JPH01246100A - Boring die unit - Google Patents
Boring die unitInfo
- Publication number
- JPH01246100A JPH01246100A JP7031788A JP7031788A JPH01246100A JP H01246100 A JPH01246100 A JP H01246100A JP 7031788 A JP7031788 A JP 7031788A JP 7031788 A JP7031788 A JP 7031788A JP H01246100 A JPH01246100 A JP H01246100A
- Authority
- JP
- Japan
- Prior art keywords
- die
- punch
- ceramic green
- green sheet
- punches
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004080 punching Methods 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 abstract description 31
- 238000005553 drilling Methods 0.000 description 14
- 238000010586 diagram Methods 0.000 description 7
- 239000002985 plastic film Substances 0.000 description 4
- 229920006255 plastic film Polymers 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
Landscapes
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
セラミック積層基板のセラミックグリーン、シートに大
量のバイアホールをパンチ穿孔する配線基板製作装置の
穿孔用金型ユニットに間し、 穿孔作業の効率化と生産
性向上を目的とし、シート状薄板に複数の孔をパンチ穿
孔する穿孔用金型ユニットであって、所定ピッチで整列
した複数個のパンチを備えたパンチヘッドと、該パンチ
のそれぞれと対向する位置に該パンチと嵌合する孔を持
ち且つ上下動する手段を備えたダイとで構成し、シート
状薄板を上記パンチヘッドと上記ダイとで挟持した状態
で上記パンチヘッドのダイ対向面を上記ダイで押圧した
時に、該ダイ対向面のみを後退させて内在するパンチの
先端部を該ダイ対向面から突出させて構成する。[Detailed Description of the Invention] [Summary] Ceramic Green, a ceramic laminated board, is used in a punching mold unit of a wiring board manufacturing device that punches a large number of via holes in a sheet, thereby increasing the efficiency and productivity of punching work. This is a punching die unit for punching a plurality of holes in a sheet-like thin plate for the purpose of improving the performance of the punch, and includes a punch head equipped with a plurality of punches arranged at a predetermined pitch, and a position facing each of the punches. and a die having a hole that fits into the punch and a means for moving up and down, and with the sheet-like thin plate being held between the punch head and the die, the die facing surface of the punch head is pressed by the die. When pressed, only the die facing surface is retracted, and the tip of the punch located therein is made to protrude from the die facing surface.
本発明はセラミック積層基板を構成するセラミックグリ
ーンシートに大量のバイアホールを穿孔する配線基板製
作装置に係り、特に穿孔作業の効率化と生産性の向上を
図った穿孔用金型ユニットに関する。The present invention relates to a wiring board manufacturing apparatus for punching a large number of via holes in a ceramic green sheet constituting a ceramic laminate board, and particularly to a punching mold unit that improves the efficiency and productivity of the punching operation.
近年のコンピュータシステムの高速化要求にともなうＬ
ＳＩ素子の高密度実装を可能とするため、最近では多層
のセラミック回路基板が多く使用されている。L due to the recent demand for faster computer systems.
Recently, multilayer ceramic circuit boards have been widely used to enable high-density mounting of SI elements.
この際、多層のセラミック積層基板を構成するセラミッ
クグリーンシートに多くのバイアホール（以下微細孔と
する）を精密に穿孔するのに、複数個のドリルを装着し
たドリルマシーンを使用し、セラミックグリーンシート
を二次元の方向に移動させながら穿孔する等の手段をと
っているが、更に高密度実装を実現するためには多数の
パンチング型による一括穿孔が有利であり、この面から
大量の微細孔を高密度に精度よく且つ生産性よく穿孔す
る穿孔用金型ユニットの開発が強く望まれている。At this time, a drill machine equipped with multiple drills is used to precisely drill many via holes (hereinafter referred to as microholes) in the ceramic green sheet that makes up the multilayer ceramic laminate board. However, in order to achieve even higher density mounting, it is advantageous to punch holes at once using multiple punching dies, and from this point of view, it is possible to drill a large number of fine holes. There is a strong demand for the development of a drilling mold unit that can drill holes with high density, precision, and productivity.
