KR100806949B1 - 직진형 연마방법 및 장치 - Google Patents
직진형 연마방법 및 장치 Download PDFInfo
- Publication number
- KR100806949B1 KR100806949B1 KR1020067019958A KR20067019958A KR100806949B1 KR 100806949 B1 KR100806949 B1 KR 100806949B1 KR 1020067019958 A KR1020067019958 A KR 1020067019958A KR 20067019958 A KR20067019958 A KR 20067019958A KR 100806949 B1 KR100806949 B1 KR 100806949B1
- Authority
- KR
- South Korea
- Prior art keywords
- workpiece
- polishing
- straight
- surface plate
- flat surface
- Prior art date
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004105655 | 2004-03-31 | ||
JPJP-P-2004-00105655 | 2004-03-31 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060132954A KR20060132954A (ko) | 2006-12-22 |
KR100806949B1 true KR100806949B1 (ko) | 2008-02-22 |
Family
ID=35063594
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067019958A KR100806949B1 (ko) | 2004-03-31 | 2005-03-29 | 직진형 연마방법 및 장치 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20070202777A1 (ja) |
EP (1) | EP1745888A4 (ja) |
JP (1) | JP4472694B2 (ja) |
KR (1) | KR100806949B1 (ja) |
CN (1) | CN1929954B (ja) |
TW (1) | TWI271261B (ja) |
WO (1) | WO2005095053A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101249632B (zh) * | 2008-03-20 | 2010-06-09 | 沈阳材佳机械设备有限公司 | 往复直线加旋转运动研磨抛光装置 |
US8684791B2 (en) * | 2011-11-09 | 2014-04-01 | Alvin Gabriel Stern | Linear, automated apparatus and method for clean, high purity, simultaneous lapping and polishing of optics, semiconductors and optoelectronic materials |
US9950404B1 (en) | 2012-03-29 | 2018-04-24 | Alta Devices, Inc. | High throughput polishing system for workpieces |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6080559A (ja) | 1983-10-12 | 1985-05-08 | Mitsubishi Metal Corp | 研磨装置 |
JPH0852652A (ja) * | 1994-08-09 | 1996-02-27 | Ontrak Syst Inc | リニアポリシャ及び半導体ウエハ平滑化方法 |
JPH08195364A (ja) * | 1994-10-11 | 1996-07-30 | Ontrak Syst Inc | 半導体ウェーハを研磨するための研磨パッドクラスタ |
JPH10249720A (ja) | 1997-03-13 | 1998-09-22 | Kobe Steel Ltd | 平板状工作物のポリッシング加工方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2144354B (en) * | 1983-07-15 | 1987-03-11 | Helical Springs Limited | Grinding apparatus |
US5371973A (en) * | 1992-09-30 | 1994-12-13 | Western Atlas Inc. | Grinding machine utilizing multiple, parallel, abrasive belts simultaneously grinding surfaces on a workpiece |
US6241583B1 (en) * | 1999-02-04 | 2001-06-05 | Applied Materials, Inc. | Chemical mechanical polishing with a plurality of polishing sheets |
US6626744B1 (en) * | 1999-12-17 | 2003-09-30 | Applied Materials, Inc. | Planarization system with multiple polishing pads |
US6422929B1 (en) * | 2000-03-31 | 2002-07-23 | Taiwan Semiconductor Manufacturing Co., Ltd. | Polishing pad for a linear polisher and method for forming |
US20040137830A1 (en) * | 2002-12-24 | 2004-07-15 | Kazumasa Ohnishi | Lapping method and lapping machine |
-
2005
- 2005-03-29 EP EP05727544A patent/EP1745888A4/en not_active Withdrawn
- 2005-03-29 JP JP2006511668A patent/JP4472694B2/ja not_active Expired - Fee Related
- 2005-03-29 WO PCT/JP2005/005858 patent/WO2005095053A1/ja active Application Filing
- 2005-03-29 US US10/599,562 patent/US20070202777A1/en not_active Abandoned
- 2005-03-29 KR KR1020067019958A patent/KR100806949B1/ko active IP Right Grant
- 2005-03-29 CN CN2005800079883A patent/CN1929954B/zh not_active Expired - Fee Related
- 2005-03-30 TW TW094110147A patent/TWI271261B/zh not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6080559A (ja) | 1983-10-12 | 1985-05-08 | Mitsubishi Metal Corp | 研磨装置 |
JPH0852652A (ja) * | 1994-08-09 | 1996-02-27 | Ontrak Syst Inc | リニアポリシャ及び半導体ウエハ平滑化方法 |
JPH08195364A (ja) * | 1994-10-11 | 1996-07-30 | Ontrak Syst Inc | 半導体ウェーハを研磨するための研磨パッドクラスタ |
JPH10249720A (ja) | 1997-03-13 | 1998-09-22 | Kobe Steel Ltd | 平板状工作物のポリッシング加工方法 |
Also Published As
Publication number | Publication date |
---|---|
JP4472694B2 (ja) | 2010-06-02 |
EP1745888A4 (en) | 2008-01-02 |
US20070202777A1 (en) | 2007-08-30 |
JPWO2005095053A1 (ja) | 2008-07-31 |
CN1929954A (zh) | 2007-03-14 |
WO2005095053A1 (ja) | 2005-10-13 |
CN1929954B (zh) | 2011-12-14 |
KR20060132954A (ko) | 2006-12-22 |
TW200531781A (en) | 2005-10-01 |
TWI271261B (en) | 2007-01-21 |
EP1745888A1 (en) | 2007-01-24 |
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