ピ
ン1はばね3により常に一定の位置に押しつけられ、通
常はピン先端1aが上部金型4の下面より引っ込んでい
る。複数のピン1は一定のピッチにより上部金型4に取
り付けられている。上部金型4は、全体が上下に作動す
るようになっている。In this embodiment, pin 1 for forming multiple through holes is
is made of cemented carbide steel, the diameter of the pin body at this time is 1.5 mm, and the tip 1a is thinned by cutting. The diameter of the pin tip 1a is 0.2 mm. This is usually the same diameter as the through hole formed in the green sheet. The pin 1 is held by a sliding bearing 2 with the direction of movement determined in the vertical direction. The pin 1 is always pressed to a fixed position by the spring 3, and the pin tip 1a is usually retracted from the lower surface of the upper mold 4. The plurality of pins 1 are attached to the upper mold 4 at a constant pitch. The entire upper mold 4 is designed to move up and down.
ピン1の配置は、基板を設計するときの配線ルールとグ
リーンシート7を積層、焼成したときの基板の収縮率と
によって決定される。すなわちピン1のピッチは、〔基
板の設計スルーホールピッチ×基板の収縮率〕の整数倍
にとるとよい、この場合は、配線ルールが1.0mm、
基板の収縮率が10%なので、ピン1のピッチは1.O
XI/(1−0,1)X20=22.222mmである
。ピン1は、その上方に位置するエアーシリンダ6によ
って駆動され、そのストロークは0.5mm〜1.0m
mである。各々のエアーシリンダ6は、図示しない電磁
バルブに接続され任意にオン、オフできる様になってい
る。The arrangement of the pins 1 is determined by the wiring rules when designing the board and the shrinkage rate of the board when the green sheets 7 are laminated and fired. In other words, the pitch of pin 1 should be an integral multiple of [designed through-hole pitch of the board x shrinkage rate of the board]. In this case, the wiring rule is 1.0 mm,
Since the shrinkage rate of the board is 10%, the pitch of pin 1 is 1. O
XI/(1-0,1)X20=22.222 mm. The pin 1 is driven by an air cylinder 6 located above it, and its stroke is 0.5 mm to 1.0 m.
It is m. Each air cylinder 6 is connected to a solenoid valve (not shown) and can be turned on and off as desired.
下部金型5はピン1の各々対応する位置にブツシュ5a
が埋め込丈れている。このときのブツシュ5aの内径は
、ピンの先端1aの径より0.04mm大きい0.24
mmである。下部金型5には、グリーンシート7を位置
合わせするときに金型に接触しないようにエアーを送り
込み、グリーンシート7を浮上させる給気孔8と、グリ
ーンシート7を位置合わせするために移動させるX−Y
駆動機構9が設けである。The lower mold 5 has bushings 5a at positions corresponding to each of the pins 1.
is recessed. The inner diameter of the bushing 5a at this time is 0.24mm, which is 0.04mm larger than the diameter of the tip 1a of the pin.
It is mm. The lower mold 5 has an air supply hole 8 that feeds air so as not to contact the mold when aligning the green sheet 7, and floats the green sheet 7, and an X that moves the green sheet 7 to align it. -Y
A drive mechanism 9 is provided.
第2図ないし第5図に本実施例の動作を順次ステップ毎
に示している。2 to 5 show the operation of this embodiment step by step.
第2図は上部金型4が下降してグリーンシート7を上下
の金型で押さえているところである。グリーンシート7
を押さえたときの上下金型4.5間のギャップは、加工
するグリーンシート7の膜厚に合わせて調整されなけれ
ばならない。そうでなければ加工の際、上下金型4,5
でグリーンシート7にダメージを与え、押しつぶしてし
tうことになる。この時のグリーンシート7の厚さ15
0μm、上下金型4,5間のギャップは145μmであ
る。FIG. 2 shows the upper mold 4 descending and pressing the green sheet 7 between the upper and lower molds. green sheet 7
The gap between the upper and lower molds 4.5 when pressed must be adjusted according to the thickness of the green sheet 7 to be processed. Otherwise, during processing, the upper and lower molds 4, 5
This will damage the green sheet 7 and crush it. The thickness of the green sheet 7 at this time is 15
The gap between the upper and lower molds 4 and 5 is 145 μm.
第3図は、エアシリンダ6を作動させ、ピン1を押して
グリーンシート7にスルーホールを形成しているところ
である。FIG. 3 shows a state in which the air cylinder 6 is operated and the pin 1 is pushed to form a through hole in the green sheet 7.
第4図は、スルーホール形成後に上部金型4を上昇させ
、下部金型5に設けた給気孔8よりエアーを送り込み、
グリーンシート7を浮上させながら、X−Y駆動機構9
によって次の位置に位置合わせしているところである。FIG. 4 shows that after forming the through holes, the upper mold 4 is raised and air is fed through the air supply holes 8 provided in the lower mold 5.
While floating the green sheet 7,
The position is being adjusted to the next position using the following commands.
位置合わせが終わった後は、第2図からの動作を繰り返
し、隣りのピンのスルーホールエリヤまでのスルーホー
ルを形成する。この場合は、20回繰り返すことになる
。スルーホールを形成しない所は、第5図の様に電磁バ
ルブでエアシリンダ6の動作を止める。After the alignment is completed, repeat the operations from FIG. 2 to form a through hole to the through hole area of the adjacent pin. In this case, it will be repeated 20 times. In areas where through-holes are not formed, the operation of the air cylinder 6 is stopped using a solenoid valve as shown in FIG.
