KR100809207B1 - Method for fabricating a light emitting diode package - Google Patents

Abstract

A method for manufacturing a light emitting diode package is provided to prevent an encapsulant from remaining on a package and to crease light emitting efficiency by using a stamp on which a guide groove is formed when an unevenness structure is formed on an encapsulation unit of a cup-type package structure. A cup-type package structure(16) is prepared. A groove is formed on an upper surface of the cup-type package structure and one or more light emitting diode chips are mounted on a bottom of a lower surface of the groove. An encapsulation unit(18) is formed by inputting an encapsulant into the groove of the cup-type package structure. A stamp having an unevenness unit and guide grooves(14a,14b) is applied to an upper surface of the encapsulation unit. The encapsulation unit and the stamp are separated from each other. A lateral side of the groove is a reflection surface having a slop.

Description

METHODS FOR FABRICATING A LIGHT EMITTING DIODE PACKAGE}

1 is a view showing a stamp for forming a conventional uneven pattern.

2 is a plan view of a cup-shaped package structure in which a light emitting diode chip is mounted and an encapsulation part is formed.

3A is a diagram illustrating the stamp of FIG. 1 applied to the cup-shaped package structure of FIG.

3B is a cross-sectional view taken along the line A-A of the cup-shaped package structure of FIG. 3A.

4 is a cross-sectional view of a stamp applied to the cup-shaped package structure of FIG.

FIG. 5A is a view illustrating a stamp used in a method of manufacturing a light emitting diode package according to an embodiment of the present invention in FIG. 4.

5B is a perspective view illustrating a cross section taken along line B-B and line C-C in the stamp of FIG. 5A.

6 is a cross-sectional view of the cup-shaped package structure with the stamp separated in FIG. 4.

<Code Description of Main Parts of Drawing>

10 stamp 12 irregularities

14a, 14b Guide Groove 16 Cup Package Structure

17 LED chip 18 Encapsulation

19a, 19b reflective surface

The present invention relates to a method of manufacturing a light emitting diode package, and more particularly, to a method of manufacturing a light emitting diode package capable of maximizing the light emitting efficiency and performing the process efficiently.

Light emitting diodes (LEDs) are solid-state light emitting devices made of semiconductors, which are more stable and reliable than other heat conversion light emitting devices, and have a long lifespan. In addition, since the driving is possible with a voltage of several V and a current of several tens of mA, the power consumption is small, and thus it is a material of a field in which its usefulness as a light emitting element is further expected.

These LEDs are used as a backlight unit in a small liquid crystal display such as a display of a mobile phone and a PDA, as a light source, a flash LED used as a light source for a cell phone and a signboard light with a camera, and a light source for lighting and electronics. As it is used as a light source in more and more areas, such as high-power LED is being used as the field of application is expanding, development as a next-generation illumination light source is called for.

LEDs come in a variety of packages depending on the leadframe type, PCB, ceramic, and ALN. One of them is a form in which a reflector is formed on a package body on which a lead frame is mounted to control the path of light emitted from the LED. In this type of package, after mounting a light emitting diode chip on a substrate or lead frame on which an electrode pattern is formed, the terminal and the electrode pattern (or lead) of the light emitting diode chip are electrically connected to each other, for example epoxy or silicon. Or the LED chip is encapsulated using a resin such as a combination thereof as the encapsulating material. The encapsulation portion may be formed with irregularities in order to increase light extraction efficiency.

1 is a view showing a stamp for forming a conventional uneven pattern. The stamp 1 is formed with irregularities in the shape opposite to the irregularities to be formed on the sealing portion of the package. In FIG. 1, the unevenness | corrugation 2 is formed uniformly in the stamp 1 whole. The reason why the unevenness 2 is generally formed in the conventional stamp 1 is that, in such a shape, rather than forming the unevenness in one light emitting diode package, it is applied to a light emitting diode package frame including a plurality of light emitting diode packages. This is because the unevenness may be formed in the plurality of light emitting diode packages by the application.