第３図は従来の穿孔方法の一例を示した構成原理図であ
る。なお図では理解し易くするため、に穿孔作業近傍部
分のみを拡大している。FIG. 3 is a diagram showing the principle of construction of an example of a conventional drilling method. In the figure, only the area near the drilling operation is enlarged for ease of understanding.
図で、１は径が１５０μｍ程度のドリル、２は該ドリル
１を装着するドリルチャック、３は複数個の該ドリルチ
ャック２を所定のピッチＰ（例えば数１０１）で−列に
整列したドリルヘッドを示し図示されていないドリルマ
シーンのヘッドと直結してＺ方向に上下動するするよう
に構成されている。In the figure, 1 is a drill with a diameter of about 150 μm, 2 is a drill chuck on which the drill 1 is mounted, and 3 is a drill head in which a plurality of the drill chucks 2 are arranged in -rows at a predetermined pitch P (for example, several 101). It is configured to be directly connected to the head of a drill machine (not shown) and move up and down in the Z direction.
また４は各ドリルチャック２を例えば図示Ｒ方向に軸回
転させるための回転機構であり上記ドリルへラド３に内
蔵されている。Reference numeral 4 denotes a rotation mechanism for axially rotating each drill chuck 2, for example, in the R direction in the drawing, and is built in the drill rod 3.
一方、厚さ０．２〜０．３ｎｍ程度のセラミックグリー
ンシート５はその周囲で固定枠６に固定されており、こ
の状態でＸ−Ｙテーブル７の上面に装着されている。な
お８はセラミックグリーンシート５の強度を上げて穿孔
を容易ならしめるためのプラスチックフィルムであり、
穿孔作業が終了した後に剥離して除去するものである。On the other hand, a ceramic green sheet 5 having a thickness of approximately 0.2 to 0.3 nm is fixed to a fixed frame 6 around the ceramic green sheet 5, and is mounted on the upper surface of an XY table 7 in this state. Note that 8 is a plastic film for increasing the strength of the ceramic green sheet 5 and making perforation easier.
It is peeled off and removed after the drilling work is completed.
ここで、上記ドリル１を軸回転させながらドリルヘッド
３を降下させてセラミックグリーンシート５に所定の穿
孔作業を行い、また上昇している間に図示していない制
御装置からの信号によってＸ−Ｙテーブル７を所定量だ
けＸ方向あるいはＹ方向に移動させてから再度ドリル１
を降下させて穿孔させる。Here, the drill head 3 is lowered while rotating the axis of the drill 1 to perform a predetermined drilling operation on the ceramic green sheet 5, and while the drill head 3 is being raised, an X-Y Move table 7 by a predetermined amount in the X direction or Y direction and then drill 1 again.
to lower and drill holes.
かかる動作を繰り返すことによってセラミックグリーン
シート５の全面所定位置に致方箇所の微細孔を穿孔して
いる。By repeating this operation, fine holes are bored at predetermined positions on the entire surface of the ceramic green sheet 5.
この場合、各ドリルチャック２それぞれにモータ等の回
転体若しくはドリルマシーンのメイン回転体からの軸回
転伝達機構を配設する必要があるため各ドリル間のピッ
チＰを小さ（することができないと共に、各微細孔間の
精密な位置関係を保持するためドリルへラド３に装着す
るドリルチャック２ひいてはドリル１の数を通常４〜５
個程度にしている。In this case, since it is necessary to provide each drill chuck 2 with a shaft rotation transmission mechanism from a rotating body such as a motor or a main rotating body of a drill machine, it is not possible to reduce the pitch P between each drill, and In order to maintain precise positional relationships between each microhole, the number of drill chucks 2 and drills 1 attached to the drill rad 3 is usually 4 to 5.