本実施例の実際のピン配置は、第6図のようになり、4
X4=16本がマトリックス状に配置されている。これ
に対してグリーンシート7をX−Y駆動機構9によって
X−Y方向に位置合わせしながら、第2図から第5図の
動作を繰り返すことにより、グリーンシート7の全面に
わたって所望のパターンを形成することができる。ピッ
チの違うスルーホールパターンを形成したいときには、
上下金型4.5をとりかえることにより対応できる。本
実施例は、スルーホール形成用のピン1をマトリクス状
に4X4=16本配置した例であり、160個のスルー
ホールを最小10回の動作で形成できる。ピン1の本数
を増やすことによりさらに形成スピードを上げることが
できる。The actual pin arrangement of this embodiment is as shown in Fig. 6.
X4=16 pieces are arranged in a matrix. On the other hand, by repeating the operations shown in FIGS. 2 to 5 while aligning the green sheet 7 in the X-Y direction by the X-Y drive mechanism 9, a desired pattern is formed over the entire surface of the green sheet 7. can do. When you want to form through-hole patterns with different pitches,
This can be handled by replacing the upper and lower molds 4.5. This embodiment is an example in which 4×4=16 pins 1 for forming through holes are arranged in a matrix, and 160 through holes can be formed in a minimum of 10 operations. By increasing the number of pins 1, the forming speed can be further increased.
以上説明したように本発明は、一定のピッチでマトリク
ス状に配置した複数のピンを同時に駆動してグリーンシ
ートにスルーホールを形成することにより、スルーホー
ル形成スピードを大幅に上げることができる。As explained above, the present invention can greatly increase the speed of forming through holes by simultaneously driving a plurality of pins arranged in a matrix at a constant pitch to form through holes in a green sheet.
第1図は本発明の一実施例の縦断面図、第2図ないし第
5図は本実施例の動作を順次に示す断面図、第6図は本
実施例のピン配置を示す斜視図である。
1・・・スルーホール形成用ピン、2・・・滑り軸受け
、3・・・ばね、4・・・上部金型、5・・・下部金型
、6・・・エアーシリンダ、7・・・グリーンシート、
8・・・給気孔、9・・・x−y駆動機構。FIG. 1 is a longitudinal sectional view of one embodiment of the present invention, FIGS. 2 to 5 are sectional views sequentially showing the operation of this embodiment, and FIG. 6 is a perspective view showing the pin arrangement of this embodiment. be. DESCRIPTION OF SYMBOLS 1... Pin for through-hole formation, 2... Sliding bearing, 3... Spring, 4... Upper mold, 5... Lower mold, 6... Air cylinder, 7... green sheet,
8...Air supply hole, 9...xy drive mechanism.
Claims (1)
造装置におけるスルーホール形成装置であって、上部金
型に一定のピッチで配置された複数個のスルーホール形
成用のピンと、前記ピンを少なくとも2個同時に駆動さ
せるためのアクチュエータ部と、下部金型に設けられグ
リーンシートの位置決めをするX−Y駆動機構とを備え
ることを特徴とするマルチピンスルーホール形成装置。 2、前記複数個のスルーホール形成用のピンがマトリク
ス状に配置されていることを特徴とする請求項1記載の
マルチピンスルーホール形成装置。 3、グリーンシート法によるセラミック多層配線基板製
造装置におけるスルーホール形成法であって、グリーン
シートをX−Y駆動機構によって下部金型上に位置決め
する工程と、上部金型に一定のピッチでマトリクス状に
配置された複数個のスルーホール形成用のピンを用い、
アクチュエータ部によって前記ピンの少なくとも2個を
同時に駆動させる工程とを有し、前記グリーンシートに
複数個のスルーホールを同時に打ち抜くことを特徴とす
るマルチピンスルーホール形成法。[Claims] 1. A through-hole forming device in a ceramic multilayer wiring board manufacturing device using a green sheet method, which comprises: a plurality of through-hole forming pins arranged at a constant pitch in an upper mold; and the pins. 1. A multi-pin through-hole forming apparatus comprising: an actuator section for simultaneously driving at least two pins; and an X-Y drive mechanism provided in a lower mold for positioning a green sheet. 2. The multi-pin through hole forming device according to claim 1, wherein the plurality of through hole forming pins are arranged in a matrix. 3. A through hole forming method in a ceramic multilayer wiring board manufacturing device using the green sheet method, which includes the step of positioning the green sheet on the lower mold by an X-Y drive mechanism, and forming the green sheet in a matrix shape at a constant pitch on the upper mold. Using multiple through-hole forming pins placed in
A method for forming a multi-pin through hole, comprising the step of simultaneously driving at least two of the pins by an actuator section, and simultaneously punching a plurality of through holes in the green sheet.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27365390A JPH04148594A (en) | 1990-10-12 | 1990-10-12 | Device and method for forming multipin through hole formation |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27365390A JPH04148594A (en) | 1990-10-12 | 1990-10-12 | Device and method for forming multipin through hole formation |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04148594A true JPH04148594A (en) | 1992-05-21 |
Family
ID=17530686
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27365390A Pending JPH04148594A (en) | 1990-10-12 | 1990-10-12 | Device and method for forming multipin through hole formation |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04148594A (en) |
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