2 is a plan view of the cup-shaped package structure 3 in which the light emitting diode chip 5 is mounted and the encapsulation portion 6 is formed. The cup-shaped groove 4 is formed in the cup-shaped package structure 3, so that the LED chip 5 can be mounted on the bottom thereof. The electrical connection of the LED chip 5 and the electrode structure therefor are omitted.

FIG. 3A shows the stamp 1 of FIG. 1 applied on the cup-shaped package structure 3 of FIG. 2. It is shown that as the stamp 1 is applied on the encapsulation 6, the encapsulation material leaks out of the cup-shaped package structure 3. 3B is a cross-sectional view taken along the line A-A of the cup-shaped package structure of FIG. 3A. Unevenness is formed in the encapsulation part 6, and the encapsulation material flows outward from the side of the cup-shaped package structure 3. Light emitted from the light emitting diode chip 5 may travel in an undesirable direction by the leaked encapsulation material. As a result, the luminous efficiency of the entire LED package is reduced. It is necessary to remove the leaked encapsulating material to increase the luminous efficiency, and this removal process must be further performed.

Therefore, the development of a method for manufacturing a light emitting diode package so as to exhibit the maximum luminous efficiency in an efficient process has been requested.

The present invention is to solve the above problems, an object of the present invention is to prevent the encapsulation material remaining in the package when forming the concave-convex structure on the sealing portion of the cup-shaped package structure and to form the concave-convex structure more effectively luminous efficiency To provide a method for manufacturing a light emitting diode package that can maximize the efficiency and perform the process efficiently.

In order to realize the above technical problem, a method of manufacturing a light emitting diode package according to an embodiment of the present invention comprises the steps of providing a cup-shaped package structure in which a groove is formed on an upper surface and one or more light emitting diode chips are mounted on a bottom of the groove. ; Inserting an encapsulating material into a groove portion of the package structure to form an encapsulation portion; Applying a stamp having an uneven portion and a guide groove to an upper surface of the encapsulation portion; And separating the seal from the stamp.

The side surface of the groove portion of the cup-shaped package structure may be a reflective surface having an inclination, wherein one surface of the guide groove portion of the stamp has the same inclination as that of the reflective surface.

The encapsulating material introduced into the groove of the cup-shaped package structure is preferably a liquid transparent resin that does not affect the light emitted from the light emitting diode. The step of applying a stamp to the encapsulation portion encapsulated with the liquid transparent resin may be performed before the curing of the injected liquid transparent resin is completed.

The shape of the cross section of the uneven portion formed in the stamp may be a shape in which any one of a triangle, a square, and a semicircle is repeated.

The guide groove portion is preferably formed around the uneven portion formed on the stamp. In addition, the guide groove portion may have a groove shape that is a shape corresponding to an upper end of the sidewall of the cup-shaped package structure.

After applying the stamp, the encapsulating material may leak out. In this case, it is preferable to remove the encapsulating material leaked out of the cup-shaped package structure through the guide groove before the step of separating the stamp. In addition, in order to separate the stamp more easily, the step of separating the stamp may be performed by applying a release agent to the uneven portion and the guide groove.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. However, embodiments of the present invention may be modified in various other forms, and the scope of the present invention is not limited to the embodiments described below. Embodiments of the present invention are provided to more fully describe the present invention to those skilled in the art. Therefore, the shape and size of the elements in the drawings may be exaggerated for more clear description, elements of the same reference numerals represent the same components.

Method of manufacturing a light emitting diode package according to an embodiment of the present invention comprises the steps of providing a cup-shaped package structure in which a groove is formed on the upper surface and the light emitting diode chip is mounted on the bottom of the groove; Inserting an encapsulant into a groove of the package structure to form an encapsulant; Applying a stamp having an uneven portion and a guide groove to an upper surface of the encapsulation portion; And separating the seal from the stamp.