I keep it to about 1 piece.
従って穿孔動作の繰り返し回数が極めて多く多大の工数
を必要としている。Therefore, the number of repetitions of the drilling operation is extremely large, requiring a large number of man-hours.
上述の如く、大量の微細孔を有するセラミックグリーン
シートを加工するのに多くの工数を必要とすると共に、
作業中のドリル折損によって該セラミックグリーンシー
トに不良が発生し易いと云う問題があった。As mentioned above, processing a ceramic green sheet with a large number of micropores requires a large number of man-hours, and
There was a problem in that the ceramic green sheets were likely to become defective due to drill breakage during operation.
上記問題点は、シート状薄板に複数の孔をパンチ穿孔す
る穿孔用金型ユニットであって、所定ピッチで整列した
複数個のパンチを備えたパンチヘッドと、該パンチのそ
れぞれと対向する位置に該パンチと嵌合する孔を持ち且
つ上下動する手段を備えたダイとで構成し、
シート状薄板を上記パンチヘッドと上記ダイとて挟持し
た状態で上記パンチヘッドのダイ対向面を上記ダイで押
圧した時に、該ダイ対向面のみを後退させて内在するパ
ンチの先端部を該ダイ対向面から突出させてなる穿孔用
金型ユニットによって解決される。The above problem is a punching die unit for punching a plurality of holes in a sheet-like thin plate. and a die having a hole that fits into the punch and a means for moving up and down, and with the sheet-like thin plate being held between the punch head and the die, the die facing surface of the punch head is pressed by the die. This problem is solved by a punching die unit which, when pressed, moves only the die facing surface back and causes the tip of the punch therein to protrude from the die facing surface.
大量の微細孔を必要とするセラミックグリーンシートに
正確に且つ効率よ（穿孔作業を実施するには多数のパン
チによる一括穿孔が有利である。For ceramic green sheets that require a large number of micropores, it is advantageous to perform perforation using a large number of punches at once in order to perform the perforation work accurately and efficiently.
また、折損し易いパンチを保護するにはパンチをできる
だけ露出させないことが望ましい。Further, in order to protect the punch which is easily broken, it is desirable to expose the punch as little as possible.
そこで常時はパンチホルダ内に保持し穿孔時のみパンチ
先端部を突出させるようにパンチ並びにダイを構成し更
に折損時のパンチ交換を容易ならしめることによって、
１５０μ曙あるいはそれ以下例えば９０μｍ程度の径の
折損じ易いパンチでも効率よく且つ生産性よく穿孔作業
を実施することができる。Therefore, by configuring the punch and die so that they are held in the punch holder at all times and the punch tip protrudes only when drilling, and by making it easier to replace the punch when it breaks,
Even with a breakable punch having a diameter of 150 μm or less, for example, about 90 μm, the punching operation can be carried out efficiently and with good productivity.
本発明になる微細孔穿孔用金型ユニットでは、押圧によ
って押圧面が後退する構造を持つパンチヘッドに常時は
内在し押圧時にのみ先端が押圧面から突出するようなパ
ンチを交換容易に且つ小さなピッチで整列させると共に
、該各パンチに対向する位置に整列して設けたダイを上
下動可能な如くに該パンチヘッドに近接して配設してお
り、上記パンチヘッドとダイの間で二次元の方向に移動
できるセラミックグリーンシートを挟持固定した状態で
ダイ部分を押し上げてパンチヘッドの上記押圧面を押圧
することによって上記パンチ先端部を突出させて穿孔し
ている。In the micro-hole drilling mold unit of the present invention, the punch, which is always inside the punch head and whose tip protrudes from the pressing surface only when pressed, is easily replaced and has a small pitch. At the same time, dies arranged in alignment at positions facing each punch are placed close to the punch head so as to be movable up and down, and a two-dimensional space is formed between the punch head and the die. A ceramic green sheet that can be moved in a direction is clamped and fixed, and the die portion is pushed up to press the pressing surface of the punch head, thereby causing the tip of the punch to protrude and punch a hole.