4 is a cross-sectional view of a stamp applied to the cup-shaped package structure of FIG. First, in order to manufacture a light emitting diode package according to the present invention, a cup-shaped package structure 16 is provided. The cup-shaped package structure 16 has a cup-shaped groove portion formed on an upper surface thereof. The light emitting diode chip 17 is mounted on the bottom of the groove portion.

An electrode pattern (not shown) for connecting the LED chip 17 and an external power source is provided on the bottom of the groove of the cup-shaped package structure 16. The light emitting diode chip 17 may be connected to an electrode pattern (not shown) through a known method, for example, wire bonding. The shape and formation method of the electrode pattern (not shown) and the light emitting diode chip 17 may be The connection method is well known and its description will be omitted.

The inner side of the cup-shaped package structure 16 may be inclined reflective surfaces 19a and 19b. The reflecting surfaces 19a and 19b reflect light emitted from the light emitting diode chip 17 to increase the efficiency of extraction to the outside of the cup-shaped package structure 16. The reflective surfaces 19a and 19b may be formed to have a predetermined angle of less than 90 ° with respect to the bottom of the groove to increase the reflection efficiency of the light.

When the LED chip 17 is mounted, the encapsulation material is introduced into the groove to form the encapsulation portion 18. The encapsulating material introduced into the groove of the cup-shaped package structure 16 is preferably a transparent material that does not affect light emitted from the light emitting diode, and may be, for example, a transparent resin. The injected transparent resin is a liquid resin before curing. The liquid transparent resin may be silicone, epoxy resin or a mixture thereof.

The encapsulating material may be introduced using a known process such as a dispensing process. The encapsulating material may include a phosphor capable of converting light of the LED chip 17 into light having a different wavelength. For example, it may be a material in which a phosphor material is dispersed in a transparent resin.

When the encapsulation portion 18 is formed, the stamp 10 having the uneven portion 12 and the guide groove portion 14 is applied to the upper surface of the encapsulation portion 18.

FIG. 5A shows a plan view of the stamp 10, and FIG. 5B is a perspective view showing a cross section taken along lines B-B and C-C in the stamp of FIG. 5A.

The stamp 10 has an uneven portion 12 and a guide groove portion 14. The uneven portion 12 is formed in the stamp 10, the circumference of the guide groove 14 is surrounded. The shape of the uneven portion 12 may vary depending on the shape of the unevenness to be formed on the light emitting diode package. For example, the shape of the cross section of the uneven portion 12 may be a shape in which any one of a triangle, a quadrangle, and a semicircle is repeated. Accordingly, the unevenness formed on the encapsulation portion 18 of the light emitting diode package may have the shape of an intaglio pattern corresponding to the concave-convex portion 12 if the shape of the concave-convex portion 12 is an embossed pattern. Can be represented.

Guide groove portion 14 is preferably formed around the uneven portion 12. The guide groove 14 is a groove formed on the stamp 10, and later, when the stamp 10 is applied on the encapsulation portion 18 of the cup-shaped package structure 16, the guide groove 14 corresponds to the side wall of the cup-shaped package structure 16. Prevent the leakage of encapsulation material during the formation of unevenness. That is, the guide groove 14 has a groove shape that is a shape corresponding to the top of the side wall of the cup-shaped package structure 16. Therefore, it is preferable that the side surfaces of the guide grooves 14a and 14b have the same slope as that of the reflecting surfaces 19a and 19b.

The stamp 10 may be formed in plural using a flat plate such as a silicon wafer. A plurality of stamp patterns having the same shape as the respective stamps 10 are formed on the silicon wafer, and a stamp having a plurality of individual light emitting diode package stamps can be manufactured using this as a master pattern. In this case, unlike the case in which the unevenness is formed on the stamp as a whole to form a continuous form, the unevenness of each light emitting diode package may be formed.