従って一度に多くのパンチ穿孔ができると共に穿孔時以
外はパンチの露出がないためパンチの折損がす＜、更に
折損した場合のパンチ交換の容易化によって生産性の高
い穿孔作業を実施することができる。Therefore, many punches can be punched at the same time, and since the punch is not exposed except when punching, there is no need to break the punch.Furthermore, if the punch breaks, it is easier to replace the punch, making it possible to carry out highly productive punching work. .
第１図は本発明になる微細孔穿孔用金型ユニットの一例
とその動作を説明する図であり、第２図はプレスマシー
ンでの実施例を示す図である。FIG. 1 is a diagram illustrating an example of a microhole drilling mold unit according to the present invention and its operation, and FIG. 2 is a diagram illustrating an embodiment in a press machine.
第１図は紙面の前後方向に例えば１００個以上のパンチ
を約２．５１１ＩＩＩＩのピッチで整列させたパンチヘ
ッドを長手方向の直角面で切断した横断面図であり、（
Ａ）は穿孔作業前の状態をまた（Ｂ）は穿孔作業途中の
状態を（のはパンチ穿孔中の状態をそれぞれ表わしてい
る。FIG. 1 is a cross-sectional view of a punch head in which, for example, 100 or more punches are arranged at a pitch of about 2.511III in the front-rear direction of the paper, taken along a plane perpendicular to the longitudinal direction.
A) represents the state before the punching operation, and (B) represents the state during the punching operation. (A) represents the state during the punching operation.
図（Ａ）で、１０は先端部１０ａ部分が９０μｍの径に
形成されまた他端近傍には径が１．ｈ＋ｓ程度に形成さ
れた鍔部１０ｂを備えた超硬材料よりなるパンチであり
、上記鍔部１０ｂ部分でパンチヘッド筐体１１の内部に
形成されている摺動孔１１ａと円滑に摺動する該パンチ
１０はばね１２によって紙面上部の開口部に装着されて
いるパンチ抑え板１３に押し付けられている。In Figure (A), 10 has a diameter of 90 μm at the tip 10a, and a diameter of 1.5 μm near the other end. The punch is made of a superhard material and has a flange 10b formed to approximately h+s. The punch 10 is pressed by a spring 12 against a punch holding plate 13 attached to an opening at the top of the page.
１４はパンチ１０が貫通する貫通孔１４ａを有し且つそ
の外径部分で上記パンチヘッド筺体１１内部の同軸上に
設けられた他の摺動孔１１ｂと円滑に摺動するパンチホ
ルダであり、ばね１５で外径部分に設けた突き当て部１
４ｂをパンチヘッド筺体１１の下端部に設けたフランジ
に押し付けている。また貫通孔１４ａの一端には上記パ
ンチ１０の先端部１０ａ部分が円滑に保持できる貫通孔
１６ａを備えた超硬材料よりなるストリッパプッシュ１
６が着脱自在に取り付けられている。Reference numeral 14 denotes a punch holder which has a through hole 14a through which the punch 10 passes, and whose outer diameter portion slides smoothly with another sliding hole 11b coaxially provided inside the punch head housing 11, and which is supported by a spring. Abutting portion 1 provided on the outer diameter portion at 15
4b is pressed against a flange provided at the lower end of the punch head housing 11. Further, a stripper pusher 1 made of a carbide material is provided with a through hole 16a at one end of the through hole 14a so that the tip portion 10a of the punch 10 can be smoothly held.
6 is detachably attached.
この状態では、パンチｌＯの先端部１０ａ部分は図の２
点（例えばパンチホルダ１４の下端面すなわちダイ対向
面１４ｃから３．５ＩＩＩＩＩｌだけ後退した点）にあ
る。In this state, the tip 10a of the punch 10 is
(for example, a point retreated by 3.5IIII from the lower end surface of the punch holder 14, that is, the die facing surface 14c).
一方、上記パンチ１０のそれぞれと対向する位置にパン
チ先端部１０ａと嵌合する孔１８ａを持った超硬材料で
形成されたダイ１８を多少の間隔を保って配設している
。On the other hand, a die 18 made of a superhard material and having a hole 18a that fits into the punch tip 10a is arranged at a position facing each of the punches 10 at a certain distance.
更に上記パンチホルダ１４のダイ対向面１４ｃとダイ１
８の間には、図示されていないＸ−Ｙテーブル上に固定
された状態で第３図同様のプラスチックフィルム８が添
着されたセラミックグリーンシート５を装着している。Furthermore, the die facing surface 14c of the punch holder 14 and the die 1
A ceramic green sheet 5 with a plastic film 8 attached thereto similar to that shown in FIG.
ここでＸ−Ｙテーブルでセラミックグリーンシート５を
Ｘ方向あるいはＹ方向に所定位置迄移動させた後、プレ
スマシーンを作動してパンチヘッド９を下死点まで降下
させてパンチホルダ１４のダイ対向面１４ｃとダイ１８
の間で該セラミックグリーンシート５を挟持固定する。After moving the ceramic green sheet 5 to a predetermined position in the X direction or Y direction using the X-Y table, the press machine is operated to lower the punch head 9 to the bottom dead center, and the punch head 9 is lowered to the die facing surface of the punch holder 14. 14c and die 18
The ceramic green sheet 5 is clamped and fixed between them.
そこでパンチヘッド９に整列した多数のパンチ１０の内
、穿孔を必要とするパンチのみを図示していない例えば
エアシリンダ等によってばね１２に抗して図示しく例え
ば３．４ｍｍ）だけ降下させると図（Ｂ）に示す状態と
なる。Therefore, among the many punches 10 lined up on the punch head 9, only the punch that requires drilling is lowered by an amount of, for example, 3.4 mm (not shown) against the spring 12 using, for example, an air cylinder (not shown). The state shown in B) is reached.
この状態では、穿孔を必要とする箇所のパンチｌＯの先
端部１０ａは図のＰ１点（例えばパンチホルダ１４のダ
イ対向面１４ｃから０．１ｍｍだけ後退した点）に位置
しており、また穿孔を必要としない箇所のパンチ１０の
先端部１０ａは、図（Ａ）のまま２点（ダイ対向面１４
ｃから３．５ｍｎ＋だけ後退した点）にある。In this state, the tip 10a of the punch 1O where drilling is required is located at point P1 in the figure (for example, a point retreated by 0.1 mm from the die facing surface 14c of the punch holder 14), and The tip portion 10a of the punch 10 in the unnecessary portion is attached at two points (die facing surface 14) as shown in Figure (A).
It is located at a point retreated by 3.5 m+ from c).
この時点で図（Ｃ）の如くダイ１８をＬ’（例えば２．
５ｍｍ）だけ上昇させると、パンチ１０を残してパンチ
ホルダ１４のみがばね１５に抗して上昇しパンチ１０の
先端部１０ａは図示Ｐ ｔｅ点の如くダイ対向面１４ｃ
からほぼＬ’（例えば２．４＋＋＋ａ＋）だけ突出する
ため、ダイ１８との間に挟持固定されているセラミック
グリーンシート５がプラスチックフィルム８と共に穿孔
される。At this point, the die 18 is set to L' (for example, 2.
5 mm), only the punch holder 14, leaving the punch 10, rises against the spring 15, and the tip 10a of the punch 10 moves to the die facing surface 14c as shown at point Pte in the figure.
Since the ceramic green sheet 5 protrudes by approximately L' (for example, 2.4+++a+) from the die 18, the ceramic green sheet 5, which is clamped and fixed between the die 18 and the plastic film 8, is perforated.