Reference is again made to FIG. 4 where the stamp 10 is applied to the encapsulation 18. In FIG. 4, the stamp 10 is applied on the encapsulation portion 18 to form irregularities. This process can be understood as an imprinting or stamping process. In this figure, the stamp 10 is shown to have a flat structure. In this case, the surface of the encapsulation portion 18 generated by the wettability of the liquid transparent resin is flattened to flatten the curved surface. Can be reduced.

After applying the stamp 10 to the cup-shaped package structure 16, the encapsulating material may be leaked to the outside. When the encapsulation material is leaked to the outside, the encapsulation portion 18 may be formed without a space to apply the stamp 10 to the groove portion. At this time, it is preferable to remove the encapsulation material leaked out before the step of separating the stamp (10). Since the guide groove 14 is formed in the stamp 10 according to the present invention, the amount of encapsulating material flowing out on the upper side of the cup-shaped package structure 16 is small. Therefore, it is easy to remove the encapsulating material leaked to the outside.

In addition, when the encapsulating material is a resin, the present process may be performed in a semi-cured state where the curing is performed for a predetermined time, that is, the curing is not completed. In this case, the subsequent stamp separation process can be easily performed according to the type of resin or the pattern of the stamp 10.

If unevenness is formed on the encapsulation part 18, the encapsulation part 18 and the stamp are separated to manufacture a light emitting diode package. 6 is a cross-sectional view of the cup-shaped package structure separated from the stamp in FIG. 4. In order to facilitate the stamp separation process, it may be desirable to apply a release material such as silicone oil to the uneven portions 12 and the guide grooves 14 of the stamp 10.

It is intended that the invention not be limited by the foregoing embodiments and the accompanying drawings, but rather by the claims appended hereto. Accordingly, various forms of substitution, modification, and alteration may be made by those skilled in the art without departing from the technical spirit of the present invention described in the claims, which are also within the scope of the present invention. something to do.

As described above, according to the manufacturing method of the LED package of the present invention, since the stamp is formed in the guide groove when the uneven structure is formed in the encapsulation portion of the cup-shaped package structure, the encapsulating material can be prevented from remaining in the package. Light loss due to the encapsulation material can be prevented, thereby maximizing the luminous efficiency.

In addition, since a separate process such as scraping to remove the remaining encapsulating material may be omitted, the process may be efficiently performed.

Claims (10)

Providing a cup-shaped package structure having a groove formed on an upper surface thereof and having at least one light emitting diode chip mounted on at least a bottom of the groove portion; Inserting an encapsulant into a groove of the package structure to form an encapsulation portion; Applying a stamp having an uneven portion and a guide groove to an upper surface of the encapsulation portion; And Separating the encapsulation unit from the stamp; a light emitting diode package manufacturing method comprising a. The method of claim 1, The side surface of the groove portion is a light emitting diode package manufacturing method, characterized in that the reflective surface. The method of claim 2, One surface of the guide groove portion has a light emitting diode package manufacturing method, characterized in that the same inclination of the reflecting surface. The method of claim 1, The encapsulating material is a light emitting diode package manufacturing method, characterized in that the liquid transparent resin. The method of claim 4, wherein The step of applying the stamp, the light emitting diode package manufacturing method, characterized in that is carried out before the curing of the injected liquid transparent resin is completed. The method of claim 1, The cross-section of the uneven portion is a light emitting diode package manufacturing method, characterized in that any one of the shape of a triangle, a square, and a semi-circle is repeated. The method of claim 1, The guide groove portion is a light emitting diode package manufacturing method, characterized in that formed around the uneven portion. The method of claim 1, The guide groove portion has a light emitting diode package manufacturing method characterized in that it has a groove shape corresponding to the top of the side wall of the cup-shaped package structure. The method of claim 1, Before removing the stamp, removing the encapsulating material spilled out of the cup-shaped package structure through the guide groove. The method of claim 1, The separating of the stamp is a method of manufacturing a light emitting diode package, characterized in that performed after applying a release agent to the uneven portion and the guide groove.

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