なお穿孔を必要としない箇所のパンチ１０の先端部１０
ａは、図（Ａ）に示す如く先端部１０ａが２点にあるた
めパンチホルダ１４がＬ”（例えば２．４ｍｍ）上昇し
てもパンチ１０の先端部１０ａが突出することがなく、
従ってセラミックグリーンシート５が穿孔されることが
ない。Note that the tip 10 of the punch 10 is located at a location where no drilling is required.
As shown in Figure (A), since the tip 10a is located at two points, the tip 10a of the punch 10 does not protrude even if the punch holder 14 rises by L" (for example, 2.4 mm).
Therefore, the ceramic green sheet 5 is not perforated.
ここでダイ１８を降下させて図（Ｂ）の状態に戻し更に
降下したパンチｌＯを初期の状態に戻すと共にパンチヘ
ッド９を上死点まで上昇させて図（Ａ）の状態に戻し、
以下同様のことを繰り返して所定の穿孔作業を継続する
。Here, the die 18 is lowered to return to the state shown in Figure (B), and the lowered punch 1O is returned to its initial state, and the punch head 9 is raised to the top dead center to return to the state shown in Figure (A).
Thereafter, the same process is repeated to continue the predetermined drilling operation.
従って、図（Ｂ）におけるパンチ１０の降下を所要の穿
孔位置に合わせて選択することにより所要位置への穿孔
を実現している。Therefore, by selecting the lowering of the punch 10 in Figure (B) in accordance with the required perforation position, perforation at the required position is realized.
なお、作業中にパンチ１０が折損した場合には、パンチ
抑え板１３あるいはストリンパブツシュ１６ヲ取り外す
ことによってパンチ１０は容易に交換することができる
。In addition, if the punch 10 breaks during operation, the punch 10 can be easily replaced by removing the punch holding plate 13 or the stripper bush 16.
プレスマシーンでの装着例を示す第２図で、二点鎖線で
示すプレスマシーン２０の駆動源２１でＺ方向に上下動
するヘッド２２に装着された第１図記載のパンチヘッド
９は、図では紙面前後方向に複数のパンチ１０が整列し
た状態にある。In FIG. 2 showing an example of installation in a press machine, the punch head 9 shown in FIG. A plurality of punches 10 are aligned in the longitudinal direction of the paper.
一方紙面の前後左右方向に移動できるＸ−Ｙテーブル２
３上には、第３図同様に固定枠６で保持されているセラ
ミックグリーンシート５が載置されている。また１８は
上記パンチヘッド９の各パンチ１０の対応位置に該パン
チ１０と嵌合する孔１８ａを持つ第１図記載のダイを示
し、図では紙面前後方向に複数の液孔１８ａが整列した
状態にある。On the other hand, an X-Y table 2 that can be moved in the front, back, left and right directions of the paper surface.
A ceramic green sheet 5 held by a fixed frame 6 as in FIG. 3 is placed on top of the ceramic green sheet 3 . Reference numeral 18 designates the die shown in FIG. 1, which has holes 18a that fit with the punches 10 at positions corresponding to the punches 10 of the punch head 9, and in the figure, a plurality of liquid holes 18a are aligned in the longitudinal direction of the paper. It is in.
また、該ダイ１８の保持台２４は上下（Ｚｌ）方向に自
在に摺動できる軸２５に固定されており、該軸２５の下
端２５ａは駆動源２１からのカム機構によって図面左右
（Ａ）方向に摺動する連結杆２６の先端部２６ａに設け
られたテーパ面２６ａ′に接して構成している。Further, the holding base 24 of the die 18 is fixed to a shaft 25 that can freely slide in the vertical (Zl) direction, and the lower end 25a of the shaft 25 is moved in the left-right (A) direction in the drawing by a cam mechanism from a drive source 21. The connecting rod 26 is configured to be in contact with a tapered surface 26a' provided at the tip 26a of the connecting rod 26.
かかる構成になるプレスマシーンでは、Ｘ−Ｙテーブル
２３でセラミックグリーンシート５を所定の位置に設定
した後ヘツド２２を作動させてパンチヘッド９を下死点
まで降下させる。そこで第１図で説明した如く所要のパ
ンチ１０のみを所定位置まで降下移動させて第１図（Ｂ
）の状態とする。In the press machine having such a configuration, after the ceramic green sheet 5 is set at a predetermined position on the X-Y table 23, the head 22 is operated to lower the punch head 9 to the bottom dead center. Therefore, as explained in FIG. 1, only the required punch 10 is moved down to a predetermined position, and as shown in FIG.
).
ここで駆動源２１からのカム機構で連結杆２６が図面左
（Ａ１）方向に移動しテーパ面２６８′で軸２５を上方
に押し上げて第１図（Ｃ）に示す状態でセラミックグリ
ーンシート５に所定の穿孔を行う。Here, the connecting rod 26 is moved to the left (A1) direction in the drawing by the cam mechanism from the drive source 21, and the shaft 25 is pushed upward by the tapered surface 268', and the ceramic green sheet 5 is moved in the state shown in FIG. 1 (C). Perform the prescribed drilling.
その後、連結杆２６が図面右（Ａ ” ”）方向に移動
してダイ１日が降下すると同時にヘッド２２すなわちパ
ンチヘッド９が上昇し更にパンチエ口が初期の位置に戻
って第１図（Ａ）の状態となる。Thereafter, the connecting rod 26 moves to the right (A") in the drawing, and the die 1 descends. At the same time, the head 22, that is, the punch head 9, rises, and the punch opening returns to its initial position, as shown in FIG. 1 (A). The state will be as follows.
上述の如く本発明により、セラミックグリーンシートに
効率よくまた生産性よく大量の微細孔を穿孔することが
できる微細孔穿孔用金型ユニットを提供することができ
る。As described above, according to the present invention, it is possible to provide a mold unit for perforating fine holes that can efficiently and productively perforate a large number of fine holes in a ceramic green sheet.
第１図は本発明になる微細孔穿孔用金型ユニットの一例
とその動作を説明する図、
第２図はプレスマシーンでの実施例を示す図、第３図は
従来の穿孔方法の一例を示した構成原理図、
である。図において、
５はセラミックグリーンシート、
６は固定枠、 ８はプラスチックフィルム、９はパン
チヘッド、 １０はパンチ、１０ａは先端部、
１０ｂは鍔部、１１はパンチヘッド筐体、ｌｌａ、
ｌｌｂは摺動孔、１２、１５はばね、 １３はパ
ンチ抑え板、１４はパンチホルダ、 １４ａは貫通孔
、１４ｂは突き当て部、 １４ｃはダイ対向面、１６
はストリッパブツシュ、１６ａは貫通孔、１８はダイ、
１８ａは孔、２０はプレスマシーン、
２１は駆動源、２２はヘッド、 ２３はＸ−Ｙ
テーブル、２４は保持台、 ２５は軸、
２５ａは下端部、 ２６は連結杆、２６ａは先端
部、 ２６ａ９はテーパ面、をそれぞれ表わす。
プレスマシーン７゛め賞況す列Σ示す２第 ？ 図
杖釆−ｇ孔方ｊリー例を示ムた構成原理図第 ３ 月Fig. 1 is a diagram illustrating an example of the mold unit for perforating fine holes according to the present invention and its operation, Fig. 2 is a diagram showing an example in a press machine, and Fig. 3 is an example of a conventional perforation method. The configuration principle diagram shown is as follows. In the figure, 5 is a ceramic green sheet, 6 is a fixed frame, 8 is a plastic film, 9 is a punch head, 10 is a punch, 10a is a tip,
10b is a flange, 11 is a punch head housing, lla,
llb is a sliding hole, 12 and 15 are springs, 13 is a punch holding plate, 14 is a punch holder, 14a is a through hole, 14b is an abutting part, 14c is a die facing surface, 16
is a strip bush, 16a is a through hole, 18 is a die,
18a is a hole, 20 is a press machine,
21 is a driving source, 22 is a head, 23 is an X-Y
24 is a holding base, 25 is a shaft, 25a is a lower end, 26 is a connecting rod, 26a is a tip, and 26a9 is a tapered surface. Press machine 7th award status line Σ showing 2nd? Diagram of the principle of construction showing an example of the 3rd month of the 3rd month
Claims (1)
ニットであって、 所定ピッチで整列した複数個のパンチ（１０）を備えた
パンチヘッド（９）と、該パンチのそれぞれと対向する
位置に該パンチと嵌合する孔（１８ａ）を持ち且つ上下
動する手段を備えたダイ（１８）とで構成し、 シート状薄板を上記パンチヘッド（９）と上記ダイ（１
８）とで挟持した状態で上記パンチヘッド（９）のダイ
対向面（１４ｃ）を上記ダイ（１８）で押圧した時に、
該ダイ対向面（１４ｃ）のみを後退させて内在するパン
チ（１０）の先端部（１０ａ）を該ダイ対向面（１４ｃ
）から突出させてなることを特徴とする穿孔用金型ユニ
ット。[Claims] A punching mold unit for punching a plurality of holes in a sheet-like thin plate, comprising: a punch head (9) equipped with a plurality of punches (10) arranged at a predetermined pitch; and the punches. , and a die (18) having a hole (18a) for fitting the punch at a position facing each of the punches and a die (18) equipped with means for moving up and down; 1
When the die facing surface (14c) of the punch head (9) is pressed with the die (18) while being held between
By retracting only the die facing surface (14c), the tip (10a) of the existing punch (10) is moved to the die facing surface (14c).
) A punching mold unit characterized by being formed by protruding from the
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63070317A JP2541274B2 (en) | 1988-03-24 | 1988-03-24 | Drilling die unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63070317A JP2541274B2 (en) | 1988-03-24 | 1988-03-24 | Drilling die unit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01246100A true JPH01246100A (en) | 1989-10-02 |
| JP2541274B2 JP2541274B2 (en) | 1996-10-09 |
Family
ID=13427954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63070317A Expired - Fee Related JP2541274B2 (en) | 1988-03-24 | 1988-03-24 | Drilling die unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2541274B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02180593A (en) * | 1988-12-28 | 1990-07-13 | Komatsu Ltd | Punching device for green sheet |
| JPH04148594A (en) * | 1990-10-12 | 1992-05-21 | Nec Corp | Device and method for forming multipin through hole formation |
| JP2009233828A (en) * | 2008-03-28 | 2009-10-15 | Tdk Corp | Punching pin, punching die, and punching device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6960848B2 (en) | 2003-05-09 | 2005-11-01 | Nisca Corporation | Electromagnetic drive device and light quantity adjustment device using the same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5385559U (en) * | 1976-12-16 | 1978-07-14 | ||
| JPS60123300A (en) * | 1983-12-02 | 1985-07-01 | 株式会社日立製作所 | Punching die having punch selective function |
-
1988
- 1988-03-24 JP JP63070317A patent/JP2541274B2/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5385559U (en) * | 1976-12-16 | 1978-07-14 | ||
| JPS60123300A (en) * | 1983-12-02 | 1985-07-01 | 株式会社日立製作所 | Punching die having punch selective function |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02180593A (en) * | 1988-12-28 | 1990-07-13 | Komatsu Ltd | Punching device for green sheet |
| JPH04148594A (en) * | 1990-10-12 | 1992-05-21 | Nec Corp | Device and method for forming multipin through hole formation |
| JP2009233828A (en) * | 2008-03-28 | 2009-10-15 | Tdk Corp | Punching pin, punching die, and punching device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2541274B2 (en) | 1996-10-09 |
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